CN201708396U - 模组元件 - Google Patents

模组元件 Download PDF

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Publication number
CN201708396U
CN201708396U CN2009203153198U CN200920315319U CN201708396U CN 201708396 U CN201708396 U CN 201708396U CN 2009203153198 U CN2009203153198 U CN 2009203153198U CN 200920315319 U CN200920315319 U CN 200920315319U CN 201708396 U CN201708396 U CN 201708396U
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circuit board
sub
conductive
module element
magnetic
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吴立群
徐勇春
黄朝栋
林志民
胡建设
黄国全
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6633—Structural association with built-in electrical component with built-in single component with inductive component, e.g. transformer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

本实用新型公开了一种模组元件，其包括设有收容腔的绝缘本体，收容于绝缘本体内的电路板单元及安装于电路板单元上的若干导电端子，所述电路板单元包括子电路板及配置于子电路板上的第一、第二磁性元件，其中，所述第一磁性元件包括植入子电路板内层的磁芯及通过印刷导电层技术配置于子电路板上的若干导电路径，导电路径环绕于磁芯，所述第二磁性元件通过表面安装技术安装于子电路板上。所述模组元件可广泛应用于自动化生产中且可实现微型化发展。

Description

模组元件 
【技术领域】
本实用新型关于一种模组元件，尤其是关于具有变压器及共模扼流线圈的模组元件。 
【背景技术】
2005年8月9日公告的公告号为US 6,926,558的专利揭示了一种模组连接器，其包括设有收容腔的绝缘本体，收容于绝缘本体收容腔内的端子模组及覆盖于绝缘本体上的遮蔽盖体。端子模组包括子电路板、与子电路板垂直连接的保持部、部分安装于保持部内且末端与子电路板电性连接的导电端子、安装于子电路板上的若干磁性元件及安装有转接端子的转接件。 
但是该设计的缺陷在于：所述磁性元件是将绕线通过手工作业方式缠绕于铁芯上制得，如此不适于广泛应用于自动化生产中。 
【实用新型内容】
本实用新型所要解决的技术问题在于提供一种有利于实现自动化生产的微型模组元件。 
为达到上述所要解决的技术问题，本实用新型提供一种模组元件，其包括设有收容腔的绝缘本体，收容于绝缘本体内的电路板单元及安装于电路板单元上的若干导电端子，所述电路板单元包括子电路板及配置于子电路板上的第一、第二磁性元件，其中，所述第一磁性元件包括植入子电路板内层的磁芯及通过印刷导电层技术配置于子电路板上的若干导电路径，导电路径环绕于磁芯，所述第二磁性元件通过表面安装技术安装于子电路板上。 
与现有技术相比，本实用新型模组连接器具有以下优点：所述第一磁性元件的磁芯植入子电路板内层。第一磁性元件的制造过程中不需要采用手工缠绕方式，如此可以大规模应用于自动化生产中。同时，第二磁芯元件通过表面安装技术安装于子电路板上。第二磁芯元件的此种安装方式亦可以应用于自动化生产中。另外，由于第一磁芯元件已经采用植入式设计，第二磁芯元件亦采用植入式设计必然导致占用子电路板的空间较多。第二磁性元件的线包式设计可以减少占用子电路板的空间，从而有利于实现产品的微型化发 展。 
【附图说明】
图1是本实用新型模组元件的立体组装图。 
图2是图1所示模组元件的部分分解图，其中磁芯为示意图。 
图3是图2所示模组元件的另一角度的部分分解图，其中磁芯为示意图。 
图4是图1所示的模组元件的分解图，其中磁芯为示意图。 
【具体实施方式】
请参阅图1至图4，本实用新型揭示一种沿着第一方向焊接于母电路板(未图示)上的模组元件100，其包括：设有收容腔11的绝缘本体1、收容于绝缘本体1的收容腔11内的电路板单元2及组设于电路板单元2上的若干导电端子3。 
参阅图1，绝缘本体1大致呈矩形盒状结构。绝缘本体1包括基部14、自基部14边缘沿着第一方向延伸的一对第一侧壁12及一对第二侧壁13。所述收容腔11围设于基部14、第一侧壁12及第二侧壁13之间。 
参阅图2及图3，电路板单元2包括子电路板21、设置于子电路板21内的变压器22及安装于子电路板21上的共模扼流线圈23。 
子电路板21具有彼此相对配置的第一侧面211及第二侧面212。子电路板21上设有贯穿第一、第二侧面211、212的两排导电孔25。两排导电孔25包括靠近共模扼流线圈23的第一排导电孔251及靠近变压器22的第二排导电孔252。结合图4，子电路板21的第二侧面212上设有若干导电片26。导电片26配置于靠近第一排导电孔251处且与对应的第一排导电孔251电性连接。 
变压器22包括植入子电路板21内层的磁芯221及通过印刷导电层技术配置于子电路板21上的若干导电路径。导电路径包括分别配置于子电路板21的第一、第二侧面211、212的导电区域222及埋设于子电路板21内层的部分导电路径(未图示)。磁芯221植入子电路板21内层故无法于子电路板21外侧观看其结构。为了便于说明，图2至图4中增加了揭示磁芯221结构的示意图。子电路板21的第一侧面211上的导电区域222的一端通过埋设于子电路板21内层的导电路径环绕对应磁芯221并与磁芯221形成磁场且产生电感，另一端与导电孔25电性连接以实现信号的传输和滤波阻抗的匹配。子电路板21的第二侧面212上的导电区域222一端通过埋设于子电路板21内层的导电路径环绕对应磁 芯221并与磁芯221形成磁场，另一端与导电片26电性连接。 
共模扼流线圈23为采用线包式结构的表面贴装器件。其通过表面安装技术焊接于子电路板21的导电片26上。共模扼流线圈23起到对高频信号的滤波作用。 
导电端子3包括水平延伸的主体部31、自主体部31一端沿着第一方向竖直延伸的插入部32及自主体部31另一端弯折延伸的焊接部33。导电端子3的插入部32沿着第一方向穿越导电孔251并通过焊接于导电孔251内。导电端子3的主体部31靠近子电路板21的第二侧面212。如果导电端子3通过植球的方式焊接于子电路板21上，则会令焊接效果更可靠。 
当电路板单元2组装于绝缘本体1的收容腔11内时，子电路板21的第二侧面212朝向收容腔11，第一侧面211呈暴露状态。共模扼流线圈23收容于收容腔11内。导电端子3的焊接部33分别穿越第一侧壁12且共面配置于与子电路板21所在平面平行的平面上。当组装成一体的模组元件100沿着第一方向安装于母电路板上时，导电端子3的焊接部33通过表面焊接技术焊接于母电路板上。 
于本实施方式中，变压器22可称之为第一磁性元件，共模扼流线圈23可称之为第二磁性元件。共模扼流线圈23亦可为环形电感器或双目电感器。于其他实施方式中，变压器22及共模扼流线圈23亦可根据需要替换成其他的电子元件或磁性元件。 
变压器22的磁芯221植入子电路板21内层，导电路径通过印刷导电层技术配置且与磁芯221形成磁场。变压器22的制造过程中不需要采用手工缠绕方式，如此可以大规模应用于自动化生产中。 
同时，共模扼流线圈23采用线包式结构通过表面安装技术安装于子电路板21的第二侧面212上的导电片26上。共模扼流线圈23的此种安装方式亦可以应用于自动化生产中。另外，由于变压器22已经采用植入式设计，共模扼流线圈23亦采用植入式设计必然导致占用子电路板21的空间较多。共模扼流线圈23的线包式设计可以减少占用子电路板21的空间，从而有利于实现产品的微型化发展。 

Claims (10)

1.一种模组元件，其包括：设有收容腔的绝缘本体，收容于绝缘本体内的电路板单元及安装于电路板单元上的若干导电端子，所述电路板单元包括子电路板及配置于子电路板上的第一、第二磁性元件，其特征在于：所述第一磁性元件包括植入子电路板内层的磁芯及通过印刷导电层技术配置于子电路板上的若干导电路径，导电路径环绕于磁芯，所述第二磁性元件通过表面安装技术安装于子电路板上。
2.如权利要求1所述的模组元件，其特征在于：所述第一磁性元件为变压器，所述第二磁性元件为共模扼流线圈。
3.如权利要求2所述的模组元件，其特征在于：所述子电路板上设有若干导电片，所述共模扼流线圈具有线包式结构且焊接于子电路板的导电片上。
4.如权利要求3所述的模组元件，其特征在于：所述子电路板具有彼此相对配置的第一、第二侧面及贯穿第一、第二侧面的若干导电孔，所述导电路径包括配置于第一、第二侧面的导电区域及埋设于子电路板内层的部分导电路径。
5.如权利要求4所述的模组元件，其特征在于：所述第一侧面上的导电区域一端通过埋设于子电路板内层的部分导电路径环绕对应磁芯并与磁芯形成磁场且产生电感，另一端与导电孔电性连接以实现信号的传输和滤波阻抗的匹配。
6.如权利要求4所述的模组元件，其特征在于：所述导电片设置于第二侧面上，所述子电路板的第二侧面上的导电区域一端通过埋设于子电路板内层的部分导电路径环绕对应磁芯并与磁芯形成磁场，另一端与导电片电性连接。
7.如权利要求4所述的模组元件，其特征在于：所述导电端子插入对应的导电孔内且焊接于导电孔内。
8.如权利要求7所述的模组元件，其特征在于：所述导电端子包括主体部、自主体部一端延伸且与导电孔配合的插入部及自主体部另一端弯折延伸的焊接部。
9.如权利要求8所述的模组元件，其特征在于：所述导电端子的焊接部通过植球的方式焊接于对应的导电孔内。 
10.如权利要求8所述的模组元件，其特征在于：所述导电端子的焊接部共面配置于与子电路板平行的平面上。 
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