CN201699041U - Wafer cleaner - Google Patents
Wafer cleaner Download PDFInfo
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- CN201699041U CN201699041U CN2010202365905U CN201020236590U CN201699041U CN 201699041 U CN201699041 U CN 201699041U CN 2010202365905 U CN2010202365905 U CN 2010202365905U CN 201020236590 U CN201020236590 U CN 201020236590U CN 201699041 U CN201699041 U CN 201699041U
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- drying chamber
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- gas flow
- guiding spare
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model discloses a wafer cleaner, which comprises a cleaning chamber, a drying chamber adjacent to the cleaning chamber, and a conveying component penetrating through the drying chamber. The drying chamber further includes a feed inlet, a discharge outlet, at least one air inlet disposed above the conveying component, at least one heater corresponding to the air inlet, an exhaust hole disposed on one side of the conveying component opposite to the air inlet, and a first gas conducting component disposed above the conveying component, wherein the first gas conducting component disposed on one side of the exhaust hole is adjacent to the conveying component. The wafer cleaner not only can prevent gas containing a great amount of cleaning chemicals in the cleaning chamber from entering the drying chamber so as to reduce pollution to wafers during a subsequent drying process, but also can reduce pollution of external air to the wafers during the subsequent drying process, and is fine in cleaning effect and simple in structure.
Description
Technical field
The utility model relates to wafer and cleans, and especially relates to a kind of wafer cleaning device, especially for the cleaning equipment of solar silicon wafers.
Background technology
Traditional silicon wafer cleaner is directly gas connection between purge chamber and drying chamber, is placed on the transport part after silicon chip cleans and transports in the drying chamber.Because the non-sealing fully in the charging aperture place of drying chamber, a large amount of gas will be easy to enter the drying chamber from the purge chamber, at this moment, contain a large amount of cleanings and will cause the pollution of having cleaned the silicon chip surface of finishing with the gas of chemicals, cause cleaning incomplete.In addition, because also non-tight of the discharging opening place of drying chamber, therefore, extraneous air also is easy to enter and pollutes silicon chip surface in the drying chamber.
The utility model content
In view of this, need provide a kind of wafer cleaning device, this wafer cleaning device can reduce purge chamber and the pollution of extraneous air in the follow-up dry run wafer being caused.
Wafer cleaning device according to embodiment of the present utility model comprises: the purge chamber; Drying chamber, the adjacent setting of described drying chamber with described purge chamber; And transport part, described transport part is run through described drying chamber and is provided with, be used for wafer to be cleaned is transferred to drying chamber from the purge chamber, wherein said drying chamber further comprises: be used to be transported into and transport the charging aperture and the discharging opening of described wafer to be cleaned, charging aperture is passed through in described transport part; At least one air inlet, described air inlet is arranged on the top of described transport part; With corresponding at least one heater of described air inlet, be used to heat gas supplied; Be arranged on the suction opeing of described transport part and a relative side of air inlet, be used to discharge the gas in the drying chamber; With the first gas flow guiding spare, the described first gas flow guiding spare is arranged on the upstream end of the transport part of running through described drying chamber and is positioned at a side of suction opeing, adjacent with described transport part, is used to stop from the air-flow of purge chamber flow into drying chamber from the upstream end of the transport part of running through described drying chamber.
According to wafer cleaning device of the present utility model, not only can avoid containing in the purge chamber a large amount of cleanings enters in the drying chamber with the gas of chemical article and reduces pollution in the follow-up dry run wafer being caused, can also reduce the pollution that extraneous air causes wafer in follow-up dry run, cleaning performance is good, and device structure is simple.
Wafer cleaning device according to embodiment of the present utility model also has following supplementary features:
Described drying chamber further comprises: the filter that at least one and described heater are oppositely arranged is used to filter heated gas.
In a kind of execution mode of the present utility model, in the described first gas flow guiding spare transmission direction that direction is parallel to described transport part is set.The hot blast that heated gas in the drying chamber forms is because the upstream portion of barrier effect in the transport part of the first gas flow guiding spare formed an enclosure space, the blocking-up air-flow flows to suction opeing fully, so that formed the air-flow that flows to the purge chamber, thereby stop air-flow to flow to drying chamber from the purge chamber.
In another kind of execution mode of the present utility model, the described first gas flow guiding spare is not less than the described first gas flow guiding spare away from an other end of upstream and the distance of described transport part near an end of upstream and the distance of described transport part.Like this, when heated gas moves downward on the first gas flow guiding spare that tilts above upstream portion, thereby reflexed to the charging aperture place owing to reflex by the first gas flow guiding spare and formed the air-flow that flows to the purge chamber, make upstream portion more effectively stop air-flow to flow to drying chamber, prevent that the air that flows out from the purge chamber from treating the surface of the wafer of oven dry and producing and stain from the purge chamber in the transport part.
In another kind of execution mode of the present utility model, the angle between described first gas flow guiding spare and the transport part is 5-30 degree or 10-60 degree.
Described drying chamber further comprises: the second gas flow guiding spare, the described second gas flow guiding spare is arranged on the upstream end of the transport part of running through described drying chamber and the side that in the vertical direction is positioned at suction opeing, and the described second air flow guiding spare is perpendicular to the transmission direction of described transport part.The setting of the second gas flow guiding spare also is flow to the air-flow of purge chamber for forming from drying chamber, thereby reaches the air-flow that stops the purge chamber to flow into drying chamber, prevents from that visceral-qi in the purge chamber from flowing to into drying chamber to bring staining wafer surface.
Described drying chamber further comprises: the 3rd gas flow guiding spare, described the 3rd gas flow guiding spare is arranged on the side that is positioned at suction opeing on the downstream part of the transport part of running through described drying chamber and the vertical direction, adjacent with described transport part, and the air-flow that is used to stop the drying chamber outside flows into drying chamber from the downstream part of the transport part of running through described drying chamber.Like this, the hot blast that heated gas in the drying chamber forms is because the barrier effect of the 3rd gas flow guiding spare has formed an enclosure space in the downstream part of transport part, the blocking-up air-flow flows to suction opeing fully, so that formed the air-flow that flows to discharging opening, thus can stop air-flow from outer flow to drying chamber and then stain wafer to be dried the drying chamber.
In described the 3rd gas flow guiding spare transmission direction that direction is parallel to described transport part is set.
Described the 3rd gas flow guiding spare is not less than described the 3rd gas flow guiding spare away from an other end in downstream and the distance of described transport part near an end in downstream and the distance of described transport part.Like this, when heated gas moves downward on the 3rd gas flow guiding spare that tilts above the downstream part, thereby reflexed to the discharging opening place owing to reflex by the 3rd gas flow guiding spare and formed the air-flow that flows out drying chamber, make more effectively to stop air-flow to flow into drying chamber, prevent to produce and stain from the surface that outside air is treated the wafer of oven dry from the outside in the downstream part of transport part.
In another kind of execution mode of the present utility model, the angle between described the 3rd gas flow guiding spare and the transport part is 5-30 degree or 10-60 degree.
Described drying chamber further comprises: the 4th gas flow guiding spare, described the 4th gas flow guiding spare is arranged on the downstream part of the transport part of running through described drying chamber and is positioned at a side of suction opeing, and in described the 4th gas flow guiding spare transmission direction of direction perpendicular to described transport part is set.The setting of the 4th gas flow guiding spare also is to flow to the air-flow of discharging opening for forming from drying chamber, thereby reaches prevention flows into drying chamber from the outside air-flow, prevents that extraneous air from entering drying chamber and bringing staining wafer surface.
In another execution mode of the present utility model, in the described first gas flow guiding spare transmission direction of direction perpendicular to described transport part be set.
The top of upstream end of running through the transport part of described drying chamber is provided with air inlet.
The top of upstream end of running through the transport part of described drying chamber is provided with heater.
The top of downstream part of running through the transport part of described drying chamber is provided with air inlet.
The top of downstream part of running through the transport part of described drying chamber is provided with heater.
Described drying chamber is provided with 3-4 air inlet, is separately positioned on the top or the side top of described drying chamber.
Described suction opeing place is provided with air exhauster, and the gas that described air exhauster is used for pumping turns back to described air inlet place.
Described drying chamber further is provided with: the Compressed Gas supply port, be used in described drying chamber, supplying with Compressed Gas, keeping the balance of gas flow in the drying chamber, described Compressed Gas can for compressed air, nitrogen or not with any other gas of wafer reaction.
Aspect that the utility model is additional and advantage part in the following description provide, and part will become obviously from the following description, or recognize by practice of the present utility model.
Description of drawings
Above-mentioned and/or additional aspect of the present utility model and advantage are from obviously and easily understanding becoming the description of embodiment below in conjunction with accompanying drawing, wherein:
Fig. 1 is the schematic internal view according to first example of the embodiment one of the drying chamber of wafer cleaning device of the present utility model, wherein, the first gas flow guiding spare 241 direction is set with parallel along the longitudinal direction;
Fig. 2 is the schematic internal view of second example of the embodiment one of the drying chamber shown in Fig. 1, wherein, the first gas flow guiding spare 241 direction is set;
Fig. 3 is the schematic internal view of the 3rd example of the embodiment one of the drying chamber shown in Fig. 1, wherein, the first gas flow guiding spare 241 that direction is set is vertical;
Fig. 4 is the schematic internal view according to the embodiment two of the drying chamber of wafer cleaning device of the present utility model;
Fig. 5 is the schematic internal view according to the embodiment three, four of the drying chamber of wafer cleaning device of the present utility model, wherein, the 3rd gas flow guiding spare 243 that direction is set is parallel with longitudinal direction;
Fig. 6 is the schematic internal view of the embodiment three, four of the drying chamber shown in Fig. 5, and wherein, the direction that is provided with of the 3rd gas flow guiding spare 243 tilts; And
Fig. 7 is the structural representation according to wafer cleaning device of the present utility model.
Embodiment
Describe embodiment of the present utility model below in detail, the example of described embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Below by the embodiment that is described with reference to the drawings is exemplary, only is used to explain the utility model, and can not be interpreted as restriction of the present utility model.
In description of the present utility model, term " interior ", " outward ", " on ", close the orientation of indications such as D score, " upstream ", " downstream " or position is based on orientation shown in the drawings or position relation, it only is the utility model rather than require the utility model therefore can not be interpreted as for convenience of description with specific orientation structure and operation to restriction of the present utility model.In description of the present utility model, term " laterally " refers to the direction perpendicular to the figure paper, and " vertically " refers to the transmission direction along the transport part, and " vertically " refers to above-below direction among the figure.In addition, the arrow in the accompanying drawing is represented gas flow.
Illustrate according to wafer cleaning device of the present utility model below with reference to Fig. 1-Fig. 7.
As Fig. 1-shown in Figure 6, according to the wafer cleaning device of embodiment of the present utility model, comprise purge chamber 1, with the drying chamber 2 and the transport part 3 of purge chamber's 1 adjacent setting.Wherein, transport part 3 is run through drying chamber 2 and is provided with, and is used for wafer to be cleaned 1 is transferred to drying chamber 2 from the purge chamber.Wherein, wafer 8 is placed on carrying basket 7, and carrying basket 7 is placed in the cleaning frame 6, and this cleaning frame 6 is transmitted portion 3 and is transported to the drying chamber 2 from purge chamber 1.
Shown in Fig. 1-7, drying chamber 2 comprise the charging aperture 27 that is used to be transported into and to transport wafer 8 to be cleaned and discharging opening 28, at least one air inlet 21, with air inlet 21 corresponding at least one heater 22, suction opeing 23 and gas conducting element.
The transport part of running through drying chamber 2 enters drying chamber 2 by charging aperture 27, then by discharging opening 28.In an example of the present utility model, the transport part can be for carrying out the transport tape 3 of shuttling movement in drying chamber 2, therefore, the cleaning frame 6 that is equipped with wafer 8 to be dried after the cleaning is placed on the upper strata transport tape 31 of transport tape 3, and from purge chamber 1, be transported in the drying chamber 2, then wafer 8 is transported drying chamber 2 and discharging by the oven dry back.
At least one air inlet 21 is arranged on the top of transport part 3, for example can be 1.In an example of the present utility model, air inlet 21 is arranged on the top of the upstream end of the transport part 3 of running through drying chamber 2.And in another example of the present utility model, air inlet 21 is provided with the top of the downstream part of the transport part 3 of running through drying chamber 2.Air inlet 21 for example also can be 3-4, is separately positioned on the top or the side top of drying chamber 2.
The below that at least one heater 22 is arranged on the top of transport part and is positioned at air inlet 21 is used for heating, drying chamber 2 from air inlet 21 gas supplied.In examples more of the present utility model, heater is arranged on the top of the upstream end of the transport part 3 of running through drying chamber 2.In other examples of the present utility model, heater is arranged on the top of the downstream part of the transport part 3 of running through drying chamber 2.
Suction opeing 23 is arranged on a relative side of described transport part and air inlet 21, promptly among the figure is the downside in the both sides up and down that are divided into, boundary with the charging aperture.Suction opeing 23 places are provided with air exhauster (figure does not show), and this air exhauster is used to discharge the gas in the drying chamber 2 and deliver to air inlet again, thereby makes hot blast inner loop in drying chamber 2.
In an example of the present utility model, also further comprise the filter 25 that at least one and heater 22 are oppositely arranged in the drying chamber 2.At least one filter 25 is all corresponding with at least one heater 22, and filter 25 be located at heater be used to filter the heated gas that blows on the wafer over against the below.
In addition, alternatively, on drying chamber 2, also be formed with Compressed Gas supply port 26, thereby can adopt Compressed Gas to mending wind in the drying chamber 2, to keep the balance of gas flow in the drying chamber 2.Described Compressed Gas can for compressed air, nitrogen or not with any other gas of wafer reaction.Compressed Gas supply port 26 for example can be arranged on the bottom of drying chamber 2 and be positioned at the below of transport part 3, also can be arranged on the top of drying chamber 2 and be positioned at filter 25 tops.
To be specifically described the setting of gas flow guiding spare by four embodiment below.
Embodiment one:
In the present embodiment, be provided with the first gas flow guiding spare 241, as shown in Figure 1-Figure 3.
The first gas flow guiding spare 241 is arranged on the upstream end of the transport part 3 of running through drying chamber 2 and a side that in the vertical direction is positioned at suction opeing 23, adjacent with transport part 3, for example be positioned at the next door of charging aperture 27 belows and transport part 3 among the figure, be used to stop from the air-flow of purge chamber 1 flow into drying chamber 2 from the upstream end of the transport part 3 of running through drying chamber 2.Like this, the hot blast that heated gas in the drying chamber 2 forms is because the upstream portion that acts on transport part 3 of the first gas flow guiding spare 241 has formed an enclosure space, so that formed the air-flow that flows to purge chamber 1, thereby stop air-flow 1 to flow to drying chamber 2 from the purge chamber.
In first example of the present utility model, in the first gas flow guiding spare 241 transmission direction (being longitudinal direction) that direction is parallel to transport part 3 is set, as shown in Figure 1.
In second example of the present utility model, the first gas flow guiding spare 241 is not less than the first gas flow guiding spare 241 away from an other end of upstream and the distance of transport part 3 near an end of upstream and the distance of transport part 3, thus, between the first gas flow guiding spare 241 and longitudinal direction horizontal line, formed an acute angle angle α, as shown in Figure 2, like this, when heated gas moves downward on the first gas flow guiding spare 241 that tilts above upstream portion, thereby reflexed to charging aperture 27 places owing to reflex by the first gas flow guiding spare 241 and formed the air-flow that flows to purge chamber 1, make in the transport part 3 upstream portion more effectively stop air-flow 1 to flow to drying chamber 2, prevent that from the purge chamber 1 air that flows out from treating the surface of the wafer 8 of oven dry and producing and stain from the purge chamber.According to an embodiment of the present utility model, the scope of this angle α can be the 5-30 degree.According to another one embodiment of the present utility model, described angle [alpha] can be the 10-60 degree.
Certainly, in the 3rd example of the present utility model, in the first gas flow guiding spare 241 transmission direction of direction perpendicular to transport part 3 be set, as shown in Figure 3.
In addition, in the present embodiment, Compressed Gas supply port 26 is alternatively, can adopt Compressed Gas to mending wind in the drying chamber 2, to keep the balance of gas flow in the drying chamber 2.
Embodiment two:
In the present embodiment, except the first gas flow guiding spare 241, drying chamber 2 also further comprises the second gas flow guiding spare 242, as shown in Figure 4.
The second gas flow guiding spare 242 is arranged on the upstream end of the transport part 3 of running through drying chamber 2 and is positioned at a side of suction opeing 23, promptly is positioned at the next door of charging aperture 27 belows and transport part 3 among Fig. 4, and the second air flow guiding spare is perpendicular to the transmission direction of transport part 3.
In the present embodiment, the first gas flow guiding spare 241 and the second gas flow guiding spare 242 can adopt simultaneously, also can only adopt one of them, purpose is formation flows to purge chamber 1 from drying chamber 2 air-flow, thereby reach the air-flow that stops purge chamber 1 to flow into drying chamber 2, prevent from that visceral-qi in the purge chamber from flowing to into drying chamber 2 to bring staining wafer surface.But it should be noted that the first gas flow guiding spare 241 that the transmission direction perpendicular to transport part 3 in the 3rd example of previous embodiment one is provided with adopts separately gets final product, and does not need to adopt simultaneously the second gas flow guiding spare 242.
With embodiment one, in the present embodiment, Compressed Gas supply port 26 is optional.
Embodiment three:
In the present embodiment, on the basis of previous embodiment one, two, drying chamber 2 further comprises the 3rd gas flow guiding spare 243, as shown in Figure 5 and Figure 6.
The 3rd gas flow guiding spare 243 is arranged on the downstream part of the transport part 3 of running through drying chamber 2 and a side that in the vertical direction is positioned at suction opeing 23, adjacent with transport part 3, promptly be positioned at the next door of discharging opening 28 belows and transport part 3, the air-flow that is used to stop drying chamber 2 outsides flows into drying chamber 2 from the downstream part of the transport part 3 of running through drying chamber 2.Like this, the hot blast that heated gas in the drying chamber 2 forms is because the downstream part that acts on transport part 3 of the 3rd gas flow guiding spare 243 has formed an enclosure space, so that formed the air-flow that flows to discharging opening 28, thus can stop air-flow from outer flow to drying chamber 2 and then stain treating the drying chamber 2 and dry wafer 8.
In the example of the utility model embodiment, in the 3rd gas flow guiding spare 243 transmission direction that direction is parallel to transport part 3 is set.As shown in Figure 5.
In another example of the utility model embodiment, the 3rd gas flow guiding spare 243 is not less than the 3rd gas flow guiding spare 243 away from an other end in downstream and the distance of transport part 3, as shown in Figure 6 near an end in downstream and the distance of transport part 3.Thus, between the 3rd gas flow guiding spare 243 and longitudinal direction horizontal line, formed an angle β, as shown in Figure 6, like this, when heated gas moves downward on the 3rd gas flow guiding spare 243 that tilts above the downstream part, thereby reflexed to discharging opening 28 places owing to reflex by the 3rd gas flow guiding spare 243 and formed the air-flow that flows out drying chamber 2, make in the transport part 3 downstream part more effectively stop air-flow to flow into drying chamber 2 from the outside, prevent to produce and stain from the surface that outside air is treated the wafer 8 of oven dry.According to an embodiment of the present utility model, the scope of this angle β can be the 5-30 degree.According to another one embodiment of the present utility model, described angle β can be the 10-60 degree.
In the present embodiment, on drying chamber 2, be formed with Compressed Gas mouth 26, thereby can adopt Compressed Gas to mending wind in the drying chamber 2, to keep the balance of gas flow in the drying chamber 2.
Embodiment four:
In the present embodiment, on the basis of previous embodiment three, drying chamber 2 also further comprises the 4th gas flow guiding spare 244, as Fig. 5-shown in Figure 6.
The 4th gas flow guiding spare 244 is arranged on the downstream part of the transport part 3 of running through drying chamber 2 and the side that in the vertical direction is positioned at suction opeing 23, promptly is positioned at the next door of discharging opening 28 belows and transport part 3 among the figure.In the 4th gas flow guiding spare 244 transmission direction of direction perpendicular to transport part 3 be set.
In the present embodiment, the 3rd gas flow guiding spare 243 and the 4th gas flow guiding spare 244 can adopt simultaneously, also can only adopt one of them, purpose is formation and flows to outside air-flow from drying chamber 2, stop the anti-air-flow that flows into drying chamber 2 of extraneous air thereby reach, prevent that extraneous air from entering drying chamber 2 and bringing staining wafer surface.
In the present embodiment, on drying chamber 2, be formed with Compressed Gas mouth 26, thereby can adopt Compressed Gas to mending wind in the drying chamber 2, to keep the balance of gas flow in the drying chamber 2.
In above-mentioned a plurality of embodiment of the present utility model, embodiment three and four is the air in the filtering drying chamber 2 more effectively, can be used for containing in the gas in the purge chamber 1 a large amount of cleanings with chemical article or the dirtier situation of drying chamber 2 extraneous airs.And, adopt embodiment one and embodiment two to be effective under the comparatively clean situation of drying chamber 2 extraneous airs.
Be that example illustrates according to the course of work in the drying chamber of wafer cleaning device of the present utility model with embodiment four below, wherein, with the first and the 3rd gas flow guiding spare to be provided with that direction tilts be that example describes.
As shown in Figure 7, at first, the cleaning frame 6 that carries basket 7 by carrying basket 7 and placement when wafer to be dried 8 is put on the upper strata transport tape 31 of transport tape 3, and is transported in the drying chamber 2 from purge chamber 1.
Then, gas is infeeded in the drying chamber 2 by air inlet 21, and is heated by heater 22, simultaneously, filters by filter, so that drying wafer 8 is dried operation.
Simultaneously, the hot blast that heated gas forms is because the upstream portion that acts on transport part 3 of the first gas flow guiding spare 241 has formed an enclosure space, and because the downstream part that acts on transport part 3 of the 3rd gas flow guiding spare 243 has formed an enclosure space, like this, 3 upstream portion and downstream part have formed air-flow that flows to purge chamber 1 and the air-flow that flows to discharging opening 28 respectively in the transport part, thereby stoped the air-flow that contains chemicals in the purge chamber 1 to flow to drying chamber 2 from the purge chamber, stoped extraneous air to flow in the drying chamber 2 simultaneously, thus, avoided pollution to wafers in the drying chamber 2.
At last, wafer 8 is transported drying chamber 2 and discharging after oven dry.
In addition, as shown in Figure 7, can also comprise feeding platform 5 and blanking bench 5 according to wafer cleaning device of the present utility model.Wherein, feeding platform 5 is adjacent to purge chamber 1 and be positioned at the upstream of purge chamber, is used for supplying with in the purge chamber wafer to be cleaned.And blanking bench 5 and drying chamber 2 are adjacent and be positioned at the downstream of drying chamber, are used to export the wafer that has cleaned and dried.
According to wafer cleaning device of the present utility model, can avoid containing in the purge chamber a large amount of cleanings enters in the drying chamber with the gas of chemical article and reduces pollution in the follow-up dry run wafer being caused, can also reduce the pollution that extraneous air causes wafer in follow-up dry run, cleaning performance is good, and device structure is simple.According to wafer cleaning device of the present utility model, for example can be used to cleaning silicon chip.
Any mentioning " embodiment ", " embodiment ", " illustrative examples " etc. mean concrete member, structure or the characteristics described in conjunction with this embodiment and are contained among at least one embodiment of the present utility model.Not necessarily refer to identical embodiment in this schematic statement everywhere of this specification.And when describing concrete member, structure or characteristics in conjunction with any embodiment, what advocated is, realizes that in conjunction with other embodiment such member, structure or characteristics all drop within those skilled in the art's the scope.
Although embodiment of the present utility model is described in detail with reference to a plurality of illustrative examples of the present utility model, but it must be understood that, those skilled in the art can design multiple other improvement and embodiment, and these improve and embodiment will drop within the spirit and scope of the utility model principle.Particularly, within the scope of aforementioned open, accompanying drawing and claim, can make rational modification and improvement aspect the layout of parts and/or subordinate composite configuration, and can not break away from spirit of the present utility model.Except the modification and the improvement of parts and/or layout aspect, its scope is limited by claims and equivalent thereof.
Claims (15)
1. a wafer cleaning device is characterized in that, comprising:
The purge chamber;
Drying chamber, the adjacent setting of described drying chamber with described purge chamber; And
The transport part, described transport part is run through described drying chamber and is provided with, and is used for wafer to be cleaned is transferred to drying chamber from the purge chamber, wherein
Described drying chamber further comprises:
Be used to be transported into and transport the charging aperture and the discharging opening of described wafer to be cleaned, charging aperture is passed through in described transport part;
At least one air inlet, described air inlet is arranged on the top of described transport part;
With corresponding at least one heater of described air inlet, be used to heat gas supplied;
Be arranged on the suction opeing of described transport part and a relative side of air inlet, be used to discharge the gas in the drying chamber; With
The first gas flow guiding spare, the described first gas flow guiding spare is arranged on the upstream end of the transport part of running through described drying chamber and is positioned at a side of suction opeing, adjacent with described transport part, is used to stop from the air-flow of purge chamber flow into drying chamber from the upstream end of the transport part of running through described drying chamber.
2. wafer cleaning device according to claim 1 is characterized in that, described drying chamber further comprises:
The filter that at least one and described heater are oppositely arranged is used to filter heated gas.
3. wafer cleaning device according to claim 1 is characterized in that, the described first gas flow guiding spare is not less than the described first gas flow guiding spare away from an other end of upstream and the distance of described transport part near an end of upstream and the distance of described transport part.
4. according to claim 1 or 3 described wafer cleaning devices, it is characterized in that described drying chamber further comprises:
The second gas flow guiding spare, the described second gas flow guiding spare are arranged on the upstream end of the transport part of running through described drying chamber and the side that in the vertical direction is positioned at suction opeing, and the described second air flow guiding spare is perpendicular to the transmission direction of described transport part.
5. according to claim 1 or 3 described wafer cleaning devices, it is characterized in that described drying chamber further comprises:
The 3rd gas flow guiding spare, described the 3rd gas flow guiding spare is arranged on the side that is positioned at suction opeing on the downstream part of the transport part of running through described drying chamber and the vertical direction, adjacent with described transport part, and the air-flow that is used to stop the drying chamber outside flows into drying chamber from the downstream part of the transport part of running through described drying chamber.
6. wafer cleaning device according to claim 5 is characterized in that, described the 3rd gas flow guiding spare is not less than described the 3rd gas flow guiding spare away from an other end in downstream and the distance of described transport part near an end in downstream and the distance of described transport part.
7. according to claim 1 or 3 described wafer cleaning devices, it is characterized in that described drying chamber further comprises:
The 4th gas flow guiding spare, described the 4th gas flow guiding spare are arranged on the downstream part of the transport part of running through described drying chamber and are positioned at a side of suction opeing, and in described the 4th gas flow guiding spare transmission direction of direction perpendicular to described transport part are set.
8. wafer cleaning device according to claim 1 is characterized in that, in the described first gas flow guiding spare transmission direction of direction perpendicular to described transport part is set.
9. wafer cleaning device according to claim 1 is characterized in that, the top of upstream end of running through the transport part of described drying chamber is provided with air inlet.
10. wafer cleaning device according to claim 1 is characterized in that, the top of upstream end of running through the transport part of described drying chamber is provided with heater.
11. wafer cleaning device according to claim 1 is characterized in that, the top of downstream part of running through the transport part of described drying chamber is provided with air inlet.
12. wafer cleaning device according to claim 1 is characterized in that, the top of downstream part of running through the transport part of described drying chamber is provided with heater.
13. wafer cleaning device according to claim 1 is characterized in that, described drying chamber is provided with 3-4 air inlet, is separately positioned on the top or the side top of described drying chamber.
14. wafer cleaning device according to claim 1 is characterized in that, described suction opeing place is provided with air exhauster, and the gas that described air exhauster is used for pumping turns back to described air inlet place.
15. wafer cleaning device according to claim 1 is characterized in that, described drying chamber further is provided with:
The Compressed Gas supply port is used for supplying with Compressed Gas in described drying chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202365905U CN201699041U (en) | 2010-06-17 | 2010-06-17 | Wafer cleaner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202365905U CN201699041U (en) | 2010-06-17 | 2010-06-17 | Wafer cleaner |
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| Publication Number | Publication Date |
|---|---|
| CN201699041U true CN201699041U (en) | 2011-01-05 |
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| CN2010202365905U Expired - Lifetime CN201699041U (en) | 2010-06-17 | 2010-06-17 | Wafer cleaner |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101887844A (en) * | 2010-06-17 | 2010-11-17 | 王敬 | Wafer cleaning device |
| CN108461578A (en) * | 2018-04-09 | 2018-08-28 | 绍兴文理学院 | A kind of photovoltaic panel cleaning integrated apparatus |
-
2010
- 2010-06-17 CN CN2010202365905U patent/CN201699041U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101887844A (en) * | 2010-06-17 | 2010-11-17 | 王敬 | Wafer cleaning device |
| CN101887844B (en) * | 2010-06-17 | 2012-01-11 | 王敬 | Wafer cleaning device |
| CN108461578A (en) * | 2018-04-09 | 2018-08-28 | 绍兴文理学院 | A kind of photovoltaic panel cleaning integrated apparatus |
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Granted publication date: 20110105 Effective date of abandoning: 20120111 |