CN201693450U - Chip double-side grinding and polishing machine - Google Patents
Chip double-side grinding and polishing machine Download PDFInfo
- Publication number
- CN201693450U CN201693450U CN2010202243683U CN201020224368U CN201693450U CN 201693450 U CN201693450 U CN 201693450U CN 2010202243683 U CN2010202243683 U CN 2010202243683U CN 201020224368 U CN201020224368 U CN 201020224368U CN 201693450 U CN201693450 U CN 201693450U
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- bistrique
- frame
- buffing machine
- grinding head
- chip according
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- Expired - Lifetime
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- 238000000227 grinding Methods 0.000 title claims abstract description 41
- 238000005498 polishing Methods 0.000 title description 5
- 230000005540 biological transmission Effects 0.000 claims abstract description 3
- 238000012545 processing Methods 0.000 abstract description 9
- 208000001840 Dandruff Diseases 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 abstract 1
- 238000003754 machining Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 230000003321 amplification Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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Abstract
The utility model relates to a mechanical equipment, a two-sided machine of throwing that grinds of chip promptly, including frame and bistrique, its characterized in that: the two grinding heads (8, 9) are oppositely arranged on the frame (1) and are driven to rotate by different transmission devices respectively, wherein at least one grinding head is provided with a feeding device, and a workpiece clamping mechanism is arranged between the two grinding heads. The beneficial effects are that: double-side grinding can be realized, and the parallelism and distance precision between the processing surfaces are improved; the planet wheel is convenient to mount and can simultaneously process a plurality of workpieces; the processing tracks on the surface of the workpiece are crossed in two directions, the chip removing force is strong and uniform, and the surface flatness is high; the annular fixture is adopted, so that the fixture is suitable for workpieces with different sizes, the force is applied uniformly, and the clamping deformation of the workpieces is avoided; the online detection device is arranged to realize automatic control and improve the processing efficiency and the surface quality.
Description
Technical field
The utility model relates to a kind of plant equipment, the two-sided lapping and buffing machine of promptly a kind of chip.
Background technology
Along with the development of modern science and technology and industrialization, silicon single crystal wafer has obtained increasingly extensive application in electronics, optics, instrument and meter, space flight and aviation, field such as civilian.Chip is many in process will to carry out high-precision grinding and polishing.As the processing of large scale integrated chip, parameters such as the depth of parallelism between flatness, roughness and each face of each machined surface, gauge tolerance all there is high required precision.Obviously, realize the processing of grinding and polishing simultaneously of many sides, significant for the precision that improves many side views and position.; the equipment that can grind a plurality of sides at present simultaneously all belongs to the free abrasive process equipment; be free to slide, roll and impact and finish process of lapping by the free abrasive particle that disperses; this technology can only promote the surface smoothness of workpiece; can not determine the morpheme relation between each side; and efficient and precision are all very low, and cleaning smear metal and abrasive particle are also cumbersome, very easily cause the scuffing of finished surface.The polishing grinding equipment that can carry out the quantitative grinding of morpheme then mostly is the single face equipment for grinding, can't carry out twin grinding simultaneously.Grind a plurality of sides with this equipment, need the angle of conversion work or the location that is installed repeatedly, all can form bigger error.Simultaneously, existing equipment also can produce a large amount of grinding heats in grinding process, and the workpiece clamping mode mostly is a little fixing in addition, unbalance stress, and the surface integrity of workpiece very easily worsens, and the precision of shape and position is wayward.All this reasons make the chip manufacture cost high, account for the 30-50% of goods totle drilling cost at least, and height then reaches 90%, has had a strong impact on the extensive use of chip.Therefore, improving chip manufacture equipment, improve technological level, reduce production costs, is the common objective of going together both at home and abroad.
Summary of the invention
The purpose of this utility model is: provides a kind of and can carry out twin grinding simultaneously, and machining accuracy height, the two-sided lapping and buffing machine of quality chip good, that efficient is high, easy and simple to handle, with low cost.
Above-mentioned purpose is realized by following technical scheme: develop the two-sided lapping and buffing machine of a kind of chip, comprise frame and bistrique.Be characterized in: said bistrique has two, is installed in relatively on the frame, respectively by different transmission device driven rotary, wherein has at least a bistrique to be provided with feed arrangement, is provided with the workpiece clamping body between two bistriques.
Said bistrique has last bistrique and following bistrique, be installed on the frame relatively up and down, frame has the guide rail of two settings, respectively assemble the traveller that can slide up and down on the guide rail, two travellers upper end has just connected a crossbeam, grinding head motor is equipped with in top, crossbeam middle part, and the power output shaft of last grinding head motor is passed down through crossbeam and connects goes up bistrique; Frame lower is provided with platform, and grinding head motor is housed down above the platform, and the upper end assembling of following grinding head motor power output shaft is bistrique down, the following workpiece clamping device that is provided with above the bistrique; Both sides respectively connect a feed screw below the crossbeam, and platform is passed in the feed screw lower end, match the feeding driven by motor of feed gear wheel below platform with the center screw of feed gear wheel.
Said bistrique down is a planet circular system of being made up of centre wheel, planetary gear and external toothing, wherein, centre wheel is connected mutually with the power output shaft upper end of following grinding head motor, external toothing is an internal gear, ring diameter is greater than the external diameter of centre wheel in it, external toothing is sleeved on the outside of centre wheel, links to each other with support by supporting plate; Be engaged with one or more planetary gears between centre wheel and the external toothing, planetary mesopore is the workpiece clamping port, the ring-type abrasive disc is housed below the centre wheel, and the upper surface of abrasive disc is relative with planetary lower surface.
Said planetary workpiece clamping port periphery has the jump ring groove, and equipped ring-type jump ring in the jump ring groove, jump ring one end hinge are on bottom land, and the other end outside is that self-locking cooperates with the eccentric colyliform kayser outer surface of hinge on bottom land.
Also be provided with automaton on the said frame.
Said automaton is the pressure sensor that is contained on the grinding head motor power output shaft.
Said automaton be contained in below the crossbeam and down above the bistrique position sensor.
The beneficial effects of the utility model are: can realize the double-side grinding of chip in a clamping of workpiece, improve the depth of parallelism and gauge precision between the machined surface; Planetary gear is easy for installation, can process a plurality of workpiece simultaneously; Surface of the work processing texture track is bidirectional crossed, does not have the texture that direction is consistent and overlap, and anti-dandruff power is strong and even, the surface smoothness height; Employing ring-type jig is suitable for workpieces with different sizes, and uniform force application, avoids the clamping deformation of workpiece; On-line measuring device is housed, carries out control automatically, improve working (machining) efficiency and workpiece surface quality.
Description of drawings
Fig. 1 is the front view of a kind of embodiment;
Fig. 2 is the vertical view of this embodiment;
Fig. 3 is the upward view of this embodiment;
Fig. 4 is the enlarged front view of bistrique assembly under the parts of this embodiment;
Fig. 5 is the amplification plan view of bistrique assembly under the parts of this embodiment;
Fig. 6 is the enlarged front view of the parts planetary gear of this embodiment;
Fig. 7 is the amplification plan view of the parts planetary gear of this embodiment;
Fig. 8 is the enlarged front view of the parts jump ring of this embodiment;
Fig. 9 is the amplification plan view of the parts jump ring of this embodiment;
Figure 10 is the parts planetary gear of this embodiment and the assembling front view of jump ring;
Figure 11 is the parts planetary gear of this embodiment and the assembling plan view of jump ring;
Figure 12 is the profile of the parts planetary gear card engaging workpiece of this embodiment.
Among the figure as seen: frame 1, guide rail 2, traveller 3, crossbeam 4, last grinding head motor 5, pressure sensor 6, position sensor 7, last bistrique 8, following bistrique 9, leading screw 10, platform 11, following grinding head motor 12, feeding motor 13, feed gear wheel 14, support 15, supporting plate 16, abrasive disc 17, base plate 18, centre wheel 19, planetary gear 20, external toothing 21, workpiece 22, jump ring 23, workpiece clamping port 24, jump ring groove 25, kayser 26.
The specific embodiment
The total design of the utility model is: adopt two bistriques of installing relatively, simultaneously grinding is carried out in the workpiece both sides, thereby improve machining accuracy and working (machining) efficiency.Only introduce a kind of embodiment below:
As shown in Figure 1, 2, 3, the guide rail 2 that a setting is respectively arranged about above the frame of this equipment, each equipped traveller 3 of guide rail 2 the insides, a crossbeam 4 is supported in the upper end of two travellers 3, the top is equipped with one and is gone up grinding head motor 5 in the crossbeam 4, and the downward crossbeam 4 of crossing of the power output shaft of motor 5 assembles a upward bistrique 8, and a platform 11 is arranged at the bottom of frame 1, a following grinding head motor 12 is housed, following bistrique 9 of power output shaft upper end assembling of following grinding head motor 12 above the platform 11.Respectively there is a rhizoid thick stick 10 both sides below crossbeam 4, and leading screw 10 is passed down through platform 11 and joins the center screw the inside that is inserted in feed gear wheel 14.Feed gear wheel 14 is driven by change-speed gearing by feeding motor 13.In addition, a pressure sensor 6 is housed, a position sensor 7 is housed below crossbeam 4 in the power output shaft bottom of last grinding head motor 5.
Descending bistrique 9 as can be known in conjunction with Fig. 4,5 is planet circular systems.The center of planet circular system is that the periphery is the external toothing 21 by support 15 and supporting plate 16 together support, can be equipped with one or more planetary gears 20 between centre wheel 19 and the external toothing 21 by the centre wheel 19 of the power output shaft support of following grinding head motor 12.In conjunction with Fig. 6,7 as seen: the mesopore of planetary gear 20 is workpiece clamping ports 24 of plug-in mounting workpiece 22, and the mesopore periphery has the jump ring groove 25 of big half-turn, and jump ring groove 25 the insides are furnished with a jump ring 23.In conjunction with Fig. 8,9 as seen, jump ring 23 is steel discs of a large semi-circular, and one is porose, can be on the bottom land of jump ring groove 25 by pin hinge, and the other end is fish tail shape, and just match with a kayser 26 in its outside.Axis hole and pull the hole is arranged above the kayser 26, and axis hole is in eccentric position, can make kayser 26 and bottom land hinge mutually by rotating shaft, pulls the hole and can insert special spanner.In conjunction with Figure 10,11,12 as seen, the workpiece 22 workpiece clamping port 24 of packing into, to the kayser 26 of intort eccentric wheel shape, can in push away jump ring 23 workpiece pressings 22, the contact-making surface of jump ring 23 and kayser 26 forms self-locking simultaneously, is difficult for loosening.When the workpiece completion of processing, oppositely twist spanner, jump ring 23 opens, and can take out workpiece 22.
Fig. 4,5 also can see: one deck base plate 18 that is connected below the centre wheel 19, have annular groove above the base plate 18, and annular abrasive disc 17 is housed in the groove, the workpiece clamping port of annular abrasive disc 17 and planetary gear 20 24 is relative and certain clearance arranged.In conjunction with Figure 12 as seen, when workpiece was packed clamping port 24 into, the upper and lower end face with centre wheel was all given prominence in its upper and lower end face, and like this, workpiece can contact with abrasive disc and grind, and planetary gear 20 then can not wear and tear.
According to the characteristics of planet circular system as can be known: workpiece is when being subjected to a certain rotation direction grinding, and itself is also pressing the rotation of equidirectional or rightabout.The opposite spin grinding effect is self-evident, even equidirectional rotation because rotating speed differs greatly, also can be ground.Therefore, no matter under which kind of situation, the machining locus on the surface of the work is not a kind of unidirectional camber line, but two kinds of camber lines that oppositely intersect.This trace specification workpiece is subjected to two rightabout grindings simultaneously, be equivalent to grinding repeatedly, and the processing texture that does not have direction one to make peace and overlap, surface quality and machining accuracy obviously improve, and anti-dandruff effect is better than unidirectional grinding, thereby under the situation of small feeding, still can obtain effective anti-dandruff effect, so be fit to very much the high accuracy polishing technology of chip.
Because the requirement on machining accuracy height has exceeded the scope that manual operation can reach, and therefore, has assembled automatic control system on this equipment.Automatic control system comprises position sensor 7 and pressure sensor 6.Position sensor 7 is formed with the laser pickoff that is contained in down above the bistrique by being contained in crossbeam 4 following generating lasers.Pressure sensor 6 adopts the sound wave emission sensor, is contained in the power output shaft lower end of grinding head motor 5.During operation, when last bistrique does not have contact workpiece or insufficient pressure, after the sound wave emission sensor is handled voice signal, send the feeding instruction, make bistrique and Work-sheet pressing to following feeding motor 13.Because planetary gear 20 can fluctuate, workpiece produces by deadweight at ordinary times to the pressure of following bistrique, and when last bistrique compressed downwards, the workpiece pressure at both sides equated.When the workpiece completion of processing, the generating laser of position sensor 7 and receiver pass to feeding motor 13 to measured distance signal, make it stop and reversing, and leading screw 10 and feed gear wheel 14 screws cooperate in the ejection bistrique 8 up, can take off workpiece.
Claims (9)
1. two-sided lapping and buffing machine of chip, comprise frame and bistrique, it is characterized in that: said bistrique (8,9) has two, be installed in relatively on the frame (1), respectively by different transmission device driven rotary, wherein have at least a bistrique to be provided with feed arrangement, be provided with the workpiece clamping body between two bistriques.
2. the two-sided lapping and buffing machine of a kind of chip according to claim 1, it is characterized in that: said bistrique has last bistrique (8) and following bistrique (9), be installed in relatively up and down on the frame (1), frame (1) has the guide rail (2) of two settings, respectively assemble the traveller that can slide up and down (3) on the guide rail (2), two travellers (3) upper end has just connected a crossbeam (4), grinding head motor (5) is equipped with in top, crossbeam (4) middle part, and the power output shaft of last grinding head motor (5) is passed down through crossbeam (4) and connects goes up bistrique (8); Frame (1) bottom is provided with platform (11), and grinding head motor (12) is housed down above the platform (11), and the power output shaft upper end assembling of following grinding head motor (12) is bistrique (9) down, is provided with workpiece clamping device above the following bistrique (9); Both sides respectively connect a feed screw (10) below the crossbeam (4), and platform (11) is passed in feed screw (10) lower end, match with the center screw of feed gear wheel (14), and the feeding motor (13) of feed gear wheel (14) below platform (11) drives.
3. the two-sided lapping and buffing machine of a kind of chip according to claim 2, it is characterized in that: said bistrique (9) down is a planet circular system of being made up of centre wheel (19), planetary gear (20) and external toothing (21), wherein, centre wheel (19) is connected mutually with the power output shaft of following grinding head motor (12), external toothing (21) is an internal gear, ring diameter is greater than the external diameter of centre wheel (19) in it, and external toothing (21) is sleeved on the outside of centre wheel (19), links to each other with frame (1) by support (15); Between centre wheel (19) and the external toothing (21) one or more planetary gears (20) are arranged, the mesopore of planetary gear (20) is workpiece clamping port (24), ring-type abrasive disc (17) is housed below the centre wheel (19), and the upper surface of abrasive disc (17) is relative with the lower surface of planetary gear (20).
4. the two-sided lapping and buffing machine of a kind of chip according to claim 3, it is characterized in that: said planetary workpiece clamping port (24) periphery has jump ring groove (25), equipped ring-type jump ring (23) in the jump ring groove (25), jump ring (23) one end hinges are on jump ring groove (25) bottom land, and the other end outside is that self-locking cooperates with the outer surface of the eccentric colyliform kayser (26) of hinge on jump ring groove (25) bottom land.
5. the two-sided lapping and buffing machine of a kind of chip according to claim 1 is characterized in that: said frame also is provided with automaton on (1).
6. the two-sided lapping and buffing machine of a kind of chip according to claim 5 is characterized in that: said automaton is the pressure sensor (6) that is contained on grinding head motor (5) power output shaft.
7. the two-sided lapping and buffing machine of a kind of chip according to claim 6 is characterized in that: said pressure sensor (6) is a kind of sound wave emission sensor.
8. the two-sided lapping and buffing machine of a kind of chip according to claim 5 is characterized in that: said automaton is to be contained in below the crossbeam (4) and the position sensor (7) above the following bistrique (9).
9. the two-sided lapping and buffing machine of a kind of chip according to claim 8 is characterized in that: said position sensor (7) is a kind of generating laser and receiver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202243683U CN201693450U (en) | 2010-05-31 | 2010-05-31 | Chip double-side grinding and polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202243683U CN201693450U (en) | 2010-05-31 | 2010-05-31 | Chip double-side grinding and polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201693450U true CN201693450U (en) | 2011-01-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202243683U Expired - Lifetime CN201693450U (en) | 2010-05-31 | 2010-05-31 | Chip double-side grinding and polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201693450U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101875181A (en) * | 2010-05-31 | 2010-11-03 | 青岛理工大学 | Grinding machine tool for brittle and hard materials |
| CN103962934A (en) * | 2013-01-25 | 2014-08-06 | 上海浦东汉威阀门有限公司 | Valve sealing surface grinding miller |
| CN105522460A (en) * | 2015-12-09 | 2016-04-27 | 安徽锐富光电科技有限公司 | Flat-grinding machine for polishing inner screens of mobile phones |
| CN105856049A (en) * | 2016-04-14 | 2016-08-17 | 南通德瑞森复合材料有限公司 | Polishing equipment for glass reinforced plastic pipe |
| CN105945664A (en) * | 2016-06-24 | 2016-09-21 | 无锡欧诺锁业有限公司 | High-efficiency polishing machine |
| CN106002515A (en) * | 2016-07-18 | 2016-10-12 | 宁波市鄞州茂鑫机械有限公司 | High-precision sheet workpiece vertical double-surface grinding machine |
| CN113090101A (en) * | 2021-04-17 | 2021-07-09 | 烟台工程职业技术学院(烟台市技师学院) | 5G distributed network architecture communication tower erection device |
| CN116372682A (en) * | 2023-06-05 | 2023-07-04 | 成都新利精密刀具有限公司 | Planetary gear train grinding device for double-sided grinding of circular blade |
| CN117798802A (en) * | 2024-03-01 | 2024-04-02 | 苏州中航天成电子科技有限公司 | Polishing equipment for metal packaging shell |
-
2010
- 2010-05-31 CN CN2010202243683U patent/CN201693450U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101875181A (en) * | 2010-05-31 | 2010-11-03 | 青岛理工大学 | Grinding machine tool for brittle and hard materials |
| CN103962934A (en) * | 2013-01-25 | 2014-08-06 | 上海浦东汉威阀门有限公司 | Valve sealing surface grinding miller |
| CN105522460A (en) * | 2015-12-09 | 2016-04-27 | 安徽锐富光电科技有限公司 | Flat-grinding machine for polishing inner screens of mobile phones |
| CN105856049A (en) * | 2016-04-14 | 2016-08-17 | 南通德瑞森复合材料有限公司 | Polishing equipment for glass reinforced plastic pipe |
| CN105856049B (en) * | 2016-04-14 | 2017-12-29 | 南通德瑞森复合材料有限公司 | A kind of glass reinforced plastic pipe sanding and polishing equipment |
| CN105945664A (en) * | 2016-06-24 | 2016-09-21 | 无锡欧诺锁业有限公司 | High-efficiency polishing machine |
| CN106002515A (en) * | 2016-07-18 | 2016-10-12 | 宁波市鄞州茂鑫机械有限公司 | High-precision sheet workpiece vertical double-surface grinding machine |
| CN113090101A (en) * | 2021-04-17 | 2021-07-09 | 烟台工程职业技术学院(烟台市技师学院) | 5G distributed network architecture communication tower erection device |
| CN116372682A (en) * | 2023-06-05 | 2023-07-04 | 成都新利精密刀具有限公司 | Planetary gear train grinding device for double-sided grinding of circular blade |
| CN116372682B (en) * | 2023-06-05 | 2023-08-11 | 成都新利精密刀具有限公司 | Planetary gear train grinding device for double-sided grinding of circular blade |
| CN117798802A (en) * | 2024-03-01 | 2024-04-02 | 苏州中航天成电子科技有限公司 | Polishing equipment for metal packaging shell |
| CN117798802B (en) * | 2024-03-01 | 2024-05-14 | 苏州中航天成电子科技有限公司 | Polishing equipment for metal packaging shell |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20110105 Effective date of abandoning: 20120222 |