CN201681838U - Embedded type single-base-island multi-circle-lead-pin lead wire frame structure - Google Patents
Embedded type single-base-island multi-circle-lead-pin lead wire frame structure Download PDFInfo
- Publication number
- CN201681838U CN201681838U CN2010201731590U CN201020173159U CN201681838U CN 201681838 U CN201681838 U CN 201681838U CN 2010201731590 U CN2010201731590 U CN 2010201731590U CN 201020173159 U CN201020173159 U CN 201020173159U CN 201681838 U CN201681838 U CN 201681838U
- Authority
- CN
- China
- Prior art keywords
- pin
- lead
- back side
- lead pins
- base island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to an embedded type single-base-island multi-circle-lead-pin lead wire frame structure, which comprises a base island (1) and lead pins (2), wherein the front sides of the base island (1) and the lead pins (2) are provided with first metal layers (4), the back side of the lead pins (2) is provided with a second metal layer (5), the number of the base island (1) is one, the number of the lead pins (2) is multiple circles, filling-material-free plastic encapsulation materials (3) are embedded and arranged on the outer periphery of the lead pins (2), at the back side of the base island (1), in regions between the base island (1) and the lead pin (2) and in regions between the lead pins (2) and the lead pins (2), the outer periphery of the lower part of the lead pins (2), the back side of the base island (1), the lower parts of the back side of the base island (1) and the lead pins (2) and the lower parts of the lead pins (2) and the lead pins (2) are connected into a whole body, and in addition, the dimension of the back side of the lead pins (2) is smaller than that of the front side of the lead pins (2) for forming a lead pin structure with the larger upper part and the smaller lower part. The utility model has the advantages that the bonding capability of a plastic encapsulation body and the metal pins is strong.
Description
(1) technical field
The utility model relates to a kind of baried type list base island multi-turn pin lead frame structure.Belong to the semiconductor packaging field.
(2) background technology
Traditional baried type list base island multi-turn pin lead frame structure, detailed following explanation:
After chemical etching and surface electrical coating are carried out in the front of employing metal substrate, promptly finish the making (as shown in Figure 2) of lead frame.Back etched is then carried out at the back side of lead frame again in encapsulation process.
And the not enough point of above-mentioned lead frame below in encapsulation process, having existed:
The lead frame structure of this kind has carried out etching partially technology in the metal substrate front, because only carried out the work that etches partially in the metal substrate front, and plastic packaging material only envelopes the height of half pin in the plastic packaging process, so the constraint ability of plastic-sealed body and metal leg has just diminished, when if the plastic-sealed body paster is not fine to pcb board, do over again again and heavily paste, with regard to the problem (as shown in Figure 3) that is easy to generate pin.
Especially the kind of plastic packaging material is to adopt when filler is arranged, because material is at the environment and the follow-up surface-pasted stress changing relation of production process, can cause metal and plastic packaging material to produce the crack of vertical-type, its characteristic is the high more then hard more crisp more crack that is easy to generate more of proportion of filler.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and the big baried type list base island multi-turn pin lead frame structure of constraint ability of a kind of plastic-sealed body and metal leg is provided.
The purpose of this utility model is achieved in that a kind of baried type list base island multi-turn pin lead frame structure, comprise Ji Dao and pin, front at described Ji Dao and pin is provided with the first metal layer, be provided with second metal level at the back side of described pin, described Ji Dao has one, pin has multi-turn, in described pin periphery, the Ji Dao back side, zone between zone between Ji Dao and the pin and pin and the pin is equipped with packless plastic packaging material, described packless plastic packaging material is with periphery, pin bottom, the Ji Dao back side, the bottom of the bottom of the Ji Dao back side and pin and pin and pin links into an integrated entity, and make described pin back side size less than the positive size of pin, form up big and down small pin configuration.
The beneficial effects of the utility model are:
1) because the zone between described metal leg and metal leg is equipped with packless soft gap filler, this packless soft gap filler has the filler plastic packaging material to envelope the height of whole metal leg with the routine in the plastic packaging process, so the constraint ability of plastic-sealed body and metal leg just becomes big, do not have the problem that produces pin again.
2) owing to adopted positive method of separating the etching operation with the back side, so in the etching operation, can form the slightly little and big slightly structure of positive basic island size of the size of back side Ji Dao, and slided by the tighter more difficult generation that packless plastic packaging material coated and falling pin with the size that varies in size up and down of a Ji Dao.
(4) description of drawings
Fig. 1 is the utility model baried type list base island multi-turn pin lead frame structure schematic diagram.
Fig. 2 was for formed insulation pin schematic diagram in the past.
Fig. 3 pin figure for what formed in the past.
Reference numeral among the figure:
Base island 1, pin 2, packless plastic packaging material 3, the first metal layer 4, second metal level 5.
(5) embodiment
Referring to Fig. 1, Fig. 1 is the utility model baried type list base island multi-turn pin lead frame structure schematic diagram.As seen from Figure 1, the utility model baried type list base island multi-turn pin lead frame structure, comprise basic island 1 and pin 2, front at described basic island 1 and pin 2 is provided with the first metal layer 4, be provided with second metal level 5 at the back side of described pin 2, described basic island 1 has one, pin 2 has multi-turn, in described pin 2 peripheries, 1 back side, base island, zone between base island 1 and the pin 2 and the zone between pin 2 and the pin 2 are equipped with packless plastic packaging material 3, described packless plastic packaging material 3 is with periphery, pin 2 bottom, 1 back side, base island, the bottom of base 1 back side, island and pin 2 and pin 2 link into an integrated entity with the bottom of pin 2, and make described pin 2 back side sizes less than pin 2 positive sizes, form up big and down small pin configuration.
Claims (1)
1. baried type list base island multi-turn pin lead frame structure, comprise Ji Dao (1) and pin (2), front at described Ji Dao (1) and pin (2) is provided with the first metal layer (4), be provided with second metal level (5) at the back side of described pin (2), it is characterized in that: described Ji Dao (1) has one, pin (2) has multi-turn, in described pin (2) periphery, Ji Dao (1) back side, zone between zone between Ji Dao (1) and the pin (2) and pin (2) and the pin (2) is equipped with packless plastic packaging material (3), described packless plastic packaging material (3) is with pin (2) periphery, bottom, Ji Dao (1) back side, the bottom of Ji Dao (1) back side and pin (2) and pin (2) link into an integrated entity with the bottom of pin (2), and make described pin (2) back side size less than the positive size of pin (2), form up big and down small pin configuration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201731590U CN201681838U (en) | 2010-04-21 | 2010-04-21 | Embedded type single-base-island multi-circle-lead-pin lead wire frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201731590U CN201681838U (en) | 2010-04-21 | 2010-04-21 | Embedded type single-base-island multi-circle-lead-pin lead wire frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201681838U true CN201681838U (en) | 2010-12-22 |
Family
ID=43346874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201731590U Expired - Lifetime CN201681838U (en) | 2010-04-21 | 2010-04-21 | Embedded type single-base-island multi-circle-lead-pin lead wire frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201681838U (en) |
-
2010
- 2010-04-21 CN CN2010201731590U patent/CN201681838U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101222 |
|
| CX01 | Expiry of patent term |