CN201681831U - Lead frame for IC packaging - Google Patents
Lead frame for IC packaging Download PDFInfo
- Publication number
- CN201681831U CN201681831U CN 201020137456 CN201020137456U CN201681831U CN 201681831 U CN201681831 U CN 201681831U CN 201020137456 CN201020137456 CN 201020137456 CN 201020137456 U CN201020137456 U CN 201020137456U CN 201681831 U CN201681831 U CN 201681831U
- Authority
- CN
- China
- Prior art keywords
- pin
- lead frame
- pressure
- support body
- sizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses a lead frame for IC packaging, which comprises a frame body (1). A plurality of pin portions and a plurality of precision pressing plates (2) are arranged on the frame body (1), the precision pressing plates (2) are located in the middle of the frame body (1), each pin portion is opposite to each precision pressing plate (2) and comprises two symmetrical pin groups, clearances are reserved among pins (3) of each pin group, and after being bent, the pins (3) of the two pin groups are in the shape of a comb to surround the precision pressing plates (2). The lead frame for IC packaging not only can increase utilization, improve packaging yield and reliability of package products and reduce use failure rate of IC products in client sides, but also is high in size precision, stable in quality and low in cost.
Description
Technical field
The utility model relates to a kind of lead frame of IC encapsulation usefulness.
Background technology
In recent years, the Packaging Industry development of semiconductor integrated circuit rapidly, especially along with the wireless a large amount of uses of multi-channel portable, the output of products such as multi-channel audio power amplification application-specific integrated circuit (ASIC) CD6283CS constantly rises, and the use amount of the FSIP12 type lead frame of products such as production integrated circuit CD6283CS also constantly rises.There is following major defect in the FSIP12 type lead frame that uses in the market: 1, the poor dimensional precision of FSIP12 type lead frame, be out of shape seriously etc., and have influence on client's normal use; 2, do not take pressure-sizing processing at the load bonding region, badly influence the evenness of IC chip and the intensity of bonding, finally cause the low and use failure rate height of packaging qualification rate; 3, do not have design and punching out to prevent misusing location hole, forward and reverse mistake when causing client's chip dress opposite direction or plastic packaging produces unnecessary waste; 4, pin does not adopt tip design, is unfavorable for that IC client's plug-in unit uses.
Summary of the invention
The utility model relates to a kind of lead frame of IC encapsulation usefulness, and it not only can improve the utilance of lead frame, has promoted the encapsulation qualification rate and the reliability of encapsulating products, reduced the use failure rate of IC product in client, and the dimensional accuracy height, steady quality, cost is low.
The utility model has adopted following technical scheme: a kind of lead frame of IC encapsulation usefulness, it comprises support body, on support body, be provided with number of pins part and some pressure-sizing sheets, the pressure-sizing sheet is positioned at the centre position of support body, each pin part is relative with each pressure-sizing sheet, described pin partly comprises the pin set of two symmetries, and is gapped between the pin of each pin set, and the pin of two pins group surrounds the pressure-sizing sheet through forming pectination after the bending.
Described support body is the KFC red copper.The head of described pressure-sizing sheet and pin forms the pressure-sizing district, pressure-sizing district surperficial silver coated.Described support body is rectangular thin plate, and its length is 134.2mm, and width is 36mm, and thickness has only 0.4mm, and length is 335.5 times with the ratio of thickness, and width is 90 times with the ratio of thickness.Each pin of described two pins group is increased gradually by the number of times of centre to the both sides bending.The bending part of described each pin of two pins group is a round-corner transition.One side of described support body is distributed with some mistake proofing location holes.The width of described pin is 0.5mm, and the head of pin is set to the tip, and most advanced and sophisticated width is 0.3mm, and the width in gap is 0.4mm between each pin.
The utlity model has following beneficial effect: the utility model support body is rectangular thin plate, its length is 134.2mm, width is 36mm, thickness has only 0.4mm, length is 335.5 times with the ratio of thickness, width is 90 times with the ratio of thickness, the pin of the pin set on the support body surrounds the pressure-sizing sheet through forming pectination after the bending, it can satisfy the encapsulation of products such as multi-channel audio power amplification application-specific integrated circuit (ASIC) CD6283CS and use, not only improved the utilance of lead frame, the encapsulation qualification rate and the reliability of FSIP12 type encapsulating products such as CD6283CS have been promoted, reduced the use failure rate of IC product in client, and the dimensional accuracy height, steady quality, cost is low.Pin head of the present utility model is set to the tip, and the plug-in unit that helps IC client like this uses.One side of the utility model support body is distributed with some mistake proofing location holes, positive and negative misoperation in the time of can avoiding using like this.
Description of drawings
Fig. 1 is a structural representation of the present utility model
Fig. 2 is the enlarged diagram at A place among Fig. 1
Embodiment
In Fig. 1 and Fig. 2, the utility model is a kind of lead frame of IC encapsulation usefulness, it comprises support body 1, support body 1 is to adopt the KFC red copper to pass through punching out successively, pressure-sizing, plating and integer make, support body 1 is rectangular thin plate, its length is 134.2mm, width is 36mm, thickness has only 0.4mm, length is 335.5 times with the ratio of thickness, width is 90 times with the ratio of thickness, one side of support body is distributed with some mistake proofing location holes 5, on support body 1, be provided with number of pins part and some pressure-sizing sheets 2, pressure-sizing sheet 2 is positioned at the centre position of support body 1, pressure-sizing sheet 2 forms the pressure-sizing district with the head of pin, pressure-sizing district surperficial silver coated, the thickness of silver layer is 2.5 μ m, the required precision height in pressure-sizing district, it is 0.02～0.04mm that the degree of depth of pressure-sizing requires, the pressure-sizing district is the load bonding region, each pin part is relative with each pressure-sizing sheet 2, it is characterized in that described pin partly comprises the pin set of two symmetries, and is gapped between the pin 3 of each pin set, the pin 3 of two pins group surrounds pressure-sizing sheet 2 through forming pectination after the bending, each pin 3 of two pins group is increased gradually by the number of times of centre to the both sides bending, and the bending part of each pin 3 of two pins group is a round-corner transition 4, and the R of radius of corner is between 0.2mm-1.5mm, the width of pin 3 is 0.5mm, the head of pin 3 is set to the tip, and most advanced and sophisticated width is 0.3mm, and the width in gap is 0.4mm between each pin 3.Dimension precision requirement height in the utility model, general size tolerance requirements are ± 0.05mm that wherein Zui Xiao dimensional tolerance is ± 0.025mm.
Claims (8)
1. the lead frame of IC encapsulation usefulness, it comprises support body (1), on support body (1), be provided with number of pins part and some pressure-sizing sheets (2), pressure-sizing sheet (2) is positioned at the centre position of support body (1), each pin part is relative with each pressure-sizing sheet (2), it is characterized in that described pin partly comprises the pin set of two symmetries, gapped between the pin of each pin set (3), the pin of two pins group (3) surrounds pressure-sizing sheet (2) through forming pectination after the bending.
2. the lead frame of IC encapsulation usefulness according to claim 1 is characterized in that described support body (1) is the KFC red copper.
3. the lead frame of IC according to claim 1 encapsulation usefulness is characterized in that the described pressure-sizing sheet (2) and the head of pin form the pressure-sizing district, pressure-sizing district surperficial silver coated.
4. the lead frame of IC encapsulation usefulness according to claim 1 is characterized in that described support body (1) is rectangular thin plate, and its length is 134.2mm, width is 36mm, thickness has only 0.4mm, and length is 335.5 times with the ratio of thickness, and width is 90 times with the ratio of thickness.
5. the lead frame of IC encapsulation usefulness according to claim 1 is characterized in that each pin (3) of described two pins group is increased gradually by the number of times of centre to the both sides bending.
6. the lead frame of IC encapsulation usefulness according to claim 1, the bending part that it is characterized in that described each pin of two pins group (3) is round-corner transition (4).
7. the lead frame of IC encapsulation usefulness according to claim 1 is characterized in that a side of described support body is distributed with some mistake proofing location holes (5).
8. the lead frame of IC encapsulation usefulness according to claim 1, the width that it is characterized in that described pin (3) is 0.5mm, and the head of pin (3) is set to the tip, and most advanced and sophisticated width is 0.3mm, and the width in gap is 0.4mm between each pin (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020137456 CN201681831U (en) | 2010-03-23 | 2010-03-23 | Lead frame for IC packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020137456 CN201681831U (en) | 2010-03-23 | 2010-03-23 | Lead frame for IC packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201681831U true CN201681831U (en) | 2010-12-22 |
Family
ID=43346867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020137456 Expired - Fee Related CN201681831U (en) | 2010-03-23 | 2010-03-23 | Lead frame for IC packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201681831U (en) |
-
2010
- 2010-03-23 CN CN 201020137456 patent/CN201681831U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101794761A (en) | Lead frame for use in IC packaging | |
| CN102074541A (en) | Carrier-free pin-free grid-array IC (Integrated Circuit) chip packaging part and production method thereof | |
| CN101752341A (en) | Lead frame of multi-chip integrated circuit | |
| CN201681831U (en) | Lead frame for IC packaging | |
| CN202127013U (en) | Semiconductor lead frame of whole substrate surface | |
| CN201838584U (en) | Encapsulated triode | |
| CN102332444A (en) | Semiconductor lead frame of whole matrix surface | |
| CN211907430U (en) | Non-contact chip inverted packaging substrate strip | |
| CN203277358U (en) | Leading wire frame for MOS semiconductor device | |
| CN202461257U (en) | Stamping die Male die punch of four-side pins of high-precision integrated circuit | |
| CN201285765Y (en) | Half-finished product structure for novel integrated circuit semiconductor device mass production | |
| CN211507626U (en) | P-series miniature double-channel electrostatic protection chip packaging structure | |
| TW201034146A (en) | Leadframe, assembly of leadframe and substrate and LED module | |
| CN204558455U (en) | Lead frame structure and chip architecture | |
| CN102332443A (en) | Lead frame for plastic package semiconductor | |
| CN202127012U (en) | Lead frame for plastic semiconductor | |
| CN201477620U (en) | IC card packaging part | |
| CN205319143U (en) | Be packaged with a plurality of audio power amplifier chip's circuit structure | |
| CN202259236U (en) | Wafer supporting carrier | |
| CN210877241U (en) | Discharge mechanism with reset function and punching machine thereof | |
| CN209880599U (en) | Lead frame | |
| CN202772132U (en) | Multi-chip stacked flat packaging part based on stamping frame | |
| CN201838583U (en) | Surface mount type lead pair | |
| CN202127014U (en) | Frame for two rows of leads used for plastic package devices of light-operated devices and voice-controlled devices | |
| CN203277360U (en) | Leading wire frame for large power semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101222 Termination date: 20120323 |