CN201673905U - 功率型发光二极管 - Google Patents
功率型发光二极管 Download PDFInfo
- Publication number
- CN201673905U CN201673905U CN2010201324382U CN201020132438U CN201673905U CN 201673905 U CN201673905 U CN 201673905U CN 2010201324382 U CN2010201324382 U CN 2010201324382U CN 201020132438 U CN201020132438 U CN 201020132438U CN 201673905 U CN201673905 U CN 201673905U
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- type light
- power type
- support
- solid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
Description
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201324382U CN201673905U (zh) | 2010-03-12 | 2010-03-12 | 功率型发光二极管 |
PCT/CN2010/071730 WO2011109948A1 (zh) | 2010-03-12 | 2010-04-13 | 一种功率型发光二极管 |
US12/811,323 US8264076B2 (en) | 2010-03-12 | 2010-04-13 | Power type LED |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201324382U CN201673905U (zh) | 2010-03-12 | 2010-03-12 | 功率型发光二极管 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201673905U true CN201673905U (zh) | 2010-12-15 |
Family
ID=43331313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010201324382U Expired - Fee Related CN201673905U (zh) | 2010-03-12 | 2010-03-12 | 功率型发光二极管 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201673905U (zh) |
-
2010
- 2010-03-12 CN CN2010201324382U patent/CN201673905U/zh not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: XINGU PHOTOELECTRIC INCORPORATION Free format text: FORMER OWNER: ZHEJIANG JINGU PACKING + PRINTING CO., LTD. Effective date: 20110831 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 200122 WENZHOU, ZHEJIANG PROVINCE TO: 065001 LANGFANG, HEBEI PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20110831 Address after: 065001 No. 73 Xiangyun Road, Langfang economic and Technological Development Zone, Hebei, China Patentee after: Xingu Photoelectric Incorporation Address before: 200122 No. two, 88 Ring Road, Third Industrial Park, Jin county, Zhejiang, Cangnan Patentee before: Zhejiang Jingu Packing&Printing Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101215 Termination date: 20160312 |
|
CF01 | Termination of patent right due to non-payment of annual fee |