CN201665709U - PECVD special film coating silicon chip carrier - Google Patents

Abstract

The utility model relates to a PECVD special film coating silicon chip carrier comprising a carrier framework, a single-side hook, a double-side hook and a backing plate, whereby the single-side hook and the double-side hook have the same structure, but the latter one has one more hook. On the band of the hook is disposed a compression boss and a bending groove, and the hook can be fixed or disassembled by using the compression boss to bend the hook along the bending groove at the right angle. When the hook is fixed, the distance between the finial of the hook and the bottom line of the connection rod of the hook is smaller than or equal to the thickness of the silicon chip. The frapping and disassembling of the band act only on the backing plate without hurting the connection rod of the hook because of the improvement of the connection structure of the hook. By using the silicon chip carrier, the utility model is advantageous in that the hook can be quickly installed and disassembled without hurting the silicon chip carrier, the deposition of silicon nitride layer on the back of the solar cell can be highly reduced, and the requirement of film coating technology can be better satisfied.

Description

PECVD plated film special silicon wafer loader

[technical field]

The utility model relates to a kind of silicon wafer carrier that silicon chip of solar cell PECVD plated film is used.

[background technology]

PECVD is the abbreviation of solar battery sheet plasma chemistry deposition plating technology, in the production process of solar cell, to silicon chip film-coated be the gordian technique that improves the solar cell assimilated efficiency, opto-electronic conversion electricity generating principle according to silicon chip, irradiate light can produce reflection to silicon chip, the optical loss of silicon chip can make the output of solar cell be lower than ideal value, silicon chip film-coated technology is to improve the mature technology of solar cell assimilated efficiency, in solar cell industry production, be used widely, can form one deck antireflective coating at silicon chip surface by PECVD.

In the PECVD coating process, must use silicon wafer carrier, used silicon wafer carrier as shown in Figure 1, it is made up of bearing frame 1, single-faced hanging hook 2 and two-sided hook 3, bearing frame 1 is put together by longitudinal rod and transverse bar, single-faced hanging hook 2 is installed on the longitudinal rod of the left and right sides, 3 of two-sided hooks are installed on other longitudinal rod, silicon chip to be coated 5 block-by-blocks are lain on the silicon wafer carrier, by single-faced hanging hook 2 and two-sided hook 3 silicon chip 5 is held up the level of, silicon chip 5 downward diffusingsurfaces are carried out plated film.Two-sided hook is shown in Fig. 2 A, single-faced hanging hook is shown in Fig. 2 B, they are sheet structure, described two-sided hook 3 is made up of hook 31, hook body 32, locating slot 33 and band 34, hook 31 is arranged on the outside of hook body 32 lower ends symmetrically, locating slot 33 is positioned at the top of hook body 32, and is between two bands 34, and two-sided hook 3 is installed on the longitudinal rod by locating slot 33; The structure of single-faced hanging hook 2 is similar to two-sided hook 3, only lacks a hook than two-sided hook 3.The mode that installs and fixes of single-faced hanging hook and two-sided hook all is identical, all be to be installed on the longitudinal rod by locating slot, with pliers two bands are hinged together then, thereby hook is fixed on the longitudinal rod, hinged when fastening, two bands will inevitably produce tightening force and friction to longitudinal rod, because the silicon chip bearing frame is made by the carbon element complex fiber material, the hook installation tighten up with demolishing process in, band is bigger to the damage of longitudinal rod, this must quicken the damage of silicon wafer carrier, shortens its work-ing life.At present, be two months the work-ing life that silicon wafer carrier is general, and production consumes bigger, because the price of silicon wafer carrier is higher, so the ratio of silicon wafer carrier consuming cost in coating cost is higher.

In process of plating, silicon chip to be coated is to lie on the silicon wafer carrier, and hold up the level of by four hooks, because hook fixed tightness can directly influence the distance between the top of hook and the longitudinal rod bottom surface, thereby change the gap between silicon chip and the silicon wafer carrier, so just increased plasma diffusion and produced sedimentary probability to the silicon chip back side, cell backside has silicon nitride layer will produce detrimentally affect to the printing sintering of the later process aluminium back of the body.Simultaneously, in coating process, all can deposited silicon nitride at silicon chip bearing frame and hook surface, according to the coating process requirement, after finishing, the hook on the silicon chip bearing frame must be removed plated film, and use the HF solution (5%) of lower concentration to soak then and adhere to silicon nitride on it with removing, otherwise hook will be fallen by the HF solution corrosion in immersion process, so not only to consume HF solution, but also need to remove hook, also increase cost and the difficulty of back road simultaneously HF solution environmental protection treatment.

[utility model content]

In order to overcome the deficiency that existing silicon wafer carrier exists, the utility model provides a kind of PECVD plated film special silicon wafer loader, hook on this silicon wafer carrier can not only Fast Installation and dismounting, and can not produce damage to the silicon chip bearing frame, can also reduce the probability of solar cell back face deposited silicon nitride layer significantly.

PECVD plated film special silicon wafer loader described in the utility model, it comprises bearing frame, single-faced hanging hook and two-sided hook, single-faced hanging hook and two-sided hook are installed on the hook union lever of bearing frame, it is characterized in that, it also comprises backing plate, described two-sided hook is by hook, the hook body, locating slot, band, oppression boss and bending groove are formed, two hooks are symmetrically located at the two bottom sides of hook body, locating slot is positioned at the top of hook body, and be between two bands, oppression boss is arranged on the top of band, the outside of two bands equal altitudes be provided with the bending groove, the status requirement of offering of bending groove is: when oppression boss along the bending groove to the inside behind 90 ° of the Edge Bends, inner side edge equals two plate thickness and hook union lever thickness sum to the distance on locating slot base; Described backing plate is " worker " font, both sides at its backing plate have strap slot, the width of strap slot is suitable with the thickness of band, distance between the inner side edge of distance between the bottom land of two strap slot and two bands is suitable, and the top distance with hook union lever base of hook is less than or equal to the thickness of silicon chip; The structure of single-faced hanging hook is identical with two-sided hook, only lacks a hook than two-sided hook; Single-faced hanging hook, two-sided hook are identical with the mounting means of hook union lever, upper surface and lower surface at the hook union lever are provided with backing plate, two bands are inserted and are through in two strap slot of backing plate, locating slot is sleeved on the hook union lever, the oppression boss of two bands upper end by along the bending groove to the inside the mode of 90 ° of Edge Bends be pressed on the upper surface of backing plate, as shown in Figure 3.

Owing on silicon wafer carrier, set up two backing plates, improved the syndeton of hook simultaneously, hook when mounted, end face and bottom surface at the hook union lever are equipped with backing plate, two bands of hook are tightening up, are all acting directly on the backing plate in the demolishing process, therefore, can not produce damage, thereby can increase substantially the work-ing life of silicon wafer carrier the hook union lever.Since the outside of two bands equal altitudes offered the bending groove, top at band is provided with oppression boss, when hook is installed if with pliers with the oppression boss of two bands upper ends along bending groove 90 ° of Edge Bends to the inside, at this moment, the inner side edge of oppression boss just can be pressed on the upper surface of backing plate reliably, hook firmly is fixed on the hook union lever, and can make that the top distance with hook union lever bottom surface of hook of all hooks is equivalent, in coating process, because the upper surface of silicon chip is not less than the bottom surface of hook union lever, so just can be reduced in the probability of solar cell back face deposited silicon nitride layer significantly.When needs are removed hook, as long as oppression boss is reduced 90 ° of bendings with pliers.The silicon wafer carrier of this structure, not only hook energy Fast Installation and dismounting, and install and remove and can not produce damage to the silicon chip bearing frame, can also reduce the probability of solar cell back face deposited silicon nitride layer significantly, can satisfy the coating process requirement better.

[description of drawings]

Fig. 1 is the structural representation of silicon wafer carrier;

Fig. 2 is the structural representation of existing hook; Wherein Fig. 2 A is two-sided hook structure synoptic diagram,

Fig. 2 B is the single-faced hanging hook structural representation;

Fig. 3 is the mounting structure synoptic diagram of two-sided hook in the utility model;

Fig. 4 is the structural representation of two-sided hook in the utility model;

Fig. 5 is the structural representation of backing plate in the utility model.

Among the figure, the 1-bearing frame; The 2-single-faced hanging hook; The two-sided hook of 3-; The 4-backing plate; The 5-silicon chip; 11-links up with union lever; The 31-hook; 32-hook body; The 33-locating slot; The 34-band; The 35-oppression boss; 36-bending groove; The 37-inner side edge; The 38-base; The 41-strap slot; The 42-bottom land.

[embodiment]

Introduce embodiment of the present utility model below in conjunction with Figure of description.

PECVD plated film special silicon wafer loader described in the utility model, it is by bearing frame 1, single-faced hanging hook 2, two-sided hook 3 and backing plate 4 are formed, bearing frame 1 is put together by longitudinal rod and transverse bar, single-faced hanging hook 2 and two-sided hook 3 are installed on the longitudinal rod of bearing frame 1, in this example, longitudinal rod is linked up with union lever 11 exactly, described two-sided hook 3 is by hook 31, hook body 32, locating slot 33, band 34, oppression boss 35 and bending groove 36 are formed, two hooks 31 are symmetrically located at the both sides of hook body 32 lower ends, locating slot 33 is positioned at the top of hook body 32, and be between two bands 34, oppression boss 35 is arranged on the top of band 34, the outside equal altitudes of two bands 34 be provided with bending groove 36, the status requirement of offering of bending groove 36 is: when oppression boss 35 after 90 ° of bending groove 36 inside side 37 bendings, inner side edge 37 equals two backing plate 4 thickness and hook union lever 11 thickness sums to the distance on locating slot 33 bases 38; Described backing plate 4 is " worker " font, be provided with strap slot 41 in the both sides of backing plate 4, the thickness of the width of strap slot 41 and band 34 is suitable, distance between the distance between the bottom land 42 of two strap slot 41 and the inner side edge 37 of two bands 34 is suitable, and the top distance with hook union lever 11 bases of hook 31 is equal to or slightly less than the thickness of silicon chip 5; The structure of single-faced hanging hook 2 is identical with two-sided hook 3, only lacks a hook 31 than two-sided hook 3; Single-faced hanging hook 2 is identical with the mounting means of hook union lever 11 with two-sided hook 3, promptly be provided with backing plate 4 in the upper surface and the lower surface of hook union lever 11, two bands 34 are inserted and are through in two strap slot 41 of backing plate 4, locating slot 33 is sleeved on the hook union lever 11, the oppression boss 35 of two band 34 upper ends is pressed on the upper surface of backing plate 4 by the mode along 90 ° of bending groove 36 inside side 37 bendings, as shown in Figure 3, hook just firmly is fixed on the hook union lever 11 like this, make that the top distance with hook union lever 11 bottom surfaces of hook 31 of all hooks is equivalent, silicon chip 5 to be coated is lain on the hook 31, can carry out coating film treatment by the PECVD coating process.

Claims (1)

1. PECVD plated film special silicon wafer loader, it comprises bearing frame (1), single-faced hanging hook (2), two-sided hook (3), single-faced hanging hook (2) and two-sided hook (3) are installed on the bearing frame (1), it is characterized in that: further comprising backing plate (4), described two-sided hook (3) is by hook (31), hook body (32), locating slot (33), band (34), oppression boss (35) and bending groove (36) are formed, two hooks (31) are symmetrically located at the both sides of hook body (32) bottom, locating slot (33) is positioned at the top of hook body (32), and be between two bands (34), oppression boss (35) is arranged on the top of band (34), the outside equal altitudes of two bands (34) be provided with bending groove (36), the status requirement of offering of bending groove (36) is: when oppression boss (35) along bending groove (36) inwardly after 90 ° of side (37) bendings, inner side edge (37) equals two backing plates (4) thickness and links up with union lever (11) thickness sum to the distance on locating slot (33) base (38); Described backing plate (4) is " worker " font, be provided with strap slot (41) in backing plate (4) both sides, the thickness of the width of strap slot (41) and band (34) is suitable, distance between the inner side edge (37) of distance between two strap slot (41) bottom lands (42) and two bands (34) is suitable, and the top distance with hook union lever (11) base of hook (31) is less than or equal to the thickness of silicon chip (5); The structure of described single-faced hanging hook (2) is identical with two-sided hook (3), only lacks a hook (31) than two-sided hook (3); Single-faced hanging hook (2) is identical with the mounting means of hook union lever (11) with two-sided hook (3), upper surface and lower surface at hook union lever (11) are provided with backing plate (4), two bands (34) are inserted and are through in two strap slot (41) of backing plate (4), locating slot (33) is sleeved on the hook union lever (11), and the oppression boss (35) of two bands (34) upper end is pressed on the upper surface of backing plate (4) by the mode along 90 ° of inside side (37) bendings of bending groove (36).

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