CN201665708U - Quick-change silicon wafer coating film single-side hanger component - Google Patents

Abstract

The utility model discloses a quick-change silicon wafer coating film single-side hanger component comprising a single-side hanger and a base plate, wherein the top ends of two ribbons are provided with compression convex plates; the outer sides of the convex plates are provided with bending grooves with equal height; the requirement of arrangement positions of the bending grooves is as follows: when the compression convex plates are bent to the inner side by 90 degrees, the distance between the inner side edge and the bottom edge of a locating slot is equal to the sum of the thickness of two base plates and a vertical rod; the base plate is I-shaped, with two sides thereof being provided with ribbon slots; the single-side hanger and the base plate are matched for using; the single-side hanger is fixed on the vertical rod through two base plates; the two ribbons can not directly act on the vertical rod in the tightening and removing process; the arrangement of the bending grooves and the compression convex plates is convenient for fast tightening and removing of the single-side hanger, can not damage a silicon wafer bearing frame, and can reduce the silicon nitride layer deposition probability on the back surface of the silicon wafer.

Description

Quickly-changed silicon chip film-coated single-faced hanging hook assembly

[technical field]

The utility model relates to a kind of silicon wafer carrier that solar battery sheet PECVD plated film is used, and relates in particular to the hook on the silicon wafer carrier.

[background technology]

PECVD is the abbreviation of solar battery sheet plasma chemistry deposition plating technology, in the production process of solar cell, to silicon chip film-coated be the gordian technique that improves the solar cell assimilated efficiency, opto-electronic conversion electricity generating principle according to silicon chip, irradiate light can produce reflection to silicon chip, the optical loss of silicon chip can make the output of solar cell be lower than ideal value, silicon chip film-coated technology is to improve the mature technology of solar cell assimilated efficiency, in solar cell industry production, be used widely, can form one deck antireflective coating at silicon chip surface by PECVD.

In the PECVD coating process, must use silicon wafer carrier, used silicon wafer carrier as shown in Figure 1, it is made up of single-faced hanging hook 1, two-sided hook 2 and bearing frame 3, bearing frame 3 is put together by longitudinal rod 31 and transverse bar 32, single-faced hanging hook 1 is installed on the longitudinal rod 31 of the left and right sides, and 2 of two-sided hooks are installed on other longitudinal rod 31.Silicon chip 4 block-by-blocks to be coated are lain on the silicon wafer carrier, silicon chip 4 is held up the level of, silicon chip 4 downward diffusingsurfaces are carried out plated film by hook.Existing single-faced hanging hook as shown in Figure 2, it is a sheet structure, by hook 11, hook body 12, locating slot 13, band 14 is formed, hook 11 is positioned at a side of hook body 12 bottoms, locating slot 13 is positioned at the top of hook body 12, and be between two bands 14, single-faced hanging hook 1 is installed on the longitudinal rod 31 of silicon wafer carrier by locating slot 13, its mode of installing and fixing is: locating slot 13 is installed on the longitudinal rod 31, with pliers two bands 14 are hinged together then, thereby single-faced hanging hook 1 is fixed on the longitudinal rod 31, when hinged fastening hook, two bands 14 will inevitably produce tightening force and friction to longitudinal rod 31, because the silicon chip bearing frame made by the carbon element complex fiber material, the installation of hook tighten up with demolishing process in, 14 pairs of longitudinal rods of band 31 can produce bigger damage, this must quicken the damage of silicon wafer carrier, shortens its work-ing life.At present, be two months the work-ing life that silicon wafer carrier is general, and production consumes bigger, because the price of silicon wafer carrier is higher, so the ratio of silicon wafer carrier consuming cost in coating cost is higher.

In process of plating, silicon chip to be coated is to lie on the silicon wafer carrier, and hold up the level of by four hooks, hook fixed tightness directly influences the distance between hook top and the longitudinal rod bottom surface, thereby change the gap between silicon chip and the silicon wafer carrier, increased the probability of silicon chip backside deposition silicon nitride layer, there is silicon nitride layer at the silicon chip back side will produce detrimentally affect to the printing sintering of the later process aluminium back of the body.Simultaneously, in coating process, all can deposited silicon nitride at silicon wafer carrier and hook surface, according to the coating process requirement, after finishing, the hook on the silicon wafer carrier must be removed plated film, use the HF solution (5%) of lower concentration to soak then and adhere to silicon nitride on it with removing, otherwise hook will be fallen by the HF solution corrosion in immersion process, so not only to consume HF solution, but also need to remove still last corrosive hook partly, also increased cost and the difficulty of back road simultaneously to HF solution environmental protection treatment.

[utility model content]

In order to overcome the deficiency of existing single-faced hanging hook, the purpose of this utility model has provided a kind of quickly-changed silicon chip film-coated single-faced hanging hook assembly, adopt this single-faced hanging hook assembly, not only be convenient to Fast Installation and dismounting, and install and remove and can not produce damage to the silicon chip bearing frame, can also be reduced in the probability of silicon chip backside deposition silicon nitride layer significantly.

Quickly-changed silicon chip film-coated single-faced hanging hook assembly described in the utility model, it is characterized in that, it comprises single-faced hanging hook and backing plate, described single-faced hanging hook is by hook, the hook body, locating slot, band, oppression boss and bending groove are formed, hook is arranged on a side of hook body bottom, locating slot is positioned at the top of hook body, and be between two bands, oppression boss is arranged on the top of band, the outside of two bands equal altitudes be provided with the bending groove, the status requirement of offering of bending groove is: when oppression boss along the bending groove to the inside behind 90 ° of the Edge Bends, inner side edge equals two plate thickness and longitudinal rod thickness sum to the distance on locating slot base; Described backing plate is " worker " font, both sides at backing plate are provided with strap slot, the width of strap slot is suitable with the thickness of band, and the distance between the inner side edge of distance between the bottom land of two strap slot and two bands is suitable, and the top and distance longitudinal rod base of hook is less than or equal to the thickness of silicon chip.

Owing to changed the structure of single-faced hanging hook, and two backing plates have been set up, single-faced hanging hook when mounted, the end face of longitudinal rod all contacts with single-faced hanging hook by backing plate with the bottom surface, two bands of single-faced hanging hook tighten up with demolishing process in all act directly on the backing plate, therefore, can not produce damage, thereby can increase substantially the work-ing life of silicon wafer carrier longitudinal rod.Since the outside of two bands equal altitudes offered the bending groove, top at band is provided with oppression boss, the installation of single-faced hanging hook if with pliers with the oppression boss of two bands upper end along bending groove 90 ° of Edge Bends to the inside, in the time will removing, need only oppression boss restored.Because single-faced hanging hook is identical with two-sided hook structure, so just can make the top of all hooks equivalent with the distance of longitudinal rod bottom surface, in coating process, because the upper surface of silicon chip is not less than the bottom surface of longitudinal rod, so just can be reduced in the probability of silicon chip backside deposition silicon nitride layer significantly, adopt this single-faced hanging hook assembly, not only be convenient to Fast Installation and dismounting, and install and remove and can not produce damage the silicon chip bearing frame, the probability of silicon chip backside deposition silicon nitride layer can also be reduced in significantly, the coating process requirement can be satisfied better.

[description of drawings]

Fig. 1 is the structural representation of silicon wafer carrier; Fig. 2 is the structural representation of existing single-faced hanging hook;

Fig. 3 is installed in structural representation on the silicon wafer carrier for the utility model;

Fig. 4 is the structural representation of single-faced hanging hook in the utility model;

Fig. 5 is the structural representation of backing plate in the utility model.

Among the figure, the 1-single-faced hanging hook; The 11-hook; 12-hook body; The 13-locating slot; The 14-band; The 15-oppression boss; 16-bending groove; The 17-inner side edge; The 18-base; The two-sided hook of 2-; The 3-bearing frame; The 31-longitudinal rod; The 32-transverse bar; The 4-silicon chip; The 5-backing plate; The 51-strap slot; The 52-bottom land.

[embodiment]

Introduce embodiment of the present utility model below in conjunction with Figure of description.

Quickly-changed silicon chip film-coated single-faced hanging hook assembly described in the utility model, as shown in Figure 3, it comprises single-faced hanging hook 1 and backing plate 5, described single-faced hanging hook 1 as shown in Figure 4, it is by hook 11, hook body 12, locating slot 13, band 14, oppression boss 15 and bending groove 16 are formed, hook 11 is arranged on a side of hook body 12 bottoms, locating slot 13 is positioned at the top of hook body 12, and be between two bands 14, oppression boss 15 is arranged on the top of two bands 14, the outside equal altitudes of two bands 14 be provided with bending groove 16, the status requirement of offering of bending groove 16 is: when oppression boss 15 after 90 ° of bending groove 16 inside side 17 bendings, inner side edge 17 equals the thickness sum of the thickness and the longitudinal rod 31 of two backing plates 5 to the distance on locating slot 13 bases 18; Described backing plate 5 is " worker " font, as shown in Figure 5, be provided with strap slot 51 in backing plate 5 both sides, the thickness of the width of strap slot 51 and band 14 is suitable, distance between distance between two strap slot, 51 bottom lands 52 and two bands, 14 inner side edges 17 is suitable, and the distance on top and longitudinal rod 31 bases of hook 11 is less than or equal to the thickness of silicon chip 4.

Installation method of the present utility model is as follows: put into a backing plate 5 earlier 14 of two bands, locating slot 13 with single-faced hanging hook is sleeved on the left longitudinal rod 31 or right longitudinal rod 31 of silicon wafer carrier then, add a backing plate 5 again, then with pliers with the oppression boss 15 of two band 14 upper ends along 90 ° of bending groove 16 inside side 17 bendings, make the inner side edge 17 of oppression boss 15 push down the upper surface of backing plate 5, as shown in Figure 3, whole like this hook just can firmly be fixed on the longitudinal rod 31, because two-sided hook 2 is identical with single-faced hanging hook 1 structure, only many hooks, and mounting means and single-faced hanging hook 1 are identical, the distance of top and longitudinal rod 31 bottom surfaces of the hook 11 of all hooks can both equate like this, silicon chip 4 to be coated is lain on the hook 11, can carry out coating film treatment by the PECVD coating process.

Claims (1)

1. quickly-changed silicon chip film-coated single-faced hanging hook assembly, it is characterized in that, it comprises single-faced hanging hook (1) and backing plate (5), described single-faced hanging hook (1) is by hook (11), hook body (12), locating slot (13), band (14), oppression boss (15) and bending groove (16) are formed, hook (11) is arranged on a side of hook body (12) bottom, locating slot (13) is positioned at the top of hook body (12), and be between two bands (14), oppression boss (15) is arranged on the top of band (14), the outside equal altitudes of two bands (14) be provided with bending groove (16), the status requirement of offering of bending groove (16) is: when oppression boss (15) along bending groove (16) inwardly after 90 ° of side (17) bendings, inner side edge (17) equals two backing plate (5) thickness and longitudinal rod (31) thickness sum to the distance on locating slot (13) base (18); Described backing plate (5) is " worker " font, be provided with strap slot (51) in backing plate (5) both sides, the thickness of the width of strap slot (51) and band (14) is suitable, distance between distance between two strap slot (51) bottom lands (52) and two bands (14) inner side edges (17) is suitable, and the distance on top and longitudinal rod (31) base of hook (11) is less than or equal to the thickness of silicon chip (4).

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