CN201623174U - Quick-change symmetric hanger assembly for film coating of silicon chips - Google Patents

Quick-change symmetric hanger assembly for film coating of silicon chips Download PDF

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Publication number
CN201623174U
CN201623174U CN2010201590624U CN201020159062U CN201623174U CN 201623174 U CN201623174 U CN 201623174U CN 2010201590624 U CN2010201590624 U CN 2010201590624U CN 201020159062 U CN201020159062 U CN 201020159062U CN 201623174 U CN201623174 U CN 201623174U
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CN
China
Prior art keywords
hook
bands
silicon chip
liner plates
distance
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Expired - Fee Related
Application number
CN2010201590624U
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Chinese (zh)
Inventor
屈莹
刘志刚
冯鑫
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Changzhou EGing Photovoltaic Technology Co Ltd
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Changzhou EGing Photovoltaic Technology Co Ltd
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Priority to CN2010201590624U priority Critical patent/CN201623174U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The utility model discloses a quick-change symmetric hanger assembly for film coating of silicon chips, which comprises double-face hangers and liner plates. A compression boss is respectively arranged at the top ends of two tying bands, and bent grooves are arranged outside the tying bands in an equal height manner. Requirements on arranging positions of the bent grooves include that after the compression bosses are bent towards inner side edges for 90 degrees, a distance from the inner side edges to the bottom edge of a positioning groove is equal to sum of thicknesses of the two liner plates and thicknesses of longitudinal rods. The liner plates are I-shaped, a tying band groove is respectively disposed on two sides of each liner plate, the double-face hangers are used with the liner plates and fixed onto the longitudinal rods via the two liner plates, the two tying bands do not directly act on the longitudinal rods in drawing in and removing processes, and the arrangement of the bent grooves and the compression bosses can facilitate quick drawing in and removing of the double-face hangers without damage on a silicon chip bearing frame, and can also lower possibility of deposition and nitridation of silicon layer on the back faces of silicon chips.

Description

Quickly-changed silicon chip film-coated symmetrical hanging hook assembly
[technical field]
The utility model relates to a kind of silicon wafer carrier that solar battery sheet PECVD plated film is used, and relates in particular to the hook on the silicon wafer carrier.
[background technology]
PECVD is the abbreviation of solar battery sheet plasma chemistry deposition plating technology, in the production process of solar cell, to silicon chip film-coated be the key technology that improves the solar cell absorption efficiency, opto-electronic conversion electricity generating principle according to silicon chip, irradiate light can produce reflection to silicon chip, the optical loss of silicon chip can make the output of solar cell be lower than ideal value, silicon chip film-coated technology is to improve the mature technology of solar cell absorption efficiency, in solar cell industry production, be used widely, can form one deck antireflective coating at silicon chip surface by PECVD.
In the PECVD coating process, must use silicon wafer carrier, used silicon wafer carrier as shown in Figure 1, it is made up of single-faced hanging hook 1, two-sided hook 2 and bearing frame 3, bearing frame 3 is put together by longitudinal rod 31 and transverse bar 32, single-faced hanging hook 1 is installed on the longitudinal rod 31 of the left and right sides, and 2 of two-sided hooks are installed on other longitudinal rod 31.Silicon chip 4 block-by-blocks to be coated are lain on the silicon wafer carrier, silicon chip 4 is held up the level of, silicon chip 4 downward diffusingsurfaces are carried out plated film by hook.Existing two-sided hook as shown in Figure 2, it is a laminated structure, by hook 21, hook body 22, location notch 23, band 24 is formed, hook 21 is positioned at a side of hook body 22 bottoms, location notch 23 is positioned at the top of hook body 22, and be between two bands 24, two-sided hook 2 is installed on the longitudinal rod 31 of silicon wafer carrier by location notch 23, its mode of installing and fixing is: location notch 23 is installed on the longitudinal rod 31, with pliers two bands 24 are hinged together then, thereby two-sided hook 2 is fixed on the longitudinal rod 31, when hinged fastening hook, two bands 24 will inevitably produce tightening force and friction to longitudinal rod 31, because the silicon chip bearing frame made by the carbon element complex fiber material, the installation of hook tighten up with demolishing process in, 24 pairs of longitudinal rods of band 31 can produce bigger damage, this must quicken the damage of silicon wafer carrier, shortens its useful life.At present, be two months the useful life that silicon wafer carrier is general, and production consumes bigger, because the price of silicon wafer carrier is higher, so the ratio of silicon wafer carrier consuming cost in coating cost is higher.
In process of plating, silicon chip to be coated is to lie on the silicon wafer carrier, and hold up the level of by four hooks, because the fixing tightness of hook directly influences the distance between hook top and the longitudinal rod bottom surface, thereby change the gap between silicon chip and the silicon wafer carrier, increased the probability of silicon chip backside deposition silicon nitride layer, cell backside has silicon nitride layer will produce harmful effect to the printing sintering of the later process aluminium back of the body.Simultaneously, in coating process, all can deposited silicon nitride at silicon wafer carrier and hook surface, according to the coating process requirement, after finishing, the hook on the silicon wafer carrier must be removed plated film, use the HF solution (5%) of low concentration to soak then and adhere to silicon nitride on it with removing, otherwise hook will be fallen by the HF solution corrosion in immersion process, so not only to consume HF solution, but also need to remove the hook part of end corrosion still, also increased cost and the difficulty of back road simultaneously to HF solution environmental protection treatment.
[utility model content]
In order to overcome the deficiency of existing two-sided hook, the purpose of this utility model has provided a kind of quickly-changed silicon chip film-coated symmetrical hanging hook assembly and installation method thereof, adopt this symmetrical hanging hook assembly, not only be convenient to Fast Installation and dismounting, and install and remove and can not produce damage to the silicon chip bearing frame, can also be reduced in the probability of silicon chip backside deposition silicon nitride layer significantly.
Quickly-changed silicon chip film-coated symmetrical hanging hook assembly described in the utility model, it is characterized in that, it comprises two-sided hook and backing plate, described two-sided hook is by hook, the hook body, location notch, band, oppression boss and bending groove are formed, hook is arranged on two sides of hook body bottom, location notch is positioned at the top of hook body, and be between two bands, oppression boss is arranged on the top of band, the outside of two bands equal altitudes be provided with the bending groove, the status requirement of offering of bending groove is: when oppression boss along the bending groove to the inside behind 90 ° of the Edge Bends, inner side edge equals two plate thickness and longitudinal rod thickness sum to the distance on location notch base; Described backing plate is " worker " font, both sides at backing plate are provided with strap slot, the width of strap slot is suitable with the thickness of band, and the distance between the inner side edge of distance between the bottom land of two strap slot and two bands is suitable, and the top and distance longitudinal rod base of hook is less than or equal to the thickness of silicon chip.
Owing to changed the structure of two-sided hook, and two backing plates have been set up, two-sided hook when mounted, the end face of longitudinal rod all contacts with two-sided hook by backing plate with the bottom surface, two bands of two-sided hook tighten up with demolishing process in all act directly on the backing plate, can not produce damage, therefore, can increase substantially the useful life of silicon wafer carrier longitudinal rod.Since the outside of two bands equal altitudes offered the bending groove, top at band is provided with oppression boss, therefore, the installation of two-sided hook as long as with pliers with the oppression boss of two bands upper end along bending groove 90 ° of Edge Bends to the inside, during dismounting, as long as restore.Because single-faced hanging hook is identical with two-sided hook structure and mounting means, the top distance with the longitudinal rod bottom surface of hook of all hooks is equated, in coating process, because the upper surface of silicon chip is not less than the bottom surface of longitudinal rod, so just can be reduced in the probability of silicon chip backside deposition silicon nitride layer significantly, adopt this symmetrical hanging hook assembly, not only be convenient to Fast Installation and dismounting, and install and remove and can not produce damage the silicon chip bearing frame, the probability of silicon chip backside deposition silicon nitride layer can also be reduced in significantly, the coating process requirement can be satisfied better.
[description of drawings]
Fig. 1 is the structural representation of silicon wafer carrier; Fig. 2 is the structural representation of existing two-sided hook;
Fig. 3 is installed in structural representation on the silicon wafer carrier for the utility model;
Fig. 4 is the structural representation of two-sided hook in the utility model; Fig. 5 is the structural representation of backing plate in the utility model.
Among the figure, the 1-single-faced hanging hook; The two-sided hook of 2-; The 21-hook; 22-hook body; The 23-location notch; The 24-band; The 25-oppression boss; 26-bending groove; The 27-inner side edge; The 28-base; The 3-bearing frame; The 31-longitudinal rod; The 32-transverse bar; The 4-silicon chip; The 5-backing plate; The 51-strap slot; The 52-bottom land.
[embodiment]
Introduce embodiment of the present utility model below in conjunction with Figure of description.
Quickly-changed silicon chip film-coated symmetrical hanging hook assembly described in the utility model, as shown in Figure 3, it comprises two-sided hook 2 and backing plate 5, described two-sided hook 2 as shown in Figure 4, it is by hook 21, hook body 22, location notch 23, band 24, oppression boss 25 and bending groove 26 are formed, hook 21 is arranged on two sides of hook body 22 bottoms, location notch 23 is positioned at the top of hook body 22, and be between two bands 24, oppression boss 25 is arranged on the top of two bands 24, the outside equal altitudes of two bands 24 be provided with bending groove 26, the status requirement of offering of bending groove 26 is: when oppression boss 25 after 90 ° of bending groove 26 inside side 27 bendings, inner side edge 27 equals two backing plate 5 thickness and longitudinal rod 31 thickness sums to the distance on location notch 23 bases 28; Described backing plate 5 is " worker " font, as shown in Figure 5, be provided with strap slot 51 in backing plate 5 both sides, the thickness of the width of strap slot 51 and band 24 is suitable, distance between distance between two strap slot, 51 bottom lands 52 and two bands, 24 inner side edges 27 is suitable, and the distance on top and longitudinal rod 31 bases of hook 21 is less than or equal to the thickness of silicon chip 4.
Installation method of the present utility model is as follows: put into a backing plate 5 earlier 24 of two bands, location notch 23 with the symmetry hook is sleeved on the longitudinal rod 31 of silicon wafer carrier then, add a backing plate 5 again, then with pliers with the oppression boss 25 of two band 24 upper ends along 90 ° of bending groove 26 inside side 27 bendings, make the inner side edge 27 of oppression boss 25 push down the upper surface of backing plate 5, as shown in Figure 3, whole so two-sided hook just can firmly be fixed on the longitudinal rod 31, because single-faced hanging hook 1 is identical with two-sided hook 2 structures, only lacked a hook than two-sided hook 2, and mounting means and two-sided hook 2 are identical, the distance of top and longitudinal rod 31 bottom surfaces of the hook 21 of all hooks can both equate like this, silicon chip 4 to be coated is lain on the hook 21, can carry out coating film treatment by the PECVD coating process.

Claims (1)

1. quickly-changed silicon chip film-coated symmetrical hanging hook assembly, it is characterized in that, it comprises two-sided hook (2) and backing plate (5), described two-sided hook (2) is by hook (21), hook body (22), location notch (23), band (24), oppression boss (25) and bending groove (26) are formed, hook (21) is arranged on the both sides of hook body (22) bottom, location notch (23) is positioned at the top of hook body (22), and be between two bands (24), oppression boss (25) is arranged on the top of band (24), the outside equal altitudes of two bands (24) be provided with bending groove (26), the status requirement of offering of bending groove (26) is: when oppression boss (25) along bending groove (26) inwardly after 90 ° of side (27) bendings, inner side edge (27) equals two backing plate (5) thickness and longitudinal rod (31) thickness sum to the distance on location notch (23) base (28); Described backing plate (5) is " worker " font, be provided with strap slot (51) in backing plate (5) both sides, the thickness of the width of strap slot (51) and band (24) is suitable, distance between distance between two strap slot (51) bottom lands (52) and two bands (24) inner side edges (27) is suitable, and the distance on top and longitudinal rod (31) base of hook (21) is less than or equal to the thickness of silicon chip (4).
CN2010201590624U 2010-03-29 2010-03-29 Quick-change symmetric hanger assembly for film coating of silicon chips Expired - Fee Related CN201623174U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010201590624U CN201623174U (en) 2010-03-29 2010-03-29 Quick-change symmetric hanger assembly for film coating of silicon chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010201590624U CN201623174U (en) 2010-03-29 2010-03-29 Quick-change symmetric hanger assembly for film coating of silicon chips

Publications (1)

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CN201623174U true CN201623174U (en) 2010-11-03

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101826483A (en) * 2010-03-29 2010-09-08 常州亿晶光电科技有限公司 Quickly-dismounted silicon wafer coating symmetrical hanging hook subassembly and mounting method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101826483A (en) * 2010-03-29 2010-09-08 常州亿晶光电科技有限公司 Quickly-dismounted silicon wafer coating symmetrical hanging hook subassembly and mounting method thereof

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C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101103

Termination date: 20120329