CN201663023U - Chip resistor and chip array both with anti-vulcanizing electrode structures - Google Patents
Chip resistor and chip array both with anti-vulcanizing electrode structures Download PDFInfo
- Publication number
- CN201663023U CN201663023U CN201020128439XU CN201020128439U CN201663023U CN 201663023 U CN201663023 U CN 201663023U CN 201020128439X U CN201020128439X U CN 201020128439XU CN 201020128439 U CN201020128439 U CN 201020128439U CN 201663023 U CN201663023 U CN 201663023U
- Authority
- CN
- China
- Prior art keywords
- sulfuration
- resistance
- substrate
- chip
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Details Of Resistors (AREA)
Abstract
The utility model relates to a chip resistor and a chip array which are both provided with anti-vulcanizing electrode structures. The chip resistor comprises a substrate, two silver electrodes formed on two sides of the substrates, a resistor formed on the substrate and lapped with the silver electrodes on two sides, a protective layer covering the resistor and an anti-vulcanizing material formed on the upper surface of the substrate and covering exposed portions of the silver electrodes. By aid of the anti-vulcanizing material, the silver electrode can not be compounded with sulfide in the external environment to generate silver sulfide, poor contact between the silver electrodes and the resistor interface is avoided, and stability of the resistor in high-vulcanizing reliability tests can be improved.
Description
Technical field
The utility model relates to a kind of Chip-R and wafer exclusion, particularly relates to the Chip-R and the wafer exclusion of the anti-sulfuration of a kind of tool electrode structure.
Background technology
Existing Chip-R mainly is to stamp electrode in the ceramic substrate both sides; each electrode all extends to the upper and lower surface of substrate; and then print the electrode that a resistance connects both sides respectively at upper surface of base plate; on resistance, cover a protective layer more at last and constitute Chip-R; wherein electrode generally adopts silver electrode; main cause is that the resistivity of silver is minimum, is the metal material of conductivity the best under the normal temperature.
Yet since the metallic character of silver make its easily and sulfide chemical combination of external environment become silver sulfide and extend to contact portion with resistance gradually, silver electrode is subjected to vulcanizing erosion easily and will causes the interface loose contact or the generation of itself and resistance to open circuit, thereby influences the product stability of Chip-R at reliability test.
This shows that above-mentioned existing Chip-R and wafer exclusion obviously still have inconvenience and defective, and demand urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found anti-Chip-R and the wafer exclusion that vulcanizes electrode structure of a kind of novel tool, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing Chip-R and wafer exclusion exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding anti-Chip-R and the wafer exclusion that vulcanizes electrode structure of a kind of novel tool, can improve general existing Chip-R and wafer exclusion, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present utility model is; overcome the defective that existing Chip-R and wafer exclusion exist; and provide a kind of novel tool anti-Chip-R and the wafer exclusion that vulcanizes electrode structure; technical problem to be solved is to make it reach the protection silver electrode by an anti-metal sulphide layer can not produce combination reaction with extraneous sulfide, is very suitable for practicality.
The purpose of this utility model and to solve its technical problem be to adopt following technical scheme to realize.According to the Chip-R of the anti-sulfuration of a kind of tool that the utility model proposes electrode structure, it comprises:
One substrate;
Two silver electrodes are formed at this substrate both sides respectively, and each silver electrode comprises the top that is positioned at upper surface of base plate, the bottom that is positioned at the sidepiece of substrate side surfaces and is positioned at base lower surface;
One resistance is formed at this upper surface of base plate, and the silver electrode top of splicing in the substrate both sides is extended at these resistance two ends respectively;
One protective layer is formed on the substrate and covers this resistance; And
Two anti-sulfuration materials are formed at the substrate both sides respectively and cover the exposed part on each silver electrode top.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
The Chip-R of the anti-sulfuration of aforesaid tool electrode structure, wherein said resistance is anti-sulfuration resistance, this two anti-sulfuration material is the extension at these resistance two ends.
The Chip-R of the anti-sulfuration of aforesaid tool electrode structure, wherein said two anti-sulfuration materials are anti-sulfuration electrode.
The Chip-R of the anti-sulfuration of aforesaid tool electrode structure, wherein said two anti-sulfuration materials are anti-sulfuration resistance.
The Chip-R of the anti-sulfuration of aforesaid tool electrode structure, it further comprises two first the metals anti-sulfuration material and the silver electrode of covered substrate both sides respectively, and two second metals cover this two first metal respectively.
The purpose of this utility model and solve its technical problem and also realize by the following technical solutions.According to the wafer exclusion of the anti-sulfuration of a kind of tool that the utility model proposes electrode structure, it comprises:
One substrate;
A plurality of resistance are formed at this upper surface of base plate, and those resistance two ends extend to the substrate both sides respectively;
A plurality of silver electrodes are formed at these substrate both sides and connect an end of each resistance respectively, and each silver electrode comprises the top that is positioned at upper surface of base plate and splices with resistance, the bottom that is positioned at the sidepiece of substrate side surfaces and is positioned at base lower surface;
One protective layer is formed on the substrate and is covered on those resistance; And
A plurality of anti-sulfuration materials are formed on the substrate and cover the exposed part on each silver electrode top.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
The wafer exclusion of the anti-sulfuration of aforesaid tool electrode structure, wherein said those resistance are respectively the extension at those resistance two ends for anti-sulfuration resistance, those anti-sulfuration materials.
The wafer exclusion of the anti-sulfuration of aforesaid tool electrode structure, wherein said those anti-sulfuration materials are anti-sulfuration electrode.
The wafer exclusion of the anti-sulfuration of aforesaid tool electrode structure, wherein said those anti-sulfuration materials are anti-sulfuration resistance.
The wafer exclusion of the anti-sulfuration of aforesaid tool electrode structure, it further comprises a plurality of first metals anti-sulfuration material and the silver electrode of covered substrates both sides respectively, and comprises a plurality of second metals and cover those first metals respectively.
The utility model compared with prior art has tangible advantage and beneficial effect.Via as can be known above, in order to achieve the above object, the utility model provides the Chip-R of the anti-sulfuration of a kind of tool electrode structure, and it reaches the protection silver electrode by an anti-metal sulphide layer can not produce combination reaction with extraneous sulfide.Make the Chip-R of the anti-sulfuration of this tool electrode structure comprise: a substrate; Two silver electrodes are formed at this substrate both sides respectively, and each silver electrode comprises the top that is positioned at upper surface of base plate, the bottom that is positioned at the sidepiece of substrate side surfaces and is positioned at base lower surface; One resistance is formed at this upper surface of base plate, and the silver electrode top of splicing in the substrate both sides is extended at these resistance two ends respectively; One protective layer is formed on the substrate and covers this resistance; And two anti-sulfuration materials, be formed at the substrate both sides respectively and cover the exposed part on each silver electrode top.Because silver electrode top has covered the anti-sulfuration of one deck material as insulating effect, can guarantee that silver electrode can not produce combination reaction with the sulfide of external environment and become silver sulfide, avoided the situation of silver electrode and the loose contact of resistance interface to take place, and then can promote the product stability of Chip-R at height sulfuration reliability test.
The utility model provides the wafer exclusion of the anti-sulfuration of a kind of tool electrode structure, and it comprises: a substrate; A plurality of resistance are formed at this upper surface of base plate, and those resistance two ends extend to the substrate both sides respectively; A plurality of silver electrodes are formed at these substrate both sides and connect an end of each resistance respectively, and each silver electrode comprises the top that is positioned at upper surface of base plate and splices with resistance, the bottom that is positioned at the sidepiece of substrate side surfaces and is positioned at base lower surface; One protective layer is formed on the substrate and is covered on those resistance; And a plurality of anti-sulfuration materials, be formed on the substrate and cover the exposed part on each silver electrode top.
By technique scheme, the Chip-R and the wafer exclusion of the anti-sulfuration of the utility model tool electrode structure have following advantage and beneficial effect at least: the utility model provides the Chip-R of the anti-sulfuration of a kind of tool electrode structure, the utility model is by cover the anti-sulfuration of one deck material on silver electrode, can guarantee that the silver electrode part that is connected with resistance can not become silver sulfide with the sulfide chemical combination of external environment, avoid taking place, and then promote the product stability of resistance at height sulfuration reliability test with the situation of resistance interface loose contact.
In sum; the utility model relates to the Chip-R and the wafer exclusion of the anti-sulfuration of a kind of tool electrode structure; this Chip-R comprises a substrate; two are formed at the silver electrode of substrate both sides; one is formed on the substrate and the resistance of the both sides silver electrode of splicing; one protective layer and that covers this resistance is formed at upper surface of base plate and covers the anti-sulfuration material of silver electrode exposed part; can guarantee that by anti-sulfuration material silver electrode can not become silver sulfide with the sulfide chemical combination of external environment; avoid taking place, and then promote the product stability of resistance at height sulfuration reliability test with the situation of resistance interface loose contact.The utility model has obvious improvement technically, and has tangible good effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the cutaway view of the utility model one preferred embodiment.
Fig. 2 is the cutaway view of another preferred embodiment of the utility model.
10: substrate 11a, 11b, 11c: silver electrode
12: resistance 13: protective layer
14: 15: the first metals of anti-sulfuration material
16: the second metals
Embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to Chip-R and its embodiment of wafer exclusion, structure, feature and effect thereof according to the anti-sulfuration of the tool that the utility model proposes electrode structure, describe in detail as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present utility model can clearly present in the following detailed description that cooperates with reference to graphic preferred embodiment.For convenience of description, in following embodiment, components identical is represented with identical numbering.
Please refer to shown in Figure 1ly, be the generalized section of Chip-R one preferred embodiment of the anti-sulfuration of the utility model tool electrode structure, it comprises:
One substrate 10 is a ceramic substrate in the present embodiment;
Two silver electrode 11a, 11b, 11c is to be formed at this substrate 10 both sides respectively, normally sees through printing means and is formed at substrate 10 both sides; Each silver electrode 11a, 11b, 11c comprise the top 11a that is positioned at substrate 10 upper surfaces, the bottom 11c that is positioned at the sidepiece 11b of substrate 10 sides and is positioned at substrate 10 lower surfaces;
One resistance 12 is to be formed at this substrate 10 upper surfaces, generally is to see through printing means to be formed at substrate 10 upper surfaces, and these resistance 12 two ends are extended respectively and spliced on the 11a of the silver electrode top of substrate 10 both sides, and it can be anti-sulfuration resistance;
One protective layer 13 is formed on the substrate 10 and covers this resistance 12, generally is formed on the resistance 12 through fabrication steps such as printing, drying, sintering;
Two anti-sulfuration materials 14 are formed at substrate 10 both sides respectively and cover the exposed part of each silver electrode top 11a, promptly cover the part of not spliced by aforementioned resistance 12, with as anti-isolated protection of vulcanizing; Should can be anti-sulfuration electrode or anti-sulfuration resistance by anti-sulfuration material 14;
Two first metals 15, the anti-sulfuration material 14 and the silver electrode 11a of difference covered substrate 10 both sides, 11b, 11c, in the present embodiment, this first metal 15 is a nickel dam; And
Two second metals 16 cover this two first metal 15 respectively, and in the present embodiment, this second metal 16 is a tin layer.
First and second metal 15,16 is mainly in order to increase aforementioned silver electrode 11a, 11b, the weld strength of 11c.
On substrate 10, form silver electrode 11a; 11b; during 11c; be earlier at substrate 10 upper and lower surface printings aforementioned silver electrode top 11a and bottom 11c; resistance 12, the protective layer 13 gone up to be printed is with after the anti-sulfuration material 14; form silver electrode sidepiece 11b again in substrate 10 sides, finish upper and lower part 11a, the electric connection of 11c.
Please further with reference to shown in Figure 2; aforementioned anti-sulfuration material 14 can design itself and resistance 12, and to be all same material made; extend the aforementioned silver electrode of covering top 11a so can be considered aforementioned resistance 12 always; therefore before forming protective layer 13, can directly make the silver electrode top 11a of resistance 12 complete covered substrate 10 upper surfaces.
Because the isolated protection of anti-sulfuration material 14, silver electrode top 11a can not produce combination reaction and extend the contact portion that corrodes silver electrode top 11a and resistance 12 gradually with extraneous sulfide.
Technological means of the present utility model also can be applicable to the structure of wafer exclusion, with Chip-R do not exist together only be from print single resistance 12 in substrate 10 change into the printing a plurality of resistance 12 on substrate 10, make a plurality of silver electrode 11a again, 11b, 11c are formed at these substrate 10 both sides and connect an end of each resistance 12 respectively; Make protective layer 13 be formed on the substrate 10 again and be covered on those resistance 12; Form the exposed part that a plurality of anti-sulfuration materials 14 cover each silver electrode top 11a at last again on substrate 10, the demand of looking again afterwards further forms first and second metal 15,16.
Because the signal of the structural profile of wafer exclusion is identical with the cutaway view of the Chip-R of the single resistance of aforementioned tool, so do not repeat to draw at this.
In sum, the utility model is by cover the anti-sulfuration of one deck material on silver electrode, can guarantee that the silver electrode part that is connected with resistance can not become silver sulfide with the sulfide chemical combination of external environment, avoid taking place, and then promote the product stability of resistance at height sulfuration reliability test with the situation of resistance interface loose contact.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art are not in breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (10)
1. a tool resists the Chip-R that vulcanizes electrode structure, it is characterized in that it comprises:
One substrate;
Two silver electrodes are formed at this substrate both sides respectively, and each silver electrode comprises the top that is positioned at upper surface of base plate, the bottom that is positioned at the sidepiece of substrate side surfaces and is positioned at base lower surface;
One resistance is formed at this upper surface of base plate, and the silver electrode top of splicing in the substrate both sides is extended at these resistance two ends respectively;
One protective layer is formed on the substrate and covers this resistance; And
Two anti-sulfuration materials are formed at the substrate both sides respectively and cover the exposed part on each silver electrode top.
2. the Chip-R of the anti-sulfuration of tool according to claim 1 electrode structure is characterized in that wherein said resistance is anti-sulfuration resistance, and this two anti-sulfuration material is the extension at these resistance two ends.
3. the Chip-R of the anti-sulfuration of tool according to claim 1 electrode structure is characterized in that wherein said two anti-sulfuration materials are anti-sulfuration electrode.
4. the Chip-R of the anti-sulfuration of tool according to claim 1 electrode structure is characterized in that wherein said two anti-sulfuration materials are anti-sulfuration resistance.
5. according to the anti-Chip-R that vulcanizes electrode structure of the described tool of arbitrary claim in the claim 1 to 4, it is characterized in that it further comprises two first the metals anti-sulfuration material and the silver electrode of covered substrate both sides respectively, and two second metals cover this two first metal respectively.
6. a tool resists the wafer exclusion that vulcanizes electrode structure, it is characterized in that it comprises:
One substrate;
A plurality of resistance are formed at this upper surface of base plate, and those resistance two ends extend to the substrate both sides respectively;
A plurality of silver electrodes are formed at these substrate both sides and connect an end of each resistance respectively, and each silver electrode comprises the top that is positioned at upper surface of base plate and splices with resistance, the bottom that is positioned at the sidepiece of substrate side surfaces and is positioned at base lower surface;
One protective layer is formed on the substrate and is covered on those resistance; And
A plurality of anti-sulfuration materials are formed on the substrate and cover the exposed part on each silver electrode top.
7. the wafer exclusion of the anti-sulfuration of tool according to claim 6 electrode structure is characterized in that wherein said those resistance are anti-sulfuration resistance, and those anti-sulfuration materials are respectively the extension at those resistance two ends.
8. the wafer exclusion of the anti-sulfuration of tool according to claim 6 electrode structure is characterized in that wherein said those anti-sulfuration materials are anti-sulfuration electrode.
9. the wafer exclusion of the anti-sulfuration of tool according to claim 6 electrode structure is characterized in that wherein said those anti-sulfuration materials are anti-sulfuration resistance.
10. according to anti-Chip-R and the wafer exclusion that vulcanizes electrode structure of the described tool of arbitrary claim in the claim 7 to 10, it is characterized in that it further comprises a plurality of first the metals anti-sulfuration material and the silver electrode of covered substrates both sides respectively, and comprise a plurality of second metals and cover those first metals respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020128439XU CN201663023U (en) | 2010-03-03 | 2010-03-03 | Chip resistor and chip array both with anti-vulcanizing electrode structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020128439XU CN201663023U (en) | 2010-03-03 | 2010-03-03 | Chip resistor and chip array both with anti-vulcanizing electrode structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201663023U true CN201663023U (en) | 2010-12-01 |
Family
ID=43233442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020128439XU Expired - Lifetime CN201663023U (en) | 2010-03-03 | 2010-03-03 | Chip resistor and chip array both with anti-vulcanizing electrode structures |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201663023U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470716A (en) * | 2012-06-14 | 2015-03-25 | 保力马科技(日本)株式会社 | Substrate sheet and touch panel |
| CN105913986A (en) * | 2015-02-19 | 2016-08-31 | 罗姆股份有限公司 | Chip resistor and method for manufacturing the same |
| JP2016171306A (en) * | 2015-02-19 | 2016-09-23 | ローム株式会社 | Chip resistor and method for manufacturing the same |
-
2010
- 2010-03-03 CN CN201020128439XU patent/CN201663023U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470716A (en) * | 2012-06-14 | 2015-03-25 | 保力马科技(日本)株式会社 | Substrate sheet and touch panel |
| CN104470716B (en) * | 2012-06-14 | 2016-08-31 | 保力马科技(日本)株式会社 | Substrate film and contact panel |
| CN105913986A (en) * | 2015-02-19 | 2016-08-31 | 罗姆股份有限公司 | Chip resistor and method for manufacturing the same |
| JP2016171306A (en) * | 2015-02-19 | 2016-09-23 | ローム株式会社 | Chip resistor and method for manufacturing the same |
| US9997281B2 (en) | 2015-02-19 | 2018-06-12 | Rohm Co., Ltd. | Chip resistor and method for manufacturing the same |
| CN105913986B (en) * | 2015-02-19 | 2019-01-01 | 罗姆股份有限公司 | Chip resistor and its manufacturing method |
| US10453593B2 (en) | 2015-02-19 | 2019-10-22 | Rohm Co., Ltd. | Chip resistor and method for manufacturing the same |
| US10832837B2 (en) | 2015-02-19 | 2020-11-10 | Rohm Co., Ltd. | Chip resistor and method for manufacturing the same |
| US11189403B2 (en) | 2015-02-19 | 2021-11-30 | Rohm Co., Ltd. | Chip resistor and method for manufacturing the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102074676A (en) | Power battery | |
| CN201663023U (en) | Chip resistor and chip array both with anti-vulcanizing electrode structures | |
| CN202534655U (en) | Novel solar battery photovoltaic solder strip device | |
| JP5957693B2 (en) | Chip resistor | |
| JP2007273699A (en) | Electric double layer capacitor | |
| CN106205911B (en) | Short-circuit-proof thermosensitive chip and preparation method thereof | |
| CN204046920U (en) | Fastening type pcb board | |
| CN210200434U (en) | Thick film chip resistor of printing type vulcanization-resistant structure | |
| CN105992458B (en) | Micro-aperture conductive through hole structure of flexible circuit board and manufacturing method thereof | |
| ITRM20110040A1 (en) | ELEMENTS OF VERTICAL ELECTRICAL CONNECTION OF PHOTOELECTROCHEMICAL CELLS. | |
| CN107275306A (en) | Stacking rectifier in encapsulation | |
| CN103996583B (en) | Micro paster type high voltage-resistant protection element and preparation method thereof | |
| CN211479789U (en) | Thick film surge-resistant chip resistor | |
| CN104347208B (en) | A kind of resistor production method, resistor and circuit | |
| CN201233778Y (en) | Nickel or nickel based alloy electrode patch type resistor | |
| CN202929059U (en) | Novel probe strip structure for solar cell | |
| CN202042875U (en) | Thin type circuit protection device | |
| CN201846318U (en) | Surface mount type quartz crystal resonator | |
| CN205564431U (en) | PTC temperature sensing subassembly of parallelly connected structure | |
| CN103367298A (en) | Semiconductor packaging structure and packaging method thereof | |
| CN212569729U (en) | Conductive film | |
| CN102891124B (en) | Package structure and method for fabricating the same | |
| CN203340403U (en) | A circuit board | |
| CN203415335U (en) | Electrode enhanced power negative-temperature thermistor | |
| CN206146965U (en) | Surface mounting is durable test base plate of heavy current for product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101201 |