CN201662582U - Reactive controllable chip testing socket - Google Patents
Reactive controllable chip testing socket Download PDFInfo
- Publication number
- CN201662582U CN201662582U CN2009202732812U CN200920273281U CN201662582U CN 201662582 U CN201662582 U CN 201662582U CN 2009202732812 U CN2009202732812 U CN 2009202732812U CN 200920273281 U CN200920273281 U CN 200920273281U CN 201662582 U CN201662582 U CN 201662582U
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- CN
- China
- Prior art keywords
- probe
- chip
- spring probe
- holding plate
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 26
- 239000000523 sample Substances 0.000 claims abstract description 74
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 239000011148 porous material Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 3
- 238000009826 distribution Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 2
- 230000036316 preload Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Measuring Leads Or Probes (AREA)
Abstract
The utility model provides a reactive controllable chip testing socket which comprises a chip retaining plate (2), a grounding copper block (3), a probe positioning plate (6), a probe retaining plate (7), a grounding spring probe (4), and a signal/power source spring probe (5). With the increasingly improved running speed of an integrated circuit chip, the requirement in the testing industry that a chip testing fixture ought to have stronger high-frequency integrated signals is satisfied, and the reactance (or the impedance) of the chip testing fixture is made within a certain range to reduce the loss during electrical signals passing; and meanwhile, when the contact distribution of different chips (1) used by the chip testing socket is changed, the use requirement can be satisfied only if the probe positioning plate (6) is conveniently replaced, and other parts has no need to be changed, so that the processability of the testing socket is greatly improved and the costs are reduced.
Description
Technical field
The utility model belongs to semicon industry, specially refers to a kind of proving installation of semi-conductor chip.
Background technology
Along with the raising day by day of integrated circuit (IC) chip travelling speed, chip testing industry requirement chip testing anchor clamps can have the integrated performance of higher high-frequency signal.In the actual test of chip, test fixture must be kept reactance (or impedance) (for example 50 ohm) in a certain particular range, with reduce electric signal by the time loss that causes, still, present chip testing anchor clamps all can not satisfy the requirement of high frequency characteristics.According to the retrieval, before the utility model was made, still the test jack for reactive controllable chip identical with the utility model found at the end.In the prior art, the major technique measure of adopting at present is to shorten the contact probe that connects chip and wiring board as far as possible, figures for good high frequency characteristics, but all can not satisfy the requirement of processibility and low price.Equally, chip testing socket of the prior art, generally formed by chip holding plate, chip carrier socket main body and probe holding plate, for signal/power supply spring probe and grounded probe, what adopt is identical spring probe, and this has also fundamentally determined reactance can not satisfy the frequency requirement that raises day by day.
The utility model content
The purpose of this utility model, be to pass through improvements over the prior art, adopted displaced type brand new and different spring probes, satisfied the controlled and test request that different contact distributions is regulated according to chip of reactance, in the hope of reaching the requirement that reduces manufacturing cost and improve processing characteristics.
The purpose of this utility model is to realize by following technical scheme: the test jack for reactive controllable chip that the utility model relates to, its structure mainly include the probe holding plate of the chip holding plate that is installed in test jack top and test jack bottom.Also be equipped with between the two one can be for convenience detach the probe location-plate.And between chip holding plate and probe location-plate, be equipped with a ground connection copper billet.The ground connection copper billet is equipped with inner chamber by actual requirement, respectively corresponding insertion ground spring probe and signal/power supply spring probe.The external diameter of ground spring probe, close with the corresponding pin lumen pore of the ground connection copper billet internal diameter that inserts, to guarantee and can insert that the excellent contact performance is arranged again; And the external diameter of signal/power supply spring probe and the corresponding pin lumen pore of ground connection copper billet internal diameter should maintain certain ratio, are generally 2.1～2.5, and gap between the two exists the air dielectric that can play insulating effect.The ground spring probe all has identical diameter with the top and bottom of signal/power supply spring probe.
Because the utility model has been introduced the ground connection copper billet, and has ensured that the ground connection copper billet contacts with the good of spring probe, has guaranteed reliable ground connection; Make again between ground connection copper billet and the signal/power supply spring probe directly not contact, reasonably exist the air dielectric of insulation, thereby obtained specific reactance.In the utility model, the isolated insulation between signal/power supply spring probe and the ground spring penetration needling depends primarily on the probe location-plate; Chip holding plate and probe holding plate have then played the positioning function that keeps probe.The probe location-plate is depended in the distribution of signal/power probe and grounded probe, when size chip of the same race, the distribution of different contact point, as long as by changing the different probe location-plate, just can realize, this shows that the utility model has reached foregoing utility model purpose.
Description of drawings
Fig. 1: the utility model structural representation
Embodiment
Below in conjunction with drawings and Examples technical solutions of the utility model are described further.
Utilize screw that chip holding plate 2 and ground connection copper billet 3 are fixed together, contact according to chip 1 distributes then, select corresponding with it probe location-plate 6, according to different vestibule diameters, be respectively charged into ground spring probe 4 and signal/power supply spring probe 5, load onto probe holding plate 7 then, be fixed on the socket main body with screw, whole socket just can be assembled and finish.
Chip holding plate 2 is made by insulating material, and the space between all vestibules and the probe 4,5 is less, thereby all spring probes 4,5 are had location and guide effect.Simultaneously, also be provided with big pilot hole on the chip holding plate 2, contact with spring probe head 4,5 to guarantee the ball on the chip 1.
Ground connection copper billet 3 is made up of the conduction copper material, it is positioned between chip holding plate 2 and the probe location-plate 6, because it contacts with ground spring probe 4, thereby the ground wire on whole ground connection copper billet 3 and the testing host is joined, so just make the specific reactance value of generation between signal pin and the vestibule.
Probe location-plate 6 is made by insulating material, with the contact between separation signal/power supply spring probe 5 and the ground spring probe 4, simultaneously, it as one with chip 1 on signal, power supply, the earthing contact corresponding locating element that distributes, concerning the chip that different contacts distribute, only need the corresponding probe location-plate 6 of preparation, other part can be constant, reduced the cost of test jack.
The upper and lower side of signal/power supply spring probe 5 and ground spring probe 4 should have identical diameter, thereby makes the pin lumen pore of chip holding plate 2 and probe holding plate 7 have identical diameter.Like this, when the distribution of the contact of chip 1 changed, spring probe 4,5, ground connection copper billet 3, chip holding plate 2 and penetration needling holding plate 7 just can become general purpose accessory, and needn't change.
The external diameter of signal/power supply spring probe 5, the ratio with the pin chamber internal diameter of ground connection copper billet 3 may be selected to be 2.3, meets the desired ratio of reactance to satisfy.The bottom cylindrical of signal/power supply spring probe is provided with a wheel flange, and under the pressure holding of probe location-plate 6, following moving pin moves up, and produces preload, can guarantee that probe is in operation stable and lower resistance.
One step is arranged at the top of ground spring probe 4, and under the pressure of chip holding plate 2, ground spring probe 4 can have preload to lower compression.
Probe holding plate 7 is made by insulating material, has the function of the probe of maintenance in vestibule, and the lower end to probe has certain guide effect simultaneously.
When needs are changed another kind of chip 1, can unclamp screw, take off probe holding plate 7, take out ground spring probe 4 and signal/power supply spring probe 5, select to change corresponding probe location-plate 6, be respectively charged into two kinds of probes 4,5 then, load onto probe holding plate 7, fix with screw, just formed a new test jack.
Claims (4)
1. test jack for reactive controllable chip, include the probe holding plate (7) of the chip holding plate (2) that is installed in socket top and socket bottom, and spring probe, it is characterized in that: the probe location-plate (6) of a movable dismounting also is equipped with on the top of probe holding plate (7); And between chip holding plate (2) and probe location-plate (6), be equipped with ground connection copper billet (3); Described spring probe has ground spring probe (4) and signal/power supply spring probe (5) respectively, inserts respectively in the corresponding vestibule of ground connection copper billet (3).
2. a kind of test jack for reactive controllable chip according to claim 1 is characterized in that: the corresponding pin lumen pore internal diameter of the external diameter of ground spring probe (4) and ground connection copper billet (3) is close, and excellent contact is arranged.
3. a kind of test jack for reactive controllable chip according to claim 2 is characterized in that: the ratio of the corresponding pin lumen pore internal diameter of the external diameter of signal/power supply spring probe (5) and ground connection copper billet (3) is 2.1～2.5; Exist the air dielectric of insulation between the two.
4. a kind of test jack for reactive controllable chip according to claim 3 is characterized in that: the top and bottom of ground spring probe (4) and signal/power supply spring probe (5), diameter is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202732812U CN201662582U (en) | 2009-12-11 | 2009-12-11 | Reactive controllable chip testing socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202732812U CN201662582U (en) | 2009-12-11 | 2009-12-11 | Reactive controllable chip testing socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201662582U true CN201662582U (en) | 2010-12-01 |
Family
ID=43233001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202732812U Expired - Lifetime CN201662582U (en) | 2009-12-11 | 2009-12-11 | Reactive controllable chip testing socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201662582U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101710659B (en) * | 2009-12-11 | 2011-07-27 | 安拓锐高新测试技术（苏州）有限公司 | Test jack for reactive controllable chip |
| CN104569505A (en) * | 2013-10-28 | 2015-04-29 | 分类测试电子系统公司 | Screwless contact spring exchange |
-
2009
- 2009-12-11 CN CN2009202732812U patent/CN201662582U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101710659B (en) * | 2009-12-11 | 2011-07-27 | 安拓锐高新测试技术（苏州）有限公司 | Test jack for reactive controllable chip |
| CN104569505A (en) * | 2013-10-28 | 2015-04-29 | 分类测试电子系统公司 | Screwless contact spring exchange |
| CN104569505B (en) * | 2013-10-28 | 2019-04-26 | 分类测试电子系统公司 | The replacement of non-threaded contact spring |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20101201 Effective date of abandoning: 20091211 |