CN101710659B - Test jack for reactive controllable chip - Google Patents
Test jack for reactive controllable chip Download PDFInfo
- Publication number
- CN101710659B CN101710659B CN2009102614100A CN200910261410A CN101710659B CN 101710659 B CN101710659 B CN 101710659B CN 2009102614100 A CN2009102614100 A CN 2009102614100A CN 200910261410 A CN200910261410 A CN 200910261410A CN 101710659 B CN101710659 B CN 101710659B
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- Prior art keywords
- probe
- chip
- spring probe
- holding plate
- signal
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- 238000012360 testing method Methods 0.000 title claims abstract description 23
- 239000000523 sample Substances 0.000 claims abstract description 74
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 238000009413 insulation Methods 0.000 claims description 3
- 238000009826 distribution Methods 0.000 abstract description 5
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 2
- 230000036316 preload Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a test jack for a reactive controllable chip, which is composed of a chip holding plate (2), a grounded copper block (3), a probe positioning plate (6), a probe holding plate (7), a ground spring probe (4) and a signal/power supply spring probe (5). With the increasing running speed of integrated circuit chips, a chip test fixture which can meet the demand of test industry should include better high-frequency integrated signal so that reactance (impedance) thereof is within a certain range to reduce the loss of electric signals at the time of get-through. Meanwhile, according to the invention, use requirements can be satisfied only by conveniently replacing the probe positioning plate (6) instead of changing other parts when the distribution of contacts using different chips (1) is changed, thus greatly enhancing the processability of the test jack and lowering cost.
Description
Technical field
The invention belongs to semicon industry, specially refer to a kind of testing apparatus of semiconductor chip.
Background technology
Along with the raising day by day of the integrated circuit (IC) chip speed of service, chip testing industry requirement chip testing anchor clamps can have the integrated performance of higher high-frequency signal.In the actual test of chip, test fixture must be kept reactance (or impedance) (for example 50 ohm) in a certain particular range, with reduce the signal of telecommunication by the time loss that causes, still, present chip testing anchor clamps all can not satisfy the requirement of high frequency characteristics.According to the retrieval, before the present invention made, still the test jack for reactive controllable chip identical with the present invention found at the end.In the prior art, the major technique measure of adopting at present is to shorten the contact probe that connects chip and wiring board as far as possible, figures for good high frequency characteristics, but all can not satisfy the requirement of machinability and low price.Equally, chip testing socket of the prior art, generally formed by chip holding plate, chip carrier socket main body and probe holding plate, for signal/power supply spring probe and grounded probe, what adopt is identical spring probe, and this has also fundamentally determined reactance can not satisfy the frequency requirement that raises day by day.
Summary of the invention
Purpose of the present invention, be to pass through improvements over the prior art, adopted displaced type brand new and different spring probes, satisfied the controlled and test request that different contact distributions is regulated according to chip of reactance, in the hope of reaching the requirement that reduces manufacturing cost and improve processing characteristics.
The objective of the invention is to realize by following technical scheme; The test jack for reactive controllable chip that the present invention relates to, its structure mainly include the probe holding plate of the chip holding plate that is installed in test jack top and test jack bottom.Also be equipped with between the two one can be for convenience detach the probe location-plate.And between chip holding plate and probe location-plate, be equipped with a ground connection copper billet.The ground connection copper billet is equipped with vestibule by actual requirement, respectively corresponding insertion ground spring probe and signal/power supply spring probe.The external diameter of ground spring probe, close with the corresponding vestibule internal diameter of ground connection copper billet that inserts, to guarantee and can insert that the excellent contact performance is arranged again; And the corresponding vestibule internal diameter of the external diameter of signal/power supply spring probe and ground connection copper billet should maintain certain ratio, is 1: 2.1～1: 2.5, and gap between the two exists the air dielectric that can play insulating effect.The top and bottom of ground spring probe are all identical with the top and bottom diameter of signal/power supply spring probe.
Because the present invention has introduced the ground connection copper billet, and has ensured that the ground connection copper billet contacts with the good of spring probe, has guaranteed reliable ground connection; Make again between ground connection copper billet and the signal/power supply spring probe directly not contact, reasonably exist the air dielectric of insulation, thereby obtained specific reactance.In the present invention, the isolated insulation between signal/power supply spring probe and the ground spring penetration needling depends primarily on the probe location-plate; Chip holding plate and probe holding plate have then played the positioning function that keeps probe.The probe location-plate is depended in the distribution of signal/power probe and grounded probe, when size chip of the same race, the distribution of different contact point, as long as by changing the different probe location-plate, just can realize that this shows, the present invention has reached foregoing goal of the invention.
Description of drawings
Fig. 1: structural representation of the present invention
Embodiment
Below in conjunction with drawings and Examples technical solution of the present invention is described further.
Utilize screw that chip holding plate 2 and ground connection copper billet 3 are fixed together, contact according to chip 1 distributes then, select corresponding with it probe location-plate 6, according to different vestibule diameters, be respectively charged into ground spring probe 4 and signal/power supply spring probe 5, load onto probe holding plate 7 then, be fixed on the socket main body with screw, whole socket just can be assembled and finish.
Chip holding plate 2 is made by insulating material, and the space between all vestibules and the probe 4,5 is less, thereby all spring probes 4,5 are had location and guide effect.Simultaneously, also be provided with big pilot hole on the chip holding plate 2, contact with spring probe head 4,5 to guarantee the ball on the chip 1.
Ground connection copper billet 3 is made up of the conduction copper material, it is positioned between chip holding plate 2 and the probe location-plate 6, because it contacts with ground spring probe 4, thereby the earth connection on whole ground connection copper billet 3 and the testing host is joined, so just make the specific reactance value of generation between signal pin and the vestibule.
Probe location-plate 6 is made by insulating material, with the contact between separation signal/power supply spring probe 5 and the ground spring probe 4, simultaneously, it as one with chip 1 on signal, power supply, the earthing contact corresponding locating element that distributes, concerning the chip that different contacts distribute, only need the corresponding probe location-plate 6 of preparation, other part can be constant, reduced the cost of test jack.
The upper and lower side of signal/power supply spring probe 5 and ground spring probe 4 should have identical diameter, thereby makes the pin lumen pore of chip holding plate 2 and probe holding plate 7 have identical diameter.Like this, when the distribution of the contact of chip 1 changed, spring probe 4,5, ground connection copper billet 3, chip holding plate 2 and penetration needling holding plate 7 just can become general purpose accessory, and needn't change.
The external diameter of signal/power supply spring probe 5, the ratio with the pin chamber internal diameter of ground connection copper billet 3 may be selected to be 1: 2.3, meets the desired ratio of reactance to satisfy.The bottom cylindrical of signal/power supply spring probe is provided with a wheel flange, and under the pressure holding of probe location-plate 6, following moving pin moves up, and produces preload, can guarantee that probe is in operation stable and lower resistance.
One step is arranged at the top of ground spring probe 4, and under the pressure of chip holding plate 2, ground spring probe 4 can have preload to lower compression.
Probe holding plate 7 is made by insulating material, has the function of the probe of maintenance in vestibule, and the lower end to probe has certain guide effect simultaneously.
When needs are changed another kind of chip 1, can unclamp screw, take off probe holding plate 7, take out ground spring probe 4 and signal/power supply spring probe 5, select to change corresponding probe location-plate 6, be respectively charged into two kinds of probes 4,5 then, load onto probe holding plate 7, fix with screw, just formed a new test jack.
Claims (2)
1. test jack for reactive controllable chip, include the probe holding plate (7) of the chip holding plate (2) that is installed in socket top and socket bottom, and spring probe, it is characterized in that: the probe location-plate (6) of a movable dismounting also is equipped with on the top of probe holding plate (7); And between chip holding plate (2) and probe location-plate (6), be equipped with ground connection copper billet (3); Described spring probe, ground spring probe (4) and signal/power supply spring probe (5) is arranged respectively, insert respectively in the corresponding vestibule of ground connection copper billet (3), the corresponding vestibule internal diameter with ground connection copper billet (3) of the external diameter of ground spring probe (4) is close, excellent contact is arranged, the corresponding vestibule internal diameter of the external diameter of signal/power supply spring probe (5) and ground connection copper billet (3) has certain ratio, is 1: 2.1～1: 2.5; Exist the air dielectric of insulation between the two.
2. a kind of test jack for reactive controllable chip according to claim 1 is characterized in that: the top and bottom of the top and bottom of ground spring probe (4) and signal/power supply spring probe (5), diameter is all identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102614100A CN101710659B (en) | 2009-12-11 | 2009-12-11 | Test jack for reactive controllable chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102614100A CN101710659B (en) | 2009-12-11 | 2009-12-11 | Test jack for reactive controllable chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101710659A CN101710659A (en) | 2010-05-19 |
| CN101710659B true CN101710659B (en) | 2011-07-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102614100A Active CN101710659B (en) | 2009-12-11 | 2009-12-11 | Test jack for reactive controllable chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101710659B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169130A (en) * | 2010-11-29 | 2011-08-31 | 苏州优德通力电气有限公司 | Probe box with air-resistor chamber |
| US8808010B2 (en) * | 2011-06-06 | 2014-08-19 | Interconnect Devices, Inc. | Insulated metal socket |
| CN102393478A (en) * | 2011-12-05 | 2012-03-28 | 安拓锐高新测试技术（苏州）有限公司 | Chip test base |
| DK3158345T3 (en) * | 2014-06-20 | 2024-02-19 | Xcerra Corp | Test plug device and related methods |
| CN107729581B (en) * | 2016-08-10 | 2021-03-09 | 苏州韬盛电子科技有限公司 | Method for designing chip test socket structure based on FEA simulation and application thereof |
| CN109830820B (en) * | 2018-07-30 | 2021-04-23 | 番禺得意精密电子工业有限公司 | Electrical connector assembly |
| CN110736859A (en) * | 2019-10-15 | 2020-01-31 | 苏州韬盛电子科技有限公司 | Micro coaxial socket for chip test and preparation method thereof |
| CN110890495A (en) * | 2019-11-29 | 2020-03-17 | 东莞市振华新能源科技有限公司 | Military spectrum battery device with replaceable battery core |
| CN112083200A (en) * | 2020-09-11 | 2020-12-15 | 苏州韬盛电子科技有限公司 | Novel high-frequency test socket |
| US12085587B2 (en) * | 2021-01-23 | 2024-09-10 | Essai, Inc. | Hybrid shielding sockets with impedance tuning for integrated circuit device test tooling |
| CN113295894B (en) * | 2021-06-02 | 2023-06-30 | 法特迪精密科技（苏州）有限公司 | Ultrahigh frequency radar chip test socket |
| CN117761515B (en) * | 2024-01-05 | 2024-05-17 | 上海捷策创电子科技有限公司 | Test socket with PCB board base |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0030407A1 (en) * | 1979-12-10 | 1981-06-17 | John Fluke Mfg. Co., Inc. | Electrical test probe for use in testing circuits on printed circuit boards and the like |
| EP0180013A1 (en) * | 1984-09-21 | 1986-05-07 | International Business Machines Corporation | Test probe system |
| CN1112683A (en) * | 1994-03-07 | 1995-11-29 | 日立化成工业株式会社 | Clamp for detecting characteristic of semiconductor and manufacture and application of same |
| CN101454676A (en) * | 2006-04-28 | 2009-06-10 | 日本发条株式会社 | Conductive contact holder |
| CN101540465A (en) * | 2008-03-19 | 2009-09-23 | 京元电子股份有限公司 | Chip carrier socket |
| CN201335847Y (en) * | 2008-11-07 | 2009-10-28 | 环旭电子股份有限公司 | Improved probe base for detecting electronic chip |
| CN201662582U (en) * | 2009-12-11 | 2010-12-01 | 安拓锐高新测试技术（苏州）有限公司 | Reactive controllable chip testing socket |
-
2009
- 2009-12-11 CN CN2009102614100A patent/CN101710659B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0030407A1 (en) * | 1979-12-10 | 1981-06-17 | John Fluke Mfg. Co., Inc. | Electrical test probe for use in testing circuits on printed circuit boards and the like |
| EP0180013A1 (en) * | 1984-09-21 | 1986-05-07 | International Business Machines Corporation | Test probe system |
| CN1112683A (en) * | 1994-03-07 | 1995-11-29 | 日立化成工业株式会社 | Clamp for detecting characteristic of semiconductor and manufacture and application of same |
| CN101454676A (en) * | 2006-04-28 | 2009-06-10 | 日本发条株式会社 | Conductive contact holder |
| CN101540465A (en) * | 2008-03-19 | 2009-09-23 | 京元电子股份有限公司 | Chip carrier socket |
| CN201335847Y (en) * | 2008-11-07 | 2009-10-28 | 环旭电子股份有限公司 | Improved probe base for detecting electronic chip |
| CN201662582U (en) * | 2009-12-11 | 2010-12-01 | 安拓锐高新测试技术（苏州）有限公司 | Reactive controllable chip testing socket |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101710659A (en) | 2010-05-19 |
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