CN117761515B - Test socket with PCB board base - Google Patents
Test socket with PCB board base Download PDFInfo
- Publication number
- CN117761515B CN117761515B CN202410015521.8A CN202410015521A CN117761515B CN 117761515 B CN117761515 B CN 117761515B CN 202410015521 A CN202410015521 A CN 202410015521A CN 117761515 B CN117761515 B CN 117761515B
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- pcb
- hole
- test socket
- power supply
- test
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- 238000012360 testing method Methods 0.000 title claims abstract description 76
- 239000000523 sample Substances 0.000 claims abstract description 34
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000004080 punching Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 6
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 4
- 238000013473 artificial intelligence Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a test socket with a PCB board base, comprising: the PCB is used as a base of the test socket, and is designed in a laminated mode by using a PCB thin core plate, and a core power supply is arranged on the PCB; the test carrier plate is electrically connected with the tested chip through the probe; the PCB board is uniformly provided with a plurality of signal holes, a power hole and a grounding hole, wherein the signal holes are used for accommodating a plurality of signal probes, the power hole is used for accommodating the power probes, and the grounding hole is used for accommodating the grounding signal probes. According to the test socket with the PCB base, the PCB is used as the base of the test socket, so that the power performance, the heat dissipation problem and the high-bandwidth signal capability are successfully improved, and the high-reliability chip test function is realized.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a test socket with a PCB base.
Background
Currently, large-power chips such as AI (ARTIFICIAL INTELLIGENCE )/HPC (High Performance Computing, high-performance computing) and the like (ATE (Automatic Test Equipment, automatic testing machine) are tested, and very high requirements on power performance, signal integrity and heat dissipation are all required, and are becoming indispensable.
The existing test socket design mode is to optimize the socket performance to the best, then optimize the test carrier board performance to the best, and assemble and use after each production. But performance after assembly often fails to meet the test requirements.
At present, a common plastic base socket cannot simulate a coaxial structure well because the base is plastic, and transmission of electromagnetic waves of quasi-TEM (TRANSVERSE ELECTROMAGNETIC, which means that an electric vector and a magnetic vector are perpendicular to a propagation direction) is performed, so that the signal bandwidth is limited to below 20 Ghz. In addition, the mutual inductance between the power supply and the ground pins of the socket pins cannot be further reduced by other means, and the self inductance can only be passively reduced by increasing the diameter of the probe, so that the purpose of reducing the loop inductance of the socket part is achieved, but the effect is quite limited.
The coaxial socket is used in the high-frequency or high-end application field, the base material of the socket is metal, then glue is filled and secondary punching is carried out, and a similar coaxial structure is realized, so that the signal bandwidth is improved, and the coaxial socket is also a main scheme for coping with high speed and high frequency in the current market.
Compared with a common socket, the coaxial socket can solve the problem of signal bandwidth, and the highest frequency can even reach more than 50Ghz, but because the probe is inserted into the base of the socket, deflection is unavoidable, and the problem of concentricity is a common problem of coaxiality. In addition, although the grounding pin of the coaxial socket depends on deflection of the probe, the grounding pin can intermittently contact with the metal base, so that mutual inductance between the power pin and the ground is improved, and loop inductance is reduced, signal connection from the tested chip to the test carrier plate is necessarily inductance of a serial socket part, and inductance of the socket part is only reduced relative to that of a common socket and is limited.
Accordingly, there is a need to provide a test socket with a PCB board base for solving the above-mentioned problems.
Disclosure of Invention
The invention aims to provide a test socket with a PCB base, which successfully improves the power performance, the heat dissipation problem and the high-bandwidth signal capability by using the PCB as the base of the test socket, and realizes the high-reliability chip test function.
The embodiment of the invention provides a test socket with a PCB base, which comprises:
The PCB is used as a base of the test socket, and is designed in a laminated mode by using a PCB thin core plate, and a core power supply is arranged on the PCB;
the test carrier plate is electrically connected with the tested chip through the probe;
The PCB board is evenly provided with a plurality of signal holes, a power hole and a grounding hole, the signal holes are used for accommodating a plurality of signal probes, the power hole is used for accommodating the power probes, the grounding hole is used for accommodating the grounding signal probes, the power probes are directly connected with a power layer of the PCB board, and chip power supply current flows through the power layer of the PCB board and then is transmitted to the test carrier board.
Preferably, the inductance formed by the PCB board is a first loop inductance, the inductance formed by the test carrier board is a second loop inductance, and the first loop inductance and the second loop inductance form a parallel path.
Preferably, the PCB board and the test carrier board are assembled using a lamination process.
Preferably, the PCB board is of a ring structure.
Preferably, the plurality of signal holes, the power supply hole, and the ground hole are subjected to electroplating treatment, and an alloy of 200um nickel and 30um gold is used as an electroplating material.
Preferably, the plurality of signal holes are first coaxial vias, the power hole and the ground hole are second common vias, the first coaxial vias and the second common vias are formed on the PCB board by etching, and the first coaxial vias and the second common vias have a first inner diameter and a second inner diameter, respectively.
Preferably, the first inner diameter is smaller than the second inner diameter.
Preferably, the first coaxial via and the second common via are hollow cylinder structures.
Preferably, the first coaxial via is obtained by:
Punching the PCB for the first time to obtain a plurality of macropores, and electroplating for the first time to form an outermost layer reflow area of the first coaxial via hole;
plugging the plurality of macropores;
And punching the plug hole for the second time to obtain a plurality of small holes, and performing electroplating for the second time to form the first coaxial via hole.
Preferably, a round table is arranged on one side of the PCB close to the chip, and the chip is in direct contact with the top layer of the PCB for electric connection.
Compared with the prior art, the technical scheme of the embodiment of the invention has at least the following beneficial effects:
The invention provides a test socket with a PCB base, which comprises: the PCB is used as a base of the test socket, and is designed in a laminated mode by using a PCB thin core plate, and a core power supply is arranged on the PCB; the test carrier plate is electrically connected with the tested chip through the probe; the PCB board is evenly provided with a plurality of signal holes, a power hole and a grounding hole, the signal holes are used for accommodating a plurality of signal probes, the power hole is used for accommodating the power probes, the grounding hole is used for accommodating the grounding signal probes, and the PCB board is used as a base of the test socket, so that the power performance, the heat dissipation problem and the high-bandwidth signal capability are successfully improved, and the chip test function with high reliability is realized.
Drawings
FIG. 1 is a schematic diagram of the structure of a PCB core power distribution in a test socket with a PCB base in an embodiment of the invention;
FIG. 2 is a schematic diagram of a test socket with a PCB base in an embodiment of the invention;
FIG. 3 is a schematic diagram of a coaxial high speed via in a test socket with a PCB board base in an embodiment of the invention;
FIG. 4 is a schematic diagram of yet another configuration of coaxial high speed vias in a test socket with a PCB board base in an embodiment of the invention;
FIG. 5 is a schematic diagram of still another configuration of coaxial high speed vias in a test socket with a PCB board base in an embodiment of the invention;
FIG. 6 is a schematic diagram of power performance of a test socket with a PCB board base in an embodiment of the invention;
Fig. 7 is another power performance schematic of a test socket with a PCB board base in an embodiment of the invention.
Reference numerals illustrate:
11-a PCB board;
12-testing a carrier plate;
131-a power probe; 132-ground signal probes; 133-signaling probe;
141-a power hole; 142-a ground hole; 143-signal holes.
Detailed Description
In order to make the objects, features and advantageous effects of the present invention more comprehensible, embodiments accompanied with figures are described in detail below. It is to be understood that the following detailed description is merely illustrative of the invention, and not restrictive of the invention. Moreover, the use of the same, similar reference numbers in the figures may indicate the same, similar elements in different embodiments, and descriptions of the same, similar elements in different embodiments, as well as descriptions of prior art elements, features, effects, etc. may be omitted.
FIG. 1 is a schematic diagram of the structure of a PCB core power distribution in a test socket with a PCB base in an embodiment of the invention; FIG. 2 is a schematic diagram of a test socket with a PCB base in an embodiment of the invention; FIG. 3 is a schematic diagram of a coaxial high speed via in a test socket with a PCB board base in an embodiment of the invention; FIG. 4 is a schematic diagram of yet another configuration of coaxial high speed vias in a test socket with a PCB board base in an embodiment of the invention; FIG. 5 is a schematic diagram of still another configuration of coaxial high speed vias in a test socket with a PCB board base in an embodiment of the invention; FIG. 6 is a schematic diagram of power performance of a test socket with a PCB board base in an embodiment of the invention; fig. 7 is another power performance schematic of a test socket with a PCB board base in an embodiment of the invention.
Referring now to fig. 1 to 7, an embodiment of the present invention provides a test socket with a PCB board base, which successfully improves power performance, heat dissipation problem, and high bandwidth signal capability by using the PCB board as the base of the test socket, thereby implementing a high-reliability chip test function.
The embodiment of the invention provides a test socket with a PCB base, which comprises:
The PCB is used as a base of the test socket, and is designed in a laminated mode by using a PCB thin core plate, and a core power supply is arranged on the PCB;
the test carrier plate is electrically connected with the tested chip through the probe;
The PCB board is evenly provided with a plurality of signal holes, a power hole and a grounding hole, the signal holes are used for accommodating a plurality of signal probes, the power hole is used for accommodating the power probes, the grounding hole is used for accommodating the grounding signal probes, the power probes are directly connected with a power layer of the PCB board, and chip power supply current flows through the power layer of the PCB board and then is transmitted to the test carrier board.
Specifically, the core power supply arranged on the PCB is screened according to the chip itself, such as an AI/GPU (analog to digital) power chip, and the impedance of the power supply is required to be very low.
In a specific implementation, the inductance formed by the PCB board is a first loop inductance, the inductance formed by the test carrier board is a second loop inductance, and the first loop inductance and the second loop inductance form a parallel path.
In a specific implementation, the PCB board and the test carrier board are assembled using a lamination process.
In a specific implementation, the PCB board is of a ring-shaped structure.
In a specific implementation, the plurality of signal holes, the power hole, and the ground hole are subjected to an electroplating process, and an alloy of 200um nickel and 30um gold is used as an electroplating material to provide high wear resistance and conductivity.
In a specific implementation, the plurality of signal holes are first coaxial vias, the power hole and the ground hole are second common vias, the first coaxial vias and the second common vias are formed on the PCB board by etching, and the first coaxial vias and the second common vias have a first inner diameter and a second inner diameter, respectively.
In a specific implementation, the first inner diameter is smaller than the second inner diameter.
In a specific implementation, the first coaxial via and the second common via are hollow cylinder structures.
In a specific implementation, the first coaxial via is obtained by:
Punching the PCB for the first time to obtain a plurality of macropores, and electroplating for the first time to form an outermost layer reflow area of the first coaxial via hole;
plugging the plurality of macropores;
And punching the plug hole for the second time to obtain a plurality of small holes, and performing electroplating for the second time to form the first coaxial via hole.
Specifically, the dielectric constant of the material of the plug hole needs to satisfy the requirement for loss.
In specific implementation, a round table is arranged on one side of the PCB, which is close to the chip, and the chip is in direct contact with the top layer of the PCB for electric connection.
Referring now to fig. 6, the abscissa is frequency, the unit is Ghz, the ordinate is return loss, and the unit is db, so that it can be seen that the test socket with the PCB board base provided by the invention has better signal transmission quality with the return loss below-10 db.
Referring now to fig. 7, the abscissa is frequency, the ordinate is impedance, and the unit is Ohm, it can be seen that the impedance performance of the test socket with the PCB board base provided by the present invention is significantly better than that of the original solution.
The test socket with the PCB base provided by the embodiment of the invention comprises: the PCB is used as a base of the test socket, and is designed in a laminated mode by using a PCB thin core plate, and a core power supply is arranged on the PCB; the test carrier plate is electrically connected with the tested chip through the probe; the PCB board is evenly provided with a plurality of signal holes, a power hole and a grounding hole, the signal holes are used for accommodating a plurality of signal probes, the power hole is used for accommodating the power probes, the grounding hole is used for accommodating the grounding signal probes, and the PCB board is used as a base of the test socket, so that the power performance, the heat dissipation problem and the high-bandwidth signal capability are successfully improved, and the chip test function with high reliability is realized.
Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the disclosure, even where only a single embodiment is described with respect to a particular feature. The characteristic examples provided in the present disclosure are intended to be illustrative, not limiting, unless stated differently. In practice, the features of one or more of the dependent claims may be combined with the features of the independent claims where technically possible, according to the actual needs, and the features from the respective independent claims may be combined in any appropriate way, not merely by the specific combinations enumerated in the claims.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (9)
1. A test socket having a PCB board base, comprising:
The PCB is used as a base of the test socket, and is designed in a laminated mode by using a PCB thin core plate, and a core power supply is arranged on the PCB;
The test carrier plate is electrically connected with the tested chip through the probe;
the PCB is uniformly provided with a plurality of signal holes, a power supply hole and a grounding hole, wherein the signal holes are used for accommodating a plurality of signal probes, the power supply hole is used for accommodating a power supply probe, the grounding hole is used for accommodating a grounding signal probe, the power supply probe is directly connected with a power supply layer of the PCB, and chip power supply current is transmitted to the test carrier plate after flowing through the power supply layers of the multi-power supply probe and the PCB;
the inductance formed by the PCB is a first loop inductance, the inductance formed by the test carrier plate is a second loop inductance, and the first loop inductance and the second loop inductance form a parallel path.
2. The test socket with PCB substrate of claim 1, wherein the PCB and the test carrier board are assembled using a lamination process.
3. The test socket with PCB substrate of claim 2, wherein the PCB is a ring structure.
4. The test socket with PCB board base of claim 1, wherein the plurality of signal holes, the power hole, the ground hole are plated with an alloy of 200um nickel and 30um gold.
5. The test socket with a PCB substrate of claim 1, wherein the plurality of signal holes are first coaxial vias, the power hole and the ground hole are second common vias, the first coaxial vias and the second common vias are formed in the PCB by etching, the first coaxial vias and the second common vias have first inner diameters and second inner diameters, respectively.
6. The test socket with PCB substrate of claim 5, wherein the first inner diameter is smaller than the second inner diameter.
7. The test socket with PCB substrate of claim 5, wherein the first coaxial via and the second common via are hollow cylinder structures.
8. The test socket with PCB substrate of claim 5, wherein the first coaxial via is obtained by:
Punching the PCB for the first time to obtain a plurality of macropores, and electroplating for the first time to form an outermost layer reflow area of the first coaxial via hole;
plugging the plurality of macropores;
And punching the plug hole for the second time to obtain a plurality of small holes, and performing electroplating for the second time to form the first coaxial via hole.
9. The test socket with the PCB base according to claim 1, wherein a round table is arranged on one side of the PCB close to the chip, and the chip is in direct contact with the top layer of the PCB for electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410015521.8A CN117761515B (en) | 2024-01-05 | 2024-01-05 | Test socket with PCB board base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410015521.8A CN117761515B (en) | 2024-01-05 | 2024-01-05 | Test socket with PCB board base |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117761515A CN117761515A (en) | 2024-03-26 |
| CN117761515B true CN117761515B (en) | 2024-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410015521.8A Active CN117761515B (en) | 2024-01-05 | 2024-01-05 | Test socket with PCB board base |
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| Country | Link |
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| CN (1) | CN117761515B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101710659A (en) * | 2009-12-11 | 2010-05-19 | 安拓锐高新测试技术（苏州）有限公司 | Test jack for reactive controllable chip |
| TWM455979U (en) * | 2012-09-21 | 2013-06-21 | Chunghwa Prec Test Tech Co Ltd | Fine pitch testing carrier board structure |
| TWM472195U (en) * | 2013-08-07 | 2014-02-11 | Chunghwa Prec Test Tech Co Ltd | Testing apparatus for semiconductor chip |
| CN106199385A (en) * | 2016-07-20 | 2016-12-07 | 苏州韬盛电子科技有限公司 | A kind of test jack for chip and test circuit thereof |
| CN209218452U (en) * | 2018-09-10 | 2019-08-06 | 上海泽丰半导体科技有限公司 | A kind of printed circuit board based on packaging and testing |
| TWI678540B (en) * | 2019-01-18 | 2019-12-01 | 佳思科技有限公司 | Semiconductor component test vehicle |
| CN115882286A (en) * | 2021-09-27 | 2023-03-31 | 史密斯互连美洲公司 | System and method for coaxial test socket and printed circuit board interface |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI474008B (en) * | 2013-07-15 | 2015-02-21 | Mpi Corp | A signal path switching device and a probe card using a signal path switching device |
-
2024
- 2024-01-05 CN CN202410015521.8A patent/CN117761515B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101710659A (en) * | 2009-12-11 | 2010-05-19 | 安拓锐高新测试技术（苏州）有限公司 | Test jack for reactive controllable chip |
| TWM455979U (en) * | 2012-09-21 | 2013-06-21 | Chunghwa Prec Test Tech Co Ltd | Fine pitch testing carrier board structure |
| TWM472195U (en) * | 2013-08-07 | 2014-02-11 | Chunghwa Prec Test Tech Co Ltd | Testing apparatus for semiconductor chip |
| CN106199385A (en) * | 2016-07-20 | 2016-12-07 | 苏州韬盛电子科技有限公司 | A kind of test jack for chip and test circuit thereof |
| CN209218452U (en) * | 2018-09-10 | 2019-08-06 | 上海泽丰半导体科技有限公司 | A kind of printed circuit board based on packaging and testing |
| TWI678540B (en) * | 2019-01-18 | 2019-12-01 | 佳思科技有限公司 | Semiconductor component test vehicle |
| CN115882286A (en) * | 2021-09-27 | 2023-03-31 | 史密斯互连美洲公司 | System and method for coaxial test socket and printed circuit board interface |
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| Publication number | Publication date |
|---|---|
| CN117761515A (en) | 2024-03-26 |
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