CN201639902U - Support structure and heat dissipation device combination - Google Patents
Support structure and heat dissipation device combination Download PDFInfo
- Publication number
- CN201639902U CN201639902U CN2009202668360U CN200920266836U CN201639902U CN 201639902 U CN201639902 U CN 201639902U CN 2009202668360 U CN2009202668360 U CN 2009202668360U CN 200920266836 U CN200920266836 U CN 200920266836U CN 201639902 U CN201639902 U CN 201639902U
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- Prior art keywords
- radiator
- supporting construction
- circuit board
- ring
- electronic component
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Abstract
The utility model provides a support structure and heat dissipation device combination, which comprises a circuit board, an electronic component, a heat dissipation device and a support structure, wherein the circuit board has a first surface and a second surface; the electronic component is encapsulated on the first surface of the circuit board; and the heat dissipation device is in contact with the electronic component. The support structure is used for supporting the heat dissipation device on the electronic component, and comprises an annular bent rod and a plurality of support pieces. The annular bent rod is provided with a plurality of joining parts. Each support piece has a first end and a second end, wherein the first end is joined on the joining part, and the second end passes through the circuit board to be connected with the heat dissipation device.
Description
Technical field
The utility model relates to a kind of supporting construction, and particularly relevant for a kind of supporting construction that is applied to the heat abstractor combination.
Background technology
The central processing unit of computer is to handle numerous and numerous and diverse data now, so its operating efficiency is also just relative day by day heavy, therefore the working temperature of this computer cpu also rises along with the increase of operating efficiency, institute thinks makes this central processing unit keep good work efficiency, the overwhelming majority can be established a radiator and central processing unit fits on the central processing unit of this motherboard, dispels the heat to be provided as central processing unit.
In known technology, for making radiator can be fixedly arranged on the motherboard, therefore radiator often uses the mode of locking to be fixed on the motherboard, but the weight of radiator itself makes the flexural deformation of motherboard rupture even easily, so need establish the opposite side of a backboard, make the crooked or fracture of motherboard with the weight of avoiding radiator in motherboard.
Existing backboard mainly contains two kinds, a kind ofly be to use the plastic cement injection mo(u)lding, a kind of be to use metal stamping formed, though wherein the backboard of plastic cement make simple and cost low, but the structural strength that supports motherboard is not enough, thereby the metal stamping formed mode of the many employings of manufacturer is now made backboard.Fig. 1 is existing a kind of backboard that utilizes stamping technology to be made.Please refer to Fig. 1, backboard 200 comprises a body 210 and four projections 220, and wherein projection 220 is bonded on respectively on the body 210 with the usefulness as support radiator (not illustrating in the drawings).Body 210 is the centre punch crush-cutting of a metal plate to be removed the back form as the square shape body 210 among Fig. 1, and the material of center after excising can only give up need not, thereby cause the waste on the material and the increase of cost of manufacture easily.
The utility model content
The utility model provides a kind of supporting construction, and it has lower cost.
The utility model provides a kind of heat abstractor combination, and its supporting construction has lower cost.
An embodiment of the present utility model proposes a kind of supporting construction, is suitable for a radiator is supported on the electronic component of a circuit board.Supporting construction comprises a ring-type knee and a plurality of strutting piece.The ring-type knee has a plurality of junction surfaces.Each strutting piece has one first end and one second end, and wherein first termination is combined on the junction surface, is connected with radiator and second end passes circuit board.
An embodiment of the present utility model proposes a kind of heat abstractor combination, and it comprises a circuit board, an electronic component, a radiator and a supporting construction.Circuit board has a first surface and a second surface.Electronic package is on the first surface of circuit board.Radiator is contacted with electronic component.Supporting construction is in order to be supported on radiator on the electronic component.Supporting construction comprises a ring-type knee and a plurality of strutting piece.The ring-type knee has a plurality of junction surfaces.Each strutting piece has one first end and one second end, and wherein first termination is combined on the junction surface, is connected with radiator and second end passes circuit board.
In an embodiment of the present utility model, above-mentioned junction surface is a composition plane.
In an embodiment of the present utility model, above-mentioned ring-type knee closely is resisted against this second surface.
In an embodiment of the present utility model, above-mentioned ring-type knee has a plurality of riveted holes, lay respectively on the junction surface, and first end of strutting piece is riveted to riveted holes.
In an embodiment of the present utility model, above-mentioned supporting construction also comprises a plurality of screws, and each strutting piece has an inner bolt hole, is positioned at second end, and screw is suitable for passing radiator and locks inner bolt hole.
Based on above-mentioned, in the foregoing description of the present utility model, heat abstractor combination is by being processed into a body of rod one ring-type knee, and with support engages on the junction surface of ring-type knee, by this to form the supporting construction that supports radiator.This measure more can reduce the cost of manufacture of supporting construction and heat abstractor combination effectively except the manufacturing process that can simplify existing backboard.
For above-mentioned feature and advantage of the present utility model can be become apparent, embodiment cited below particularly, and cooperate appended graphic being described in detail below.
Description of drawings
Fig. 1 is existing a kind of backboard that utilizes stamping technology to be made;
Fig. 2 is the explosive view according to a kind of heat abstractor combination of the utility model one embodiment;
Fig. 3 is the explosive view of supporting construction during the heat abstractor of Fig. 2 makes up.
The main element symbol description
100: the heat abstractor combination; 110: circuit board;
120: electronic component; 130: radiator;
140: supporting construction; 142: the ring-type knee;
142a: junction surface; 142b, 144a: riveted holes;
144: strutting piece; 144b: inner bolt hole;
146: rivet; 148: screw;
200: backboard; 210: body;
220: projection; E1: first end;
E2: second end; S1: first surface;
S2: second surface; 132: perforation.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model embodiment clearer, below in conjunction with the accompanying drawing among the utility model embodiment, technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
Fig. 2 is the explosive view according to a kind of heat abstractor combination of the utility model one embodiment.Please refer to Fig. 2, heat abstractor combination 100 comprises a circuit board 110, an electronic component 120, a radiator 130 and a supporting construction 140.In the present embodiment, circuit board 110 for example is the motherboard of a notebook computer, electronic component 120 for example is central processing unit or the north bridge wafer on motherboard, and radiator 130 for example is the radiating fin group that is configured on the electronic component 120, and right present embodiment is not as limit.
Circuit board 110 has a first surface S1 and a second surface S2.Electronic component 120 is encapsulated on the first surface S1 of circuit board 110.Radiator 130 is contacted with electronic component 120.Supporting construction 140 causes damage to avoid radiator 130 directly to oppress electronic component 120 with circuit board 110 in order to radiator 130 is supported on the electronic component 120.
Fig. 3 is the explosive view of supporting construction during the heat abstractor of Fig. 2 makes up.Please also refer to Fig. 2 and Fig. 3, supporting construction 140 comprises a ring-type knee 142 and a plurality of strutting pieces 144.Ring-type knee 142 has a plurality of junction surface 142a.Each strutting piece has one first end E1 and one second end E2, and wherein the first end E1 is bonded on the 142a of junction surface, is connected with radiator 130 and the second end E2 passes circuit board 110, so that radiator 130 supported structures 140 support.
Based on above-mentioned, present embodiment is by being processed into metallic rod body one ring-type knee 142, and processes a plurality of junction surface 142a thereon, so that strutting piece 144 can be bonded on the 142a of junction surface.In view of the above, the ring-type knee 142 of present embodiment can improve the waste problems that existing backboard causes by stamping technology effectively, and then simplifies and reduce supporting construction 140 and make up 100 manufacturing process and manufacturing cost with heat abstractor.
Details are as follows more in addition, refer again to Fig. 2 and Fig. 3, in the present embodiment, ring-type knee 142 has a plurality of riveted holes 142b, it lays respectively on the 142a of junction surface, and strutting piece 144 also has corresponding riveted holes 144a, and riveted holes 144a be positioned at strutting piece 144 the first end E1, so strutting piece 144 can be riveted on the 142a of junction surface by a plurality of rivets 146, it should be noted that for strutting piece 144 can closely be engaged with junction surface 142a, so in the present embodiment, junction surface 142a is a composition plane, so that strutting piece 144 can reach above-mentioned purpose.Only present embodiment is not limited the juncture between strutting piece 144 and the ring-type knee 142, and any strutting piece 144 that can allow closely is bonded on the ring-type knee 142 person all applicable to present embodiment.
In addition, ring-type knee 142 is that a metallic rod body is bent into rectangle, but present embodiment is as limit, and the designer also can be bent into any geometry with a metallic rod body, and this measure end relies the designer to decide with the design requirement of radiator 130 for electronic component 120.
On the other hand, in the present embodiment, supporting construction 140 also comprises a plurality of screws 148, and each strutting piece 144 has an inner bolt hole 144b, and it is positioned at the second end E 2 of strutting piece.These screws 148 are locked the inner bolt hole 144b of strutting piece 144 in order to pass the perforation 132 on the radiator 130, use radiator 130 and supporting construction 140 are locked together.Moreover, the designer can change the length of strutting piece 144 according to radiator 130 with the external form of electronic component 120, allow radiator 130 contact by this and reach the function of heat radiation with electronic component 120, the weight of radiator 130 can be configured on the supporting construction 140 again simultaneously, use and avoid radiator 130 compressing electronic components 120 to cause damage with circuit board 110.
In addition, when supporting construction 140 locked together by screw 148 and radiator 130, ring-type knee 142 can closely be resisted against the second surface S2 of circuit board 110.This measure allow ring-type knee 142 except above-mentioned in order to support the radiator 130, also can use the structural strength of accentuator plate 110 as the supporting construction of circuit board 110.
In sum, the utility model is by being processed into a metallic rod body one ring-type knee, and processes the junction surface thereon, to allow strutting piece can be engaged in the junction surface.Compared to existing back board structure by being stamped to form, supporting construction of the present utility model and heat abstractor combination can be made with the operation of simplification and lower cost.Moreover the junction surface on the ring-type knee is processed to composition plane, and strutting piece can more closely be riveted on this junction surface.
It should be noted that at last: above embodiment only in order to the explanation the technical solution of the utility model, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (10)
1. a supporting construction is suitable for a radiator is supported on the electronic component of a circuit board, it is characterized in that this supporting construction comprises:
One ring-type knee has a plurality of junction surfaces; And
A plurality of strutting pieces, respectively this strutting piece has one first end and one second end, and wherein this first termination is combined on this junction surface, and this second end is suitable for passing this circuit board and is connected with this radiator.
2. supporting construction according to claim 1, wherein respectively this junction surface is a composition plane.
3. supporting construction according to claim 1, wherein this circuit board has a different first surface and a second surface, and this electronic package is on this first surface, and this ring-type knee closely is resisted against this second surface.
4. supporting construction according to claim 1, wherein this ring-type knee has a plurality of riveted holes, lay respectively on described a plurality of junction surface, and respectively this first end of described a plurality of strutting pieces is riveted to described a plurality of riveted holes.
5. supporting construction according to claim 1 also comprise a plurality of screws, and respectively this strutting piece has an inner bolt hole, is positioned at this second end, and these a plurality of screws are suitable for passing this radiator and lock this inner bolt hole.
6. a heat abstractor combination is characterized in that, comprising:
One circuit board has a first surface and a second surface;
One electronic component is encapsulated on this first surface of this circuit board;
One radiator is contacted with this electronic component;
One supporting construction, in order to this radiator is supported on this electronic component, this supporting construction comprises:
One ring-type knee has a plurality of junction surfaces; And
A plurality of strutting pieces, respectively this strutting piece has one first end and one second end, and wherein this first termination is combined on this junction surface, and this second end passes this circuit board and is connected with this radiator.
7. heat abstractor combination according to claim 6, wherein respectively this junction surface is a composition plane.
8. heat abstractor combination according to claim 6, wherein this ring-type knee closely is resisted against this second surface of this circuit board.
9. heat abstractor combination according to claim 6, wherein this ring-type knee has a plurality of riveted holes, lay respectively on described a plurality of junction surface, and respectively this first end of described a plurality of strutting pieces is riveted to described a plurality of riveted holes.
10. heat abstractor combination according to claim 6, wherein this supporting construction also comprises a plurality of screws, and respectively this strutting piece has an inner bolt hole, is positioned at this second end, described a plurality of screws are suitable for passing this radiator and lock this inner bolt hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202668360U CN201639902U (en) | 2009-11-09 | 2009-11-09 | Support structure and heat dissipation device combination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202668360U CN201639902U (en) | 2009-11-09 | 2009-11-09 | Support structure and heat dissipation device combination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201639902U true CN201639902U (en) | 2010-11-17 |
Family
ID=43084410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202668360U Expired - Fee Related CN201639902U (en) | 2009-11-09 | 2009-11-09 | Support structure and heat dissipation device combination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201639902U (en) |
-
2009
- 2009-11-09 CN CN2009202668360U patent/CN201639902U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101117 Termination date: 20121109 |