CN201623176U - High-power LED structure - Google Patents
High-power LED structure Download PDFInfo
- Publication number
- CN201623176U CN201623176U CN 200920229366 CN200920229366U CN201623176U CN 201623176 U CN201623176 U CN 201623176U CN 200920229366 CN200920229366 CN 200920229366 CN 200920229366 U CN200920229366 U CN 200920229366U CN 201623176 U CN201623176 U CN 201623176U
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- China
- Prior art keywords
- led
- circuit
- great power
- power led
- structure according
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model adopts the technical scheme that an LED heat sink is closely connected with a radiator through bolts; and the thermoresistance is greatly reduced. Compared with the prior art, in the utility model, an LED is closely connected with the radiator through threads on a heat sink; heat passages are firmly and reliably connected; and the thermoresistance is small. The LED is electrically connected with a circuit board through resilient contacts; the centers of the two resilient contacts are positioned on the concentric circumferences with different radiuses; and the LED is always in contact with the circuit no matter the LED is rotated at any angle, while the positive pole and the negative pole of the LED have little possibility of being reversed, so that the LED is assembled or disassembled without any tools. The utility model can greatly facilitate installation and maintenance of the LED.
Description
Technical field
The utility model patent relates to lighting field, relates in particular to a kind of great power LED structure.
Background technology
LED illumination has the advantage that good and life-span of color rendering grows etc.Be widely used in the various products, especially illuminating product.
Traditional great power LED structure is the heat sink mounting means of fitting with aluminium base in bottom surface, electrical pin and the welding of aluminium base paster.Between the above-mentioned great power LED structure, heat sink and aluminium base only by the heat dissipating silicone grease master of conducting heat, the applying defective tightness, firm inadequately, have bigger thermal resistance.Electrical pin and the welding of aluminium base paster must be taken off the LED of damage and the LED that more finishes changing by electric iron, need professional and tool operation, change extremely inconvenience, seriously restrict the development of LED.In view of this, this patent provides a kind of big merit LED structure, can effectively solve the problems referred to above that traditional LED exists.Promote the development of great power LED at lighting field.
Summary of the invention
Technical problem to be solved in the utility model is exactly at above-mentioned deficiency, and provides a kind of easy for installation, the great power LED structure that thermal resistance is little.
The purpose of this utility model can be achieved through the following technical solutions, and the utility model includes resilient contact, bolt and circuit board.
A kind of great power LED structure is characterized in that: the installation and maintenance of LED need not welding.
A kind of great power LED structure is characterized in that: be threaded the heat sink of structure.
A kind of great power LED structure, it is characterized in that: LED is installed on the radiator by bolt.
A kind of great power LED structure is characterized in that: LED is electrically connected by resilient contact and circuit board.
Compared with prior art, what the utility model adopted closely is connected LED with radiator by the screw thread that has on heat sink, the heat passage firm and reliable connection, and thermal resistance is little.LED is electrically connected by resilient contact and circuit board, need not professional tool when making the LED installing/dismounting.This utility model can greatly facilitate the installation and maintenance of LED.
Description of drawings
Fig. 1 is the cross-sectional schematic of a utility model.
Fig. 2 is the cross-sectional schematic that the utility model and radiator are installed.
Fig. 3 is a three-dimensional cross-sectional schematic of the present utility model.
Fig. 4 is a shrapnel contact structural representation of the present utility model.
Fig. 5 is a circuit board of the present utility model front circuit diagram.
Fig. 6 is a circuit board reverse side circuit diagram of the present utility model.
Fig. 7 is the outline drawing of two kinds of structures of the present utility model.
Among the figure, threaded heat sink 1 contact 2 springs, 3 positive electrodes, 4 negative electrodes, 5 gold threads, 6 led chips, 7 circuit boards, 8 radiators, 9 shrapnel contacts, 10 via holes, 11 inner ring circuit, 12 outer ring circuit, 13 printed circuits, 14 back side circuit 15.
Embodiment
Embodiment describes in further detail the utility model below in conjunction with accompanying drawing:
Typical structure of the present utility model is seen Fig. 1-shown in Figure 4, a kind of great power LED structure.Spring 3 and contact 2 are arranged below positive electrode 4 and the negative electrode 5, and circuit board 8 is installed in the surface of radiator 9.LED is by threaded heat sink 1 when radiator 9 close installation, and spring 3 is compressed, and reaction force is connected contact 2 and the outer ring circuit 13 on the circuit board 8.After the energising, the circulating pathway of electric current is inner ring circuit 12 circuit on the following contact 2 → circuit board 8 of the spring 3 → negative electrode 4 below gold thread 6 → negative electrode 5 → negative electrode 5 of spring 3 → positive electrode 4 → gold thread 6 → led chip 7 → the connections negative electrode 5 below contact 2 → positive electrode 4 below the outer ring circuit 13 → positive electrode 4 in circuit board 8 fronts.In the structure of Fig. 4, there are not contact 2 and spring 3, but shrapnel contact 10 directly links to each other with positive electrode 4 (or negative electrode 5), and the reaction force of the part of V oxbow makes the bossing of shrapnel contact 10 be communicated with inner ring circuit 12 (or outer ring circuit 13) after installing.
Shown in Figure 6 as Fig. 5, circuit board 8 is formed series circuit together by back side circuit 15 on positive inner ring circuit 12 and outer ring circuit 13 and via hole 11 and the circuit board 8.As shown in Figure 4, one end of shrapnel contact 10 links to each other with positive electrode 4 (negative electrode 5), as LED during by bolt and radiator 9 close installation, shrapnel contact 10 is compressed, the active force of compression make shrapnel contact 10 respectively with circuit board 8 on inner ring circuit 12 and outer ring circuit 13 connect.Via hole 11 makes electric current pass through outer ring circuit 13 and arrive next outer ring circuit 13 from inner ring circuit 12, and a plurality of LED connect.When led chip 7 was many, structure was with above-mentioned consistent.
Though the utility model only illustrates and describes by embodiment; but those skilled in the art should understand; in the scope of claims; to threaded heat sink 1 flight pitch and diameter different size; the difformity of contact 2 and shrapnel contact 10; it is multi-form that contact 2 (comprising shrapnel contact 10) is connected with positive electrode 4 (comprising negative electrode); the number of inner ring circuit 12 and outer ring circuit 13 in the circuit board 8; the number of led chip 7; and each component materials of the utility model is dissimilar, all belongs to protection range of the present utility model.
Claims (8)
1. great power LED structure, comprise threaded heat sink (1), contact (2) and circuit board (8), LED is installed on the radiator (9) by screw thread, LED install at any angle equal can make two contacts (2) respectively with circuit board (8) on inner ring circuit (12) and outer ring circuit (13) connect.
2. great power LED structure according to claim 1 is characterized in that: threaded heat sink (1) is whole to be bolt arrangement, and upper end is used to install led chip (7), and the bottom is a screw thread.
3. great power LED structure according to claim 1 is characterized in that: there are two holes the LED lower surface, and a hole front end is the positive electrode (4) of LED, the negative electrode (5) that another hole front end is LED.
4. great power LED structure according to claim 1 is characterized in that: two holes are centered close to concentric and on the circumference of different radii, and corresponding with inner ring circuit (12) and outer ring circuit (13) on the circuit board (8) respectively.
5. great power LED structure according to claim 1 is characterized in that: hole the inside is equipped with spring (3), contact (2) is installed below the spring (3).
6. great power LED structure according to claim 1, it is characterized in that: there are two shrapnel contacts (10) the LED lower surface, one end of two shrapnel contacts (10) is connected with negative electrode (5) with the positive electrode (4) of LED respectively, and the other end becomes the V font, and outstanding part contacts with circuit board (8).
7. great power LED structure according to claim 1, it is characterized in that: the front of circuit board (8) has with inner ring circuit (12) and outer ring circuit (13) forms set of circuits at least, and each is organized circuit and forms series circuit by via hole (11) and back side circuit (15).
8. great power LED structure according to claim 1 is characterized in that: led chip (7) can be one, also can be many.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200920229366 CN201623176U (en) | 2009-11-06 | 2009-11-06 | High-power LED structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200920229366 CN201623176U (en) | 2009-11-06 | 2009-11-06 | High-power LED structure |
Publications (1)
Publication Number | Publication Date |
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CN201623176U true CN201623176U (en) | 2010-11-03 |
Family
ID=43026633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200920229366 Expired - Fee Related CN201623176U (en) | 2009-11-06 | 2009-11-06 | High-power LED structure |
Country Status (1)
Country | Link |
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CN (1) | CN201623176U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102376856A (en) * | 2011-10-24 | 2012-03-14 | 宁波市佰仕电器有限公司 | Thermoelectric separation light-emitting diode (LED) |
WO2013067840A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Method of manufacturing heat sink structure for high-power led |
CN108475712A (en) * | 2015-12-01 | 2018-08-31 | 夏普株式会社 | Image formation component |
CN114038979A (en) * | 2021-09-22 | 2022-02-11 | 深圳市华笙光电子有限公司 | LED packaging support |
-
2009
- 2009-11-06 CN CN 200920229366 patent/CN201623176U/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102376856A (en) * | 2011-10-24 | 2012-03-14 | 宁波市佰仕电器有限公司 | Thermoelectric separation light-emitting diode (LED) |
WO2013067840A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Method of manufacturing heat sink structure for high-power led |
KR101524388B1 (en) * | 2011-11-09 | 2015-05-29 | 동광 킹선 옵토일렉트로닉 컴퍼니 리미티드 | Method of manufacturing heat sink structure for high-power led |
US9153760B2 (en) | 2011-11-09 | 2015-10-06 | Dongguan Kingsun Optoelectronic Co., Ltd | Method of making a heat radiating structure for high-power LED |
CN108475712A (en) * | 2015-12-01 | 2018-08-31 | 夏普株式会社 | Image formation component |
CN114038979A (en) * | 2021-09-22 | 2022-02-11 | 深圳市华笙光电子有限公司 | LED packaging support |
CN114038979B (en) * | 2021-09-22 | 2023-07-21 | 深圳市华笙光电子有限公司 | LED packaging support |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101103 Termination date: 20141106 |
|
EXPY | Termination of patent right or utility model |