CN201570510U - Novel silicon wafer texturing device - Google Patents

Novel silicon wafer texturing device Download PDF

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Publication number
CN201570510U
CN201570510U CN2009203174866U CN200920317486U CN201570510U CN 201570510 U CN201570510 U CN 201570510U CN 2009203174866 U CN2009203174866 U CN 2009203174866U CN 200920317486 U CN200920317486 U CN 200920317486U CN 201570510 U CN201570510 U CN 201570510U
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CN
China
Prior art keywords
opening
tank
novel silicon
communicating pipe
silicon slice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009203174866U
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Chinese (zh)
Inventor
马殿军
南毅
赵志跃
张伟娜
魏文豪
林禹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANAN SANJING SUNSHINE AND POWER Co Ltd
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NANAN SANJING SUNSHINE AND POWER Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN2009203174866U priority Critical patent/CN201570510U/en
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Publication of CN201570510U publication Critical patent/CN201570510U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

The utility model relates to a novel silicon wafer texturing device which comprises the following components: an acid storing tank which is filled with prepared acid solution; a reaction tank which is internally provided with a solar silicon wafer and is provided with an opening at the bottom, wherein the opening is communicated with the acid storing tank through a communicating pipe. The communicating pipe is provided with a circulation pump. A baffle for shunting, a flow equalizing screen and a spraying plate are sequentially provided above the opening. The spraying plate is provided with a plurality of spraying openings. Compared with the prior art, the heat generated in reaction according to the utility model can be radiated uniformly in time. The reaction concentration is easily controlled and the reaction time is easily controlled correspondingly. Therefore the texturing effect is better and the texturing cost is lower.

Description

A kind of novel silicon slice etching device
Technical field
The utility model relates to a kind of solar power silicon slice etching device, is meant a kind of new type solar energy silicon chip slot type acid etching device especially.
Background technology
Making herbs into wool is one of the key link in the polysilicon solar cell production line at present.At present etching method and equipment all are to adopt two kinds of slot type and chain types.Chain type is present better performances but the higher making herbs into wool mode of cost.Slot type is to adopt immersion type (or adding ultrasonic wave), and cost is low, and effect is relatively poor relatively, and the concentration of reaction can not evenly be controlled, and then the reaction time is also wayward; In addition, the heat of the generation during reaction can not in time scatter and disappear uniformly.
The utility model content
Main purpose of the present utility model is to overcome the shortcoming of prior art, provides a kind of cost the low preferable novel silicon slice etching device of effect simultaneously, has the advantage of existing slot type and chain type texturing concurrently.
The utility model adopts following technical scheme:
A kind of novel silicon slice etching device comprises
One storage acid tank is equiped with the acid solution for preparing in it;
One reactive tank is placed with solar silicon wafers in it, its bottom offers an opening, and this opening was communicated with described storage acid tank by communicating pipe, and this communicating pipe is provided with circulating pump; This opening top is provided with shunting successively with baffle plate, current-sharing screen cloth and shower plate, offers a plurality of mouth sprays on this shower plate.
According to a better embodiment of the present utility model, described reactive tank is provided with an overflow launder that highly is higher than this reactive tank outward, and this overflow launder is provided with the refluxing opening that is communicated with described storage acid tank.
According to a better embodiment of the present utility model, be provided with a flow control valve communicating pipe between described opening and the described circulating pump.
According to a better embodiment of the present utility model, on the top of described storage acid tank and be provided with a bypass overflow valve between described communicating pipe.
According to a better embodiment of the present utility model, be provided with condenser in the described storage acid tank.
Further, described condenser is made up of condensation pipe and the recirculated water that is full of condensation pipe.
By above-mentioned to description of the present utility model as can be known, compared with prior art, a kind of novel silicon slice etching device of the present utility model has following beneficial effect:
One, the utility model is provided with shunting baffle plate, current-sharing screen cloth and shower plate successively above the bottom opening of reactive tank, offer a plurality of mouth sprays on this shower plate, the making herbs into wool mode of this kind bottom spray, make reaction density more easy to control, reaction time is also corresponding more easy to control, make that the making herbs into wool effect is preferable, and the making herbs into wool cost is lower;
Two, reactive tank is provided with the overflow launder that highly is higher than this reactive tank outward, and overflow launder is provided with the refluxing opening that is communicated with the storage acid tank, can overflow after acid solution is full of in reactive tank to be back in the storage acid tank, and acid solution can reuse;
Three, the communicating pipe between opening and the circulating pump is provided with flow control valve, and the acid solution flow is adjustable during making herbs into wool;
Four, the storage acid tank top and be provided with vent relief valve between communicating pipe, avoid storing up acid tank and overflow because of in time not putting acid;
Five, be provided with condenser in the storage acid tank, the heat of the generation when making reaction can in time scatter and disappear uniformly, thereby makes that the making herbs into wool effect is better.
Description of drawings
Fig. 1 is the structural representation of a kind of embodiment of a kind of novel silicon slice etching device of the utility model.
Embodiment
Below the utility model will be further described by embodiment.
With reference to Fig. 1, a kind of novel silicon slice etching device of the present utility model comprises storage acid tank 10, a reactive tank 20, and reactive tank 20 is outer to be provided with an overflow launder 80 that highly is higher than this reactive tank 20, and this overflow launder 80 is provided with the refluxing opening 81 that is communicated with storage acid tank 10.
Be equiped with the acid solution for preparing in the storage acid tank 10, its top is provided with a benefit acid mouth 11, the bottom is provided with one and puts sour mouthful 12; In the storage acid tank 10 and be provided with a condenser 110, condenser 110 is made up of condensation pipe and the recirculated water that is full of condensation pipe, and condenser 110 is provided with condenser water inlet 111 and condenser delivery port 112.
Be placed with solar silicon wafers 120 in the reactive tank 20, its bottom offers an opening 21, and opening 21 was communicated with the bottom of storing up acid tank 10 by communicating pipe 30, was provided with circulating pump 40 and flow control valve 90 on communicating pipe 30 successively; Opening 21 tops are provided with shunting successively with baffle plate 50, polytetrafluoroethylene system current-sharing screen cloth 60 and shower plate 70, offer a plurality of mouth sprays on the shower plate 70.
The storage acid tank 10 top and be provided with a bypass overflow valve 100 between the communicating pipe 30 between circulating pump 40 and the flow control valve 90.
A kind of novel silicon slice etching device of the present utility model in use, at first the acid solution for preparing is added in the storage acid tank 10, and silicon chip 120 put into reactive tank 20, utilize circulating pump 40 that acid solution is taken out opening 21 to reactive tank 20 bottoms from storage acid tank 10, and by flow control valve 90 control acid solution flows; Acid solution enters after a plurality of mouth sprays of offering from shower plate 70 after baffle plate 50 shunting, 60 current-sharings of current-sharing screen cloth spray to silicon chip 120 from opening 21; After acid solution was full of reactive tank 20, acid solution spilt into overflow launder 80, and flowed back in the storage acid tank 10 via refluxing opening 81, and device 110 coolings that are condensed in storage acid tank 10.Compare with prior art, a kind of solar silicon wafers slot type etching device circulation of the present utility model is fast, rapid heat dissipation, making herbs into wool matte are even.
Above-mentioned only is an embodiment of the present utility model, but design concept of the present utility model is not limited thereto, and allly utilizes this design that the utility model is carried out the change of unsubstantiality, all should belong to the behavior of invading the utility model protection range.

Claims (6)

1. a novel silicon slice etching device is characterized in that: comprise
One storage acid tank is equiped with the acid solution for preparing in it;
One reactive tank is placed with solar silicon wafers in it, its bottom offers an opening, and this opening was communicated with described storage acid tank by communicating pipe, and this communicating pipe is provided with circulating pump; This opening top is provided with shunting successively with baffle plate, current-sharing screen cloth and shower plate, offers a plurality of mouth sprays on this shower plate.
2. a kind of novel silicon slice etching device as claimed in claim 1 is characterized in that: described reactive tank is provided with an overflow launder that highly is higher than this reactive tank outward, and this overflow launder is provided with the refluxing opening that is communicated with described storage acid tank.
3. a kind of novel silicon slice etching device as claimed in claim 1 is characterized in that: be provided with a flow control valve communicating pipe between described opening and the described circulating pump.
4. a kind of novel silicon slice etching device as claimed in claim 1 is characterized in that: on the top of described storage acid tank and be provided with a bypass overflow valve between described communicating pipe.
5. as claim 1 or 2 or 3 or 4 described a kind of novel silicon slice etching devices, it is characterized in that: be provided with condenser in the described storage acid tank.
6. a kind of novel silicon slice etching device as claimed in claim 5 is characterized in that: described condenser is made up of condensation pipe and the recirculated water that is full of condensation pipe.
CN2009203174866U 2009-12-15 2009-12-15 Novel silicon wafer texturing device Expired - Fee Related CN201570510U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009203174866U CN201570510U (en) 2009-12-15 2009-12-15 Novel silicon wafer texturing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009203174866U CN201570510U (en) 2009-12-15 2009-12-15 Novel silicon wafer texturing device

Publications (1)

Publication Number Publication Date
CN201570510U true CN201570510U (en) 2010-09-01

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102082201A (en) * 2010-11-29 2011-06-01 常州亿晶光电科技有限公司 Isocyatic chemical reagent supplementing device
CN102242402A (en) * 2011-07-11 2011-11-16 苏州赤诚洗净科技有限公司 Texturing device for solar cell silicon wafer
CN102315319A (en) * 2011-07-07 2012-01-11 苏州赤诚洗净科技有限公司 Symmetrical texturing device for solar cell silicon chip
CN105200527A (en) * 2015-09-16 2015-12-30 国网天津市电力公司 Texturing equipment and cleaning method thereof
CN105470170A (en) * 2015-11-23 2016-04-06 百力达太阳能股份有限公司 System of making uniform texturing-groove chemical groove liquid temperature
WO2016115721A1 (en) * 2015-01-19 2016-07-28 常州捷佳创精密机械有限公司 Shower type wet-process texturing device and method for solar silicon wafer
TWI614913B (en) * 2015-01-19 2018-02-11 Shower type wet flocking device and method for solar cymbal

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102082201A (en) * 2010-11-29 2011-06-01 常州亿晶光电科技有限公司 Isocyatic chemical reagent supplementing device
CN102315319A (en) * 2011-07-07 2012-01-11 苏州赤诚洗净科技有限公司 Symmetrical texturing device for solar cell silicon chip
CN102315319B (en) * 2011-07-07 2012-12-12 苏州赤诚洗净科技有限公司 Symmetrical texturing device for solar cell silicon chip
CN102242402A (en) * 2011-07-11 2011-11-16 苏州赤诚洗净科技有限公司 Texturing device for solar cell silicon wafer
WO2016115721A1 (en) * 2015-01-19 2016-07-28 常州捷佳创精密机械有限公司 Shower type wet-process texturing device and method for solar silicon wafer
TWI614913B (en) * 2015-01-19 2018-02-11 Shower type wet flocking device and method for solar cymbal
CN105200527A (en) * 2015-09-16 2015-12-30 国网天津市电力公司 Texturing equipment and cleaning method thereof
CN105470170A (en) * 2015-11-23 2016-04-06 百力达太阳能股份有限公司 System of making uniform texturing-groove chemical groove liquid temperature
CN105470170B (en) * 2015-11-23 2018-05-25 百力达太阳能股份有限公司 Make the uniform system of texturing slot chemistry tank liquor temperature

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100901

Termination date: 20121215