CN203967050U - A kind of wet etching machine - Google Patents
A kind of wet etching machine Download PDFInfo
- Publication number
- CN203967050U CN203967050U CN201420420478.5U CN201420420478U CN203967050U CN 203967050 U CN203967050 U CN 203967050U CN 201420420478 U CN201420420478 U CN 201420420478U CN 203967050 U CN203967050 U CN 203967050U
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- China
- Prior art keywords
- heat exchanger
- wet etching
- water tank
- cover plate
- fluid reservoir
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a kind of wet etching machine, comprise etching groove and cover plate thereof, rinse bath and cover plate thereof; Etching groove downside is provided with fluid reservoir, is provided with liquid injecting pipeline and reflux line between the two, is provided with the first heat exchanger in fluid reservoir; Rinse bath downside is provided with water tank, is provided with filling pipe and water return pipeline between the two; Wet etching machine also comprises the cooling device of medium in cooling water tank, the preset temperature of cooling device is less than or equal to the preset temperature of the first heat exchanger, make the preset temperature of water tank be less than or equal to the preset temperature of fluid reservoir, thereby the steam temperature that makes rinse bath top is less than or equal to the acid gas temperature of etching groove top, when air current flow, can not form acid drop, fundamentally avoid condensing of etching groove upper cover plate drop, avoided silicon chip in etching process, to form defective.
Description
Technical field
The utility model relates to photovoltaic technology field, particularly relates to a kind of wet etching machine.
Background technology
Photovoltaic module utilizes application on a large scale of form as the one of solar energy, and has formed huge industry, and increasing photovoltaic module comes into operation, for the mankind are providing clean electric power energy.
Photovoltaic module utilizes glass plate, backboard and EVA packaged battery sheet, and cell piece is made up of silicon chip, is the core of photovoltaic module.Silicon chip is formed by silicon ingot cutting, then makes cell piece through techniques such as surface wool manufacturing, diffusion knot processed, etching, depositing antireflection film, printing-sinterings.Wherein, etching technics is an important procedure in cell piece manufacture process, and object is to remove the PN junction of silicon chip lower surface and four sides, to reach the object of upper and lower surface insulation, removes the phosphorosilicate glass layer of lower surface and four sides simultaneously.
At present, a kind of conventional lithographic method is wet etching, erodes PN junction and the phosphorosilicate glass layer of silicon chip lower surface and four sides by chemical reagent.As shown in Figure 1, Fig. 1 is a kind of structural representation of typical wet etching machine.
The process need of wet etching is used chemical reagent, needs cleaning silicon chip after etching, and in wet etching machine, etching groove 1 is adjacent with rinse bath 2, and both are respectively equipped with cover plate 3 and cover plate 4 in top.Etching groove 1 below is provided with fluid reservoir 5, the reflux line 7,8 that is provided with liquid injecting pipeline 6 between fluid reservoir 5 and etching groove 1 and refluxes for liquid, in fluid reservoir 5, being provided with the first heat exchanger 9, the first heat exchangers 9 can make liquid in fluid reservoir 5 be cooled to the temperature of setting.The below of rinse bath 2 is provided with water tank 10, is provided with filling pipe 11 and the water return pipeline 12 for refluxing between water tank 10 and rinse bath 2.
In process of production, have air-flow from flowing between rinse bath 2 and cover plate 4 between etching groove 1 and cover plate 3, due to the requirement of technique, need the fluid temperature in fluid reservoir 5 lower, thereby make the fluid temperature in etching groove 1 also lower, and liquid constantly volatilizees, cause between etching groove 1 and cover plate 3 and be full of cooler acid gas.In rinse bath 2, the temperature of pure water is higher comparatively speaking, is about room temperature, and under the effect of air-flow, a large amount of steam more flows between etching groove 1 and cover plate 3 with air-flow, runs into cooler acid gas and is aggregated into acid drop.Drop can, to drippage in etching groove 1, if now there is silicon chip to pass through, drops onto silicon chip surface and can form defective under the effect of gravity.
Conventionally adopt at present the mode of regular manual wipping to wipe the acid drop forming on the cover plate 3 of etching groove 1, reduce defective that acid drop causes as far as possible.But the mode of manual wipping can not be avoided drop drippage timely and effectively, also can cause defective an of part.
Therefore, how avoiding silicon chip in etching process, to form defective, is that those skilled in the art are badly in need of the technical problem solving at present.
Utility model content
The purpose of this utility model is to provide a kind of wet etching machine, can not form acid drop on the etching slot cover plate of this wet etching machine, has avoided silicon chip in etching process, to form defective.
In order to realize above-mentioned technical purpose, the utility model provides a kind of wet etching machine, comprises etching groove and cover plate thereof, rinse bath and cover plate thereof; Described etching groove downside is provided with fluid reservoir, is provided with liquid injecting pipeline and reflux line between the two, is provided with the first heat exchanger in described fluid reservoir; Described rinse bath downside is provided with water tank, is provided with filling pipe and water return pipeline between the two; Described wet etching machine also comprises the cooling device of medium in cooling described water tank, and the preset temperature of described cooling device is less than or equal to the preset temperature of described the first heat exchanger.
Preferably, described cooling device is the second heat exchanger, and described the second heat exchanger is located in described water tank.
Preferably, also comprise cooling tank, described water tank is provided with water inlet pipe and outlet pipe, and described water inlet pipe and described outlet pipe are all communicated with described cooling tank; Described cooling device is the second heat exchanger, and described the second heat exchanger is located in described cooling tank.
Preferably, described the first heat exchanger has the first water inlet pipe and the first outlet pipe, and described the second heat exchanger has the second water inlet pipe and the second outlet pipe; Described the first water inlet pipe and described the second water inlet pipe all with cold water but house steward be communicated with; Described the first outlet pipe and described the second outlet pipe are all communicated with return main.
Preferably, described water tank is provided with water inlet pipe and outlet pipe, and described water inlet pipe and described outlet pipe and described cooling device form circulation circuit.
Preferably, the preset temperature of described cooling device equals the preset temperature of described the first heat exchanger.
The wet etching machine that the utility model provides, comprises etching groove and cover plate thereof, rinse bath and cover plate thereof; Etching groove downside is provided with fluid reservoir, is provided with liquid injecting pipeline and reflux line between the two, is provided with the first heat exchanger in fluid reservoir; Rinse bath downside is provided with water tank, is provided with filling pipe and water return pipeline between the two; Wet etching machine also comprises the cooling device of medium in cooling water tank, the preset temperature of cooling device is less than or equal to the preset temperature of the first heat exchanger, make the preset temperature of water tank be less than or equal to the preset temperature of fluid reservoir, thereby the steam temperature that makes rinse bath top is less than or equal to the acid gas temperature of etching groove top, when air current flow, can not form acid drop, fundamentally avoid condensing of etching groove upper cover plate drop, avoided silicon chip in etching process, to form defective.
Brief description of the drawings
Fig. 1 is a kind of structural representation of typical wet etching machine;
Fig. 2 is the structural representation of a kind of embodiment of wet etching machine provided by the utility model.
Wherein, the Reference numeral in Fig. 1 and Fig. 2 and the corresponding relation between component names are as follows:
Etching groove 1; Rinse bath 2; Cover plate 3; Cover plate 4; Fluid reservoir 5; Liquid injecting pipeline 6; Reflux line 7,8; The first heat exchanger 9; Water tank 10; Filling pipe 11; Water return pipeline 12; The second heat exchanger 13.
Embodiment
Core of the present utility model is to provide a kind of wet etching machine, can not form acid drop on the etching slot cover plate of this wet etching machine, has avoided silicon chip in etching process, to form defective.
In order to make those skilled in the art person understand better the utility model scheme, below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Please refer to Fig. 2, Fig. 2 is the structural representation of a kind of embodiment of wet etching machine provided by the utility model.
In a kind of concrete execution mode, the utility model provides a kind of wet etching machine, comprises etching groove 1 and cover plate 3 thereof, rinse bath 2 and cover plate 4 thereof; Etching groove 1 downside is provided with fluid reservoir 5, is provided with liquid injecting pipeline 6 and reflux line 7,8 between the two, is provided with the first heat exchanger 9 in fluid reservoir 5; Rinse bath 2 downsides are provided with water tank 10, are provided with filling pipe 11 and water return pipeline 12 between the two; Wet etching machine also comprises the cooling device of cooling water tank 10 interior media, and the preset temperature of cooling device is less than or equal to the preset temperature of the first heat exchanger 9.
While silicon chip being carried out to etching by wet etching machine, silicon chip is placed in etching groove 1, the required liquid of etching is housed in the fluid reservoir 5 of etching groove 1 downside, liquid injects etching groove 1 endlessly by liquid injecting pipeline 6, and the liquid after contacting with silicon chip flows back to reservoir 5 by reflux line 7 and the reflux line 8 on etching groove 1 both sides.
Silicon chip after etching moves in rinse bath 2, in the water tank 10 of rinse bath 2 downsides, clear water is housed, and clear water flows into rinse bath 2 by filling pipe 11, flows back to water tank 10 after having cleaned silicon chip by water return pipeline 12.
In etching process, the fluid temperature in technological requirement fluid reservoir 5 is lower, and it is the predetermined temperature of the first heat exchanger 9 that the first heat exchanger 9 can make the temperature of fluid reservoir 5 inner liquid medicines, thereby makes the fluid temperature in etching groove 1 lower.Meanwhile, cooling device can make the predetermined temperature that the temperature of water tank 10 interior clear water is cooling device, thereby it is also lower to make to carve clear water temperature in rinse bath 2.
The preset temperature of cooling device is less than or equal to the preset temperature of the first heat exchanger 9, make the temperature of water tank 10 be less than or equal to the temperature of fluid reservoir 5, thereby the steam temperature that makes rinse bath 2 tops is less than or equal to the acid gas temperature of etching groove 1 top, when air current flow, can not form acid drop, fundamentally avoid condensing of etching groove 1 upper cover plate 3 drops, avoided silicon chip in etching process, to form defective.
One preferred embodiment in, cooling device is that the second heat exchanger 13, the second heat exchangers 13 are located in water tank 10.By the clear water in the cooling water tank 10 of the second heat exchanger 13, make its temperature be less than or equal to the temperature of the liquid in fluid reservoir 5, avoid etching groove 1 cover plate 3 to form acid drop.
In another preferred embodiment, also comprise cooling tank, water tank 10 is provided with water inlet pipe and outlet pipe, and water inlet pipe and outlet pipe are all communicated with cooling tank; Cooling device is that the second heat exchanger 13, the second heat exchangers 13 are located in described cooling tank.
Can reduce the temperature of clear water in cooling tank by the second heat exchanger 13, if the water temperature in cooling tank is different from the water temperature in water tank 10, the two just can form circulation circuit by water inlet pipe and outlet pipe, and then reduced the temperature of water tank 10 interior clear water, can avoid equally etching groove 1 cover plate 3 to form acid drop.
It should be noted that, the mode that cooling device is set for water tank 10 is not only confined to above-mentioned two kinds of modes, and other modes that can make the interior clear water temperature of water tank 10 reduce also can be applied in this application.
In the respective embodiments described above, the first heat exchanger 9 has the first water inlet pipe and the first outlet pipe, and the second heat exchanger 13 has the second water inlet pipe and the second outlet pipe; The first water inlet pipe and the second water inlet pipe all with cold water but house steward be communicated with; The first outlet pipe and the second outlet pipe are all communicated with return main.
The first heat exchanger 9 and the second heat exchanger 13 can be by same system controls, make the predetermined temperature of the two identical, make the temperature of fluid reservoir 10 equal the temperature of reservoir 5, the steam temperature of rinse bath 2 tops equals the acid gas temperature of etching groove 1 top, equally also can not form acid drop.
Certainly, the first heat exchanger 9 and the second heat exchanger 13 also can be respectively by different system controls.
Above wet etching machine provided by the utility model is described in detail.Applied specific case herein principle of the present utility model and execution mode are set forth, the explanation of above embodiment is just for helping to understand method of the present utility model and core concept thereof.Should be understood that; for those skilled in the art; do not departing under the prerequisite of the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection range of the utility model claim.
Claims (4)
1. a wet etching machine, comprises etching groove (1) and cover plate (3) thereof, rinse bath (2) and cover plate (4) thereof; Described etching groove (1) downside is provided with fluid reservoir (5), between the two, be provided with liquid injecting pipeline (6) and reflux line (7,8), in described fluid reservoir (5), be provided with the first heat exchanger (9); Described rinse bath (2) downside is provided with water tank (10), is provided with filling pipe (11) and water return pipeline (12) between the two; It is characterized in that, described wet etching machine also comprises the cooling device of the interior medium of cooling described water tank (10), and the preset temperature of described cooling device is less than or equal to the preset temperature of described the first heat exchanger (9).
2. wet etching machine as claimed in claim 1, is characterized in that, described cooling device is the second heat exchanger (13), and described the second heat exchanger (13) is located in described water tank (10).
3. wet etching machine as claimed in claim 1, is characterized in that, also comprises cooling tank, and described water tank (10) is provided with water inlet pipe and outlet pipe, and described water inlet pipe and described outlet pipe are all communicated with described cooling tank; Described cooling device is the second heat exchanger (13), and described the second heat exchanger (13) is located in described cooling tank.
4. wet etching machine as claimed in claim 2 or claim 3, is characterized in that, described the first heat exchanger (9) has the first water inlet pipe and the first outlet pipe, and described the second heat exchanger (13) has the second water inlet pipe and the second outlet pipe; Described the first water inlet pipe and described the second water inlet pipe all with cold water but house steward be communicated with; Described the first outlet pipe and described the second outlet pipe are all communicated with return main.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420420478.5U CN203967050U (en) | 2014-07-28 | 2014-07-28 | A kind of wet etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420420478.5U CN203967050U (en) | 2014-07-28 | 2014-07-28 | A kind of wet etching machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203967050U true CN203967050U (en) | 2014-11-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420420478.5U Expired - Fee Related CN203967050U (en) | 2014-07-28 | 2014-07-28 | A kind of wet etching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203967050U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977186A (en) * | 2016-05-10 | 2016-09-28 | 深圳市华星光电技术有限公司 | Wet etching device and explosion-proof method thereof |
| CN106975636A (en) * | 2017-05-02 | 2017-07-25 | 惠科股份有限公司 | Substrate etching cleaning machine, substrate cleaning system and substrate cleaning method |
-
2014
- 2014-07-28 CN CN201420420478.5U patent/CN203967050U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977186A (en) * | 2016-05-10 | 2016-09-28 | 深圳市华星光电技术有限公司 | Wet etching device and explosion-proof method thereof |
| WO2017193453A1 (en) * | 2016-05-10 | 2017-11-16 | 深圳市华星光电技术有限公司 | Wet-etching device and explosion-proof method thereof |
| CN105977186B (en) * | 2016-05-10 | 2019-11-05 | 深圳市华星光电技术有限公司 | Wet-method etching device and its explosion-proof method |
| CN106975636A (en) * | 2017-05-02 | 2017-07-25 | 惠科股份有限公司 | Substrate etching cleaning machine, substrate cleaning system and substrate cleaning method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141126 Termination date: 20210728 |