CN201556023U - Wafer air-flow flusher - Google Patents

Wafer air-flow flusher Download PDF

Info

Publication number
CN201556023U
CN201556023U CN 200920232183 CN200920232183U CN201556023U CN 201556023 U CN201556023 U CN 201556023U CN 200920232183 CN200920232183 CN 200920232183 CN 200920232183 U CN200920232183 U CN 200920232183U CN 201556023 U CN201556023 U CN 201556023U
Authority
CN
China
Prior art keywords
air nozzle
wafer
enclosed cavity
box
spool box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200920232183
Other languages
Chinese (zh)
Inventor
聂金根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHENJIANG GANGNAN ELECTRIC CO Ltd
Original Assignee
ZHENJIANG GANGNAN ELECTRIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHENJIANG GANGNAN ELECTRIC CO Ltd filed Critical ZHENJIANG GANGNAN ELECTRIC CO Ltd
Priority to CN 200920232183 priority Critical patent/CN201556023U/en
Application granted granted Critical
Publication of CN201556023U publication Critical patent/CN201556023U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a wafer air-flow flusher which comprises an enclosed cavity, a film box and an air nozzle, wherein the film box and the air nozzle are arranged on the enclosed cavity, and the open end of the film box is arranged oppositely to the air nozzle which is connected with an air source, thus, wafers in the film box can be blown into the enclosed cavity by the sir floe through the air nozzle, on one hand, the static electricity between wafers is removed, on the other hand, the collecting of the dropping wafers are convenient.

Description

A kind of wafer gas flow flusher
Technical field
The utility model relates to a kind of wafer gas flow flusher, belongs to the wafer process field.
Background technology
Because the wafer volume is little, thin thickness, therefore, very easily produce static between the wafer, when then wafer being poured out in spool box, because electrostatic interaction usually has wafer to stick in the spool box, in the prior art, the general hair-dryer that adopts blows out these wafers of being close to the spool box bottom, and still, this mode is inconvenient operation on the one hand, then be easily collecting not after wafer blows out on the other hand, fly around.
The utility model content
The utility model is at the demand of prior art, a kind of wafer gas flow flusher is provided, and it is removed with the static that will keep somewhere between the wafer in spool box by airflow scouring, it is dropped in the enclosed cavity, be convenient to the collection of wafer and the utilization again of spool box.
For realizing above technical purpose, the utility model will be taked following technical scheme.
A kind of wafer gas flow flusher comprises enclosed cavity and is installed in spool box and air nozzle on the enclosed cavity that the opening end of described spool box is placed towards air nozzle, and air nozzle is connected with source of the gas.
Offer the box body putting hole suitable with the spool box outside wall surface on the described enclosed cavity, then spool box places in this box body putting hole.
Enclosed cavity is the rectangular parallelepiped cavity, and described spool box and air nozzle are installed in respectively on two opposite faces of this rectangular parallelepiped cavity.
According to above technical scheme, can realize following beneficial effect:
The utility model is installed in spool box and air nozzle on the enclosed cavity, and the opening end of spool box is placed towards air nozzle, then can the wafer in the spool box be dashed and fall in the enclosed cavity by the air-flow of air nozzle ejection, remove the static between the wafer on the one hand, also conveniently fall the collection of wafer on the other hand.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
Explain the technical solution of the utility model below with reference to accompanying drawing.
As shown in Figure 1, wafer gas flow flusher described in the utility model, comprise enclosed cavity 1 and be installed in spool box 2 and air nozzle 31 on the enclosed cavity 1, the opening end of spool box 2 is placed towards air nozzle 31, and air nozzle 31 is connected with source of the gas 32, offer on the described enclosed cavity 1 and the suitable box body putting hole of spool box 2 outside wall surface, then spool box 2 places in this box body putting hole, enclosed cavity 1 described in the utility model is the rectangular parallelepiped cavity, and described spool box 2 and air nozzle 31 are installed in respectively on two opposite faces of this rectangular parallelepiped enclosed cavity 1.
During use, there is the spool box 2 of wafer to be installed on the enclosed cavity 1 indwelling, then air nozzle 31 is connected source of the gas 32, then air nozzle 31 is aimed at spool box 2 and carry out airflow scouring, thereby will place the wafer in this spool box 2 to blow off in enclosed cavity 1, to remove the static between the wafer, carry out the recycling of wafer collection and spool box 2 then.

Claims (3)

1. a wafer gas flow flusher is characterized in that, comprises enclosed cavity and is installed in enclosed cavity fix the film box and air nozzle, and the opening end of described spool box is placed towards air nozzle, and air nozzle is connected with source of the gas.
2. wafer gas flow flusher according to claim 1 is characterized in that, offers the box body putting hole suitable with the spool box outside wall surface on the described enclosed cavity, and then spool box places in this box body putting hole.
3. wafer gas flow flusher according to claim 1 and 2 is characterized in that, enclosed cavity is the rectangular parallelepiped cavity, and described spool box and air nozzle are installed in respectively on two opposite faces of this rectangular parallelepiped cavity.
CN 200920232183 2009-09-11 2009-09-11 Wafer air-flow flusher Expired - Fee Related CN201556023U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200920232183 CN201556023U (en) 2009-09-11 2009-09-11 Wafer air-flow flusher

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200920232183 CN201556023U (en) 2009-09-11 2009-09-11 Wafer air-flow flusher

Publications (1)

Publication Number Publication Date
CN201556023U true CN201556023U (en) 2010-08-18

Family

ID=42615712

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200920232183 Expired - Fee Related CN201556023U (en) 2009-09-11 2009-09-11 Wafer air-flow flusher

Country Status (1)

Country Link
CN (1) CN201556023U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101972758A (en) * 2010-10-27 2011-02-16 镇江市港南电子有限公司 Silicon wafer flushing mechanism
CN101972757A (en) * 2010-10-27 2011-02-16 镇江市港南电子有限公司 Connecting mechanism for silicon wafer washing device
CN102427047A (en) * 2011-09-28 2012-04-25 上海华力微电子有限公司 Wafer back cleaning device and wafer back cleaning method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101972758A (en) * 2010-10-27 2011-02-16 镇江市港南电子有限公司 Silicon wafer flushing mechanism
CN101972757A (en) * 2010-10-27 2011-02-16 镇江市港南电子有限公司 Connecting mechanism for silicon wafer washing device
CN102427047A (en) * 2011-09-28 2012-04-25 上海华力微电子有限公司 Wafer back cleaning device and wafer back cleaning method
CN102427047B (en) * 2011-09-28 2014-03-12 上海华力微电子有限公司 Wafer back cleaning device and wafer back cleaning method

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100818

Termination date: 20110911