CN201544116U

CN201544116U - GMP grinding device

Info

Publication number: CN201544116U
Application number: CN2009202148027U
Authority: CN
Inventors: 赵正元; 张震宇
Original assignee: Shanghai Hua Hong NEC Electronics Co Ltd
Current assignee: Shanghai Huahong Grace Semiconductor Manufacturing Corp
Priority date: 2009-12-15
Filing date: 2009-12-15
Publication date: 2010-08-11
Anticipated expiration: 2019-12-15

Abstract

The utility model discloses a GMP grinding device which comprises a grinding table, a grinding pad and a grinding disc, wherein the grinding pad is fixed on the top of the grinding table, the grinding disc moves under the driving of a motor, and the friction and grinding are conducted on the surface of the grinding pad; and the motor of the grinding disc is provided with a current monitoring and feedback device, and the current monitoring and feedback device processes the monitored current value and transmits a feedback signal to a pressure supply module of the grinding disc. By monitoring the current of the motor, the GMP grinding device realizes monitoring on the frictional force of the grinding pad, can feed back the result to the pressure supply module of the grinding disc by the current monitoring and feedback device, and automatically adjust the pressure applied on the grinding pad by the grinding disc to lead the current of the motor to be kept stable, thus guaranteeing the polishing effect of the grinding disc on the grinding pad, and guaranteeing the stability of the grinding speed.

Description

The CMP lapping device

Technical field

The utility model relates to a kind of chemical-mechanical planarization device, is specifically related to a kind of CMP lapping device.

Background technology

At chemical-mechanical planarization (Chemical Mechanical Planarization, abbreviation CMP) in the manufacture craft process, the oxide-film of silicon chip surface contacts with grinding pad, and and grinding pad on the lapping liquid haptoreaction of carrying, effect by physics and chemistry polishes the projection of silicon chip surface.

But after grinding pad uses a period of time, chip that the surface micropore crack of grinding pad can be ground and reflection accessory substance are filled, and form the glazing layer, and the surface roughness of grinding pad reduces, make the coefficient of friction of grinding pad and silicon chip surface change, thereby have influence on the grinding effect of silicon chip.

For guaranteeing that silicon chip surface is polished, need make grinding pad remain coarse state.For this reason, need to use abrasive disk polishing grinding pad surface, and the polishing effect of abrasive disk depends primarily on 2 points: the firstth, the relative rotation speed of abrasive disk and grinding pad; The secondth, abrasive disk is to the contact pressure of grinding pad, and abrasive disk is to the too small effect that can not play polishing of the contact pressure of grinding pad, and pressure is excessive then excessive to the wearing and tearing of grinding pad, causes waste.

And the abrasive disk that uses at present can't be regulated the contact pressure to grinding pad, and after the coefficient of friction of grinding pad and silicon chip surface diminished, this contact pressure just can't satisfy the grinding requirement of grinding pad.

The utility model content

Technical problem to be solved in the utility model provides a kind of CMP lapping device, and it can regulate the contact pressure of abrasive disk to grinding pad automatically, guarantees the grinding effect of grinding pad.

For solving the problems of the technologies described above, the technical solution of the utility model CMP lapping device is:

Comprise grinding table, grinding pad, abrasive disk, grinding pad is fixed in the grinding table top, and abrasive disk moves under the driving of motor, grinds in the mantle friction of grinding pad; The motor of described abrasive disk is provided with current monitoring and feedback device, and the pressure feed module of abrasive disk handled and feedback signal is passed to by current monitoring and feedback device to the current value of monitoring.

The technique effect that the utility model can reach is:

The utility model is by the monitoring to motor current, realization is to the monitoring of the frictional force of grinding pad, and by current monitoring and feedback device pressure feed module feedback to abrasive disk, automatically regulate abrasive disk to the grinding pad applied pressure, make motor current keep stable, thereby guarantee the polishing effect of abrasive disk, guarantee the stable of grinding rate grinding pad.

Description of drawings

Below in conjunction with the drawings and specific embodiments the utility model is described in further detail:

Fig. 1 is the schematic diagram of the utility model CMP lapping device.

Description of reference numerals among the figure:

1 is grinding table, and 2 is grinding pad,

3 is abrasive disk, and 10 is current monitoring and feedback device,

20 is silicon chip.

The specific embodiment

As shown in Figure 1, the utility model CMP lapping device comprises grinding table 1, grinding pad 2, abrasive disk 3, and grinding pad 2 is fixed in grinding table 1 top, and abrasive disk 3 moves under the driving of motor, grinds in the mantle friction of grinding pad 2; The motor of abrasive disk 3 is provided with current monitoring and feedback device 10, and the pressure feed module of abrasive disk 3 handled and feedback signal is passed to by current monitoring and feedback device to the current value of monitoring.

During work, silicon chip 20 grinds on grinding pad under the effect of plus-pressure F overleaf, meanwhile, abrasive disk 3 contact grinding pads 2, and under the driving of motor, rotate, frictional force produced between abrasive disk 3 and the grinding pad 2, the size of this frictional force is directly proportional with the motor current that drives abrasive disk 3 rotations.

By current monitoring and feedback device the electric current of motor is monitored, when motor current becomes big, it is big that frictional force between expression abrasive disk 3 and the grinding pad 2 becomes, for avoiding the excessive wear of 3 pairs of grinding pads 2 of abrasive disk, reduce the pressure of 3 pairs of grinding pads 2 of abrasive disk this moment by the pressure feed module of abrasive disk 3, frictional force between the two is diminished, and then motor current reduces thereupon.

The utility model is regulated the pressure of 3 pairs of grinding pads 2 of abrasive disk automatically according to the size of the motor current of abrasive disk 3, and motor current diminishes, and expression frictional force diminishes, and should increase pressure this moment; When motor current becomes big, represent that frictional force is excessive, should reduce pressure this moment.

The utility model is kept the stable of motor current by regulating the pressure of 3 pairs of grinding pads 2 of abrasive disk, thereby the frictional force of keeping between abrasive disk 3 and the grinding pad 2 is stable, and is stable with the waste of guarantor unit's 3 pairs of grinding pads 2 of abrasive disk in the time.

Claims

1. a CMP lapping device comprises grinding table, grinding pad, abrasive disk, and grinding pad is fixed in the grinding table top, and abrasive disk moves under the driving of motor, grinds in the mantle friction of grinding pad; It is characterized in that: the motor of described abrasive disk is provided with current monitoring and feedback device, and the pressure feed module of abrasive disk handled and feedback signal is passed to by current monitoring and feedback device to the current value of monitoring.