CN111055213A - Regulator for grinding device - Google Patents
Regulator for grinding device Download PDFInfo
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- CN111055213A CN111055213A CN201811474030.0A CN201811474030A CN111055213A CN 111055213 A CN111055213 A CN 111055213A CN 201811474030 A CN201811474030 A CN 201811474030A CN 111055213 A CN111055213 A CN 111055213A
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- pressure
- conditioner
- polishing pad
- grinding apparatus
- measuring
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- 238000005498 polishing Methods 0.000 claims abstract description 168
- 230000003750 conditioning effect Effects 0.000 claims abstract description 97
- 238000005259 measurement Methods 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 17
- 230000033001 locomotion Effects 0.000 claims description 15
- 230000001105 regulatory effect Effects 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 description 48
- 230000008569 process Effects 0.000 description 48
- 230000000694 effects Effects 0.000 description 28
- 238000012937 correction Methods 0.000 description 19
- 239000000126 substance Substances 0.000 description 11
- 239000002002 slurry Substances 0.000 description 10
- 230000001276 controlling effect Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 8
- UIAFKZKHHVMJGS-UHFFFAOYSA-N 2,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1O UIAFKZKHHVMJGS-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000007517 polishing process Methods 0.000 description 6
- 239000011148 porous material Substances 0.000 description 6
- 230000001143 conditioned effect Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000002407 reforming Methods 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to a conditioner for a polishing apparatus, comprising: a conditioning disk for reconditioning the polishing pad; a pressurizing portion for applying an axial pressure to the adjustment disk; a measuring section provided between the pressurizing section and the adjustment disk, for measuring the pressure from the pressurizing section; and a correcting unit that corrects the pressure from the pressurizing unit based on the signal measured by the measuring unit.
Description
Technical Field
The present invention relates to a conditioner for a polishing apparatus, and more particularly, to a conditioner for a polishing apparatus capable of improving the conditioning accuracy and stability of a polishing pad.
Background
In general, a Chemical Mechanical Polishing (CMP) process is considered as a standard process for Polishing a wafer surface by relatively rotating a wafer such as a wafer required for manufacturing a semiconductor having a Polishing layer and a Polishing platen.
Fig. 1 is a diagram schematically illustrating a conventional chemical mechanical polishing apparatus, and fig. 2 is a diagram illustrating a conditioner of the conventional chemical mechanical polishing apparatus. As shown in fig. 1 and 2, a conventional chemical mechanical polishing apparatus 1 includes a polishing platen 10 having a polishing pad 11 attached to an upper surface thereof, a polishing head 20 on which a wafer W to be polished is mounted and which rotates while contacting the upper surface of the polishing pad 11, and a conditioner 300 which performs fine cutting while pressing the surface of the polishing pad 11 with a predetermined pressure so that micropores formed on the surface of the polishing pad 11 appear on the surface.
The polishing disk 10 is attached with a polishing pad 11 for polishing a wafer W, and rotationally moves in accordance with the rotational driving of the rotation shaft 12.
The polishing head 20 is composed of a carrier head (not shown) which is positioned above the polishing pad 11 of the polishing platen 10 and holds the wafer W, and a polishing arm 22 which reciprocates at a constant amplitude by rotationally driving the carrier head.
The conditioner 30 finely cuts the surface of the polishing pad 11 so as not to clog the large number of foamed fine pores on the surface of the polishing pad 11 serving to contain the slurry mixed with the abrasive and the chemical; and the slurry filled in the foaming pores of the polishing pad 11 is smoothly supplied to the wafer W held by the carrier head 21.
The conditioner 30 includes a rotary shaft 32, a disk holder 34 coupled to the rotary shaft 32 so as to be movable in the vertical direction, and a conditioning disk 36 disposed on the lower surface of the disk holder 34, and is configured to be rotated relative to the polishing pad 11 along a rotation path.
The rotary shaft 32 is rotatably mounted to a housing 33, and the housing 33 is mounted to an adjustment arm that performs a pivotal motion in a predetermined angular range.
More specifically, the rotary shaft 32 includes: a drive shaft portion 32a that is rotationally driven in a home position by a drive motor; a transmission shaft 32c that is engaged with the drive shaft 32a to be rotationally driven and that moves relative to the drive shaft 32a in the vertical direction; and a hollow outer peripheral shaft portion 32b that houses the drive shaft portion 32a and the transmission shaft portion 32c in the hollow portion and is disposed on the outer periphery thereof.
The disk holder 34 is movable in the vertical direction with respect to the rotary shaft 32, is rotatable together with the rotary shaft 32, and is movable in the vertical direction with respect to the rotary shaft 32, and has a conditioning disk 36 coupled to a lower portion of the disk holder 34, the conditioning disk being necessary for reforming the polishing pad 11 attached to the polishing disk 10.
Since the pressure chamber 31 is provided between the rotary shaft 32 and the disk holder 34 and the air pressure reaching the pressure chamber 31 from the pressure adjusting portion 31a connected to the pressure chamber 31 is adjusted, the disk holder 34 can move in the vertical direction with respect to the rotary shaft 32, and the pressure with which the adjustment disk 36 presses the polishing pad 11 can be varied in accordance with the vertical movement of the disk holder 34 with respect to the rotary shaft 32.
On the other hand, in order to uniformly adjust the polishing pad 11 as a whole, the pressure applied to the polishing pad 11 by the adjustment disk 36 should be accurately corrected (calibration) before the adjustment process for the polishing pad 11 is performed.
That is, if a deviation occurs between the target pressure and the actual pressure of the conditioning disk 36, the polishing pad 11 cannot be uniformly conditioned, and therefore, the conditioner 30 needs to be calibrated (pressure-calibrated) before the conditioning process for the polishing pad 11 is performed.
However, in the prior art, the conditioner 30 is brought into contact with the separate jig 40 provided outside the polishing pad 11, and there is a problem that the time required for the correction process of the conditioner 30 increases as the correction process of the conditioner 30 proceeds, and the movement path of the conditioner inevitably increases, which complicates the equipment and control.
Further, even if the calibration process of the conditioner 30 is performed in the jig 40 in the related art, since the conditions for performing the calibration process in the jig 11 and the conditions for actually performing the conditioning process in the polishing pad 11 are different from each other, there is a problem that a deviation occurs between the target pressure and the actual pressure of the conditioning disk 36, and there is a problem that it is difficult to accurately control the pressure at which the conditioning disk 36 pressurizes the polishing pad 11, and the conditioning stability and efficiency of the polishing pad 11 are deteriorated.
Therefore, various studies have been recently made to improve the adjustment accuracy and stability and simplify the adjustment process, but these studies are still insufficient and development thereof is required.
Disclosure of Invention
Technical problem to be solved
The invention aims to provide a regulator for a polishing device, which can improve the regulation accuracy and stability of a polishing pad.
In addition, the invention aims to simplify the correction process of the regulator and improve the correction accuracy.
In addition, the invention aims to accurately control the pressure of the polishing pad pressurized by the adjusting disc.
Further, the present invention aims to simplify the structure and facilitate the adjustment control.
In addition, the invention aims to improve the conditioning efficiency of the polishing pad and shorten the time required for conditioning.
In addition, the invention aims to maintain the surface height of the polishing pad constantly and improve the polishing quality of the wafer.
Technical scheme
In order to achieve the above object, the present invention provides a conditioner for a polishing apparatus, comprising: a conditioning disk for reconditioning the polishing pad; a pressurizing portion for applying an axial pressure to the adjustment disk; a measuring unit provided between the pressurizing unit and the adjustment disk, for measuring the pressure from the pressurizing unit; and a correcting unit that corrects the pressure from the pressurizing unit based on the signal measured by the measuring unit.
Effects of the invention
In summary, the present invention can obtain the advantageous effect of improving the conditioning accuracy and stability of the polishing pad.
In particular, the present invention can obtain advantageous effects of simplifying the correction process of the regulator and improving the correction accuracy.
In addition, the present invention can obtain an advantageous effect of accurately controlling the pressure of the pressing of the polishing pad by the conditioning disk.
In addition, the present invention can obtain advantageous effects that the structure can be simplified and the adjustment control can be easily performed.
In addition, the present invention can obtain advantageous effects of improving conditioning efficiency of the polishing pad and shortening the time required for conditioning.
In addition, the present invention can obtain the advantageous effect of maintaining the surface height of the polishing pad at a constant level and improving the polishing quality of the wafer.
Drawings
Fig. 1 is a diagram illustrating a structure of a conventional general chemical mechanical polishing apparatus.
Fig. 2 is a diagram illustrating the regulator of fig. 1.
Fig. 3 and 4 are views for explaining a chemical mechanical polishing apparatus to which the conditioner of the present invention is applied.
Fig. 5 is a diagram for explaining a database as the regulator of the present invention.
Fig. 6 is a perspective view for explaining the regulator of the present invention.
Fig. 7 is a cut-away perspective view of an adjuster for illustrating the present invention.
Fig. 8 is a sectional view of the regulator for explaining the present invention.
Fig. 9 is an enlarged view of the portion "a" of fig. 8.
Fig. 10 is an enlarged view of the portion "B" of fig. 8.
Fig. 11 is a diagram for explaining a state in which the measuring unit is moved to the upper part as the regulator of the present invention.
Fig. 12 is a block diagram for explaining a regulator-based regulation process of the present invention.
Reference numerals:
100: the grinding disc 110: polishing pad
200: the carrier head 300: regulator
302: regulator housing 304: swing arm
310: the pressurization section 312: cylinder body
313: pressure chamber 313 a: a first pressure chamber
313 b: second pressure chamber 314 a: a first pressure regulating part
314 b: the second pressure regulating portion 316: piston component
320: second coupler 322: guide hole
330: measurement unit 340: first coupler
342: the guide projection 350: rotating part
352: spline shaft 354: bearing component
356: the rotating block 360: disk holder
362: gimbal structure 370: adjusting disk
380: the control unit 392: driving source
394: power transmission portion 394 a: first gear
394 b: second gear 400: correcting part
410: the database 420: alarm generating part
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, and the present invention is not limited or restricted by the embodiments. For reference, in the present description, the same reference numerals denote substantially the same elements, and under such a rule, description may be made with reference to contents described in other figures, and contents judged to be self-evident or duplicated by a person skilled in the art may be omitted.
Referring to fig. 3 to 12, a conditioner 300 for a polishing apparatus according to the present invention includes: a conditioning disk 370 that reforms the polishing pad 110; a pressing portion 310 that applies an axial pressing force to the adjustment disk 370; a measuring unit 330 provided between the pressurizing unit 310 and the adjustment dial 370, for measuring the pressure from the pressurizing unit 310; and a correcting unit 400 for correcting the pressure from the pressurizing unit 310 based on the signal measured by the measuring unit 330.
This is to improve the conditioning stability of the polishing pad 110 and to accurately control the pressure with which the conditioning disk 370 pressurizes the polishing pad 110.
That is, in order to uniformly adjust the polishing pad as a whole, the pressure by the conditioner should be able to be corrected before performing the adjusting process for the polishing pad, so that the conditioning disk accurately pressurizes the polishing pad as needed. In other words, if a deviation occurs between the target pressure and the actual pressure of the conditioning disk, the polishing pad cannot be uniformly conditioned, and therefore the conditioner should be able to correct (pressure correction) before the conditioning process for the polishing pad is performed.
However, since the conditioner is brought into contact with a separate jig provided outside the polishing pad and the correction process of the conditioner is performed based on a signal sensed by the jig, the time required for the correction process of the conditioner is increased, the moving path of the conditioner is inevitably increased, and the equipment and control are complicated.
Further, in the related art, even if the adjustment process of the conditioner is performed in the jig, since the condition for performing the adjustment process in the jig (for example, the hardness or height of the mounting surface of the jig) and the condition for actually performing the adjustment process in the polishing pad are different from each other, there is a problem that a deviation occurs between the target pressure and the actual pressure of the conditioning disk, and there is a problem that it is difficult to accurately control the pressure of the conditioning disk for pressing the polishing pad, and the conditioning stability and efficiency of the polishing pad are low.
However, in the present invention, the measuring unit 330 is directly provided in the conditioning head, and the pressure applied to the polishing pad 110 by the conditioning disk 370 is corrected based on the signal measured by the measuring unit 330, thereby achieving the advantageous effects of improving the conditioning efficiency of the polishing pad 110 and shortening the time required for conditioning.
Further, the present invention can perform the correction process of the conditioner without providing a separate jig in the outer region of the polishing pad 110, and thus can shorten the moving path of the conditioner, simplify the structure and equipment, and obtain an advantageous effect that the conditioning control of the conditioner can be more easily performed.
More importantly, the present invention has an advantageous effect of improving the accuracy of pressure correction of the conditioner and more accurately controlling the pressure applied to the polishing pad 110 by the conditioning disk 370 by performing the pressure correction process of the conditioner on the polishing pad 110 to be conditioned without the conditioning disk 370 coming off the polishing pad 110.
For reference, a polishing pad 110 for polishing a substrate W is disposed on an upper surface of the polishing platen 100, and the chemical mechanical polishing process is performed by pressing the substrate on the upper surface of the polishing pad 110 by means of the carrier head 200 in a state where slurry is supplied from a slurry supply portion (see 130 of fig. 4) onto the upper surface of the polishing pad 110, and the conditioner 300 serves to reform the surface of the polishing pad 110.
That is, the conditioner 300 finely cuts the surface of the polishing pad 110 to prevent clogging of the plurality of foamed micro pores that function to receive the slurry mixed with the polishing agent and the chemical substance on the surface of the polishing pad 110; and the slurry filled in the foaming pores of the polishing pad 110 can be smoothly supplied to the substrate held by the carrier head 200.
The pressurization part 310 serves to apply an axial pressure to the adjustment disk 370.
The pressurizing part 310 may apply the axial pressure to the adjustment disk 370 in various ways according to required conditions and design specifications. As an example, a rotation part 350 for rotating the adjustment disc 370 is coupled to an upper portion of the adjustment disc 370, and a pressurizing part 310 is provided to an upper portion of the rotation part 350 to selectively apply an axial pressure (downward force) to the rotation part 350.
Various pressure applying devices capable of applying pressure to the rotating part 350 may be used as the pressurizing part 310, and the present invention is not limited or restricted by the kind and structure of the pressurizing part 310.
As an example, the pressing part 310 includes: a cylinder main body 312 formed with a pressure chamber 313; and a piston member 316 attached to the cylinder body 312 so as to be movable in the vertical direction in accordance with a change in pressure of the pressure chamber 313, and coupled to the measurement unit 330. The first pressure chamber 313a and the second pressure chamber 313b are collectively referred to as a pressure chamber 313.
More specifically, referring to fig. 9, the pressure chamber 313 includes: a first pressure chamber 313a formed at a lower portion of the piston member 316; a second pressure chamber 313b formed at an upper portion of the piston member 316; the piston member 316 can be moved in the up-down direction by controlling the pressure of at least one of the first pressure chamber 313a and the second pressure chamber 313 b.
Preferably, a uniform range of fixed pressure P1 is applied to the first pressure chamber 313a and a selectively variable pressure P2 is applied to the second pressure chamber 313 b. Therefore, the first pressure chamber 313a is connected to the first pressure adjusting part 314a for applying the constant pressure P1 in a uniform range, and the second pressure chamber 313b is connected to the second pressure adjusting part 314b for applying the variable pressure P2 which is selectively varied.
As an example, in a state where the fixed pressure P1 is constantly maintained in the first pressure chamber 313a, if the fluctuating pressure P2 higher than the fixed pressure P1 is applied to the second pressure chamber 313b, the piston member 316 moves to the lower side according to the pressure difference between the fluctuating pressure P2 and the fixed pressure P1, and pressurizes the rotation section 350. In contrast to this (see fig. 10), if the varied pressure P2 lower than the fixed pressure P1 is applied to the second pressure chamber 313b in a state where the fixed pressure P1 is constantly maintained in the first pressure chamber 313a, the piston member 316 moves to the upper portion according to the pressure difference between the varied pressure P2 and the fixed pressure P1. (refer to FIG. 11)
As described above, by keeping the fixed pressure P1 constant in the first pressure chamber 313a and moving the piston member 316 in the up-down direction as the pressure of the varying pressure P2 applied to the second pressure chamber 313b varies, it is possible to obtain the advantageous effects of more accurately controlling the pressure from the pressurizing portion 310 and improving the pressure control resolving power (resolution) of the pressurizing portion 310. In particular, the difference between the variable pressure and the fixed pressure can be formed in a unit smaller than the minimum pressure adjustment unit of the pressure adjustment portion (for example, a pump), and thus an advantageous effect of more precisely controlling the movement of the piston member 316 can be obtained.
Further, by moving the piston member 316 in the vertical direction in accordance with the pressure change of the fluctuating pressure P2 applied to the second pressure chamber 313b while the fixed pressure P1 is kept constant in the first pressure chamber 313a, it is possible to obtain an advantageous effect of preventing the pressure due to the load of the pressurizing portion 310 (including the components fixed to the pressurizing portion) from acting on the rotating portion 350 in a state where the fluctuating pressure is not applied to the second pressure chamber 313b (for example, in a state where the fluctuating pressure is "0").
For reference, in the embodiment of the present invention, the description is given by taking an example in which the pressure chamber 313 of the pressurizing portion 310 is constituted by a plurality of chambers, but according to another embodiment of the present invention, the pressure chamber of the pressurizing portion may be constituted by only a single chamber.
Referring to fig. 7 and 8, the rotation part 350 is rotatably disposed inside the regulator housing 302, is located below the pressurization part 310, and is selectively pressurized by the pressurization part 310.
At this time, the actuator case 302 is attached to a swing arm 304 that performs swing rotation (circling motion) within a predetermined angular range with reference to a swing rotation shaft 304 a.
The rotating portion 350 may take a variety of configurations that are capable of rotating on the regulator housing 302. As an example, the rotation part 350 includes: a spline shaft 352 coupled to the adjustment plate 370; a ring-shaped bearing member 354 coupled to surround the outer periphery of the spline shaft 352 and supporting the first coupler 340.
Here, the spline shaft 352 is coupled to the adjustment plate 370, and the spline shaft 352 and the adjustment plate 370 are integrally rotatably coupled to each other.
As spline shaft 352, a usual spline can be used, and the present invention is not limited or restricted by the kind of spline shaft 352. As one example, spline shaft 352 may use a ball spline.
Referring to fig. 3 and 4, the rotation portion 350 is rotated inside the regulator housing 302 by the drive source 392.
Preferably, a driving source 392 (e.g., a motor) that generates a driving force for rotating the rotation portion 350 is attached to the swing arm 304 separately from the regulator housing 302, and the driving force of the driving source 392 is transmitted to the rotation portion 350 via a power transmission portion 394.
The power transmission portion 394 may be formed in various structures capable of transmitting the driving force of the driving source 392 to the rotation portion 350. As one example, the power transmission portion 394 includes: a first gear 394a that is rotated by the drive source 392; and a second gear 394b coupled to the rotating part 350 and rotating while meshing with the first gear 394 a. As the first gear 394a and the second gear 394b, a general bevel gear may be used. According to circumstances, the power transmission portion may be configured using other different gears such as a planetary gear.
The connection structure between the rotation portion 350 and the driving source 392 can be variously changed according to required conditions and design specifications. As an example, the rotation portion 350 rotates integrally with the rotation block 356 rotatably coupled inside the adjuster housing 302, and the second gear 394b is coupled to the rotation block 356. The rotary block 356 is rotated by the driving source 392, and the rotary portion 350 is rotated together.
Further, a speed reducer (for example, a speed reduction ratio of 1: 5) for reducing the driving force of the driving source 392 may be provided between the driving source 392 and the power transmission unit 394.
As described above, by mounting the drive source 392 for rotating the rotary unit 350 to the swing arm 304 so as to be spaced apart from the regulator case 302, the advantageous effects of minimizing the sagging of the regulating head (the portion including the pressurization portion and the regulating disk, which is located at the end of the swing arm) and improving the heat radiation performance of the drive source 392 can be obtained.
That is, since the drive source 392 for rotating the rotating portion 350 is conventionally attached to the adjusting head located at the end portion of the swing arm 304, there is a problem that the end portion of the swing arm 304 is sagged by the load of the drive source 392, and if the adjusting process is performed in a state where the swing arm 304 is sagged, there is a problem that the polishing pad 110 is unevenly reformed. Further, in the related art, since the pressurizing unit 310, the driving source 392, and the like are densely mounted in a narrow space of the adjustment head, there is a problem in that the heat dissipation performance of the driving source 392 is deteriorated.
However, in the present invention, the drive source 392 for rotating the rotating portion 350 is mounted to the swing arm 304 so as to be spaced apart from the conditioner housing 302, whereby the advantageous effects of preventing the swing arm 304 from sagging due to the load of the drive source 392 and improving the conditioning stability of the polishing pad 110 can be obtained. Further, by separating the drive source 392 from the adjustment head having a narrow space, the heat dissipation performance of the drive source 392 can be improved, and an advantageous effect of improving the degree of freedom in design and the space utilization of the adjustment head can be obtained.
Referring to fig. 7, the measuring unit 330 is provided between the pressurizing unit 310 and the adjustment disk 370, and measures the pressure applied to the adjustment disk 370 by the pressurizing unit 310.
As an example, the measuring unit 330 measures the pressure applied to the conditioning disk 370 by the pressurizing unit 310 for the purpose of correcting the pressure from the pressurizing unit 310 before the conditioning process for the polishing pad 110 is performed.
Preferably, the measuring part 330 measures the pressure from the pressurizing part 310 at a stop position where the movement and rotation of the adjustment disk 370 is stopped.
The stop position at which the movement and rotation of the conditioning disk 370 are stopped is defined as including all of the inner region or the outer region of the polishing pad 110 at which the movement and rotation of the conditioning disk 370 are stopped, and the present invention is not limited or restricted by the stop position.
As one example, the measuring part 330 measures the pressure applied to the conditioning disc 370 by the pressing part 310 in a state where the conditioning disc 370 contacts the polishing pad 110 and stops moving and rotating.
According to another embodiment of the present invention, the measuring unit may measure the pressure from the pressurizing unit in a state where the conditioning disk moves and rotates on the polishing pad (or the outer region of the polishing pad), but it is preferable to measure the pressure applied to the conditioning disk via the pressurizing unit in a state where the movement and rotation of the conditioning disk are stopped, so that the occurrence of noise due to vibration or the like can be minimized, and the accuracy of measuring the pressure from the pressurizing unit can be improved.
In contrast, the pressure applied to the conditioning disk by the pressure section may be measured while the conditioning disk is stopped in the polishing pad outer region (for example, a device disposed in the polishing pad outer region).
As the measuring unit 330, various measuring devices capable of measuring pressure can be used, and the kind of the measuring unit 330 can be variously changed according to required conditions and design specifications. As an example, as the measuring part 330, a load cell may be used, and a lower end of the load cell is formed in a circular arc end surface form so as to be in point contact with the rotation part 350.
The measuring part 330 may directly contact or may be a separate member that media-contacts the rotating part 350.
As an example, a first coupler 340 is fixedly coupled to an upper portion of the rotation part 350, the measurement part 330 contacts the first coupler 340 when the measurement part 330 moves to a lower portion by means of the pressurization part 310, the pressure is transmitted to the rotation part 350 through the first coupler 340, and the measurement part 330 is spaced apart from the first coupler 340 when the measurement part 330 moves to an upper portion by means of the pressurization part 310.
More specifically, referring to fig. 10, the pressure transmitted from the measurement portion 330 to the first coupler 340 is transmitted to the spline shaft 352 via the bearing member 354.
Preferably, the first coupler 340 is continuously supported by the bearing member 354 along the circumferential direction of the bearing member 354, and the pressure F1 transmitted to the first coupler 340 is transmitted to the spline shaft 352 along the bearing member 354 in a state of being dispersed in a ring state (F2).
As described above, the pressure force F1 transmitted to the first coupler 340 is transmitted to the spline shaft 352 in a state dispersed in a ring state (F2) along the bearing member 354, whereby the advantageous effect of transmitting the pressure force transmitted to the first coupler 340 to the spline shaft 352 more stably while minimizing play and rattling of the spline shaft 352 can be obtained.
That is, the pressure transmitted to the first coupling may be directly transmitted to the spline shaft. However, when the first coupler and the spline shaft are arranged non-coaxially due to assembly tolerance, error, or the like, the pressure of the pressurizing portion (the pressure transmitted to the first coupler) is transmitted to a portion away from the center of the spline shaft, not the center of the spline shaft, and therefore, there is a problem in that play and rattling of the spline shaft are induced.
However, according to the present invention, the pressure transmitted to the first coupler 340 is transmitted coaxially to the spline shaft 352 in a state dispersed in a ring shape along the bearing member 354, and thus, the advantageous effect of stably transmitting the pressure to the spline shaft 352 without play and rattling of the spline shaft 352 can be obtained.
Further, a second coupler 320 selectively moved in the vertical direction by the pressurizing part 310 may be provided at a lower portion of the pressurizing part 310, and the measuring part 330 may be fixedly coupled to the second coupler 320.
Preferably, the second coupler 320 is formed in a cylindrical shape surrounding the outer periphery of the side surface of the first coupler 340, a guide hole 322 is formed in the sidewall of the second coupler 320, and a guide boss 342 is formed to protrude from the outer peripheral surface of the first coupler 340 to be vertically movable and received in the guide hole 322.
As described above, the guide boss is made to move up and down along the guide hole 322 while the second coupler 320 moves up and down in a state of surrounding the outer circumference of the first coupler 340, whereby an advantageous effect of more stably supporting the up and down movement of the second coupler 320 (or the measuring part) with respect to the first coupler 340 (or the rotating part) can be obtained. In addition, by the interference of the guide boss 342 with the guide hole 322, the excessive up-and-down movement of the second coupler 320 with respect to the first coupler 340 can be restricted.
The conditioning disk 370 is coupled to a lower portion of the rotating part 350, and reforms (conditions) the polishing pad 110 while rotating by the rotating part 350 in a state of being pressurized by the pressure of the pressurizing part 310.
As an example, a disk holder 360 is installed at a lower end of the rotation part 350, and a conditioning disk 370 for reforming the polishing pad 110 attached to the polishing disk 100 is coupled to the disk holder 360.
The conditioning disk 370 is defined to condition the polishing pad 110 by finely cutting the surface of the polishing pad 110 while applying pressure P determined in advance so that the micropores formed on the surface of the polishing pad 110 are exposed to the surface. In other words, the conditioning disk 370 finely cuts the outer surface of the polishing pad 110 to prevent a large number of foamed micro-pores on the outer surface of the polishing pad 110, which function to contain slurry mixed with an abrasive and a chemical, from being clogged, so that the slurry filled in the foamed micro-pores of the polishing pad 110 is smoothly supplied to the substrate. In some cases, diamond particles may be attached to the surface of the conditioning disk 370 that contacts the polishing pad 110 in order to finely cut the polishing pad 110.
The coupling and connection structure of the rotation part 350 and the disk holder 360 may be variously changed according to required conditions and design specifications, and the present invention is not limited or restricted by the coupling and connection structure of the rotation part 350 and the disk holder 360.
As an example, the rotating portion 350 and the disk holder 360 may be connected by means of a gimbal structure 362. The gimbal structure 362 self-aligns (self-aligning) the disk holder 360 with respect to the rotation portion 350.
More specifically, if a phenomenon occurs in which the housing 3020 of the conditioner is inclined (arranged obliquely with respect to the vertical line) by the surface state of the polishing pad 110 or a physical force acting in the reverse direction on the conditioning disk 370 during the conditioning process of the polishing pad 110 by the conditioner 300, there is a problem in that the conditioning of the polishing pad 110 cannot be uniformly achieved as the conditioning disk 370 is partially separated from the polishing pad 110. For this reason, the gimbal structure 362 allows a gimbal movement of the disk holder 360 relative to the conditioner case 302 when the conditioner case 302 is tilted, thereby maintaining a state in which the conditioning disk 370 contacts the polishing pad 110 even if the conditioner case 302 is tilted.
As an example, a gimbal, a self-aligning bearing (self-aligning bearing), or the like can be used as the gimbal structure 362. The self-aligning bearing is defined as a concept including all of a general self-aligning ball bearing and a self-aligning roller bearing.
Also, if an external force that tilts the disk holder 360 with respect to the rotation portion 350 is removed, the gimbal structure 362 may automatically restore the disk holder 360 to an initial position (a state before the disk holder 360 is tilted with respect to the adjuster housing 302) by means of an elastic member such as a spring.
As described above, by making the universal movement of the saucer holder 360 with respect to the rotating part 350 ensured, it is possible to obtain an advantageous effect that the conditioning disk 370 stably maintains a state of being in close contact with the polishing pad 110 even if the inclination of the conditioner case 302 (or the rotating part) occurs in the conditioning process, and uniformly maintains the pressure applied to the conditioning disk 370.
The correcting unit 400 corrects the pressure from the pressurizing unit 310 based on the signal measured by the measuring unit 330.
As an example, the correcting unit 400 corrects the pressure from the pressurizing unit 310 based on the signal measured by the measuring unit 330 before the polishing pad 110 is subjected to the conditioning process.
Preferably, the correcting unit 400 corrects the pressure from the pressurizing unit 310 in a state where the conditioning disk 370 is disposed on the polishing pad 110.
As described above, the pressure from the pressurizing unit 310 is corrected based on the signal measured by the measuring unit 330 before the conditioning process for the polishing pad 110 is performed, whereby the conditioning efficiency of the polishing pad 110 can be improved and the time required for conditioning can be shortened.
That is, in order to uniformly adjust the polishing pad as a whole, the pressure by the conditioner should be corrected before performing the adjusting process for the polishing pad so that the conditioning disk 370 accurately pressurizes the polishing pad as needed. In other words, if a deviation occurs between the target pressure and the actual pressure of the conditioning disk 370, the polishing pad cannot be uniformly conditioned, and therefore, the conditioner should be able to be corrected (pressure correction) before the conditioning process for the polishing pad is performed.
However, since the conditioner is brought into contact with a separate jig provided outside the polishing pad and the correction process of the conditioner is performed based on a signal sensed by the jig, the time required for the correction process of the conditioner is increased, and the movement path of the conditioner is inevitably increased, which makes the equipment and control complicated.
Further, in the related art, even if the adjustment process of the conditioner is performed in the jig, since the conditions (for example, hardness or height of the mounting surface of the jig) for performing the adjustment process in the jig and the conditions for actually performing the adjustment process in the polishing pad are different from each other, there are problems that a deviation occurs between a target pressure and an actual pressure of the conditioning disk, and it is difficult to accurately control the pressure of the conditioning disk for pressing the polishing pad, and the conditioning stability and efficiency of the polishing pad are low.
However, in the present invention, the measuring unit 330 is directly provided in the conditioning head, and the pressure applied to the polishing pad 110 by the conditioning disk 370 is corrected based on the signal measured by the measuring unit 330, thereby achieving the advantageous effects of improving the conditioning efficiency of the polishing pad 110 and shortening the time required for conditioning.
Further, the present invention can perform the adjustment process of the conditioner without providing a separate jig in the outer region of the polishing pad 110, so that the moving path of the conditioner 300 can be shortened, the structure and equipment can be simplified, and the advantageous effect of easier control of the adjustment process can be obtained.
More importantly, the present invention has the advantageous effect of improving the accuracy of pressure correction of the conditioner 300 and more accurately controlling the pressure applied to the polishing pad 110 by the conditioning disk 370 by performing the conditioning process on the polishing pad 110 being conditioned without the conditioning disk 370 coming off the polishing pad 110, in other words, by performing the pressure correction of the conditioner 300 on the polishing pad 110 actually performing the conditioning process.
Preferably, the regulator includes a database 410 in which a reference pressure range of the regulating disk 370 is stored in advance, and the correcting section 400 corrects the pressure from the pressurizing section 310 based on a deviation between the measured pressure range of the regulating disk 370 measured by the measuring section 330 and the reference pressure range stored in the database 410.
As an example, referring to fig. 5, the reference pressure ranges P1 to Pn may be stored in advance in a Lookup Table (Lookup Table) according to the service life (condition 1 to condition n) of the adjustment disk 370 (e.g., the degree of wear of the adjustment disk), and the pressure from the pressure section 310 may be corrected by comparing the measured pressure range of the adjustment disk 370 with information (reference pressure range) stored in advance in the Lookup Table.
The reference pressure range not stored in advance in the lookup table can be calculated by interpolation (interpolation) or the like using adjacent reference pressure ranges stored in advance.
As described above, the pressure deviation is detected by comparing the measured pressure range of the conditioning disk 370 with the reference pressure range stored in advance in the lookup table, whereby the advantageous effect of correcting the pressure from the pressurizing portion 310 (the pressure of the conditioning polishing pad) more quickly and accurately can be obtained.
More preferably, the reference pressure range is stored based on the measured pressure range measured in the polishing pad 110 by means of the measuring part 330 according to the age of the conditioning disk 370. As described above, the reference pressure range is defined based on the measured pressure range measured in the polishing pad 110 performing the polishing pad 110 conditioning process, and thus the reference pressure range is defined based on the measured pressure range measured under the same conditions as those under which the actual conditioning process is performed, whereby the advantageous effects of improving the accuracy and reliability of the reference pressure range and correcting the pressure from the pressurization part 310 more accurately can be obtained.
According to another embodiment of the present invention, the reference pressure range may be calculated based on a measurement pressure range measured by a measurement unit (or other measurement device) at a position other than the polishing pad.
In addition, the regulator 300 includes an alarm generating part 420, and the alarm generating part 420 generates an alarm signal if a deviation between the measured pressure range and the reference pressure range exceeds the reference deviation range.
As one example, the alarm generating part 420 may generate an alarm signal if a deviation between the measured pressure range and the reference pressure range exceeds the reference deviation range to the extent that it is difficult to perform the pressure correction process of the regulator 300.
The alarm signal may include at least one of an audible alarm signal by a normal acoustic device and a visual alarm signal by a normal warning lamp, and may be other various alarm signals that enable the operator to recognize an abnormal condition of the regulator 300.
On the other hand, according to another embodiment of the present invention, the measuring part 330 may measure the pressure from the pressurizing part 310 even during the conditioning of the polishing pad 110.
As an example, the measuring part 330 is provided between the pressurizing part 310 and the rotating part 350, and measures the pressure while transmitting the pressure from the pressurizing part 310 to the rotating part 350.
More specifically, the measuring part 330 is selectively moved in the up-and-down direction by the pressurizing part 310, and contacts or is spaced apart from the upper end of the rotating part 350.
In the past, during the adjustment of the polishing pad, it was difficult to accurately measure the pressure of the adjustment disk pressing the polishing pad, and the pressure of the adjustment disk pressing the polishing pad could not be accurately controlled according to the surface height deviation of the polishing pad, so that there was a problem that the adjustment stability and efficiency of the polishing pad were low, and it was difficult to uniformly adjust the polishing pad as a whole.
However, the present invention has an advantageous effect that the measuring part 330 is provided between the pressurizing part 310 and the rotating part 350 such that the measuring part 330 measures the pressure while transmitting the pressure from the pressurizing part 310 to the rotating part 350, thereby accurately measuring and controlling the pressure of the pressing pad 110 by the adjustment disc 370 in the adjustment process.
The regulator 300 further includes a control unit 380, and the control unit 380 controls the pressure from the pressure unit 310 based on the signal measured by the measurement unit 330.
As an example, the control unit 380 may control the pressure from the pressurization unit 310 by comparing a target value (reference pressure range) to be introduced into the conditioner 300 with a measurement value (measurement pressure range) measured by the measurement unit 330 in accordance with the radial height deviation of the polishing pad 110.
Preferably, the control unit 380 controls the pressure from the pressurization unit 310 in real time while the conditioning process of the polishing pad 110 is performed.
That is, even if the surface of the polishing pad 110 is finely cut with a uniform pressure in the conditioning disk 370, if the distribution of the force applied to the polishing pad 110 for the substrate polishing process is not uniform, the surface height of the polishing pad 110 is not uniform in the radial direction. By controlling the pressure from the pressing part 310 in accordance with such a variation in the height of the polishing pad 110 in the radial direction, the amount of cutting by which the fine cutting is performed while the polishing pad 110 is pressed by the conditioning disk 370 can be adjusted, and thus, there can be obtained an advantageous effect that the slurry is uniformly supplied to the substrate while the entire surface of the polishing pad 110 is maintained at the same height in the polishing process of the substrate, even if there is a variation in the force in the radial direction of the polishing pad 110.
Accordingly, since the reforming effect of the conditioner 300 is uniform over the entire surface of the polishing pad 110, the amount of slurry flowing into the substrate does not vary locally, and the chemical mechanical polishing process of the substrate with more excellent quality can be advantageously performed.
Further, since the surface height of the polishing pad 110 can be measured in real time during the polishing process, and the pressure applied to the conditioning disk 370 can be varied in real time based on the information on the surface height measurement of the polishing pad 110 measured in real time, even if the surface height of the polishing pad 110 is not uniform during the polishing process, the surface of the polishing pad 110 can be maintained flat by controlling the pressure applied by the disk of the conditioner 300 in accordance with the surface height deviation of the polishing pad 110.
The adjustment process of the adjuster according to the present invention will be described below.
As an example, referring to fig. 12, before the conditioning process for the polishing pad 110 is performed, in a state where the conditioning disk 370 is in contact with the polishing pad 110, the pressure (conditioner pressure) applied to the conditioning disk 370 by the pressurization part 310 is measured by the measurement part 330 provided inside the conditioner head (S12).
When the deviation of the pressure measured by the measuring unit 330 (the deviation between the measured pressure range and the reference pressure range) is within the reference deviation range (S12), the pressure from the pressurizing unit 310 is corrected based on the deviation between the measured pressure range and the reference pressure range (S20). In contrast, if the pressure deviation measured by the measuring part 330 is out of the reference deviation range, an alarm signal is issued (S14).
After the pressure correction of the pressurization part 310, the adjustment process for the polishing pad 110 is performed using the corrected pressure (S30).
Further, even while the conditioning process of the polishing pad 110 is in progress, the pressure from the pressurization part 310 may be measured, and the pressure of the conditioner 300 may be controlled based on the measured signal (S40).
As described above, although the present invention has been described with reference to the preferred embodiments thereof, it will be understood by those skilled in the relevant art that various modifications and changes can be made without departing from the spirit and scope of the present invention as set forth in the appended claims.
Claims (21)
1. A conditioner for a grinding apparatus, comprising:
a conditioning disk for reconditioning the polishing pad;
a pressurizing portion for applying an axial pressure to the adjustment disk;
a measuring section provided between the pressurizing section and the adjustment disk, for measuring the pressure from the pressurizing section;
and a correcting unit that corrects the pressure from the pressurizing unit based on the signal measured by the measuring unit.
2. The conditioner for a grinding apparatus according to claim 1,
the measuring section measures the pressure from the pressurizing section at a stop position where the movement and rotation of the dial are stopped.
3. The conditioner for a grinding apparatus according to claim 2,
the correcting unit corrects the pressure from the pressure unit in a state where the conditioning disk is disposed on the polishing pad.
4. The conditioner for a grinding apparatus according to claim 1,
comprising a database in which reference pressure ranges of the regulating disc are stored,
the correcting unit corrects the pressure from the pressure section based on a deviation between the measured pressure range of the dial measured by the measuring unit and the reference pressure range.
5. The conditioner for a grinding apparatus according to claim 4,
the reference pressure range is stored in accordance with the service life of the conditioning disk, based on the measurement pressure range measured by the measuring unit in the polishing pad.
6. The conditioner for a grinding apparatus according to claim 4,
the pressure measuring device comprises an alarm generating part, and when the deviation between the measuring pressure range and the reference pressure range exceeds a reference deviation range, the alarm generating part sends out an alarm signal.
7. The conditioner for a grinding apparatus according to claim 1,
the correcting unit corrects the pressure from the pressure unit before the polishing pad is subjected to the conditioning step.
8. The conditioner for a grinding apparatus according to claim 1,
comprises a rotating part which is combined with the upper part of the adjusting disk and rotates the adjusting disk,
the pressurizing unit is provided on an upper portion of the rotating unit, and the measuring unit is provided between the pressurizing unit and the rotating unit, and measures the pressure while transmitting the pressure from the pressurizing unit to the rotating unit.
9. The conditioner for a grinding apparatus according to claim 8,
the measuring part is selectively moved in an up-and-down direction by the pressurizing part to contact the rotating part or be spaced apart from the rotating part.
10. The conditioner for a grinding apparatus according to claim 9,
includes a first coupler coupled to an upper portion of the rotary part,
when the measuring part is moved to a lower portion by means of the pressurizing part, the measuring part contacts the first coupler, the pressure is transmitted to the rotating part via the first coupler,
the measuring portion is spaced apart from the first coupler when the measuring portion moves to an upper portion by the pressing portion.
11. The conditioner for a grinding apparatus according to claim 10,
the rotating part includes:
a spline shaft coupled to the adjustment plate;
a bearing member coupled to the spline shaft so as to surround an outer periphery of the spline shaft, for supporting the first coupler,
the pressure transmitted to the first coupler is transmitted to the spline shaft via the bearing member.
12. The conditioner for a grinding apparatus according to claim 11,
the first coupler is continuously supported to the bearing member in a circumferential direction of the bearing member;
the pressure transmitted to the first coupler is transmitted to the spline shaft in a state dispersed in a ring shape along the bearing member.
13. The conditioner for a grinding apparatus according to claim 9,
a second coupler which is selectively moved in the up-down direction by the pressurizing part;
the measuring part is fixedly combined with the second coupler.
14. The conditioner for a grinding apparatus according to claim 13,
a guide hole is formed in the second coupler,
a guide boss is formed in the first coupler so as to be vertically movable and received in the guide hole.
15. The conditioner for a grinding apparatus according to claim 8,
the rotating part is provided with a disk support, and the adjusting disk is combined with the disk support.
16. The conditioner for a grinding apparatus according to claim 1,
the measuring part is a force transducer.
17. The conditioner for a grinding apparatus according to claim 1,
the pressing portion includes:
a cylinder main body formed with a pressure chamber;
and a piston member coupled to the measuring unit, attached to the cylinder main body, and movable in a vertical direction according to a pressure change of the pressure chamber.
18. The conditioner for a grinding apparatus according to claim 17,
the pressure chamber includes:
a first pressure chamber formed at a lower portion of the piston member;
a second pressure chamber formed at an upper portion of the piston member.
19. The conditioner for a grinding apparatus according to claim 18, comprising:
a first pressure adjusting portion that applies a uniform range of fixed pressure to the first pressure chamber;
and a second pressure adjusting portion that applies a varying pressure that is selectively changed to the second pressure chamber.
20. The conditioner for a grinding apparatus according to claim 19,
in a state where the fixed pressure is applied to the first pressure chamber,
the piston member moves up and down according to a pressure change of the change pressure applied to the second pressure chamber.
21. The conditioner for a grinding apparatus according to claim 1,
the measuring section measures the pressure from the pressurizing section during the conditioning of the polishing pad,
the pressure control device includes a control unit that controls the pressure from the pressurization unit based on a signal measured by the measurement unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180124025A KR20200043209A (en) | 2018-10-17 | 2018-10-17 | Conditioner of chemical mechanical polishing apparatus |
| KR10-2018-0124025 | 2018-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111055213A true CN111055213A (en) | 2020-04-24 |
Family
ID=70297229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811474030.0A Pending CN111055213A (en) | 2018-10-17 | 2018-12-04 | Regulator for grinding device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20200043209A (en) |
| CN (1) | CN111055213A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220176515A1 (en) * | 2020-12-03 | 2022-06-09 | Changxin Memory Technologies, Inc. | Force measurement system |
| US20230304877A1 (en) * | 2020-12-03 | 2023-09-28 | Changxin Memory Technologies, Inc. | Force measurement system and force measurement method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201544116U (en) * | 2009-12-15 | 2010-08-11 | 上海华虹Nec电子有限公司 | GMP grinding device |
| CN207120114U (en) * | 2017-01-31 | 2018-03-20 | 凯斯科技股份有限公司 | Substrate board treatment |
| CN207290112U (en) * | 2017-07-03 | 2018-05-01 | 株式会社安川电机 | Robot grinding system, robot system, lapping device, Acetabula device, driving part and Pressure generator |
| CN207534614U (en) * | 2017-01-31 | 2018-06-26 | 凯斯科技股份有限公司 | The adjuster of chemical-mechanical polishing device |
-
2018
- 2018-10-17 KR KR1020180124025A patent/KR20200043209A/en not_active Application Discontinuation
- 2018-12-04 CN CN201811474030.0A patent/CN111055213A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201544116U (en) * | 2009-12-15 | 2010-08-11 | 上海华虹Nec电子有限公司 | GMP grinding device |
| CN207120114U (en) * | 2017-01-31 | 2018-03-20 | 凯斯科技股份有限公司 | Substrate board treatment |
| CN207534614U (en) * | 2017-01-31 | 2018-06-26 | 凯斯科技股份有限公司 | The adjuster of chemical-mechanical polishing device |
| CN207290112U (en) * | 2017-07-03 | 2018-05-01 | 株式会社安川电机 | Robot grinding system, robot system, lapping device, Acetabula device, driving part and Pressure generator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220176515A1 (en) * | 2020-12-03 | 2022-06-09 | Changxin Memory Technologies, Inc. | Force measurement system |
| US20230304877A1 (en) * | 2020-12-03 | 2023-09-28 | Changxin Memory Technologies, Inc. | Force measurement system and force measurement method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20200043209A (en) | 2020-04-27 |
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