CN201509184U - Plate-type quartz crystal frequency device of ceramic packaging - Google Patents
Plate-type quartz crystal frequency device of ceramic packaging Download PDFInfo
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- CN201509184U CN201509184U CN2009201529318U CN200920152931U CN201509184U CN 201509184 U CN201509184 U CN 201509184U CN 2009201529318 U CN2009201529318 U CN 2009201529318U CN 200920152931 U CN200920152931 U CN 200920152931U CN 201509184 U CN201509184 U CN 201509184U
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- frequency device
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Abstract
The utility model relates to a plate-type quartz crystal frequency device of ceramic packaging. The frequency device comprises an upper cover plate, a lower cover plate and a wafer, wherein the wafer is located in a dent of the lower cover plate, the length and the width of the lower cover plate are bigger than the length and the width of the wafer, the depth of the dent of the lower cover plate is bigger than the thickness of the wafer, and the frequency device further comprises an inner electrode and an outer electrode. The plate-type quartz crystal frequency device of ceramic packaging not only has simple structure, small size and excellent air impermeability, but also is reliable, and the method for manufacturing the frequency device not only is simple, but also has low manufacture cost and high efficiency.
Description
Technical field
The utility model relates to a kind of crystal frequency device, is specifically related to a kind of sheet type quartz crystal frequency device of ceramic packaging.
Background technology
At present, quartz crystal frequency device is widely used in fields such as communication, TV, digital product and industrial automation, is used to produce the time-base oscillation frequency or carries out frequency-selecting.
Quartz crystal frequency device is to utilize quartz crystal under the effect of alternating electric field, and the principle that can produce mechanical oscillation is made.Therefore, it can not be subjected to the influence of outside electromagnetic interference.In use, do not need, carry out complicated shielding for preventing electromagnetic interference as other frequency elements.To the miniaturization of electronic product, integrated quite positive meaning arranged.
Because quartz-crystal unit is to carry out work by the mode of mechanical oscillation.Therefore, it must have an oscillation space, just the vibration cavity of our said quartz crystal frequency device.Existing more advanced quartz crystal frequency device is that the applicant applies for that on November 23rd, 2004 " monolithic sheet style quartz crystal frequency device and manufacture method thereof " (application number is: 200410084466.0), but be used for from actual making, because the length of its lower cover pit is less than the length of wafer, there are following two big problems in the product of this pattern:
When 1, producing in enormous quantities, in a glue last slice (placement wafer) process, because in plane operations, so wafer can not accurately be located; The part wafer places the back offset or situation such as crooked all has generation, causes the obvious decline of operation qualification rate.
2, when sheet encapsulates, adhesive can leak out and extend near the wafer even cling wafer from the junction of upper cover plate and lower cover sometimes, thereby influences the end product quality of product.
The utility model content
Technical problem to be solved in the utility model provides a kind of sheet type quartz crystal frequency device of ceramic packaging.Not only product size is little for this sheet type quartz crystal frequency device, air-tightness is good, and low cost of manufacture, efficient height.
For solving the problems of the technologies described above, a kind of sheet type quartz crystal frequency device of ceramic packaging, comprise upper cover plate, lower cover and wafer, have the lower cover pit in the inboard of lower cover, wafer is fixed in the lower cover pit with conducting resinl, the cavity of this frequency device is made up of upper cover plate, lower cover pit, and the length of lower cover pit and width are greater than the length and the width of wafer, and the degree of depth of lower cover pit is greater than wafer thickness; Electrode and external electrode in this frequency device also comprises simultaneously, external electrode is positioned on the lower cover lateral surface, and interior electrode is positioned at the pit both sides of lower cover medial surface.
The sheet type quartz crystal frequency device of described ceramic packaging, the termination seamed edge of described frequency device is equipped with circular arc chamfering, draws the back with electrode in guaranteeing and is connected reliably with external electrode; Simultaneously, the length and width size of upper cover plate and lower cover is in full accord, and relative position overlaps fully.
The sheet type quartz crystal frequency device of described ceramic packaging has the upper cover plate pit on the upper cover plate of described this frequency device; The length of upper cover plate pit and width are greater than the length and the width of lower cover pit.
The sheet type quartz crystal frequency device of described ceramic packaging, described lower cover pit comprise pit and following pit, and the length of described upward pit and width are greater than the length and the width of following pit.
The sheet type quartz crystal frequency device of described ceramic packaging has the support of two place's projections in the described down pit, the height of this support is less than the degree of depth of pit down, and the distance of stent length direction is less than quartz wafer length.
The sheet type quartz crystal frequency device of described ceramic packaging, the electrode place is provided with the electrode pit in this frequency device lower cover inboard, prints the additional interior electrode of preparation with silver-colored slurry in the electrode pit, and the degree of depth of electrode pit is not less than the thickness of additional interior electrode.
The sheet type quartz crystal frequency device of described ceramic packaging, described lower cover is formed by a base plate and orifice plate bonding, and through hole and base plate in the middle of the orifice plate constitute the lower cover pit jointly.
The sheet type quartz crystal frequency device of described ceramic packaging, middle part surface is provided with inside recess, is provided with the anti-overflow pit all around in the described lower cover; The length of described inside recess and width are less than the length and the width of quartz wafer, and the anti-overflow pit is round quartz wafer; Also be provided with the electrode pit on the outer fix of the anti-overflow pit of lower cover simultaneously, electrode in the useful silver slurry printing preparation in the electrode pit, the thickness of electrode in the degree of depth of electrode pit is not less than.
Because frequency device of the present utility model adopts special structure design, utilize the pit of upper and lower cover plate or the pit of upper cover plate and lower cover to form cavity, the length of lower cover pit and width are greater than the length and the width of wafer, and the degree of depth of lower cover pit is 2-3 a times of wafer thickness; The big ceramic substrate that employing has pit substitutes the little base of ceramic that has support, avoided making the base of ceramic that has support one by one, saved the sticking required expensive equipment investment of small cap one by one, not only improved efficient, and reduced cost.In addition, the utility model becomes length greater than wafer with the Design of length of lower cover, makes that wafer all carries out in the lower cover pit on the invocation point glue, guarantees that so last slice location accurately, improved the operation qualification rate.So owing to adopted this monolithic structure product can do very thinly, minimum thickness can reach 0.8mm; With the method for vacuum evaporation, make extraction electrode at the cutting end face of product and contact well with inside and outside electrode and fuse, guaranteed reliability of products and, guaranteed that the air-tightness of product is not damaged without undergoing high temperature.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and embodiments:
Fig. 1 is embodiment 1 profile of frequency device described in the utility model;
Fig. 2-1 to Fig. 2-3 be frequency device preparation method schematic diagram described in the utility model; Wherein Fig. 2-1a is that lower cover end view, Fig. 2-1c are the lower cover rearview for stand-by lower cover front view, Fig. 2-1b in preparation back; Fig. 2-2a is the compound schematic diagram of two-layer structure, and Fig. 2-2b is the compound schematic diagram of three-decker; Fig. 2-3 draws schematic diagram in the termination;
Fig. 3 is embodiment 2 schematic diagrames of frequency device of the present utility model;
Fig. 4 is embodiment 3 schematic diagrames of frequency device of the present utility model;
Fig. 5 is embodiment 4 schematic diagrames of frequency device of the present utility model;
Fig. 6 is embodiment 5 schematic diagrames of frequency device of the present utility model;
Fig. 7 is embodiment 6 schematic diagrames of frequency device of the present utility model;
Fig. 8 is embodiment 7 schematic diagrames of frequency device of the present utility model;
Fig. 9 is described orifice plate schematic diagram.
Embodiment
As shown in Figure 1, a kind of sheet type quartz crystal frequency device of ceramic packaging, comprise upper cover plate 1, lower cover 2 and wafer 3, have lower cover pit 5 in the inboard of lower cover 2, wafer 3 is fixed in lower cover 2 pits with conducting resinl 7, the cavity of this frequency device is made up of upper cover plate 1, lower cover pit 5, and the length of lower cover pit 5 and width are greater than the length and the width of wafer 3, and the degree of depth of lower cover pit 5 is greater than wafer 3 thickness; Electrode 8 and external electrode 10 in this frequency device also comprises simultaneously, external electrode 10 is positioned on lower cover 2 lateral surfaces, and interior electrode 8 is positioned at the pit both sides of lower cover 2 medial surfaces.
Among the embodiment 1 of the present utility model, the sheet type quartz crystal frequency device of described ceramic packaging, the seamed edge everywhere of the upper and lower cover plate 1,2 of described frequency device is equipped with rounded corner, draws the back with electrode 8 in guaranteeing and is connected reliably with external electrode 9; Simultaneously, the length and width size of upper cover plate 1 and lower cover 2 is in full accord, and relative position overlaps fully.
See also Fig. 2, the concrete steps of the manufacture method of present embodiment are as follows:
On all four potsherd is stand-by as upper and lower cover plate 1,2 respectively, is specially:
(1) according to the product plane dimensional requirement, make two on all four potsherds of length and width size, wherein a slice is stand-by as upper cover plate 1;
(2) a slice is as lower cover 2 in addition, and one side goes up and forms m*n array lower cover pit 5 therein, wherein, and m 〉=1, n 〉=1;
(3) do not have pit face printed silver slurry in above-mentioned ceramic lower cover 2 outsides, form external electrode 10 behind the sintering;
(4) electrode 8 is stand-by in there is the preparation of pit face the inboard of ceramic lower cover 2;
(1) wafer 3 usefulness conducting resinls 7 is adhered to respectively on m * n the position in the lower cover pit 5;
(2) glue wafer 3 after, press the product requirement on electric performance, the resonance frequency of m * n locational wafer 3 is adjusted respectively, make frequency accuracy meet the product requirement on electric performance;
(3) after the heating and pressurizing, form upper and lower cover plate 1,2 coherent composite sheet;
Embodiment 2:
As shown in Figure 3, in order to strengthen the vibration cavity, have upper cover plate pit 4 on the upper cover plate of described this frequency device; The length of upper cover plate pit 4 and width are greater than the length and the width of lower cover pit 5.
Then this embodiment manufacture method in, step 1 also comprises: utilize blasting method upper cover plate 1 to be made the ceramic upper cover plate of a slice band m * n array pit;
In order to increase the oscillation space of wafer 3 belows, the described lower cover pit 5 of the quartz crystal frequency device of present embodiment comprises pit 51 and following pit 52, and the length of described upward pit 51 and width are greater than the length and the width (see figure 4) of following pit 52.
Then in the manufacture method of the sheet type quartz crystal frequency device of described ceramic packaging, lower cover 2 is made and is included in lower cover and forms pit as behind the pit 52 down in the described step 1 they (2), forms one once more and goes up pit 51.
See also Fig. 5, a prioritization scheme as embodiment 3, the support 11 that two place's projections are arranged in the following pit 52 of the sheet type quartz crystal frequency device of described ceramic packaging, the height of this support 11 is less than the degree of depth of following pit 52, and the distance of support 11 length directions is less than wafer 3 length.
Then in the preparation, described step 1 they (2) except that embodiment 3 comprised institute in steps, comprise also that simultaneously at lower cover 2 each forms the support 11 of two projections down in pit 52.
See also Fig. 6 again, in order to increase the internal and external electrode connection reliability, electrode places are provided with electrode pit 6 in these frequency device lower cover 2 inboards, print the additional interior electrode 9 of preparation with silver-colored slurry in the electrode pit 6, and the degree of depth of electrode pit 6 is not less than the thickness of additional interior electrode 9.
Therefore, described preparation method's step 1 also comprises: electrode 8 places establish electrode pit 6 in lower cover 2, print the additional interior electrode 9 of preparation with silver-colored slurry in the electrode pit 6, and the degree of depth of electrode pit 6 is not less than the thickness of additional interior electrode 9.
As the modification of the foregoing description, see also Fig. 7 and in conjunction with Fig. 9, described lower cover 2 is formed by dull and stereotyped 21 and one orifice plate, 22 bondings, and the through holes in the middle of the orifice plate 22 and dull and stereotyped 21 constitute lower cover pits 5 jointly.
The manufacture method of the sheet type quartz crystal frequency device of described ceramic packaging then, they (2) of described step 1 are made the orifice plate 22 and dull and stereotyped 21 and both are bonded together formation lower cover 2 of m * n through hole of a band.
As the sheet type quartz crystal frequency device of the described ceramic packaging of the prioritization scheme of embodiment 6 (see Fig. 8 and with reference to figure 9), middle part surfaces are provided with inside recess 12, are provided with anti-overflow pit 13 all around in described dull and stereotyped 21; The length of described inside recess 12 and width are less than the length and the width of wafer 3, and anti-overflow pit 12 is round wafer 3; Also be provided with electrode pit 6 on the outer fix of the anti-overflow pit 13 of lower cover 2 simultaneously, electrode 8 in the useful silver slurry printing preparation in the electrode pit 6, the thickness of electrode 8 in the degree of depth of electrode pit 6 is not less than.
The manufacture method of the sheet type quartz crystal frequency device of described ceramic packaging, described step 1 also are included in and form inside recess 12, anti-overflow pit 13 and electrode pit 6 in the lower cover pit 5; Printed silver slurry in above-mentioned ceramic lower cover 2 outsides and medial electrode pit 6 forms external electrode 10 and additional interior electrode 9 respectively behind the sintering.
Claims (8)
1. the sheet type quartz crystal frequency device of a ceramic packaging, comprise upper cover plate, lower cover and wafer, have the lower cover pit in the inboard of lower cover, wafer is fixed in the lower cover pit with conducting resinl, the cavity that it is characterized in that this frequency device is made up of upper cover plate, lower cover pit, the length of lower cover pit and width are greater than the length and the width of wafer, and the degree of depth of lower cover pit is greater than wafer thickness; Electrode and external electrode in this frequency device also comprises simultaneously, external electrode is positioned on the lower cover lateral surface, and interior electrode is positioned at the pit both sides of lower cover medial surface.
2. the sheet type quartz crystal frequency device of ceramic packaging according to claim 1 is characterized in that, the length and width size of the upper cover plate of described frequency device and lower cover is in full accord, and relative position overlaps fully; Simultaneously, the termination seamed edge of frequency device is equipped with circular arc chamfering, draws the back with electrode in guaranteeing and is connected reliably with external electrode.
3. the sheet type quartz crystal frequency device of ceramic packaging according to claim 1 is characterized in that, has the upper cover plate pit on the upper cover plate of described this frequency device; The length of upper cover plate pit and width are greater than the length and the width of lower cover pit.
4. the sheet type quartz crystal frequency device of ceramic packaging according to claim 1 is characterized in that, described lower cover pit comprises pit and following pit, and the length of described upward pit and width are greater than the length and the width of following pit.
5. the sheet type quartz crystal frequency device of ceramic packaging according to claim 4 is characterized in that, the support of two place's projections is arranged in the described pit down, and the height of this support is less than the degree of depth of following pit, and the distance of stent length direction is less than quartz wafer length.
6. the sheet type quartz crystal frequency device of ceramic packaging according to claim 4, it is characterized in that, the electrode place is provided with the electrode pit in this frequency device lower cover inboard, prints the additional interior electrode of preparation with silver-colored slurry in the electrode pit, and the degree of depth of electrode pit is not less than the thickness of additional interior electrode.
7. the sheet type quartz crystal frequency device of ceramic packaging according to claim 1 is characterised in that, described lower cover is formed by a base plate and orifice plate bonding, and through hole and base plate in the middle of the orifice plate constitute the lower cover pit jointly.
8. the sheet type quartz crystal frequency device of ceramic packaging according to claim 7 is characterised in that, middle part surface is provided with inside recess, is provided with the anti-overflow pit all around in the described lower cover; The length of described inside recess and width are less than the length and the width of quartz wafer, and the anti-overflow pit is round quartz wafer; Also be provided with the electrode pit on the outer fix of the anti-overflow pit of lower cover simultaneously, electrode in the useful silver slurry printing preparation in the electrode pit, the thickness of electrode in the degree of depth of electrode pit is not less than.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201529318U CN201509184U (en) | 2008-05-28 | 2009-05-20 | Plate-type quartz crystal frequency device of ceramic packaging |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810038150.6 | 2008-05-28 | ||
| CN2009201529318U CN201509184U (en) | 2008-05-28 | 2009-05-20 | Plate-type quartz crystal frequency device of ceramic packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201509184U true CN201509184U (en) | 2010-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201529318U Expired - Fee Related CN201509184U (en) | 2008-05-28 | 2009-05-20 | Plate-type quartz crystal frequency device of ceramic packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201509184U (en) |
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2009
- 2009-05-20 CN CN2009201529318U patent/CN201509184U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100616 Termination date: 20120520 |