CN201456501U - Polymethylpentene film coated with mold releasing agent - Google Patents
Polymethylpentene film coated with mold releasing agent Download PDFInfo
- Publication number
- CN201456501U CN201456501U CN2009201332117U CN200920133211U CN201456501U CN 201456501 U CN201456501 U CN 201456501U CN 2009201332117 U CN2009201332117 U CN 2009201332117U CN 200920133211 U CN200920133211 U CN 200920133211U CN 201456501 U CN201456501 U CN 201456501U
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- CN
- China
- Prior art keywords
- polymethylpentene film
- mould release
- base material
- polymethylpentene
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Laminated Bodies (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model relates to a polymethylpentene film coated with a mold releasing agent, comprising a polymethylpentene film base material; and at least one surface of the polymethylpentene film base material is coated with the mold releasing agent. The polymethylpentene film has the advantages of high-temperature resistance, good mold-releasing performance and low cost, can be used for being laminated with circuit boards at the temperature higher than 200 DEG C and is easy to be separated from the circuit boards after being laminated.
Description
[technical field]
The utility model relates to laminar product, particularly relates to comprising the product with different physical properties thin layer basically, relates in particular to the poly-methyl pentene film of used coating mould release when being used for circuit board pressing.
[background technology
The prior art circuits plate need be used a kind of mould release membrance when its blind hole plate pressing, it mainly is to prevent that resin from flowing to wiring board plate face from the hole that this mould release membrance is used for the circuit board pressing, promptly plays the effect of resistance glue; And after this mould release membrance and the circuit board pressing, need again to be easy to separate with circuit board, promptly need release performance better.The used mould release membrance of prior art circuits plate comprises PET (polyethylene terephthalate, PET) mould release membrance, fluoroplastic film such as PTFE (polytetrafluoro efhylene, polytetrafluoroethylene (PTFE), i.e. Teflon) film and polymethylpentene film, wherein:
One, the release performance of PET mould release membrance is better, but following shortcoming is arranged: 1. need at high temperature to solidify, and easy deformation when solidifying, cause change in size bigger; 2. the tolerant pressing-in temp of institute is lower, and is promptly aging rapidly about 200 ℃, easily fragmentation after the pressing; This PET mould release membrance only is suitable for the flexible PCB pressing that temperature is lower than 200 ℃;
Two, fluoroplastic film such as Teflon film is mainly used in temperature and is higher than 200 ℃ circuit board pressing, but too expensive, the cost height;
Three, polymethylpentene film, better performances can be high temperature resistant, also is not easy to wear out even temperature reaches 220 ℃, can be used for the circuit board pressing that temperature is higher than 200 ℃, but its release performance is relatively poor, is difficult to after the pressing separate with circuit board.
[utility model content]
The technical problems to be solved in the utility model is to avoid above-mentioned the deficiencies in the prior art part and a kind of polymethylpentene film that applies mould release is provided, and this polymethylpentene film energy is high temperature resistant, release performance good and cost is low.
The technical scheme that the utility model solve the technical problem employing is:
A kind of polymethylpentene film that applies mould release is provided, comprises the polymethylpentene film base material; Described polymethylpentene film base material has had a surface applied at least mould release.
As a kind of preferred embodiment of the present utility model, described polymethylpentene film base material two surfaces have all applied mould release.
Above-mentioned mould release is siliceous mould release.
Above-mentioned polymethylpentene film base material 10 is poly(4-methyl-1-pentene) films.
Compare with prior art, the beneficial effect of the polymethylpentene film of the utility model coating mould release is:
By at polymethylpentene film surface applied one deck mould release, obtained a kind of polymethylpentene film that applies mould release, the polymethylpentene film of this coating mould release had both kept the resistance to elevated temperatures of former polymethylpentene film, had improved release performance again; Solve the PET mould release membrance and be not suitable for the problem of circuit board pressing at high temperature, and caused the high problem of cost after using fluoroplastic film such as Teflon film when having solved the circuit board pressing; The polymethylpentene film of described coating mould release has advantage high temperature resistant, that release performance good and cost is low, can be used for the circuit board pressing that temperature is higher than 200 ℃, separates with circuit board easily after the pressing.
[description of drawings]
Fig. 1 is the orthographic projection master cross-sectional schematic of the polymethylpentene film of a kind of preferred embodiment coating of the utility model mould release;
Fig. 2 is the orthographic projection master cross-sectional schematic of the polymethylpentene film of the another kind of preferred embodiment coating of the utility model mould release.
[specific embodiment]
Below in conjunction with each accompanying drawing the utility model is described in further detail.
Referring to Fig. 1 and Fig. 2, a kind of polymethylpentene film that applies mould release comprises polymethylpentene film base material 10; Described polymethylpentene film base material 10 has had a surface applied at least mould release 20.The English name of polymethylpentene film is polymethylpentene film.
As a kind of preferred embodiment of the present utility model, referring to Fig. 2,10 liang of surfaces of described polymethylpentene film base material have all applied mould release 20.
Described mould release is siliceous mould release, as a kind of siloxanes (English name: siloxane), a kind of polysiloxanes (English name: polysiloxane).
Above-mentioned polymethylpentene film base material 10 is poly(4-methyl-1-pentene) film (English names: base material poly4-methyl-1-pentene film).
Can adopt a kind of roller at the very thin siliceous mould release 20 of described polymethylpentene film base material 10 surface applied one decks, and solidify the several seconds below 100 ℃ in temperature, make this mould release 20 be fixed on described polymethylpentene film base material 10 surfaces, obtained a kind of polymethylpentene film that applies mould release, the polymethylpentene film of this coating mould release had both kept the resistance to elevated temperatures of former polymethylpentene film, improved release performance again, and described polymethylpentene film base material 10 low prices, the price of the polymethylpentene film of coating mould release is also cheap.
The above embodiment has only expressed preferred implementation of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim; Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection domain of the present utility model; Therefore, all equivalents and modifications of being done with the utility model claim scope all should belong to the covering scope of the utility model claim.
Claims (3)
1. a polymethylpentene film that applies mould release comprises polymethylpentene film base material (10); It is characterized in that:
Described polymethylpentene film base material (10) has had a surface-coated at least mould release (20).
2. the polymethylpentene film of coating mould release according to claim 1 is characterized in that:
Described polymethylpentene film base material (10) two surfaces have all applied mould release (20).
3. the polymethylpentene film of coating mould release according to claim 1 and 2 is characterized in that:
Described polymethylpentene film base material (10) is the poly(4-methyl-1-pentene) film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201332117U CN201456501U (en) | 2009-06-23 | 2009-06-23 | Polymethylpentene film coated with mold releasing agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201332117U CN201456501U (en) | 2009-06-23 | 2009-06-23 | Polymethylpentene film coated with mold releasing agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201456501U true CN201456501U (en) | 2010-05-12 |
Family
ID=42383854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201332117U Expired - Lifetime CN201456501U (en) | 2009-06-23 | 2009-06-23 | Polymethylpentene film coated with mold releasing agent |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201456501U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106003706A (en) * | 2014-10-28 | 2016-10-12 | 全谱激光器有限公司 | Elease liner/layer, system and method of using the same with additive manufacturing |
| CN111993734A (en) * | 2019-05-27 | 2020-11-27 | 宁波长阳科技股份有限公司 | High-temperature-resistant release film and preparation method thereof |
-
2009
- 2009-06-23 CN CN2009201332117U patent/CN201456501U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106003706A (en) * | 2014-10-28 | 2016-10-12 | 全谱激光器有限公司 | Elease liner/layer, system and method of using the same with additive manufacturing |
| CN111993734A (en) * | 2019-05-27 | 2020-11-27 | 宁波长阳科技股份有限公司 | High-temperature-resistant release film and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100512 |
|
| CX01 | Expiry of patent term |