WO2008126523A1 - Film forming composition for nanoimprinting, process for production of structures, and structures - Google Patents

Film forming composition for nanoimprinting, process for production of structures, and structures Download PDF

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Publication number
WO2008126523A1
WO2008126523A1 PCT/JP2008/053988 JP2008053988W WO2008126523A1 WO 2008126523 A1 WO2008126523 A1 WO 2008126523A1 JP 2008053988 W JP2008053988 W JP 2008053988W WO 2008126523 A1 WO2008126523 A1 WO 2008126523A1
Authority
WO
WIPO (PCT)
Prior art keywords
structures
production
forming composition
mold
nanoimprinting
Prior art date
Application number
PCT/JP2008/053988
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshiyuki Takeuchi
Kiyoshi Ishikawa
Original Assignee
Tokyo Ohka Kogyo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007091695A external-priority patent/JP4963254B2/en
Priority claimed from JP2007227089A external-priority patent/JP2009056736A/en
Priority claimed from JP2007227090A external-priority patent/JP2009056737A/en
Application filed by Tokyo Ohka Kogyo Co., Ltd. filed Critical Tokyo Ohka Kogyo Co., Ltd.
Publication of WO2008126523A1 publication Critical patent/WO2008126523A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y5/00—Nanobiotechnology or nanomedicine, e.g. protein engineering or drug delivery
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Abstract

The invention provides a film-forming composition for nanoimprinting which permits high-precision pattern transfer from a mold and is excellent in the close adhesion to a substrate and the peelability of a mold; a process for the production of structures which brings about an efficient and effective improvement in the thermal stability of structures; a process for the production of structures which makes it possible to obtain a structure even at a relatively low pressing pressure; and structures obtained by the processes. It is preferable either to use a silsesquioxane resin comprising specific constituent units as the film-forming composition or to incorporate a low-molecular-weight siloxane resin having a mass-average molecular weight of 300 to 5000 into the composition. Further, after the peeling of a mold in the production of a structure, it is preferable to irradiate the resin layer with ultraviolet light under a reduced pressure.
PCT/JP2008/053988 2007-03-30 2008-03-05 Film forming composition for nanoimprinting, process for production of structures, and structures WO2008126523A1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-091695 2007-03-30
JP2007091695A JP4963254B2 (en) 2007-03-30 2007-03-30 Film-forming composition for nanoimprint, structure manufacturing method and structure
JP2007227089A JP2009056736A (en) 2007-08-31 2007-08-31 Method of producing structure, and structure
JP2007-227089 2007-08-31
JP2007227090A JP2009056737A (en) 2007-08-31 2007-08-31 Method of producing structure, and structure
JP2007-227090 2007-08-31

Publications (1)

Publication Number Publication Date
WO2008126523A1 true WO2008126523A1 (en) 2008-10-23

Family

ID=39863681

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053988 WO2008126523A1 (en) 2007-03-30 2008-03-05 Film forming composition for nanoimprinting, process for production of structures, and structures

Country Status (3)

Country Link
KR (1) KR20090117947A (en)
TW (1) TW200838939A (en)
WO (1) WO2008126523A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110780363A (en) * 2018-07-30 2020-02-11 佳能株式会社 Resin article, method of manufacturing resin article, interchangeable lens, and optical apparatus
WO2024043000A1 (en) * 2022-08-26 2024-02-29 住友化学株式会社 Layered body and method for producing same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415736B (en) * 2009-04-10 2013-11-21 Japan Science & Tech Agency Pattern formation method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09274319A (en) * 1996-04-02 1997-10-21 Shin Etsu Chem Co Ltd Chemical amplification positive type resist material
JP2002184719A (en) * 2000-12-19 2002-06-28 Matsushita Electric Ind Co Ltd Method of forming pattern

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09274319A (en) * 1996-04-02 1997-10-21 Shin Etsu Chem Co Ltd Chemical amplification positive type resist material
JP2002184719A (en) * 2000-12-19 2002-06-28 Matsushita Electric Ind Co Ltd Method of forming pattern

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110780363A (en) * 2018-07-30 2020-02-11 佳能株式会社 Resin article, method of manufacturing resin article, interchangeable lens, and optical apparatus
US11485052B2 (en) 2018-07-30 2022-11-01 Canon Kabushiki Kaisha Resin product, method of making resin product, interchangeable lens, and optical device
WO2024043000A1 (en) * 2022-08-26 2024-02-29 住友化学株式会社 Layered body and method for producing same

Also Published As

Publication number Publication date
KR20090117947A (en) 2009-11-16
TW200838939A (en) 2008-10-01

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