CN201434236Y - Fixture formed by light-emitting diodes - Google Patents

Fixture formed by light-emitting diodes Download PDF

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Publication number
CN201434236Y
CN201434236Y CN2009200706090U CN200920070609U CN201434236Y CN 201434236 Y CN201434236 Y CN 201434236Y CN 2009200706090 U CN2009200706090 U CN 2009200706090U CN 200920070609 U CN200920070609 U CN 200920070609U CN 201434236 Y CN201434236 Y CN 201434236Y
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China
Prior art keywords
light
module
light source
protection cavity
chip
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Expired - Fee Related
Application number
CN2009200706090U
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Chinese (zh)
Inventor
张栋楠
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Individual
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Individual
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Priority to CN2009200706090U priority Critical patent/CN201434236Y/en
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Publication of CN201434236Y publication Critical patent/CN201434236Y/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a fixture formed by light-emitting diodes, which is provided with a circuit and a cooling device, wherein a light source module is provided with a chip and a module protection cavity. The module protection cavity is suitable for protecting the light source module with a large area, and the structure of the module protection cavity with a large area for covering the light source module with the large area is simple. The chip on the light source module does not need to be encapsulated and can be directly exposed in the module protection cavity. When the utility modelis manufactured into a fixture with high power, not only the structure of the light source module can be simplified, but also the manufacturing cost of the product can be facilitated to be lowered.

Description

A kind of Light-Emitting Diode light fixture
Technical field
The utility model relates to the light emitting diode that electricity field uses, and especially relates to a kind of light fixture that is made of light emitting diode.
Background technology
Owing to having advantage low in energy consumption, that brightness is high, light emitting diode obtained using widely.In order to improve the illuminating area of light-emitting diodes, often will be integrated and constitute high power light source with a plurality of Light-Emitting Diodes.
Existing integration mode mainly contains 3 kinds: 1, be encapsulated as pinned or SMD formula LED earlier, again array structure made in this encapsulation; 2, be made into 1 watt to several watts high-power packaging body earlier, again with this packaging array combination with heat sink and circuit; 3, directly with the Light-Emitting Diode chip array on base plate, form power number watt high power module to hectowatt.Though the Light-Emitting Diode light fixture adopts these structures can obtain high power light source.But the production link of this class Light-Emitting Diode light fixture is many, and complex process is unfavorable for reducing the manufacturing cost of product, especially when doing the secondary optics design, is unfavorable for reducing manufacture difficulty and manufacturing cost.
Summary of the invention
At the deficiencies in the prior art, the purpose of this utility model provides a kind of Light-Emitting Diode light fixture, and it not only is fit to make high power light source, but also has simplified the structure of traditional great power LED lamp.
The purpose of this utility model is achieved in that a kind of Light-Emitting Diode light fixture, comprises circuit and cooling device, and light source module has chip, and light source module has the module protection cavity.
On the basis of technique scheme, the utility model also has following further scheme:
Described chip is positioned at the module protection cavity.
Described module protection cavity is the hermetically-sealed construction cavity.
Described hermetically-sealed construction cavity is an inflatable structure.
Described protection cavity has lens.
Described chip is the ultraviolet light-emitting diodes chip.
Advantage of the present utility model is as follows:
Because light fixture comprises circuit and cooling device, light source module has chip, and light source module has the module protection cavity; The module protection cavity is fit to the large tracts of land light source module is protected, and the structure that large-area module protection cavity covers the large tracts of land light source module is simpler.As, the chip on the light source module need not encapsulation and can directly expose in the module protection cavity.When the utility model was made large-power lamp, not only the structure of light source module can obtain simplifying, but also helped reducing the manufacturing cost of product.
Description of drawings
Fig. 1 is the part exploded view of rectangular shaped light source module;
Fig. 2 is the part exploded view of sectored light source module.
The specific embodiment
Below in conjunction with accompanying drawing in detail embodiment of the present utility model is described in detail:
Referring to Fig. 1.A kind of Light-Emitting Diode light fixture comprises circuit and cooling device, and light source module is made of substrate 10, circuit and chip 11; Light source module has the module protection cavity, and the module protection cavity is a rectangular module protection cavity 3.Light source module can be en-block construction or polylith combining structure.4 light source module combinations can be formed the larger area light source.Circuit comprises power supply module and the circuit that is connected chip 11, and the power supply module uses prior art.Chip 11 quantity on the substrate 10 can be determined as required.As, chip 11 quantity on the substrate 10 are 36.36 chips 11 on the substrate 10 are the light-emitting diode chip for backlight unit that do not encapsulate, i.e. the light-emitting diode chip for backlight unit of exposed structure.
Referring to Fig. 1.4 blocks of large-area light sources of light source module one-tenth capable of being combined.Cooling device uses prior art.Cooling device can use water-cooling structure or air-cooled structure, or the heat pipe for thermal conductivity mode, or fin etc.The large tracts of land light source that 4 light source modules are combined into is installed in the top 9 of shell 4, and cooling device 5 and temperature sensor 6 are arranged in the shell 4, and temperature sensor 6 circuit connect power supply module and chip 11 circuit through control circuit.The binding post of temperature sensor 6 can be installed on the cooling device 5.When cooling device 5 is water-cooling structure, water inlet pipe 7 and outlet pipe 8 are arranged on the cooling device 5.
Referring to Fig. 1.Described chip 11 is positioned at the module protection cavity.Rectangular module protection cavity 3 is installed on substrate 10.Rectangular module protection cavity 3 uses transparent plastic material manufacturing, and rectangular module protection cavity 3 has cavity 2, and Feng Zhuan chip 11 is not exposed in the cavity 2.Rectangular module protection cavity 3 both can have been made the structure that covers 4 substrates 10, and 1 rectangular module protection cavity 3 also can be installed on every substrate 10.
Rectangular module protection cavity 3 forms sealing with substrate 10 by fluid sealant and combines, and promptly described module protection cavity is the hermetically-sealed construction cavity.In case of necessity, also can charge into the inert gas that shields in rectangular module is protected cavity 3, promptly described hermetically-sealed construction cavity is an inflatable structure.Inert gas can be helium, neon, argon, nitrogen.
Referring to Fig. 2.Light source module can be made suitable shape according to customer requirements.As, light source module is made 203,6 conglobate surface of light sources of sectored light source module 203 capable assemblings of sectored light source module, and 6 sectored light source modules 203 are installed in the top 204 of circular box 205.In the circular box 205 cooling device 5 and temperature sensor 6 are arranged, temperature sensor 6 circuit connect power supply module and chip 11 circuit through control circuit.The circuit connection post of temperature sensor 6 can be installed on the cooling device 5.When cooling device is water-cooling structure, water inlet pipe 7 and outlet pipe 8 are arranged on the cooling device 5.Round die block protection cavity 201 uses transparent plastic material manufacturing, and round die block protection cavity 201 has circular cavity 202.
Referring to Fig. 1.Described protection cavity has lens.144 chips 11 on corresponding respectively 4 substrates 10 of 12,144 lens of 144 lens 12 are set on the transparent surface 1 of rectangular module protection cavity 3.
Described chip 11 is the ultraviolet light-emitting diodes chip.Chip 11 in above-mentioned all embodiments can use the ultraviolet light-emitting diodes chip as required.
The utility model also can be made shadowless lamp.Referring to Fig. 2.With the lamp installation of 30 band light source modules and round die block protection cavitys 201 on same disk, and configuration cooling device, circuit module and control circuit.Where necessary.In addition, reflection shield 200 also can be set up in round die block protection cavity 201 peripheries.

Claims (6)

1, a kind of Light-Emitting Diode light fixture comprises circuit and cooling device, it is characterized in that, light source module has chip (11), and light source module has the module protection cavity.
2, a kind of Light-Emitting Diode light fixture according to claim 1 is characterized in that, described chip (11) is positioned at the module protection cavity.
3, a kind of Light-Emitting Diode light fixture according to claim 1 is characterized in that, described module protection cavity is the hermetically-sealed construction cavity.
4, a kind of Light-Emitting Diode light fixture according to claim 3 is characterized in that, described hermetically-sealed construction cavity is an inflatable structure.
5, a kind of Light-Emitting Diode light fixture according to claim 1 is characterized in that, described protection cavity has lens.
6, a kind of Light-Emitting Diode light fixture according to claim 1 is characterized in that, described chip (11) is the ultraviolet light-emitting diodes chip.
CN2009200706090U 2009-04-17 2009-04-17 Fixture formed by light-emitting diodes Expired - Fee Related CN201434236Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009200706090U CN201434236Y (en) 2009-04-17 2009-04-17 Fixture formed by light-emitting diodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009200706090U CN201434236Y (en) 2009-04-17 2009-04-17 Fixture formed by light-emitting diodes

Publications (1)

Publication Number Publication Date
CN201434236Y true CN201434236Y (en) 2010-03-31

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009200706090U Expired - Fee Related CN201434236Y (en) 2009-04-17 2009-04-17 Fixture formed by light-emitting diodes

Country Status (1)

Country Link
CN (1) CN201434236Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013127021A1 (en) * 2012-02-27 2013-09-06 迟志均 An led high-power flat plate focus lamp
CN103851361A (en) * 2012-11-28 2014-06-11 李鑫浓 Design method of honeycomb type LED (light emitting diode) lamp panel structure and modular light source module structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013127021A1 (en) * 2012-02-27 2013-09-06 迟志均 An led high-power flat plate focus lamp
CN103851361A (en) * 2012-11-28 2014-06-11 李鑫浓 Design method of honeycomb type LED (light emitting diode) lamp panel structure and modular light source module structure
CN103851361B (en) * 2012-11-28 2015-11-18 李鑫浓 The method for designing of cellular LED lamp panel structure and modularized light source modular structure

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C14 Grant of patent or utility model
GR01 Patent grant
DD01 Delivery of document by public notice

Addressee: Zhang Dongnan

Document name: Notification of Termination of Patent Right

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100331

Termination date: 20140417