CN201369880Y - Pad pasting device for resisting solder and shielding circuit board partially and solder resisting transfer film - Google Patents
Pad pasting device for resisting solder and shielding circuit board partially and solder resisting transfer film Download PDFInfo
- Publication number
- CN201369880Y CN201369880Y CNU2008200610021U CN200820061002U CN201369880Y CN 201369880 Y CN201369880 Y CN 201369880Y CN U2008200610021 U CNU2008200610021 U CN U2008200610021U CN 200820061002 U CN200820061002 U CN 200820061002U CN 201369880 Y CN201369880 Y CN 201369880Y
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- CN
- China
- Prior art keywords
- circuit board
- welding resistance
- carrier layer
- film
- film carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a pad pasting device for resisting solder and shielding circuit board partially, which comprises a base plate, a plurality of locating pins and a supporting block, wherein the locating pins and the supporting block are arranged on the base plate, and the supporting block is arranged on the middle portion of the base plate. The pad pasting device further comprises a rubber idler wheel for pressing film to be flat in the pad pasting process. The locating pins are step-shaped cylindrical bodies which are big on the lower portions and small on the lower portions, and the height of the supporting block is consistent with the height of big cylindrical bodies of the locating pins. The pad pasting device is used to resist solder and shield partially before wave-soldering in the assembly process of circuit board elements, has simple and practical structure, can guarantee that the position and shape of solder resisting shielding formed on the circuit board are accurate, the position error can be controlled under 0.1mm, and the operation efficiency can be improved. The utility model also discloses a solar resisting transfer film for the pad pasting device.
Description
Technical field
The utility model relates to a kind of solder technology, is specifically related to a kind of film sticking apparatus that the local welding resistance of circuit board is covered that is used for, and the utility model also relates to a kind of welding resistance transfer membrane.
Background technology
In the assembling process of circuit board element,, need cover at the positions such as pad, electrode or hole slot that preceding working procedure does not need to weld in circuit board usually if adopt wave soldering.Existing method is with artificial or point gum machine liquid welding resistance glue to be coated on the circuit board, treats that welding resistance glue carries out wave soldering after air-dry again.But liquid welding resistance glue is being coated in the process of circuit board,, is adding the uncertainty of artificial applying glue operation, can cause some gluing regional excessive or too small because the viscosity of liquid welding resistance glue and flowability are difficult to accurately control.Particularly on than the thin space circuit board, the gluing excessive or too small meeting in zone causes the leakage glue or the excessive glue of some pads, electrode or hole slot, and these locally the mistake weldering occurs, leak mass defects such as weldering or many tin when causing wave soldering.
Also having a kind of method is to carry out craft with the welding resistance adhesive tape that width does not wait to cover the circuit board operation, this method is more in shaded areas, shaded areas is less or circuit board in irregular shape on to implement be very difficult, and operating efficiency is lower, feasibility is relatively poor.
The utility model content
Technical problem to be solved in the utility model provides a kind of film sticking apparatus that the local welding resistance of circuit board is covered that is used for, and it can guarantee that welding resistance is covered on the circuit board position and shape are accurate.
For solving the problems of the technologies described above, the technical solution that the utility model is used for the film sticking apparatus that the local welding resistance of circuit board covers is:
Comprise substrate, a plurality of shop bolt, back-up block; Described shop bolt, back-up block are arranged on the substrate, and back-up block is arranged at the middle part of substrate.Also comprise rubber roll, in the pad pasting process that mould is flat.
Described shop bolt is for going up little stepped cylinder down greatly.The height of described back-up block is consistent with the large cylinder height of shop bolt.
The utility model also provides a kind of welding resistance transfer membrane that is used for this film sticking apparatus, and its technical solution is:
Comprise film carrier layer, stamp soldering-resistance layer, peeling paper, described film carrier layer, stamp soldering-resistance layer, peeling paper are arranged in order.
Described film carrier layer is provided with film carrier layer location hole, matches with the position of described shop bolt in the position of described film carrier layer location hole, matches with the external diameter of the small cylinder of shop bolt in the aperture of film carrier layer location hole.
Described film carrier layer is that anti-static polyester film or the thickness antistatic bubble that be 1～5mm of thickness between 0.1～0.3mm is continuous.
Described stamp soldering-resistance layer is the polyimide film of thickness between 0.04～0.16mm, and double-coated has the glue of cohesive force.
Described peeling paper is the brown paper of thickness between 0.06～0.16mm.
Described film carrier layer and/or peeling paper are provided with handle.
The technique effect that the utility model can reach is:
The utility model is used for carrying out local welding resistance and covers before the wave-soldering of circuit board element assembling process, simple and practical, position and shape that the welding resistance that can guarantee to form on circuit board is covered are accurate, and site error can be controlled at below the 0.1mm, and can improve operating efficiency.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail:
Fig. 1 is the structural representation that the utility model is used for the film sticking apparatus that the local welding resistance of circuit board covers;
Fig. 2 is the structural representation of welding resistance transfer membrane;
Fig. 3 is the vertical view of Fig. 2;
Fig. 4 is the schematic diagram that circuit board is installed on film sticking apparatus;
Fig. 5 is attached to schematic diagram on the circuit board with the welding resistance transfer membrane;
The schematic diagram that Fig. 6 utilizes rubber roll that the welding resistance transfer membrane is flattened;
Fig. 7 is the schematic diagram that the film carrier layer of welding resistance transfer membrane is peeled off;
Fig. 8 is the schematic diagram that posts the circuit board of welding resistance transfer membrane.
Among the figure, 1 substrate, 2 shop bolts, 3 back-up blocks, 4 rubber rolls, 10 film sticking apparatus, 11 film carrier layers, 111 film carrier layers are peeled off handle, 112 film carrier layer location hole, 113 film carrier break mouths, 12 stamp soldering-resistance layers, 13 peeling papers, 131 peeling papers handle, 20 circuit boards, 30 welding resistance transfer membranes.
Embodiment
As shown in Figure 1, the utility model is used for the film sticking apparatus 10 that the local welding resistance of circuit board is covered, comprise substrate 1, a plurality of shop bolt 2, back-up block 3, rubber roll 4, a plurality of shop bolts 2, back-up block 3 all are arranged on the substrate 1, and back-up block 3 is arranged at the middle part of substrate 1.
Shop bolt 2 little stepped cylinder for big down, and shop bolt 2 is used for circuit board 20 is positioned substrate 1, and makes between the lower surface of circuit board 20 and the substrate 1 certain intervals is arranged, with the components and parts of protective circuit plate 20 lower surfaces.
The height of back-up block 3 is consistent with the height of the large cylinder of shop bolt 2 bottoms.Back-up block 3 is used for the middle part of support circuit plate 20, makes circuit board 20 be difficult for taking place deformation.
As Fig. 2, shown in Figure 3, the utility model is used for the used welding resistance transfer membrane 30 of film sticking apparatus that the local welding resistance of circuit board is covered, and comprises film carrier layer 11, stamp soldering-resistance layer 12, peeling paper 13, and film carrier layer 11, stamp soldering-resistance layer 12, peeling paper 13 are arranged above and below successively.
Stamp soldering-resistance layer 12 is positioned at the intermediate layer, stamp soldering-resistance layer 12 can adopt the polyimide film of thickness at 0.04～0.16mm, double-coated silica gel, the cohesive force of the contact-making surface of stamp soldering-resistance layer 12 and film carrier layer 11 is less than the cohesive force of stamp soldering-resistance layer 12 with the contact-making surface of peeling paper 13.The polyimides soldering-resistance layer has the characteristic of the high temperature of anti-the welding.
According to the difference of various boards 20 required welding resistance shaded areas, 12 punchings of stamp soldering-resistance layer become different figures, stick on corresponding position on the film carrier layer 11.
Peeling paper 13 is positioned at lower floor, and peeling paper 13 is provided with peeling paper handle 131, conveniently peels off when pad pasting.
Peeling paper 13 is used to protect the glue face of stamp soldering-resistance layer 12, can adopt the brown paper of 0.06～0.16mm thickness.
When the operation of circuit board welding resistance, as shown in Figure 4, earlier circuit board 20 is placed on the utility model film sticking apparatus 10, circuit board 20 needs one of welding resistance to face up; Peeling paper 13 with welding resistance transfer membrane 30 tears then, the film carrier layer 11 of welding resistance transfer membrane 30 up, according to being placed on after the alignment shown in Figure 5 on the circuit board 20; Then welding resistance transfer membrane 30 is flattened on circuit board 20, as shown in Figure 6 with rubber roll 4; The film carrier layer 11 of peeling off welding resistance transfer membrane 30 at last gets final product, as shown in Figure 7.
As shown in Figure 8, adopt the utility model the welding resistance transfer membrane can be transferred to once to need on the circuit board zone of covering, operating speed is fast, need not wait for and can carry out follow-up assembling of circuit board element and welding sequence; And the position is accurate, and site error can be controlled at below the 0.1mm.
The utility model needing before the welding resistance operation to be used for do not have components and parts on the solder side of welding resistance or to need institute's assembling components and parts on the solder side of welding resistance or the maximum height of components and parts pin is no more than the circuit board of 3mm.The utility model had both gone for wave soldering, reflow soldering circuit board welding resistance is covered operation, also go for Reflow Soldering mix with wave-soldering the assembling the circuit board welding resistance cover operation.
Claims (10)
1, a kind ofly is used for the film sticking apparatus that the local welding resistance of circuit board is covered, it is characterized in that: comprise substrate, a plurality of shop bolt, back-up block; Described shop bolt, back-up block are arranged on the substrate, and back-up block is arranged at the middle part of substrate.
2, according to claim 1ly be used for the film sticking apparatus that the local welding resistance of circuit board is covered, it is characterized in that: also comprise rubber roll, in the pad pasting process that mould is flat.
3, according to claim 1ly be used for the film sticking apparatus that the local welding resistance of circuit board is covered, it is characterized in that: described shop bolt little stepped cylinder for big down.
4, according to claim 3ly be used for the film sticking apparatus that the local welding resistance of circuit board is covered, it is characterized in that: the height of described back-up block is consistent with the large cylinder height of shop bolt.
5, a kind of described welding resistance transfer membrane that is used for the film sticking apparatus that the local welding resistance of circuit board covers of claim 1 that is used for, it is characterized in that: comprise film carrier layer, stamp soldering-resistance layer, peeling paper, described film carrier layer, stamp soldering-resistance layer, peeling paper are arranged in order.
6, welding resistance transfer membrane according to claim 5, it is characterized in that: described film carrier layer is provided with film carrier layer location hole, matching with the position of described shop bolt in the position of described film carrier layer location hole, matches with the external diameter of the small cylinder of shop bolt in the aperture of film carrier layer location hole.
7, welding resistance transfer membrane according to claim 5 is characterized in that: described film carrier layer is that anti-static polyester film or the thickness antistatic bubble that be 1～5mm of thickness between 0.1～0.3mm is continuous.
8, welding resistance transfer membrane according to claim 5 is characterized in that: described stamp soldering-resistance layer is the polyimide film of thickness between 0.04～0.16mm, and double-coated has the glue of cohesive force.
9, welding resistance transfer membrane according to claim 5 is characterized in that: described peeling paper is the brown paper of thickness between 0.06～0.16mm.
10, welding resistance transfer membrane according to claim 5 is characterized in that: described film carrier layer and/or peeling paper are provided with handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200610021U CN201369880Y (en) | 2008-12-16 | 2008-12-16 | Pad pasting device for resisting solder and shielding circuit board partially and solder resisting transfer film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200610021U CN201369880Y (en) | 2008-12-16 | 2008-12-16 | Pad pasting device for resisting solder and shielding circuit board partially and solder resisting transfer film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201369880Y true CN201369880Y (en) | 2009-12-23 |
Family
ID=41488762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200610021U Expired - Lifetime CN201369880Y (en) | 2008-12-16 | 2008-12-16 | Pad pasting device for resisting solder and shielding circuit board partially and solder resisting transfer film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201369880Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323985A (en) * | 2014-07-28 | 2016-02-10 | 欣兴电子股份有限公司 | Manufacture Method of circuit board |
-
2008
- 2008-12-16 CN CNU2008200610021U patent/CN201369880Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323985A (en) * | 2014-07-28 | 2016-02-10 | 欣兴电子股份有限公司 | Manufacture Method of circuit board |
| CN105323985B (en) * | 2014-07-28 | 2018-07-03 | 欣兴电子股份有限公司 | The production method of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091223 |