CN201349366Y

CN201349366Y - Liquid removing device of base plate horizontal wet process

Info

Publication number: CN201349366Y
Application number: CNU2009200016004U
Authority: CN
Inventors: 徐美华
Original assignee: Individual
Current assignee: Individual
Priority date: 2009-02-04
Filing date: 2009-02-04
Publication date: 2009-11-18
Anticipated expiration: 2019-02-04

Abstract

The utility model provides a liquid removing device of base plate horizontal wet process, comprising at least one suction tube at the side of the groove, a pump, an inlet pipe and a circulation pipe respectively communicated with the groove and pump on a groove of a base plate processing device and the circulation pipe is also communicated with each suction tube and when pumping the liquid the groove, the air flow flowing towards the circulation pipe is generated in the suction tube, therefore the liquid on the base plate is sucked. When the base plate enters and leaving from the base plate processing device, the liquid and impurities on the base plate is sucked using the suction pipe to prevent the impurities on the base plate in the process course from re-adhering to the next end face of the same base plate or the end face of the next base plate and furthermore prevent the copper foil circuit short circuit or broken circuit phenomena in next base plate process and the liquid on the base plate is removed to prevent the liquid influencing the next processing steps.

Description

The liquid removing device of the horizontal wet process of substrate

Technical field

The utility model relates to a kind of liquid removing device, refers to a kind of liquid that can remove on the described substrate especially before substrate processing, in order to the liquid removing device of further processing.

Background technology

With regard to circuit board (Printed Circuit Board; PCB) or membrane transistor LCD (Thin FilmTransistor Liquid Crystal Display; TFT-LCD) the base plate line molding manufacture procedure of panel etc.; the application of the horizontal wet process of base plate line is by general use; with the horizontal wet process of the circuit of circuit board is example; the base plate line of one circuit board is in molding manufacture procedure; be on the substrate that is stained with copper foil layer in advance; utilize developing manufacture process developer to be formed with the protective layer of circuit pattern with the light shield visualization way; utilize the etching solution of substrate material etch process that the etching operation is carried out at the copper foil layer position that substrate is not provided with protective layer again; the Copper Foil etching of non-scheduled circuit part on the copper foil layer is peeled off; not etched liquid corrosion is carved the circuit that part then presents Copper Foil; again with substrate process manufacturing process for cleaning; with the etching solution on the clean substrate of clear water; the last substrate of process again material dry tack free device is removed the clear water on the substrate, makes described dry substrate after etching can carry out next step processing.

Wherein, referring to shown in Figure 4, the processing unit (plant) of processing procedures such as aforesaid substrate development, etching or cleaning mainly is to be provided with a upper roller group 61, once roller set 62, a plurality of jet pipe 63 and a plurality of pinch roller 64 on a cell body (not shown); The axostylus axostyle 611,621 that upper and lower roller set 61,62 has a plurality of intervals respectively and be arranged in parallel, and on each axostylus axostyle 611,621, be interval with a plurality of rollers that are crisscross arranged 612,622; Jet pipe 63 is located at respectively between the two adjacent axostylus axostyles 611,612 of upper and

lower roller set

61,62; Pinch roller 64 one group is located at the arrival end and the port of export of described base plate processing device in twos, and goes to upper and lower stacked kenel.

When a substrate 65 enters this base plate processing device, rely on earlier the pinch roller 64 that is located at described base plate processing device arrival end roughly to remove last procedure of processing and remained in liquid on the described substrate 65 with fashion of extrusion, then be folded between the described upper and lower roller set 61,62 and move, and rely on the liquid of each jet pipe 63 ejection that described substrate 65 is carried out procedure of processings such as etching or cleaning; Utilize the pinch roller 64 of the port of export be located at described base plate processing device roughly to remove liquid on the substrate 65 at last, enter next step procedure of processing again.

Yet in substrate 65 procedure for processing, because of the length of substrate 65 all many greatly than circumference when pinch roller 64, so the front end that pinch roller 64 can be on same plate base 65 to rotation in regular turn between the rear end repeatedly.And in development and etched processing procedure, because of developer and the stripping agent that is used for removing developer all belong to the chemical substance of toughness, so having the impurity such as chip of part developer and stripping is retained on the substrate 65, therefore when above-mentioned pinch roller 64 compresses substrate 65, described impurity is sticked on pinch roller 64 surfaces, thereby add man-hour when carrying out substrate 65, stick to the impurity on pinch roller 64 surfaces by substrate 65 front sides, very likely can oppositely stick on the not ad-hoc location on surface of same substrate 65 following process, and last substrate 65 sticks to pinch roller 64 lip-deep impurity, also might stick on the not ad-hoc location on substrate 65 surfaces of next processing, and the developer impurity of developing manufacture process can influence the qualification rate of next etch process circuit, adhere on the substrate 65 not ad-hoc location because of sticking to pinch roller 64 lip-deep developer impurity, can cause on the substrate 65 of described following process has the thickness of impurity adhesion place thicker, and then make that the copper foil circuit moulding after the etching is uncertain, especially at present substrate 65 manufacturing technologies progress greatly day by day following, the width of copper foil circuit and gap are also meticulous further, slightly oppositely the developer impurity that adheres to just may cause short circuit or breaking phenomena to the process of copper foil circuit moulding, and then cause the problem of substrate 65 product qualified rate step-downs, and the impurity of etch process etching stripping also can impact the qualification rate of following process manufacturing process for cleaning.

And for example in the anti-welding developing manufacture process of circuit board, also be same as and develop and etch process, can be provided with pinch roller 64 at the going into of cell body, the port of export, also can oppositely adhere on the substrate 65 not ad-hoc location and stick to pinch roller 64 lip-deep anti-solder flux impurity, will cause the qualification rate of scolding tin processing procedure on next substrate 65 to reduce equally; So the substrate of prior art is in the course of processing of horizontal wet process, what institute's impurity that produces can be because of pinch roller oppositely sticks on the substrate the not shortcoming of ad-hoc location, the improvement that reality remains to be continued.

Summary of the invention

Because the shortcoming of aforementioned prior art, the utility model designer provides the liquid removing device of the horizontal wet process of a kind of substrate, uncommon so design solves in the base plate processing device of prior art, be located at impurity such as to adhere to chip on the pinch roller of its arrival end and the port of export, thereby cause the untrue problem of circuit moulding on the substrate.

In order to reach above-mentioned utility model purpose, the technological means that the utility model utilized provides the liquid removing device that is located at the horizontal wet process of a substrate, and it is provided in a side of on the cell body of a base plate processing device, and includes

At least one absorption pipe, it is located at the side of cell body cell wall;

One pump;

One oral siphon, its two ends are communicated in a water inlet of described cell body and described pump respectively;

One circulation pipe, its two ends are communicated in a delivery port and the described cell body of described pump respectively, and the stage casing of described circulation pipe forms the necking section of contracting in the caliber, and described necking section is absorbed pipe and is connected with each.

When pump extracts liquid in the cell body by described oral siphon, and the necking section that relies on circulation pipe is when flowing described liquid apace in circulation pipe, meeting thereby generation negative pressure make and absorb the necking section airflow flowing that produces in the pipe towards circulation pipe, thereby reach the function of liquid on absorption one substrate.

Compared with prior art, adopt the advantage that the utlity model has of technique scheme to be: to rely on above-mentioned design, when substrate enters and leave described base plate processing device, can utilize earlier and absorb residual liquid and impurity on the pipe absorption substrate, except can avoid remaining in the course of processing copper foil circuit moulding that impurity on the substrate causes substrate really, also can remove the liquid on the substrate really, in order to avoid influence procedure of processing thereafter.

Description of drawings

Fig. 1 is the stereo appearance figure of the utility model at the state of enforcement;

Fig. 2 is the schematic side view of the utility model at the state of enforcement;

Fig. 3 is that the utility model is implemented the schematic side view of state at another;

Fig. 4 is the stereo appearance figure of prior art.

Description of reference numerals: 1,1A, 1B-liquid removing device; 10,10A, 10B-absorb pipe; The 11-suction inlet; 20,20A, 20B-circulation pipe; The 21-necking section; 22,22A, 22B-oral siphon; The 30-pump; 40,40A-base plate processing device; 41,41A-cell body; The 411A-dividing plate; Room before the 412A-; Room behind the 413A-; 42-upper roller group; The 421-axostylus axostyle; The 422-roller; 43-bottom roller group; The 431-axostylus axostyle; The 432-roller; 44,44A-jet pipe; The 50-substrate; 61-upper roller group; The 611-axostylus axostyle; The 612-roller; 62-bottom roller group; The 621-axostylus axostyle; The 622-roller; The 63-jet pipe; The 64-pinch roller; The 65-substrate.

Embodiment

Referring to Fig. 1 and embodiment shown in Figure 2, the liquid removing device 1 of the horizontal wet process of substrate of the present utility model is provided in a side of on the base plate processing device 40, described base plate processing device 40 can be a substrate developing apparatus, a substrate Etaching device or a base plate cleaning device, and it mainly includes a cell body 41, a upper roller group 42, once roller set 43 and a plurality of jet pipe 44: make the two opposite sides of described cell body 41 be respectively an arrival end and a port of export; Described upper and

lower roller set

42,43 is located between the entry and exit end of cell body 41, and it is to be interval with a plurality of rollers that are crisscross arranged 422,432 respectively on a plurality of intervals and the axostylus axostyle 421,431 that be arranged in parallel; Described jet pipe 44 is located at respectively between the two adjacent axostylus axostyles 421,431 of upper and lower roller set 42,43.One substrate 50 to be processed enters this base plate processing device 40 by the arrival end of cell body 41, then be folded between the roller 422,432 of described upper and

lower roller set

42,43 and move, and rely on the liquid of each jet pipe 44 ejection that described substrate 50 is carried out procedure of processings such as etching or cleaning.

Wherein, the liquid removing device 1 of the utility model embodiment includes at least one and absorbs pipe 10, one pump 30, an oral siphon 22 and a circulation pipe 20:

Absorb pipe 10 and be located at cell body 41 outlet or arrival ends, also can be located at out simultaneously, a wherein side in the cell wall inboard, arrival end place or the outside, and with described roller set 42,43 axostylus axostyle 421,431 be arranged in parallel, cooperate substrate 50 to be two-sided processing or single-sided process in addition, described absorption pipe 10 can also be gone up, stacked mode is located at the top and the below of substrate 10 simultaneously down, or only above substrate 50, locate to be provided with described absorption pipe 10, and make 11 pairs of the suction inlets that each absorbs pipe 10 should substrate 50, described suction inlet 11 can be the strip finedraw and be provided with along described absorption pipe 10, but, the suction inlet 11 that is the strip finedraw only is embodiment of the present utility model, and described suction inlet 11 also can include a plurality of circular hole or slotted holes that are distributed in distance and are provided with;

One end of oral siphon 22 is connected with the bottom land of cell body 14, and the other end then joins with a water inlet of described pump 30;

One end of circulation pipe 20 and a delivery port of described pump 30 join, and the other end is connected with the bottom land of described cell body 41, and the stage casing of described circulation pipe 20 forms the necking section 21 of contracting in the caliber, and described necking section 21 is absorbed pipe 10 and is connected with each;

When starting pump 30, described pump 30 can extract the liquid of cell body 41 bottom lands by described oral siphon 22, described liquid is pressurizeed, described liquid is flowed in circulation pipe 20 apace, and when described flow of liquid during, also can dwindle and its flow velocity is further accelerated, and then produce negative pressure because of the caliber of necking section 21 through the necking section 21 of circulation pipe 20, and cause and absorb necking section 21 airflow flowing that produce in the pipe 10 towards circulation pipe 20, thereby the liquid on the absorption substrate 50.

Further referring to shown in Figure 3, when aforementioned base plate processing device 40A is a base plate cleaning device, a room 412A and a back room 413A before can further utilizing a dividing plate 411A to be separated out one in its cell body 41A, be loaded with the detergent remover of substrate 50 capable of washing before described in room 412A and the back room 413A respectively, and jet pipe 44A, the 44B of described base plate processing device 40A to be the detergent remover that extracts in corresponding room 412A, the 413A come cleaning base plate 50, and described detergent remover is taken advantage of a situation among room 412A, the 413A that flows into the below with recycling; Wherein, because of the substrate cleaning step is to be next to after the substrate etching step, so the most meeting of etching solution residual on the substrate 50 flows into and is blended in the detergent remover of preceding room 412A, and when substrate 50 moves to room 413A place, back, just can utilize that comparatively pure detergent remover cleans in the room 413A of back, so improve the cleaning effect of substrate 50;

Wherein, cell body 41A go up to should before room 412A and back room 413A place be provided with one group of liquid removing device 1A of the present utility model, 1B respectively:

The described liquid removing device 1A that is located at the preceding room 412A place of cell body 41A, it absorbs pipe 10A is the side that is located at cell body 41A arrival end place's cell wall and dividing plate 411A respectively, the end of described oral siphon 22A and circulation pipe 20A is communicated in the bottom land of the preceding room 412A of cell body 41A respectively, relies on the detergent remover that extracts described preceding room 412A bottom land to make the interior formation of described absorption pipe 10A can absorb the air-flow of liquid on the substrate 50;

The described liquid removing device 1B that is located at room 413A place behind the cell body 41A, it absorbs pipe 10B is the side that is located at cell body 41A port of export place cell wall respectively, the end of described oral siphon 22B and circulation pipe 20B is communicated in the bottom land of room 413A behind the cell body 41A respectively, relies on the detergent remover that extracts described back room 413A bottom land to make formation in the described absorption pipe 10B can absorb the air-flow of liquid on the substrate 50.

Aforesaid design, when substrate 50 enters and leaves described base

plate processing device

40,40A, utilize and absorb residual liquid and impurity on

pipe

10,10A, the 10B absorption substrate 50, except can avoid remaining in the course of processing copper foil circuit moulding that impurity on the substrate 50 causes substrate 50 really, also can remove the liquid on the substrate 50 really, in order to avoid influence procedure of processing thereafter.

More than explanation is just illustrative for the utility model; and nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited; can make many modifications, variation or equivalence, but all will fall within the protection range of the present utility model.

Claims

1. the liquid removing device of the horizontal wet process of substrate, it is characterized in that: it is located on the cell body of a base plate processing device, and includes at least one absorption pipe, a pump, an oral siphon and a circulation pipe, wherein:

Absorb the side that pipe is located at the cell body cell wall;

The two ends of oral siphon are communicated in a water inlet of described cell body and described pump respectively;

The two ends of circulation pipe are communicated in a delivery port and the described cell body of described pump respectively, and the stage casing of described circulation pipe forms the necking section of contracting in the caliber, and described necking section is absorbed pipe and is connected with each.

2. the liquid removing device of the horizontal wet process of substrate according to claim 1 is characterized in that: it has a plurality of absorption pipes, and described absorption pipe is located at the side of end place, cell body entry and exit cell wall.

3. the liquid removing device of the horizontal wet process of substrate according to claim 1 and 2, it is characterized in that: described cell body further is separated out a plurality of rooms with at least one dividing plate, and on described cell body, be provided with the described liquid removing device of plural groups, each liquid removing device is a corresponding room respectively, and the absorption pipe of each liquid removing device is located at cell body cell wall and each dividing plate side respectively.

4. the liquid removing device of the horizontal wet process of substrate according to claim 1 and 2 is characterized in that: the suction inlet of aforementioned absorption pipe is the strip finedraw and along the setting of described absorption pipe.

5. the liquid removing device of the horizontal wet process of substrate according to claim 1 and 2 is characterized in that: the suction inlet of aforementioned absorption pipe includes a plurality of circular holes that are distributed in distance and are provided with, and is provided with along described absorption pipe.

6. the liquid removing device of the horizontal wet process of substrate according to claim 1 and 2 is characterized in that: the suction inlet of aforementioned absorption pipe includes a plurality of slotted holes that are distributed in distance and are provided with, and is provided with along described absorption pipe.