CN201340431Y

CN201340431Y - Aging board used in mounting type packaged semiconductor power device

Info

Publication number: CN201340431Y
Application number: CN 200920037687
Authority: CN
Inventors: 陆阳; 吴玉轩
Original assignee: Wuxi Tianhe Electronic Co Ltd
Current assignee: Wuxi Tianhe Electronic Co Ltd
Priority date: 2009-01-22
Filing date: 2009-01-22
Publication date: 2009-11-04
Anticipated expiration: 2019-01-22

Abstract

The utility model relates to a aging board used in mounting type packaged semiconductor power device. The aging board is characterized in that: it comprises a circuit board and a cover plate covering thereon, a socket is disposed on the circuit board; the socket is opened with jacks; conductive spring probes are mounted in the jacks; the cover plate is formed with a hole; the position of the hole is respectively corresponding to the socket on the circuit board; a movable pressing plate is disposed on the cover plate; the utility model applies test electric signal to the external electrode of the mounting type packaged semiconductor power device by the spring probes which is connected wit the supply socket by a soldering disc; has the advantages of simple structure of aging voltage applying apparatus and reliable electric contact; can effectively solve the problem of aging mounting type packaged semiconductor power device.

Description

The ageing plate of mounted type encapsulated semiconductor power device

Technical field

The utility model relates to the manufacturing equipment of semiconductor devices, relates in particular to the ageing equipment of semiconductor power device.

Background technology

At the requirement of semiconductor devices miniaturization, designed the miniature mounted type package casing of semiconductor power device.Because the package casing of original semiconductor power device has pin, must semiconductor devices be fixed on the ageing plate by mogul base, on socket, apply the ageing electric signal semiconductor power device is carried out ageing, this ageing socket and ageing plate can not be applicable to the ageing of mounted type encapsulated semiconductor power device, because the mounted type package casing is not with pin, as shown in Figure 7, only have flat shape

external electrode

18,, 19,20.

The utility model content

Miniature mounted type package casing at semiconductor power device, design a kind of ageing plate of supporting with it mounted type encapsulated semiconductor power device, it applies the simple and reliable for structure of ageing voltage, makes seasoned conveniently realization of mounted type encapsulated semiconductor power device.

In order to solve the problems of the technologies described above, the utility model adopts following technical scheme:

The ageing plate of mounted type encapsulated semiconductor power device, comprise circuit board and cover cover plate on it, circuit board is provided with the circuit bar, circuit board is provided with socket, has jack on the socket, and the spring probe of conduction is installed in the jack, described spring probe is connected with circuit bar on the circuit board, have the hole on the described cover plate, the position of the above socket of the position in hole difference corresponding circuits plate on the cover plate, there is movable pressing board the top of cover plate.

On the described circuit board pad is installed, the conduction connecting pipe on the pad respectively with described circuit board on circuit bar and the corresponding electrical connection of electrical socket.

Technique effect of the present utility model is:

The utility model applies ageing voltage by spring probe to the external electrode of mounted type encapsulated semiconductor power device, spring probe is connected with supply socket by pad, apply the simple in structure of ageing voltage device, electrically contact reliably, can effectively solve the ageing problem of mounted type encapsulated semiconductor power device.

Description of drawings

Fig. 1 is the vertical view of circuit board in the utility model;

Fig. 2 is the vertical view of the utility model cover plate;

Fig. 3 is the front view of spring probe;

Fig. 4 be equipped with spring probe socket overlook enlarged drawing;

Fig. 5 is the A-A direction cut-open view of Fig. 4.

Fig. 6 is an installment state synoptic diagram of the present utility model;

Fig. 7 is the external electrode figure of mounted type encapsulated semiconductor power device.

Embodiment

Below in conjunction with accompanying drawing embodiment of the present utility model is further described.

See Fig. 1, Fig. 2, the utility model comprises circuit board 1 and covers cover plate 8 on it, circuit board 1 is provided with P.e.c. bar and 20 sockets 3, each socket 3 is included in 10 jacks arranging about reaching up and down of having on the circuit board 1, welded tube is installed in the jack, in the welded tube respectively welded and installed just like Fig. 3, power spring probe shown in Figure 5, described power spring probe comprises probe tube 12, spring 13 and the probe 11 that is fixed in spring one end, and embodiment adopts the commercially available spring probe of this structure.The probe tube 12 of power spring probe is connected with the P.e.c. bar that is provided with on the circuit board 1 respectively.See Fig. 4, Fig. 7, the input electrode 18 of two spring probes in the right and mounted type encapsulated semiconductor power device electrically contacts, two spring probes in the left side electrically contact for the common port electrode 20 of mounted type encapsulated semiconductor power device, and six spring probes electrically contact for the output terminal electrode 19 of mounted type encapsulated semiconductor power device up and down.See Fig. 1, an end of described circuit board 1 is equipped with 22 pairs of conductive welding disks 5, and the conduction connecting pipe is installed on the pad 5, the conduction connecting pipe respectively with described PCB socket 3 in power spring probe syringe 12 and the corresponding electrical connection of electrical socket.The pair of conductive pad 5 of left end upper-lower position 6 is electrically connected with each two spring probe in socket 3 left sides of Fig. 4 respectively, the pair of conductive pad of right-hand member upper-lower position 4 is electrically connected with each two spring probe in socket 3 the right of Fig. 4 respectively, the conduction connecting pipe on 20 pairs of conductive welding disks 5 in centre position 7 respectively with circuit board 1 on the P.e.c. bar and the corresponding electrical connection of electrical socket that are provided with.See Fig. 5, the probe 11 of spring probe exceeds circuit board 1, contacts with the reliable of probe 11 with the electrode that guarantees mounted type encapsulated semiconductor power device 14, sees Fig. 2, have hole 10 on the described cover plate 8, the position of socket 3 on the position difference corresponding circuits plate 1 in hole 10.

See Fig. 1, Fig. 2, circuit board 1 edge has pilot hole 2, and cover plate 8 edges have pilot hole 9, see Fig. 6,3

circuit boards

1 and 3 cover plates 8 is fixed on the framework 15 with screw by pilot hole.Every circuit board 1 can install 20 mounted type encapsulated semiconductor power devices and carry out ageing.6 private jacks 16 of the fit beneath of framework 15, each socket has 10 conductive plugs, on each conductive plug and the circuit board 1 between the conductive welding disk 5 in centre position 7 by the corresponding electrical connection of P.e.c. bar on the circuit board 1.10 conductions of device are transplanted a cutting in each socket, and every corresponding altogether 20 conductions of circuit board 1 are transplanted a cutting.Mounted type encapsulated semiconductor power device 14 is installed on when carrying out ageing in the utility model as shown in Figure 5, the electric signal of its output electrode passes through the conductive plug of power spring probe 11-12, conductive welding disk 5, socket 16 in proper order, be incorporated into corresponding conduction and transplant a cutting, transplant a cutting by conduction and carry out the online detection of ageing data.

The course of work of the present utility model: as Fig. 5, shown in Figure 6, in the hole 10 on the semiconductor power device 14 insertion cover plates 8, mounted type encapsulated semiconductor power device is located in hole 10, on mounted type encapsulated semiconductor power device, add and put movable pressing board 17, make that the spring probe head 11 in the socket 3 contacts with the

electrode

18,19,20 of semiconductor power device 14 respectively on the circuit board, the ageing electric signal is joined the electrode of mounted type encapsulated semiconductor power device 14 by the respective springs probe, can enter the ageing process.

Claims

1. the ageing plate of mounted type encapsulated semiconductor power device, it is characterized in that comprising circuit board and cover cover plate on it, circuit board is provided with the circuit bar, circuit board is provided with socket, has jack on the socket, and the spring probe of conduction is installed in the jack, described spring probe is connected with circuit bar on the circuit board, have the hole on the described cover plate, the position of the above socket of the position in hole difference corresponding circuits plate on the cover plate, there is movable pressing board the top of cover plate.

2. according to the ageing plate of the described mounted type encapsulated semiconductor of claim 1 power device, it is characterized in that on the described circuit board pad being installed, the conduction connecting pipe on the pad respectively with described circuit board on circuit bar and the corresponding electrical connection of electrical socket.