CN201315704Y - PCB board silk screen printing plate - Google Patents
PCB board silk screen printing plate Download PDFInfo
- Publication number
- CN201315704Y CN201315704Y CNU2008202051510U CN200820205151U CN201315704Y CN 201315704 Y CN201315704 Y CN 201315704Y CN U2008202051510 U CNU2008202051510 U CN U2008202051510U CN 200820205151 U CN200820205151 U CN 200820205151U CN 201315704 Y CN201315704 Y CN 201315704Y
- Authority
- CN
- China
- Prior art keywords
- printing plate
- screen printing
- half tone
- pcb board
- aluminium flake
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a screen printing plate for printing peelable solder mask at the specific bonding pad of PCB board. The screen printing plate includes a screen printing plate body, an aluminum sheet covering on the screen printing plate body and an aluminum frame for the installation of the former two. The aluminum sheet is provided with a plurality of holes corresponding to the bonding pad on which the peelable solder mask is required to be printed on the PCB board. The aluminum sheet is bonded with the screen printing plate body through glue. After the aluminum sheet is arranged on the original screen printing plate, the distance between the screen printing plate and PCB board is increased, thereby being good for the leakage of the liquid solder mask. The leakage volume is large, thus effectively increasing the thickness of the peelable solder mask and meeting the requirements of customers. Besides, the aluminum sheet has low cost, thus facilitating processing. The periphery of the holes is in good order. The solder mask doesn't leak.
Description
Technical field
The utility model relates to a kind of half tone that peelable blue glue is printed at specific pads place in the circuit board that is used for.
Background technology
When wiring board carried out Reflow Soldering and wave-soldering, it was that the highest furnace temperature of scolder requirement reaches 235 ℃ that lead is arranged, and the unleaded temperature that is the wave-soldering of scolder needs has then reached 260 ℃-270 ℃ height.Some electronic devices and components can break or damage under this high temperature, so these components and parts will welding separately behind wave-soldering.And for fear of tin on PCB pad herein is when the wave-soldering, when PCB produces, will these pads be covered with resistant to elevated temperatures peelable blue glue usually, after removing blue glue behind the wave-soldering, pad is welded again.The thickness requirement of general this type of blue glue uses normal screen painting can reach requirement about 0.5-1mm.But also some in particular cases the client can require to reach 4-5mm thickness, under prior art, use traditional half tone and silk-screen method can't reach this thickness requirement.
The utility model content
The problem that the utility model need solve provides a kind of new with low cost and effective half tone that peelable blue glue is printed on pcb board specific pads place that is used for.
Designed a kind of half tone according to above-mentioned problem the utility model that needs to solve, this half tone comprises a half tone body and an aluminium flake that covers on the half tone body, have some holes on the described aluminium flake, the quantity in hole, shape and position are to be provided with according to quantity, shape and the position of the pad of the peelable blue glue of needs silk-screen on the wiring board are corresponding one by one.Described aluminium flake and half tone body are installed in the aluminium frame by the common body of installing in the bonding back of glue.
Advantage of the present utility model is: after 1, covering aluminium flake on the former half tone, increased during silk-screen half tone and pcb board identity distance from, help the following leakage of liquid indigo plant glue, thereby leakage quantity greatly effectively increases the thickness of peelable blue glue under the blue glue; 2, the periphery in aluminium flake gong hole is neat, blue glue without leakage; 3, the low processing and fabricating of being convenient to of aluminium flake cost, general PCB producer uses existing equipment all can finish.
Description of drawings
Fig. 1 becomes decomposing schematic representation for the utility model structural group.
Embodiment
For the ease of it will be appreciated by those skilled in the art that the utility model is described in further detail below in conjunction with accompanying drawing.
As shown in Figure 1, the utility model comprises half tone body 1 and covers aluminium flake 2 on the half tone body, on the described aluminium flake according to the position and the shape one corresponding perforate of the pad of the peelable blue glue of wiring board needs silk-screen.Described aluminium flake and half tone body are installed in the aluminium frame 3 by the common body of installing in the bonding back of glue.
Can select the aluminium flake of different-thickness in the utility model flexibly according to the peelable blue glue thickness of customer requirements silk-screen, general aluminium flake thickness is 0.12～0.18mm.
As Fig. 2, half tone cost described in the utility model is low, easy to process, all can gather materials on the spot self manufacture for general PCB producer.
Its concrete flow process of making is:
(1) makes the film according to the silk-screen needs of peelable blue glue on the wiring board;
(2) press the film to aluminium flake perforate and hole periphery polishing is level and smooth with CNC gong machine;
(3) drawing in the net yarn in square tube aluminium frame makes common half tone;
(4) on aluminium flake, evenly smear one deck glue, notice that the half tone place of windowing can not be coated with;
(5) with aluminium flake and the accurate contraposition of making of half tone, pressing is pasted together;
(6) will secure around the aluminium flake with the elargol band, increase the binding ability of grenadine and aluminium flake, guarantee that simultaneously the tension force of half tone can not reduce.
In described step 3, generally draw in the net yarn when making common half tone the order number of grenadine be located at 15～25T (T: the number in hole on the unit are), because the mesh number is less, the more little then Kong Yueda of the quantity in hole on the unit are, the blue glue pattern of going out after solarization net and development is irregular like this, and occur exosmosing easily more in the thick more manufacturing process of the blue glue of silk-screen, causing blue glue to be interconnected or leaking is not needing to cover blue Jiao Chu.And the utility model draw in the net yarn when making common half tone the order number of grenadine still be located at 15～25T, but since half tone in conjunction with aluminium flake after, the periphery in aluminium flake gong hole is neat, can solve the dew problem of oozing fully.
Because aluminium flake has increased the distance of half tone and pcb board face, improved height between half tone and plate, help increasing the following China ink amount of blue glue, thereby can effectively increase the thickness of peelable blue glue, satisfied customer requirement.If directly the steel mesh of opening respective thickness according to customer demand also can reach this purpose, but by comparison, the cheap several times of the utility model cost.
Claims (5)
1, a kind of pcb board silk-screen half tone, comprise the half tone body, it is characterized in that: the aluminium flake that on described half tone body, covers a same size, gong is porose on the described aluminium flake, and described hole number, shape and position are provided with according to the number of pads, shape and the position that need the peelable blue glue of silk-screen on the wiring board are corresponding one by one.
2, pcb board silk-screen half tone according to claim 1, it is characterized in that: described aluminium flake and half tone body are installed in the aluminium frame.
3, pcb board silk-screen half tone according to claim 2 is characterized in that: adopt glue bonding between described aluminium flake and the half tone body.
4, pcb board silk-screen half tone according to claim 3, it is characterized in that: described aluminium flake thickness is 0.12～0.18mm.
5, pcb board silk-screen half tone according to claim 4, it is characterized in that: the meshcount of described half tone body is 15～25T.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202051510U CN201315704Y (en) | 2008-12-10 | 2008-12-10 | PCB board silk screen printing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202051510U CN201315704Y (en) | 2008-12-10 | 2008-12-10 | PCB board silk screen printing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201315704Y true CN201315704Y (en) | 2009-09-23 |
Family
ID=41127508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202051510U Expired - Fee Related CN201315704Y (en) | 2008-12-10 | 2008-12-10 | PCB board silk screen printing plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201315704Y (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036510A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Depth-controlled hole plugging method for printed circuit board (PCB) |
| CN102248823A (en) * | 2011-05-13 | 2011-11-23 | 昆山鼎鑫电子有限公司 | Large sized printing process for aluminum plates |
| CN103433171A (en) * | 2013-08-30 | 2013-12-11 | 深圳创维－Rgb电子有限公司 | Device and method for coating adhesion agents on bonding pads of PCB (printed circuit board) of LED (light-emitting diode) area light source |
| CN103862898A (en) * | 2014-02-28 | 2014-06-18 | 奥士康精密电路（惠州）有限公司 | Circuit board blue glue printing process |
| CN105142344A (en) * | 2015-07-31 | 2015-12-09 | 大连崇达电路有限公司 | Method for processing printed circuit board with blue-gel cover holes |
| CN105323983A (en) * | 2015-09-22 | 2016-02-10 | 东莞市诚志电子有限公司 | Method for preparing blue gel particles by PCB |
| CN106142874A (en) * | 2016-06-23 | 2016-11-23 | 江门崇达电路技术有限公司 | The method of circuit board silk-screen indigo plant glue |
| CN106793518A (en) * | 2016-12-29 | 2017-05-31 | 奥士康科技股份有限公司 | A kind of aluminium flake consent half tone |
| CN107398392A (en) * | 2017-07-31 | 2017-11-28 | 京东方科技集团股份有限公司 | A kind of silk-screen half tone |
| CN109109444A (en) * | 2018-08-17 | 2019-01-01 | 北方电子研究院安徽有限公司 | A kind of metal plate press back adhesive dispenser |
-
2008
- 2008-12-10 CN CNU2008202051510U patent/CN201315704Y/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036510A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Depth-controlled hole plugging method for printed circuit board (PCB) |
| CN102036510B (en) * | 2010-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Depth-controlled hole plugging method for printed circuit board (PCB) |
| CN102248823A (en) * | 2011-05-13 | 2011-11-23 | 昆山鼎鑫电子有限公司 | Large sized printing process for aluminum plates |
| CN103433171A (en) * | 2013-08-30 | 2013-12-11 | 深圳创维－Rgb电子有限公司 | Device and method for coating adhesion agents on bonding pads of PCB (printed circuit board) of LED (light-emitting diode) area light source |
| CN103862898A (en) * | 2014-02-28 | 2014-06-18 | 奥士康精密电路（惠州）有限公司 | Circuit board blue glue printing process |
| CN105142344A (en) * | 2015-07-31 | 2015-12-09 | 大连崇达电路有限公司 | Method for processing printed circuit board with blue-gel cover holes |
| CN105323983A (en) * | 2015-09-22 | 2016-02-10 | 东莞市诚志电子有限公司 | Method for preparing blue gel particles by PCB |
| CN106142874A (en) * | 2016-06-23 | 2016-11-23 | 江门崇达电路技术有限公司 | The method of circuit board silk-screen indigo plant glue |
| CN106793518A (en) * | 2016-12-29 | 2017-05-31 | 奥士康科技股份有限公司 | A kind of aluminium flake consent half tone |
| CN107398392A (en) * | 2017-07-31 | 2017-11-28 | 京东方科技集团股份有限公司 | A kind of silk-screen half tone |
| CN109109444A (en) * | 2018-08-17 | 2019-01-01 | 北方电子研究院安徽有限公司 | A kind of metal plate press back adhesive dispenser |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090923 Termination date: 20151210 |
|
| EXPY | Termination of patent right or utility model |