CN201311646Y

CN201311646Y - Inlaid type smart card base

Info

Publication number: CN201311646Y
Application number: CNU2008201246507U
Authority: CN
Inventors: 杨准; 韩晓奇; 李刚
Original assignee: BEIJING BIG BEN TECHNOLOGY DEVELOPMENT Co Ltd
Current assignee: BEIJING BIG BEN TECHNOLOGY DEVELOPMENT Co Ltd
Priority date: 2008-12-16
Filing date: 2008-12-16
Publication date: 2009-09-16
Anticipated expiration: 2018-12-16

Abstract

The utility model relates to an inlaid type smart card base which comprises a female card base and a small card base, wherein the small card base is arranged in the female card base and can be separated with the female card base, the female card base is formed by compounding more than one layer of paper wood, at least one packaging hole is arranged on the female card base, the small card base is made of higher molecular polymeric materials, the shape of the small card base is matched with that of the packaging hole on the female card base and is inlaid into the packaging hole, and the periphery of the small card base is connected with the female card base. The utility model reduces the production cost of the smart card base and furthest reduces the environmental pollution by the waste of the smart card base. Compared with the present well-known injection molding production technology, the efficiency of the utility model is increased by 10 times, the utility model has high labor productivity and low defective rate, the size of the card base is easy to control, the production accuracy can reach a level of 0.01 mm, the maximum allowable tolerance range is larger or smaller than 0.05 mm, and the card base completely conforms to a standard requirement.

Description

Embedded smart card base

Technical Field

The utility model relates to an inserted smart card base.

Background

The smart card is a card product which is common and closely related in daily life of people, such as a contact smart card of a telecommunication card (a GSM card, a SIM card, a CDMA card, etc.), a bank card, a traffic card, a city all-purpose card, etc., and has become an indispensable article in daily life of people. For example, the production capacity of china is statistically more than about 8 billion sheets per year for only one product, the telecom card.

Fig. 1 is a schematic diagram illustrating an overall structure of a known contact smart card. As shown in the figure, the current contact smart card is composed of an integral card base 10, and for a SIM card for a telecommunication mobile phone, for example, the integral card base 10 includes a card base body 11, a card base 12 with a chip connected to the card base body 11, wherein the periphery of the card base 12 with the chip is punched to form an intermittent easy-to-cut line 13, so that the card base 12 with the chip can be conveniently taken off from the card base body in use. The known integrated card base 10 is made of ABS, PVC, PET, but the user actually uses only the card base 12 with chip, which accounts for about 8.12% of the integrated card base 10, in other words 91.88% of the telecom cards purchased by the user are discarded, and the above-mentioned polymer material is known to be a material which is seriously polluted by the environment, and is strictly prohibited from being processed and produced in the country in europe in many countries. Therefore, a waste smart card or a card base body 11 from which a useful chip portion is removed is one of the sources of environmental pollution. In order to prevent the waste card body from polluting the environment, the waste card body needs to be treated, and the treatment process also increases the equipment cost, causes energy consumption and is very uneconomical.

On the other hand, since the telecommunication card is a standardized product whose external dimensions are strictly specified in the standard, all processing equipment is designed according to the standard, and thus it is impossible to produce only a small card or to supply only a small card to a user.

The contact type smart card base 10 has the following problems because the contact type smart card base is an integral card base: the integrated card base 10 is manufactured by a lamination process, for example, by adopting a plurality of layers of ABS or PVC sheets, and needs to be laminated and synthesized at high temperature and high pressure.

If the integral card base 10 is manufactured by an injection molding process, ABS or PVC granular materials are used and are subjected to high-temperature and high-pressure injection molding by an injection molding machine.

Both the two production processes are high-energy-consumption production processes, and all smart card base manufacturers are large consumers, so that the energy-saving requirements of the whole society are not met.

In view of the above-mentioned drawbacks of the known technology, the present inventors have developed the present invention based on the production design experience of many years in this field and related fields to reduce the environmental pollution, reduce the energy consumption, improve the production efficiency, reduce the production cost and improve the product quality.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a smart card base, especially an inlay formula smart card base that constitutes by the female card base of paper system and inlay in female card base and the little card base that can separate.

Therefore, the utility model provides an embedded smart card base, which comprises a mother card base and a small separable card base arranged in the mother card base, wherein the mother card base is formed by compounding more than one layer of paper materials and is provided with at least one packaging hole; the small card base is made of high polymer materials, the appearance of the small card base is matched with the packaging hole in the mother card base and is embedded in the packaging hole, and the periphery of the small card base is connected with the mother card base.

The embedded smart card substrate as described above, wherein the two opposite side edges of the upper or lower surface of the small card substrate are provided with oblique cutting planes, an open glue injection groove for connecting the small card substrate and the mother card substrate is formed between the side edge of the packaging hole on the mother card substrate and the cutting planes, and the glue for connecting the mother card substrate and the small card substrate is filled therein.

The embedded smart card base is of a three-layer structure, and comprises a middle layer, a bottom layer and a surface layer, wherein the bottom layer and the surface layer are arranged on the upper surface and the lower surface of the middle layer; the middle layer is provided with a containing cavity, the containing cavity is positioned at the periphery of the packaging hole and is provided with an adhesive overflow port communicated with the packaging hole, the containing cavity is internally provided with hot melt adhesive, and the hot melt adhesive is embedded between the small card base in the packaging hole and the mother card base and is fixedly connected with the hot melt adhesive.

The embedded smart card substrate as described above, wherein the receiving cavity is disposed along the periphery of the packaging hole, and has a circular or elongated shape, and at most, the receiving cavity may be continuously formed into an annular elongated slot.

The embedded smart card base is characterized in that the thickness of the small card base is the same as that of the mother card base, a groove corresponding to an adhesive overflow port arranged on the middle layer of the mother card base is arranged on a connecting surface of the periphery of the small card base and the mother card base, hot melt adhesive in the mother card base can be embedded into the groove, and the small card base is fixedly connected with the mother card base.

The embedded smart card base comprises a mother card base and a small card base, wherein the upper surface or the lower surface of at least one of the mother card base or the small card base is provided with an injection notch, and the injection notch forms an open injection notch for connecting the mother card base and the small card base; the glue injection notch is arranged close to the side edge of the packaging hole and/or the small card base, one side edge of the glue injection notch is communicated with the side edge of the packaging hole and/or the small card base, and adhesive glue for connecting the mother card base and the small card base is filled in the glue injection notch.

The embedded smart card substrate as described above, wherein the glue-injection slot formed on the small card substrate and the glue-injection slot formed on the mother card substrate are located on the same plane, and the positions of the glue-injection slots are corresponding and are communicated with each other to form a complete open glue-injection slot.

The embedded smart card substrate is characterized in that the glue injection notches are respectively arranged on the mother card and the small card substrate and have the same depth.

The embedded smart card base as described above, wherein the mother card base is made of a fired paperboard or a multi-layer paper composite.

The embedded smart card base is made of high polymer material PVC, ABS, PET or polycarbonate by injection molding.

The utility model discloses an inserted smart card base specially adapted contact smart card, it comprises two parts: the small card base is used for helping the small card base to smoothly pass through subsequent processing (such as chip packaging, coding, personalization, packaging and the like) and enter a flow channel to reach the hands of a final user. The utility model discloses an inserted smart card base, through the female card base of making by the paper material and at least one little card base of taking the chip groove, through inlaying the processing and encapsulating into a whole. The thickness of the paper mother card base is completely consistent with that of the small card base with the chip groove, at least one through hole with the same outline dimension as the small card base is punched on the paper mother card base, the small card base with the chip groove is embedded in the through hole of the paper mother card base during assembly, and the mother card base and the small card base are packaged into a complete product through molten hot melt adhesive. Adopt the utility model discloses a structure is guaranteeing under the prerequisite of all technical index of well-known smart card base, can reduce polymer polymerization material's use amount to 8.12% of well-known product quantity, not only reduces expensive production materials, reduces smart card base manufacturing cost, and more importantly can furthest reduce the pollution of the discarded object of smart card base to the environment.

Because the utility model discloses a smart card base adopts paper as the main production material of mother's card base, and it accounts for the holistic 91.88% of smart card base, and this 91.88% card base just in time is the abandonment that the user will 100%, so the utility model discloses can be with because the pollution of abandonment smart card base to the environment falls to minimumly. Meanwhile, the smart card substrate production does not use the production process of high temperature, high pressure, quenching and shock heating, so that the energy consumption is saved by more than 70%.

Furthermore, the utility model discloses because little card base adopts the injection moulding process shaping, the chip groove that sets up on it also integrated into one piece simultaneously, consequently than present publicly known injection moulding production technology raise the efficiency 10 times.

The utility model discloses still have that productivity is high, the defective percentage is low, the advantage of product size easily controlled, and the production precision can reach 0.01mm rank, and the biggest allowable tolerance scope 0.05 mm. And the product completely meets the standard requirements.

Drawings

The drawings are only intended to illustrate and explain the present invention and do not limit the scope of the invention. Wherein,

fig. 1 is a schematic diagram of the overall structure of a known contact smart card;

FIG. 2 is a schematic structural diagram of the embedded smart card substrate of the present invention;

FIG. 3 is a schematic diagram of a mother card base structure of the embedded smart card base of the present invention;

FIG. 4 is an exploded view of one embodiment of a mother card base of the present invention embedded smart card base;

fig. 5 is a schematic perspective view of a mother card base structure of the embedded smart card base of the present invention;

FIG. 5A is an enlarged partial schematic view of FIG. 5;

fig. 6A is a schematic front view of an embodiment of a small card base of the embedded smart card base of the present invention;

FIG. 6B is a schematic top view of FIG. 6A;

FIG. 6C is a schematic side view of FIG. 6A;

FIG. 6D is an enlarged partial schematic view of FIG. 6C;

FIG. 6E is a schematic view of a small card base with a partial cut;

fig. 7 is a schematic structural diagram of another embodiment of a mother card base of the embedded smart card base of the present invention;

fig. 8 is a schematic structural diagram of another embodiment of a small card base of the embedded smart card base of the present invention;

FIG. 9 is a schematic structural view of the small card base of the present invention embedded in the mother card base;

FIG. 10 is a schematic perspective view of yet another embodiment of a small card base of the embedded smart card base of the present invention;

FIG. 11 is a schematic front view of yet another embodiment of a small card base of the embedded smart card base of the present invention;

FIG. 12 is a schematic side view of a small card base of the damascene smart card base of the present invention;

fig. 13 is a schematic diagram of a structure of a small card base embedded in a mother card base of the embedded smart card base of the present invention.

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described with reference to the accompanying drawings.

Fig. 2 is a schematic structural diagram of the embedded smart card base of the present invention. As shown in fig. 2, the embedded smart card base 20 of the present invention is formed by combining a paper-based mother card base 21 and at least one small card base 22 with a chip slot 23 through an embedding process. The thickness of the paper mother card base 21 is completely consistent with that of the small card base 22 with the chip slot, at least one through packaging hole with the same size as the small card base 22 is punched on the mother card base 21 for packaging the small card base 22, and two or more through holes can be punched on one mother card base 21 for packaging two or more small card bases, for example, the paper mother card base can be used for double-mode and double-card mobile phones. During assembly, the small card base 22 is embedded in the through hole of the mother card base 21, and the mother card base and the small card base are packaged into a complete product by adhering the peripheral connecting surface 220 of the small card base 22 and the side wall of the packaging hole formed in the mother card base 21. The utility model discloses for example can be used to mobile communication's SIM card, GSM card and CDMA card.

Example 1

FIG. 3 is a schematic diagram of a mother card base structure of the embedded smart card base of the present invention; FIG. 4 is an exploded view of one embodiment of a mother card base of the present invention embedded smart card base; fig. 5 is a schematic perspective view of a mother card base structure of the embedded smart card base of the present invention; fig. 5A is a partially enlarged schematic view of fig. 5. As shown in fig. 3, fig. 4, fig. 5, and fig. 5A, and please refer to fig. 2, the embedded smart card base 20 of the present invention includes a mother card base 21 and a separable small card base 22 disposed in the mother card base 21. The mother card base 21 is formed by compounding more than one layer of paper base, and at least one packaging hole 210 is formed in the mother card base. The small card base 22 is made of high polymer materials, the shape of the small card base is matched with the packaging hole 210 on the mother card base 21, the small card base is embedded in the packaging hole 210, the periphery of the small card base 22 is connected with the mother card base 21, and a chip groove 23 is integrally formed in the small card base 22.

The mother card base 21 may be made of a paperboard manufactured by a known frying process, or may be made of a plurality of layers of paper by compounding. The small card base 22 can be made of high polymer material PVC, ABS, PET or polycarbonate by injection molding.

In the present embodiment, a mother card base 21 formed by a three-layer structure is taken as an example for explanation, wherein the mother card base 21 includes a middle layer 212, a bottom layer 211 and a surface layer 213 disposed on the upper and lower surfaces of the middle layer 212; the surface of the top layer 213 and the bottom layer 211 may be printed with visual information required for a smart card. The middle layer 212 is provided with an accommodating cavity 2121, the accommodating cavity 2121 is located at the periphery of the packaging hole 210 and is provided with an adhesive overflow port 2122 communicated with the packaging hole 210, the accommodating cavity 2121 is internally provided with hot melt adhesive, and the side edge of the small card base 22 embedded in the packaging hole 210 can be fixed with the packaging hole 210 through the hot melt adhesive, so that the mother card base 21 and the small card base 22 are packaged into a complete smart card base.

At least two receiving cavities 2121 are provided, and in order to firmly connect the small card base 22 and the mother card base 21, the receiving cavities 2121 are preferably disposed on two opposite sides of the encapsulating hole 210. The receiving cavity 2121 may be circular or square. As shown in fig. 4 and 5, in the present embodiment, four circular receiving cavities 2121 are provided, wherein two receiving cavities are provided at a short side of the encapsulating hole 210, two receiving cavities are provided at two opposite long sides of the encapsulating hole 210, and the four receiving cavities 2121 have glue overflow ports 2122 communicated with the encapsulating hole 210. In addition, in order to improve the connection strength between the small card base 22 and the mother card base 21, the receiving cavity 2121 may be formed in a long groove shape, so as to increase the area of the glue overflow opening 2122 and increase the bonding area between the small card base and the mother card base. According to actual needs, the receiving cavity 2121 may be disposed along the periphery of the encapsulating hole 210 and formed by a continuous or discontinuous elongated slot, so as to further increase the connection strength between the small card base and the mother card base.

Referring to fig. 4, 5 and 5A, the forming principle of the embedded smart card base of the present invention is: in this embodiment, the intermediate layer 212 is punched to form a through-hole 2121 in the thickness direction, and the hole 2121 is formed around the position where the package hole 210 is to be formed. The mother card base can be manufactured by adopting a secondary composite process, wherein one surface of the middle layer 212 is combined with one of the bottom layer 211 or the surface layer 213 into a whole, for example, the lower surface of the middle layer 212 is combined with the bottom layer 211 into a whole; injecting hot melt adhesive into the accommodating cavity 2121; the surface layer 213 is then bonded to the other surface (upper surface) of the intermediate layer 212, thereby forming a paper mother card base composed of a three-layer structure. After the hot melt adhesive is injected into the accommodating cavity 2121, the hot melt adhesive is rolled, and the surface layer 213 or the bottom layer 211 is bonded to the middle layer 212 to form the mother card base 21, so that the pre-embedded capsule is formed in the mother card base 21.

At least one through hole which is used for packaging the small card base 22 and has the same shape as the small card base 22 is punched on the manufactured paper mother card base 21, and the through hole is the packaging hole 210. After the packaging hole 210 is formed in the mother card base 21, the accommodating cavity 2121 is communicated with the packaging hole 210, and a glue overflow opening 2122 of the cavity placing cavity 2121 is formed at a side edge of the packaging hole 210. After the small card base 22 is embedded in the encapsulation hole 210 formed by punching the mother card base 21, the mother card base 21 is heated from the outside, and the melted hot melt adhesive flows out through the adhesive overflow port 2122, so that the mother card base 21 and the small card base 22 are adhered into a whole, the encapsulation of the small card base 22 and the mother card base 21 is completed, and the embedded smart card base is manufactured. After the chip is implanted, a complete smart card is formed, and when the smart card is used, a user only needs to cut off and take down the small card base with the chip and the mother card like a well-known smart card.

In the in-service use, the user only uses little card base 22, and mother card base 21 will all abandonment, because the utility model discloses a mother card base 21 adopts the paper-wood preparation, consequently can not cause any pollution to the environment after the abandonment, can conveniently retrieve through current waste product recovery system moreover. Similarly, because the mother card base 21 is made of paper, high temperature and high pressure are not needed in the production process, the raw material cost can be greatly reduced, the productivity can be greatly improved, the energy consumption is reduced, and the labor productivity is improved.

In the production process of little card base 22, the utility model discloses an injection moulding process makes the chip groove simultaneously on it when producing little card base, constitutes the little card base that has the chip groove, because the volume of moulding plastics compares the great reduction with well-known smart card base, reduces to original 8.12%, consequently production efficiency improves more than 10 times, reaches the purpose that reduces the energy consumption equally.

The utility model discloses broken through the structure of current contact smart card base completely, mainly embodied:

1. and (4) structural breakthrough. The single-structure card base is reasonably divided into a carrier part (mother card base 21) and a user-effective use part (small card base 22).

2. Breakthrough in material usage. The card base made of single high molecular polymer material is changed into a mother card base made of 91.88% of paper base and a small card base made of 8.12% of high molecular polymer material.

3. Breakthrough in production process. The mother card base 21 made of paper material and the small card base 22 made of high molecular polymer material are bonded into a whole through the embedding and packaging process, so that the environmental pollution is reduced, and the use by a user is facilitated.

The utility model discloses under the prerequisite of guaranteeing all technical indicator of contact smart card base, effectively and reduced the pollution of smart card base discarded object to the environment by a wide margin, effectively and reduced the energy consumption of processing production smart card base by a wide margin, improved productivity at to a great extent and reduced the defective percentage.

Example 2

Fig. 6A is a schematic front view of an embodiment of a small card base of the embedded smart card base of the present invention; FIG. 6B is a schematic top view of FIG. 6A; FIG. 6C is a schematic side view of FIG. 6A; FIG. 6D is an enlarged partial schematic view of FIG. 6C; fig. 6E is a schematic diagram of a small card base structure after partial cutting.

As shown in fig. 6A, 6B, 6C, 6D and 6E, the difference between this embodiment and the above embodiment 1 is mainly that the connecting surface 220, at which the periphery of the small card base 22 is connected to the female card base 21, is provided with

grooves

221, 222 corresponding to the glue overflow ports 2122 arranged on the middle layer 212 of the female card base 21, so that the hot melt glue in the pre-embedded capsule of the female card base can be inserted into the

grooves

221, 222 after melting, and the small card base 22 and the female card base 21 are firmly connected into a whole.

In the process of packaging, the mother card base 21 is heated from the outside to melt the hot melt adhesive (pre-embedded capsule) in the accommodating cavity 2121, the melted adhesive flows into the

grooves

221 and 222 arranged on the connecting surface 220 at the periphery of the small card base 22 through the adhesive overflow port 2122 on the side wall of the packaging hole 210 of the mother card base, and after the adhesive is cured, a connecting tenon embedded in the mother card base 21 and the small card base 22 is formed.

In this embodiment, the connection tenon is formed by the cured hot melt adhesive between the small card base 22 and the mother card base 21, so that the connection between the small card base 22 and the mother card base 21 can be more firm. The structure of this embodiment can suitably reduce the quantity and the length of setting up the holding chamber on mother's card base, simplifies manufacturing process, reduces manufacturing cost, and it takes off from mother's card base 21 to be easier for the user small card base 22.

Other structures and advantageous effects of the present embodiment are the same as those of the above embodiment, and are not described herein again.

Example 3

Fig. 7 is a schematic structural diagram of another embodiment of a mother card base of the embedded smart card base of the present invention; fig. 8 is a schematic structural diagram of another embodiment of a small card base of the embedded smart card base of the present invention; fig. 9 is a schematic structural view of the small card base of the present invention embedded in the mother card base.

As shown in fig. 7, 8 and 9, the present embodiment is different from embodiment 1 mainly in that the upper or lower surface of at least one of the mother card base 31 or the small card base 32 is provided with glue-injecting

notches

311 and 321. In the drawings of the present embodiment, only the case where the glue injection groove is provided on the lower surface is shown.

As shown in fig. 7, the glue injection slot may be disposed on only one side of the mother card base 31, and is located at a side of the package hole 310, and one side of the glue injection slot 311 is communicated with the package hole 310; as shown in fig. 8, the glue injection notch 321 may be provided only on one surface of the small card base 33, and the glue injection notch 321 is located at a side edge of the small card base 32, and one side of the glue injection notch 321 may be penetrated through the side edge of the small card base. The

glue injection grooves

311 and 321 form an open glue injection groove for connecting the mother card base 31 and the small card base 32. After the small card base 32 is embedded in the packaging hole 310 of the mother card base 31, the melted adhesive is injected into the glue injection grooves 311 and/or 321 through a known device, such as a glue dispenser, and the connection surface 320 at the periphery of the small card base and the mother card base are bonded and packaged together through the adhesive force of the glue after cooling and curing or ultraviolet irradiation and curing, so as to form the complete embedded smart card base. The shape and length of the

glue injection notch

311 or 321 are not limited, and it may also be a long glue injection notch that is continuous or discontinuous along the periphery of the package hole or the periphery of the small card base, as shown in the figure, which is only one shape shown in an exemplary form. The adhesive can be, for example, a known hot melt adhesive, an instant adhesive, or a UV adhesive.

As shown in fig. 9, in order to firmly connect the small card base 32 and the mother card base 31, it is preferable that the

glue injection grooves

311 and 321 are provided in both the mother card base 31 and the small card base 32, and the glue injection groove 321 formed in the small card base 32 and the glue injection groove 311 formed in the mother card base 31 are located on the same plane and at positions corresponding to each other. The depth of the

glue injection notches

311 and 321 is the same. After the small card base is embedded into the packaging hole of the mother card base, the

glue injection notches

311 and 321 arranged on the same surface of the packaging hole of the mother card base and the small card base correspond to each other and are communicated with each other to form a complete open glue injection groove.

In the packaging process, molten adhesive glue, such as hot melt adhesive, instant adhesive or UV glue, is injected into the

glue injection notches

311 and 321 through a glue dispenser, and the mother card base 31 and the small card base 32 are fixedly connected together after the glue is cooled and cured or is irradiated and cured by ultraviolet light, so as to form a complete embedded smart card base.

Example 4

FIG. 10 is a schematic perspective view of yet another embodiment of a small card base of the embedded smart card base of the present invention; FIG. 11 is a schematic front view of yet another embodiment of a small card base of the embedded smart card base of the present invention; FIG. 12 is a schematic side view of a small card base of the damascene smart card base of the present invention; FIG. 13 is a schematic diagram of a small card base of the present invention embedded in a mother card base.

As shown in fig. 10, 11, 12 and 13, the present embodiment is different from the above embodiments mainly in that the two opposite sides of the upper or lower surface of the small card base 42 are provided with oblique cutting surfaces 43, for example, the cutting surface 43 may be a 45-degree oblique surface, or a 30-degree or 60-degree oblique surface, and the angle thereof is not limited. When manufacturing the small card base 42, it is only necessary to form the downwardly inclined cutting planes 43 at two opposite side edges of the small card base 42, respectively (please refer to fig. 12). For ease of manufacture, the cut surface 43 is preferably formed through the side of the card base. In addition, in order to improve the connection firmness between the small card base 42 and the mother card base 41, the cutting surfaces 43 are preferably formed on two corresponding long sides of the small card base 42.

As shown in fig. 13, after the small card base 42 is mounted in the packaging hole of the mother card base 41, an open glue injection groove for connecting the mother card base 41 and the small card base 42 is formed between the cutting surface 43 and the side wall of the packaging hole of the mother card base 41. After the small card base 42 is embedded in the packaging hole of the mother card base 41, a molten adhesive, such as a hot melt adhesive, an instant adhesive or a UV adhesive, is injected into the open type glue injection groove formed by the cutting surface 43 and the packaging hole by a known device, such as a glue dispenser, and the small card base 42 and the mother card base 41 are bonded and packaged together through the adhesive force of the glue after cooling and curing or after irradiation and curing by ultraviolet light, so as to form a complete embedded smart card base.

Compared with the embodiment 3, in the embodiment, the through cutting surface 43 is formed on one side edge of the small card base 42, and after the small card base 42 is embedded in the packaging hole of the mother card base 41, the open glue injection groove is formed between the side edge of the packaging hole and the cutting surface 43, so that the structure and the method of the embodiment are simpler and more convenient, the manufacturing cost can be further reduced, and the production efficiency can be improved.

Other structures, manufacturing methods and beneficial effects of the present embodiment are the same as those of the above embodiments, and are not described herein again.

The foregoing is merely an illustrative embodiment of the present invention, and is not intended to limit the scope of the invention. Any person skilled in the art should also realize that such equivalent changes and modifications can be made without departing from the spirit and principles of the present invention.

Claims

1. An embedded smart card base comprises a mother card base and a small separable card base arranged in the mother card base, and is characterized in that the mother card base is formed by compounding more than one layer of paper materials and is provided with at least one packaging hole; the small card base is made of high polymer materials, the appearance of the small card base is matched with the packaging hole in the mother card base and is embedded in the packaging hole, and the periphery of the small card base is connected with the mother card base.

2. A mounted smart card substrate as claimed in claim 1, wherein said small card substrate has oblique cut surfaces on two opposite sides of the upper or lower surface thereof, and an open glue injection groove for connecting the small card substrate and the mother card substrate is formed between the side of the package hole on the mother card substrate and the cut surfaces, and is filled with the adhesive glue for connecting the mother card substrate and the small card substrate.

3. A mounted smart card substrate as recited in claim 1, wherein said mother card substrate has at least a three-layer structure including a middle layer, a bottom layer and a top layer disposed on both upper and lower sides of said middle layer; the middle layer is provided with a containing cavity, the containing cavity is positioned at the periphery of the packaging hole and is provided with an adhesive overflow port communicated with the packaging hole, the containing cavity is internally provided with hot melt adhesive, and the hot melt adhesive is embedded between the small card base in the packaging hole and the mother card base and is fixedly connected with the hot melt adhesive.

4. A mounted smart card substrate according to claim 3 wherein said receiving cavity is formed along the perimeter of said packaging aperture and is circular or elongated and is continuous at most in a circular elongated slot.

5. An embedded smart card base as claimed in claim 3 or 4, wherein the thickness of the small card base is the same as that of the mother card base, a groove corresponding to the glue overflow port arranged on the middle layer of the mother card base is arranged on the connection surface of the periphery of the small card base and the mother card base, the hot melt glue in the mother card base can be embedded into the groove, and the small card base is firmly connected with the mother card base.

6. A mounted smart card substrate as recited in claim 1, wherein said at least one of said mother card substrate and said small card substrate has an upper or lower surface provided with an injection recess, said injection recess forming an open injection recess for connecting said mother card substrate and said small card substrate; the glue injection notch is arranged close to the side edge of the packaging hole and/or the small card base, one side edge of the glue injection notch is communicated with the side edge of the packaging hole and/or the small card base, and adhesive glue for connecting the mother card base and the small card base is filled in the glue injection notch.

7. An embedded smart card substrate as recited in claim 6, wherein said glue-injecting grooves formed on said small card substrate and said glue-injecting grooves formed on said mother card substrate are located on the same plane, and have corresponding positions and are connected to each other to form a complete open glue-injecting groove.

8. A mounted smart card substrate as recited in claim 7 wherein said glue injection notches provided in said mother card and said small card substrate, respectively, are of the same depth.

9. A mounted smart card substrate as recited in claim 1, wherein said mother card substrate is constructed from a fired paperboard or a multi-ply paper composite.

10. A mounted smart card substrate as recited in claim 1, wherein said small card substrate is injection molded from a polymeric material selected from the group consisting of PVC, ABS, PET and polycarbonate.