KR20060117541A - Multi functional memory card mass-produced by transfer mold - Google Patents

Abstract

A multi-functional memory card is provided to improve the productivity, to simplify manufacturing processes and to reduce remarkably failure by using an improved transfer mold. Discrete substrates(2,2') are formed inside a rectangle type base substrate(1). Transfer molds(3,3') are formed on the discrete substrates, respectively. The transfer mold is made of a thermosetting resin. The transfer mold is used to enclose the entire upper surface of the discrete substrate and to cover a lower edge portion alone of the discrete substrate. A separation groove(4) is formed at one upper side of the transfer mold. An antenna ground portion(5,5') is formed at both sides of the transfer mold. A plurality of memory cards are formed by cutting discrete substrates.

Description

Multi functional memory card mass-produced by transfer mold

1 is an overall perspective view of a card molding set of a memory card according to the present invention completed by a transfer mold;

2 is a partially enlarged perspective view of a memory card molding set according to the present invention;

3 is an enlarged perspective view of an individual memory card cut from a memory card molding set according to the present invention;

4 is a bottom perspective view of an individual memory card cut from the memory card molding set according to the present invention;

5 is a cross-sectional schematic view of an individual memory card cut from a memory card molding set in accordance with the present invention.

Explanation of symbols on the main parts of the drawings

1: Base board 2,2 ': Individual board

3,3 ': transfer mold 4: separation groove

5,5 ': Antenna ground

10: chip component 11: memory

12: USB terminal

The present invention relates to a memory card used for a mobile phone, a digital camera, an MP3 player, a smart card, and the like, and in particular, since it can be mass-produced at one time by transfer molding without the need for a separate case or assembling work,

It is possible to produce a large amount of memory cards with a simple work process, which not only reduces costs but also maximizes productivity. It also aims at simplifying the production process, minimizing work defects and maintaining stable quality to obtain higher quality products. Multifunctional memory card for mass production by transfer mold.

Memory embedded in or inserted into a mobile phone, a digital camera, an MP3 player, or a smart card is proposed and used in various forms, such as a USB memory, a CF memory, an SD card, and a flash memory. It is applied depending on the form.

These various memory cards require security and a large amount of memory storage space, but also require fast data transfer rates. In order to increase transfer speeds with various portable devices in which such memory cards are inserted, in recent years, mainly USB2.0 communication is used. It is adopted mainly.

However, in order to support USB 2.0 in the main controller of the main body, the development period is not only long, but also bulky, and has a lot of power consumption.

Therefore, in recent years, ultra-thin thin-film memory cards have been released to realize a large amount of storage space. However, since the card itself has a USB port and a built-in USB2.0 controller, no need for a separate cable and allow high-speed communication. The card has been released.

This memory card uses USB2.0 for fast download to flash memory and NAND flash can be used for reading the contents of flash memory from portable devices. It can be used for storage, and its size has also become extremely small and thin due to high integration.

In addition, the ultra-small memory card as described above is easy to expand the storage capacity, even without the installation of a separate cable or driver can be used directly connected to the USB port of the computer without an additional reader.

The production process of such a memory card is outlined. After designing a circuit board, a chip-type component and a memory, etc. are attached to the substrate by a surface mount device (SMD), and the components on the circuit board are molded. The chip dies are processed and made into a unit, and then the adhesive is applied to the bottom of a separate case that can accommodate the chip dies. will be.

Therefore, the conventional multifunctional memory card as described above is composed of a chip die production process, a case forming process, a case adhesive applying process, a chip die pressing process, and an adhesive fixing process.

Therefore, the above-described multi-functional memory card is not suitable for mass production due to its low productivity due to the multi-step production process described above. Therefore, the multi-functional memory card has a high cost of product due to an increase in production cost. It is causing the weighting.

In addition, the cost of the defective products is very high due to the high number of work processes, which are very difficult, and the high quality products are precise and high-performance products, which can cause fatal errors in distribution of defective products. .

The present invention has been made to eliminate the above problems, a base substrate is formed in which the individual substrate having a circuit pattern is continuously formed at a predetermined interval,

A transfer mold is formed by injection molding the entire upper and lower edges of the individual substrate while the device, the memory, and the control chip are bonded on the individual substrate.

By forming the separation groove by the groove on one side of the upper side, and on each side of the antenna ground to expose the internal circuit board, respectively,

Since the continuous formed memory card can be mass-produced at once by the transfer mold, its productivity is greatly improved, and since it is not produced by manual operation such as gluing or press-in, it greatly simplifies the work process and greatly reduces the defective rate. It is an object of the present invention to provide a multifunctional memory card for mass production by a transfer mold having the effect of greatly improving the utility of the memory card by simultaneously forming the ground portion.

Hereinafter, preferred embodiments of the present invention will be described.

1 is an overall perspective view of a card molding set in which a memory card according to the present invention is completed by a transfer mold, and FIG. 2 is a partially enlarged perspective view of the memory card molding set according to the present invention.

Transfer formed by thermosetting resin on the inner side of the base substrate 1 on the rectangular frame body and integrally formed in succession, and on the upper side of the individual substrates 2, 2 '. A mold 3, 3 ′ is formed, wherein the transfer mold 3, 3 ′ is molded by the upper front surface of the individual substrates 2, 2 ′ and the lower edge of the individual substrates 2, 2 ′. ,

The upper side of the transfer mold (3) (3 ') is formed with a recess groove 4 on the groove, and on both sides the individual substrate (2) (2') inside the transfer mold (3) (3 ') is exposed. To form the antenna ground portion 5 (5 '),

The individual substrates 2 and 2 'on which the transfer molds 3 and 3' are molded from the base substrate 1 are cut and configured to be used as memory cards.

In the drawings, reference numeral 10 denotes a chip component, 11 a memory, and 12 a USB terminal.

The operation and production process of the multifunctional memory card for mass production by the transfer mold of the present invention having the above configuration will be described.

First, prior to forming the base substrate 1, a pattern design necessary for a circuit of a memory card is made on a PCB of a predetermined size.

After the pattern design, the same pattern having a predetermined interval is formed on the circuit board according to the pattern. In this state, when the base substrate 1 is punched and formed by a press machine, individual substrates 2 and 2 'of the same size having a constant pattern are continuously formed inside the base substrate 1 on the rectangular frame.

On the individual substrates 2 and 2 ', circuit patterns for soldering various chip components 10, that is, resistors, transistors, diodes, etc., are formed, and among the circuit patterns, control chips for mobile banking or satellite reception. Or a bonding pattern for bonding the memory 11 capable of storing a large amount of data.

Accordingly, various chip components 10 and memory 11 are soldered and bonded to each individual substrate 2 and 2 'by using a surface mount device (SMD).

The base substrate 1 and the individual substrates 2 and 2 'in such a state are introduced into the molding mold, and the transfer substrate is transferred to the individual substrates 2 and 2' according to the upper and lower core shapes of the molding mold. (3) (3 ') is formed,

A transfer mold is a deformation | transformation of the injection molding of thermosetting plastics, such as a phenol resin, and is also called a transfer molding.

The plastic material is changed to a hard state in the process of injecting the material into a closed heating mold and then transferring the material. The operation is performed in the order of preforming → preheating → mold closing → material supply → curing → mold opening → removal of molded products. This molding method is characterized by the use of brittle inserts (metal inserts in the resin), which are suitable for complex shapes and are not possible with normal compression molding.The parts of the product become homogeneous, especially in thick products. . In addition, products with precise dimensions can be obtained, and particularly thin and long products can be formed, and thin and long pipes can be formed.

It was developed around the United States during World War II and widely used for molding industrial parts and electrical parts. The thermosetting resin is molded at about 175 ° C., and the above-mentioned transceiver molds 3 and 3 ' It covers the various chip parts 10 and the memory 11 on the individual substrates 2 and 2 'and serves to protect these parts.

At this time, the transfer mold (3) (3 ') is formed on the upper front surface of the individual substrate (2) (2') and the bottom of the individual substrate (2) (2 ') by molding only the edge, While the various inner parts are protected, the lower contact pattern and the USB terminal 12 are prevented from being molded, thereby enabling connection use with other portable devices.

When the transfer molds 3 and 3 'are molded in this way, when the individual substrates 2 and 2' are cut from the base substrate 1, the memory card as a practically usable product is completed.

At this time, the upper side of the transfer mold (3) (3 ') is formed in the groove groove separating groove 4, when the memory card produced from the base substrate (1) to use in various portable devices, the portable device When the memory card is taken out of the device, the separating groove 4 can be easily used to easily remove the memory card with a fingernail.

As described above, the ultra-thin and ultra-small memory card has a structure that a user cannot easily grasp or take out. Thus, since the memory card is removed using a separate holder, in the present invention, the separation groove 4 is formed as described above. This makes it possible to use the memory card more conveniently.

In addition, the transfer molds 3 and 3 'formed by molding only the lower edges of the individual substrates 2 and 2' are separated from each other by the lower molding. While preventing the flow, the connection pattern or the contact pattern and the USB terminal 12 formed on the lower surface of the individual substrate (2) (2 ') is exposed as it is to be able to insert directly into a variety of portable devices.

In particular, the antenna ground portion 5, 5 'on the groove formed on both sides of the transfer mold 3, 3' is a separate substrate (2) (2) embedded by the transfer mold (3) (3 '). By exposing the inside of '), by allowing antennas of various portable devices to be connected, it is possible to improve the reception power when using satellite reception or mobile banking, etc. to enable more efficient use.

In addition, the built-in memory 11 can be used in a variety of storage capacity, and since no space loss or thickness loss occurs by the transfer mold, it is possible to form a stack of the memory 11 while maintaining the conventional thickness. Therefore, it is possible to complete a micro memory card having a high storage capacity.

Therefore, it is very economical because a large quantity of memory cards can be produced with stable quality without a separate bonding process, a press-fitting and a drying process.

The multifunctional memory card for mass production by the above-described transfer mold of the present invention can mass-produce a continuously formed memory card at a time by the transfer mold, so that its productivity is greatly improved and, as a result, it is not produced by manual labor such as bonding or press-fitting. This greatly simplifies the work process and greatly reduces the failure rate. The formation of the separation groove and the antenna ground at the same time greatly improves the effectiveness of the memory card. Since there is no space loss or thickness loss, it is very suitable for the production of very small and ultra thin memory cards. There is a suitable effect.

Claims (1)

Transfer formed by thermosetting resin on the inner side of the base substrate 1 on the rectangular frame body and integrally formed in succession, and on the upper side of the individual substrates 2, 2 '. A mold 3, 3 ′ is formed, wherein the transfer mold 3, 3 ′ is molded by the upper front surface of the individual substrates 2, 2 ′ and the lower edge of the individual substrates 2, 2 ′. , The upper side of the transfer mold (3) (3 ') is formed with a recess groove 4 on the groove, and on both sides the individual substrate (2) (2') inside the transfer mold (3) (3 ') is exposed. To form the antenna ground portion 5 (5 '), A large amount by transfer mold, characterized by cutting each of the individual substrates 2 and 2 'on which the transfer molds 3 and 3' are molded from the base substrate 1 and using them as memory cards. Multifunctional memory card for production.

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