CN101430774A - SIM card based on metal framework injection molding and its manufacturing technique - Google Patents
SIM card based on metal framework injection molding and its manufacturing technique Download PDFInfo
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- CN101430774A CN101430774A CNA2008102271303A CN200810227130A CN101430774A CN 101430774 A CN101430774 A CN 101430774A CN A2008102271303 A CNA2008102271303 A CN A2008102271303A CN 200810227130 A CN200810227130 A CN 200810227130A CN 101430774 A CN101430774 A CN 101430774A
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- metal framework
- chip
- sim card
- card
- haptic element
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Abstract
The invention discloses an SIM card formed by injection molding based on a metal framework. The SIM card comprises the metal framework and a chip. A plurality of unconnected contact pins are formed on a surface of the metal framework, and the thickness of the contact pins is thicker than that of other part of the metal framework; a contact on the chip is electrically connected with the contact pins by leads; the metal framework, the chip, the contact pins and the lead are mold in a card with a shape suitable for the SIM card by injection, and the contact pins are exposed on a surface of the card. The invention also discloses a preparation process of the SIM card formed by injection molding based on the metal framework, and the preparation process comprises the following steps: forming the metal framework, attaching the chip, plastic package and the like. The preparation process has the following advantages that: 1. the production cost is greatly reduced by taking the metal framework mainly made of copper; 2. a plastic card base is not used in the process, thus avoiding material waste and environmental pollution; 3. equipment such as a production milling machine is no longer used, thus reducing the equipment investment; and 4. the process flow is shortened, and the production efficiency is improved.
Description
Technical field
The present invention relates to a kind of SIM card and preparation technology thereof.
Background technology
Along with development, the information communication of society constantly develops, people use the mode of mobile communication more and more frequent and general, no matter be CDMA or GSM, perhaps recent 3G mobile demand is all in continuous rising, and the demand of the vital SIM cards of mobile phones of communication constantly strengthens in the mobile phone.
SIM card (Subscriber Identity Model client identification module) is also referred to as smart card, subscriber identification card.It has stored digital mobile phone client's information on a computer chip, contents such as encrypted secret key, can differentiate for GSM network client identity, and the voice messaging the when client conversed carries out the use of SIM card, prevented that fully parallel operation and conversation are by the eavesdropping behavior, and the making of SIM card is finished in strict accordance with the GSM international standards, thereby has ensured client's proper communication reliably.
Present employed SIM card mainly comprises: the card base that is made of plastics, on the card base, mill out used inside groove and the water jacket of implantation integrated circuit modules by special-purpose groove milling equipment, and be implanted into integrated circuit modules by implant module equipment at groove again.The problem that this structure exists is the manufacturing cost height, and when SIM was taken off from blocking base, remaining card base generally all went out of use.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of SIM card and preparation technology thereof based on metal framework injection molding, not only can reduce manufacturing cost greatly, enhance productivity, and environmental protection.
In order to address the above problem, the invention provides a kind of SIM card based on metal framework injection molding comprises: metal framework, chip, be formed with a plurality of mutual disjunct haptic elements on the one side of this metal framework, the thickness of haptic element is greater than the thickness of metal framework other parts; Contact on the chip is electrically connected by lead and described haptic element, and described metal framework, chip, haptic element and lead are injection-moulded in the card of fitting mutually with the SIM card profile, and described haptic element is exposed on the one side of described card.
Preferably, also be provided with hollow out on the described metal framework.
Preferably, described lead is spun gold or copper wire, and described lead joins by the contact of pressure welding and described haptic element and described chip.
Preferably, described contact is 8.
Preferably, described framework is the copper metal framework.
The preparation technology who the invention provides a kind of SIM card based on metal framework injection molding comprises the steps:
Step 1: process metal framework by punching press or etch process on sheet metal, be formed with a plurality of mutual disjunct haptic elements in the one side of this metal framework, the thickness of haptic element is greater than the thickness of metal framework other parts;
Step 2: with the SIM chip attachment on metal framework, and between the contact of a plurality of haptic elements and respective chip the pressure welding upper conductor;
Step 3: by plastic package process metal framework, chip, haptic element and lead be injection-moulded in the suitable mutually card of SIM card profile in, and haptic element is exposed on the one side of card.
Preferably, also be provided with hollow out on the described metal framework.
Preferably, described lead is spun gold or copper wire, and described lead joins by the contact of pressure welding and described haptic element and described chip.
Preferably, described framework is the copper metal framework.
Preferably, on the one side that is exposed to described card of described haptic element, also be coated with one deck Gold plated Layer.
The present invention has following advantage:
1, the coil type metal and nonmetal laminar composite of having avoided using expensive import is as chip carrier, and adopting the metal framework based on copper is carrier, greatly reduces production cost and has substituted import;
2 compare with traditional SIM card, and the present invention does not re-use the plastic clip base, and the therefore waste and the environmental pollution of having stopped material meets the energy-saving and emission-reduction policy that current country advocates fully;
3, owing to do not re-use equipment such as production miller, therefore also reduced the equipment input, thereby further reduced manufacturing cost;
4, shorten process flow, improved production efficiency.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is that the A-A of Fig. 1 is to the partial cross section synoptic diagram;
Fig. 3 is the metal framework structure synoptic diagram.
Embodiment
As shown in Figure 1, 2, 3, the present invention includes: copper metal framework 1, chip 3, on metal framework 1, be formed with a plurality of mutual disjunct haptic elements 2, in the present embodiment be 8, the thickness of haptic element 2 is slightly larger than the thickness of metal framework 1 other parts.Can guarantee like this in follow-up plastic packaging envelope can be with the other parts plastic packaging of metal framework 1, and the one side that haptic element 2 is used for being electrically connected with external unit is exposed to outside the plastic packaging shell.
Preparation process of the present invention is as follows:
Step 1: shown in Fig. 1～3, process metal framework 1 by punching press or etch process on the certain thick sheet metal, one side (B face as shown in Figure 2) at this metal framework 1 is formed with 9 zones, wherein 8 zones respectively are formed with a haptic element 2, and the another one zone is used to mount the SIM chip.Through behind the follow-up cutting step, 9 zones form the zone that independently is not electrically connected mutually.The surface gold-plating of haptic element 2, the thickness of haptic element 2 is slightly larger than the thickness of metal framework 1 other parts.In addition, uniform Design has hollow space on metal framework 1, and purpose is in the plastic packaging process, and plastic packaging material can flow into this one side of 8 haptic elements 2;
Step 2: SIM chip 3 is mounted on the relative another side of the face B with haptic element 2 places of metal framework 1 on (face B ' as shown in Figure 2), and in pressure welding between the contact of a plurality of haptic elements 2 and respective chip 3 spun gold, the spun gold here also can adopt copper wire;
Step 3: by plastic package process metal framework 1, chip 3, haptic element 2 and spun gold be injection-moulded in the suitable mutually card 5 of SIM card profile in, plastic packaging goes out the profile of SIM card, the physical dimension specification is according to long 25mm ± 0.1 of national regulation, wide 15mm ± 0.1, thick 0.82 ± 0.01, and haptic element 2 is exposed on the one side of card 5;
Step 4: adopt laser or straight line to cut, also can adopt mould die-cut, the SIM card after plastic packaging is finished cuts into single SIM card finished product, as shown in Figure 1.
It is carrier that the present invention adopts the metal framework 1 based on copper, greatly reduces production cost.In addition and traditional SIM card manufacturing relatively, the present invention adopts the injection moulding mode to form the SIM shell, does not therefore re-use the plastic clip base, thereby has stopped the waste and the environmental pollution of material.
In sum; being preferred embodiment of the present invention only below, is not to be used to limit protection scope of the present invention, therefore; all any modifications of being done within the spirit and principles in the present invention, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1, a kind of SIM card based on metal framework injection molding is characterized in that, comprising: metal framework, chip, on the one side of this metal framework, be formed with a plurality of mutual disjunct haptic elements, and the thickness of haptic element is greater than the thickness of metal framework other parts; Contact on the chip is electrically connected by lead and described haptic element, and described metal framework, chip, haptic element and lead are injection-moulded in the card of fitting mutually with the SIM card profile, and described haptic element is exposed on the one side of described card.
2, SIM card as claimed in claim 1 is characterized in that, described metal framework is provided with hollow out.
3, SIM card as claimed in claim 1 or 2 is characterized in that, described lead is spun gold or copper wire, and described lead joins by the contact of pressure welding and described haptic element and described chip.
4, SIM card as claimed in claim 3 is characterized in that, described contact is 8.
5, SIM card as claimed in claim 4 is characterized in that, described framework is the copper metal framework.
6, a kind of preparation technology of the SIM card based on metal framework injection molding is characterized in that, comprises the steps:
Step 1: process metal framework by punching press or etch process on sheet metal, be formed with a plurality of mutual disjunct haptic elements in the one side of this metal framework, the thickness of haptic element is greater than the thickness of metal framework other parts;
Step 2: with the SIM chip attachment on metal framework, and between the contact of a plurality of haptic elements and respective chip the pressure welding upper conductor;
Step 3: by plastic package process metal framework, chip, haptic element and lead be injection-moulded in the suitable mutually card of SIM card profile in, and haptic element is exposed on the one side of card.
7, method as claimed in claim 6 is characterized in that, also is provided with hollow out on the described metal framework.
As claim 6 or 7 described methods, it is characterized in that 8, described lead is spun gold or copper wire, described lead joins by the contact of pressure welding and described haptic element and described chip.
9, method as claimed in claim 8 is characterized in that, described framework is the copper metal framework.
10, method as claimed in claim 9 is characterized in that, also is coated with one deck Gold plated Layer on the one side that is exposed to described card of described haptic element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102271303A CN101430774A (en) | 2008-11-21 | 2008-11-21 | SIM card based on metal framework injection molding and its manufacturing technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102271303A CN101430774A (en) | 2008-11-21 | 2008-11-21 | SIM card based on metal framework injection molding and its manufacturing technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101430774A true CN101430774A (en) | 2009-05-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008102271303A Pending CN101430774A (en) | 2008-11-21 | 2008-11-21 | SIM card based on metal framework injection molding and its manufacturing technique |
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| Country | Link |
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| CN (1) | CN101430774A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102955972A (en) * | 2011-08-25 | 2013-03-06 | 上海一芯智能科技有限公司 | GSM (global system for mobile communications) mobile phone communication card and package method and device therefor |
| CN101587557B (en) * | 2009-06-29 | 2015-12-09 | 北京握奇数据系统有限公司 | A kind of Subscriber Identity Module and manufacture method thereof and system |
-
2008
- 2008-11-21 CN CNA2008102271303A patent/CN101430774A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101587557B (en) * | 2009-06-29 | 2015-12-09 | 北京握奇数据系统有限公司 | A kind of Subscriber Identity Module and manufacture method thereof and system |
| CN102955972A (en) * | 2011-08-25 | 2013-03-06 | 上海一芯智能科技有限公司 | GSM (global system for mobile communications) mobile phone communication card and package method and device therefor |
| CN102955972B (en) * | 2011-08-25 | 2015-11-18 | 上海一芯智能科技有限公司 | A kind of gsm mobile telephone address card and method for packing thereof and equipment |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20090513 |