CN201298927Y

CN201298927Y - Silicon crystal ground heating board

Info

Publication number: CN201298927Y
Application number: CNU2008201529120U
Authority: CN
Inventors: 王亚言
Original assignee: SHANGHAI ZHENGPAN INDUSTRIAL Co Ltd
Current assignee: SHANGHAI ZHENGPAN INDUSTRIAL Co Ltd
Priority date: 2008-09-10
Filing date: 2008-09-10
Publication date: 2009-08-26
Anticipated expiration: 2018-09-10

Abstract

The utility model relates to a silicon crystal ground heating board which comprises a base 1, a heating layer 2, an electrode 3 and wire connecting terminals 4, wherein, the base 1 consists of a glass fiber board; the heating layer 2 can be screen-printed on the glass fiber board after processing and synthesizing by superfine crystal nano materials, such as silicon, carbon and the like, so that the glass fiber board has the advantages of high temperature resistance, acid and alkali resistance, impact resistance, large ultra-thin area, uniform distribution and uniform heating; and the wire connecting terminals 4 are arranged at two ends of the electrode 3, so that power can be conducted between the two ends. Therefore, the heating boards can be spliced according to the size of the area to be heated, thereby obtaining large area heating.

Description

A kind of silicon wafer floor heating heating board

Technical field

The utility model belongs to a kind of electro-heat equipment, and is especially relevant with the ground electrothermal heating apparatus.

Background technology

General electrothermal heating apparatus is as infrared warmer, heating cable, fiber heating sheet, Electric radiant Heating Film etc.As for infrared warmer, its weak point is that surface temperature is too high, fail safe deficiency, shortcoming such as power consumption is big, heating is inhomogeneous, and intensity, resistance to wear and useful life are short.

The utility model content

The purpose of this utility model provides a kind of uniform silicon wafer floor heating heating board that can splice in flakes, generate heat according to the size of using the place.

The purpose of this utility model reaches like this: comprise substrate, heating layer, electrode, binding post; Heating layer is pressed together on the substrate material, and its both sides are electrode, and binding post is drawn at the two ends of electrode.

From the above, after the binding post energized, the heating layer heating power reaches the purpose of even heating, because binding post is all drawn at the two ends of electrode, substrate can be spliced according to the size and the shape of heating environment, and the expansion heating surface (area) (HS realizes the purpose that floor heating is generated heat.

Description of drawings

Fig. 1 is the utility model one example structure principle schematic;

Embodiment

Referring to Fig. 1, the utility model comprises substrate 1, heating layer 2, electrode 3, binding post 4; Heating layer 2 attached knots are in substrate 1, and its two ends are electrode 3, and binding post 4 is drawn at the two ends of electrode 3.

Substrate 1 can be made of glass mat.Heating layer 2 can by the crystal nanometer material of superfines such as silicon and carbon treated synthetic after, wire mark makes it have high temperature resistant, acid and alkali-resistance, shock-resistant, ultra-thin large tracts of land and the advantage of uniform that is evenly distributed, generates heat on glass mat.Electrode 3 is 2 copper conductors, and the energising back becomes pyrotoxin with regard to heating layer 2 energized.Because the two ends of electrode 3 all are provided with binding post 4, be convenient to each other implement to be communicated with power supply, make the utility model implement splicing, thereby obtain the advantage of large tracts of land heating according to heating service area size.

The extrusion molding heat preserving and insulating material can be laid in substrate 1 below during use, runs off to prevent heat, reduces thermal losses, and minimizing heat energy radiation earthward plays insulation.

Substrate 1 can be arranged to difformities such as square, rectangle or regular hexagon.

The above, it only is the preferred embodiment of the utility model structure, be not that technical scope of the present utility model is imposed any restrictions, so every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification, equivalent variations and modification that above embodiment did.

Claims

1, a kind of silicon wafer floor heating heating board comprises substrate (1), heating layer (2), and electrode (3), binding post (4) is characterized in that: the attached knot of heating layer (2) is in substrate (1), and its two ends are electrode (3), and binding post (4) is drawn at the two ends of electrode (3).

2, silicon wafer floor heating heating board according to claim 1, it is characterized in that: square or rectangular is arranged in substrate (1).

3, silicon wafer floor heating heating board according to claim 1, it is characterized in that: square, rectangle or other shape are arranged in substrate (1), and electrode this moment (3) can be along substrate (1) extension bending.