CN201270372Y - Micro glass packed diode conductive wire forming machine - Google Patents
Micro glass packed diode conductive wire forming machine Download PDFInfo
- Publication number
- CN201270372Y CN201270372Y CNU2008201527981U CN200820152798U CN201270372Y CN 201270372 Y CN201270372 Y CN 201270372Y CN U2008201527981 U CNU2008201527981 U CN U2008201527981U CN 200820152798 U CN200820152798 U CN 200820152798U CN 201270372 Y CN201270372 Y CN 201270372Y
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- CN
- China
- Prior art keywords
- thimble
- cam
- slide block
- mould
- forming machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a mini-type glass sealed diode wire forming machine, which comprises a machine, and a cutting mechanism, a front mold, a back mold and a ram which are arranged on the machine, and a pushing mechanism for driving all components, wherein the front mold and the back mold can joint to form a mold cavity, the cutting mechanism comprises a threading block with threading holes, and the outlet end of the threading block is adjacent to the inlet end of the mold cavity, and a cutter is arranged on the adjacency thereof. The forming machine further comprises a wire pressing mechanism which is arranged on the front side of the threading block, and the wire pressing mechanism comprises a pressing needle fixture, and a pressing needle fixed on the pressing needle fixture. A concave surface is arranged on the head end of the ram, and the angle of the concave surface is 88 degrees. Compared with the prior art, the forming machine reduces the cost of products, and has small product volume, can be applied in mini-type electronic products, and greatly increases the quality of the products.
Description
Technical field
The utility model relates to the diode wire make-up machine, particularly relates to a kind of miniature forming machine for conducting wire of glass-sealed diode.
Background technology
Miniature conducting wire of glass-sealed diode is mainly used in laptop computer and miniature electrical equipment, voltage stabilizing and switching circuit, digital circuit.The product variety that former miniature glass sealed diode production equipment is produced is single, can only produce tack and the criss-cross product of big subfacies, and product quality is difficult to guarantee.
Summary of the invention
Technical problem to be solved in the utility model is exactly to provide a kind of miniature forming machine for conducting wire of glass-sealed diode for the defective that overcomes above-mentioned prior art existence.
The purpose of this utility model can be achieved through the following technical solutions: miniature forming machine for conducting wire of glass-sealed diode, comprise board, be located at the tangent mechanism on the board, front mold, back mould, ram, and the pushing mechanism that drives above-mentioned each parts, described front mold, back mould is involutory to constitute die cavity, described tangent mechanism comprises the threading piece with through wires hole, the port of export of this threading piece is adjacent with the arrival end of die cavity, adjacent is provided with cutting knife, described make-up machine also comprises top line mechanism, this top line mechanism is located at the front side of threading piece, and it comprises the thimble anchor clamps, and is fixed in the thimble on the thimble anchor clamps; The line base is sent between the forward and backward mould through the threading piece, described pushing mechanism promotes the back mould line base is sandwiched die cavity, pushing mechanism continues to promote the back mould, and cutting knife cuts off the line base, and die cavity is pushed into the thimble place, pushing mechanism promotes top line mechanism, thimble ejects to the port of export from the end of mold cavity inlet end with the line base, and pushing mechanism promotes to ram and hits the line blank molding twice, it is characterized in that, described head end of raming is provided with concave surface, and the angle of this concave surface is 88 °.
Described pushing mechanism comprises the main shaft by driven by motor, by travelling gear several power transmission shafts with the main shaft rotation, be located at mould translating cam, thimble cam, the cam of raming on main shaft and the power transmission shaft respectively, and the mould slide block, thimble slide block, the slide block of raming that are used for transmission, described mould slide block is located between back mould and the mould translating cam, described thimble slide block is located between thimble anchor clamps and the thimble cam, and the described slide block of raming is located at and is ramed and ram between the cam.
Described thimble cam is provided with first projection, second projection, and the height of described first projection is 1.2mm, and the height of described second projection is 0.2～0.7mm.
Described raming ramed for wolfram steel.
Compared with prior art, the utility model has reduced the cost of product, and small product size is little, can be used for the miniature electronic product, has improved the quality of product simultaneously greatly.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is a structure of raming of the present utility model;
Fig. 3 is the structural representation of thimble cam of the present utility model.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
Shown in Fig. 1～3, miniature forming machine for conducting wire of glass-sealed diode, comprise board 1, be located at the tangent mechanism 2 on the board 1, front mold 3, back mould 4, ram 5, and the pushing mechanism 6 that drives above-mentioned each parts, described front mold 3, back mould 4 is involutory to constitute die cavity, described tangent mechanism 2 comprises the threading piece 7 with through wires hole, the port of export of this threading piece 7 is adjacent with the arrival end of die cavity, adjacent is provided with cutting knife 8, and described make-up machine also comprises top line mechanism 9, and this top line mechanism 9 is located at the front side of threading piece 7, it comprises thimble anchor clamps 10, and is fixed in the thimble 11 on the thimble anchor clamps 10; The line base is sent between the forward and backward mould 3,4 through threading piece 7, described pushing mechanism 6 promotes back mould 4 the line base is sandwiched die cavity, pushing mechanism 6 continues to promote back mould 4, cutting knife 8 cuts off the line base, and die cavity is pushed into thimble 11 places, and pushing mechanism 6 promotes top line mechanism 9, thimble 11 ejects to the port of export from the end of mold cavity inlet end with the line base, pushing mechanism 6 promotes to ram and 5 hits the line blank moldings twice, and described 5 the head end of raming is provided with concave surface 21, and the angle A of this concave surface 21 is 88 °.
Described pushing mechanism 6 comprises the main shaft 12 by driven by motor, by travelling gear several power transmission shafts 13,14 with main shaft 12 rotations, be located at mould translating cam 15, the thimble cam 16 on main shaft and the power transmission shaft, the cam 17 of raming respectively, and be used for mould slide block 18, the thimble slide block 19 of transmission, the slide block 20 of raming, described mould slide block 18 is located between back mould 4 and the mould translating cam 15, described thimble slide block 19 is located between thimble anchor clamps 10 and the thimble cam 16, and the described slide block 20 of raming is located at and is ramed 5 and ram between the cam 17; Described thimble cam is provided with first projection 22, second projection 23, and the height of described first projection 22 is 1.2mm, and the height of described second projection 23 is 0.2～0.7mm; Described raming 5 ramed for wolfram steel.
The board operation principle: wire rod enters mould, and this moment, the mould cam ran to boss, and mould slide block is slided, make the involutory formation die cavity of mould, simultaneously wire rod is sandwiched die cavity, mould slide block continues to slide, and die strip moving-wire material is through cutting knife, cutting knife cuts off wire rod, die cavity moves to the thimble place, and this moment, the thimble cam slided the thimble slide block, and cut wire rod is ejected mould, by the cam running of raming the slide block of raming is slided, ram and clash into wire rod and the moulding product.Because of board in continuous running, after product fell down, mould slide block was got back to low level again and is waited for line sending, and the thimble slide block and the slide block of raming are all got back to low level and waited for and action next time so just formed the action of a circulation, whenever turn around and will produce a product.
Claims (4)
1. miniature forming machine for conducting wire of glass-sealed diode, comprise board, be located at the tangent mechanism on the board, front mold, back mould, ram, and the pushing mechanism that drives above-mentioned each parts, described front mold, back mould is involutory to constitute die cavity, described tangent mechanism comprises the threading piece with through wires hole, the port of export of this threading piece is adjacent with the arrival end of die cavity, and adjacent is provided with cutting knife, and described make-up machine also comprises top line mechanism, this top line mechanism is located at the front side of threading piece, it comprises the thimble anchor clamps, and is fixed in the thimble on the thimble anchor clamps, it is characterized in that, described head end of raming is provided with concave surface, and the angle of this concave surface is 88 °.
2. miniature forming machine for conducting wire of glass-sealed diode according to claim 1, it is characterized in that, described pushing mechanism comprises the main shaft by driven by motor, by travelling gear several power transmission shafts with the main shaft rotation, be located at the mould translating cam on main shaft and the power transmission shaft respectively, the thimble cam, the cam of raming, and the mould slide block that is used for transmission, the thimble slide block, the slide block of raming, described mould slide block is located between back mould and the mould translating cam, described thimble slide block is located between thimble anchor clamps and the thimble cam, and the described slide block of raming is located at and is ramed and ram between the cam.
3. miniature forming machine for conducting wire of glass-sealed diode according to claim 2 is characterized in that, described thimble cam is provided with first projection, second projection, and the height of described first projection is 1.2mm, and the height of described second projection is 0.2～0.7mm.
4. according to claim 1 or 3 described miniature forming machine for conducting wire of glass-sealed diode, it is characterized in that described raming ramed for wolfram steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201527981U CN201270372Y (en) | 2008-09-05 | 2008-09-05 | Micro glass packed diode conductive wire forming machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201527981U CN201270372Y (en) | 2008-09-05 | 2008-09-05 | Micro glass packed diode conductive wire forming machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201270372Y true CN201270372Y (en) | 2009-07-08 |
Family
ID=40842982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201527981U Expired - Fee Related CN201270372Y (en) | 2008-09-05 | 2008-09-05 | Micro glass packed diode conductive wire forming machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201270372Y (en) |
-
2008
- 2008-09-05 CN CNU2008201527981U patent/CN201270372Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090708 Termination date: 20170905 |