CN101656390B - Forming machine for conducting wire of glass-sealed diode - Google Patents
Forming machine for conducting wire of glass-sealed diode Download PDFInfo
- Publication number
- CN101656390B CN101656390B CN 200810041953 CN200810041953A CN101656390B CN 101656390 B CN101656390 B CN 101656390B CN 200810041953 CN200810041953 CN 200810041953 CN 200810041953 A CN200810041953 A CN 200810041953A CN 101656390 B CN101656390 B CN 101656390B
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- thimble
- mould
- slide block
- cam
- forming machine
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention relates to a forming machine for a conducting wire of a glass-sealed diode. The forming machine comprises a station, a thread cutting mechanism, a front mold, a rear mold and a ram which are arranged on the station, a pushing mechanism for driving the components, and a thread ejection mechanism, wherein the front mold and the rear mold can be closed to form a mold cavity; the thread cutting mechanism comprises a threading block provided with a threading hole; an outlet end of the threading block is adjacent to an inlet end of a mold cavity; a cutting knife is arranged at the adjacent position; and the thread ejection mechanism is arranged on the front side of the threading block, and comprises a thimble fixture and a thimble fixed on the thimble fixture. Compared with the prior art, a product produced by the forming machine has higher dimensional precision and smooth surface, completely improves the defects such as clamp marks, scratches, burrs and the like, has a fully smooth incision surface, and not only has qualitative change of the product quality, but also greatly improves the production efficiency from the original 120 counts/min to the current 180 counts/min.
Description
Technical field
The present invention relates to the diode wire make-up machine, particularly relate to a kind of forming machine for conducting wire of glass-sealed diode.
Background technology
Conducting wire of glass-sealed diode is mainly used in producing light-emitting diode and rectifier diode.Originally the lead product is to be shaped by the clamping of lead forming machine, and the formed product dimensional accuracy is lower, and there are defectives such as catcher mark, scuffing, burr in rough surface, and production efficiency is not high.
Summary of the invention
Technical problem to be solved by this invention is exactly to provide a kind of forming machine for conducting wire of glass-sealed diode for the defective that overcomes above-mentioned prior art existence.
Purpose of the present invention can be achieved through the following technical solutions: forming machine for conducting wire of glass-sealed diode, comprise board, be located at the tangent mechanism on the board, front mold, back mould, ram, and the pushing mechanism that drives above-mentioned each parts, described front mold, back mould is involutory to constitute die cavity, it is characterized in that, described tangent mechanism comprises the threading piece with through wires hole, the port of export of this threading piece is adjacent with the arrival end of die cavity, adjacent is provided with cutting knife, and described make-up machine also comprises top line mechanism, and this top line mechanism is located at the front side of threading piece, it comprises the thimble anchor clamps, and is fixed in the thimble on the thimble anchor clamps; The line base is sent between the forward and backward mould through the threading piece, described pushing mechanism promotes the back mould line base is sandwiched die cavity, pushing mechanism continues to promote the back mould, cutting knife cuts off the line base, die cavity is pushed into the thimble place, pushing mechanism promotes top line mechanism, and thimble ejects to the port of export from the end of mold cavity inlet end with the line base, and the pushing mechanism promotion is ramed and hit the line blank molding.
Described pushing mechanism comprises the main shaft by driven by motor, by travelling gear several power transmission shafts with the main shaft rotation, be located at mould translating cam, thimble cam, the cam of raming on main shaft and the power transmission shaft respectively, and the mould slide block, thimble slide block, the slide block of raming that are used for transmission, described mould slide block is located between back mould and the mould translating cam, described thimble slide block is located between thimble anchor clamps and the thimble cam, and the described slide block of raming is located at and is ramed and ram between the cam.
Compared with prior art, the product size precision that the present invention produces is higher, smooth surface, defectives such as catcher mark, scuffing, burr are thoroughly improved, cut sides is smooth fully, not only make product quality that the change of matter has been arranged, and production efficiency improves greatly, bring up to 180 present/min by 120 original/min.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a schematic diagram one of the present invention;
Fig. 3 is a schematic diagram two of the present invention.
Embodiment
The invention will be further described below in conjunction with accompanying drawing.
Shown in Fig. 1～3, forming machine for conducting wire of glass-sealed diode, comprise board 1, be located at the tangent mechanism 2 on the board 1, front mold 3, back mould 4, ram 5, and the pushing mechanism 6 that drives above-mentioned each parts, described front mold 3, back mould 4 is involutory to constitute die cavity, described tangent mechanism 2 comprises the threading piece 7 with through wires hole, the port of export of this threading piece 7 is adjacent with the arrival end of die cavity, adjacent is provided with cutting knife 8, and described make-up machine also comprises top line mechanism 9, and this top line mechanism 9 is located at the front side of threading piece 7, it comprises thimble anchor clamps 10, and is fixed in the thimble 11 on the thimble anchor clamps 10; The line base is sent between the forward and backward mould 3,4 through threading piece 7, described pushing mechanism 6 promotes back mould 4 the line base is sandwiched die cavity, pushing mechanism 6 continues to promote back mould 4, cutting knife 8 cuts off the line base, die cavity is pushed into thimble 11 places, pushing mechanism 6 promotes top line mechanisms 9, and thimble 11 ejects to the port of export from the end of mold cavity inlet end with the line base, and pushing mechanism 6 promotes to ram and 5 hits the line blank moldings.
Described pushing mechanism 6 comprises the main shaft 12 by driven by motor, by travelling gear several power transmission shafts 13,14 with main shaft 12 rotations, be located at mould translating cam 15, the thimble cam 16 on main shaft and the power transmission shaft, the cam 17 of raming respectively, and be used for mould slide block 18, the thimble slide block 19 of transmission, the slide block 20 of raming, described mould slide block 18 is located between back mould 4 and the mould translating cam 15, described thimble slide block 19 is located between thimble anchor clamps 10 and the thimble cam 16, and the described slide block 20 of raming is located at and is ramed 5 and ram between the cam 17.
The present invention changes extrusion molding in the present hole by wire forming machine is improved into by original clamping shaping.The board operation principle: wire rod enters mould, and this moment, the mould cam ran to boss, and mould slide block is slided, make the involutory formation die cavity of mould, simultaneously wire rod is sandwiched die cavity, mould slide block continues to slide, and die strip moving-wire material is through cutting knife, cutting knife cuts off wire rod, die cavity moves to the thimble place, and this moment, the thimble cam slided the thimble slide block, and cut wire rod is ejected mould, by the cam running of raming the slide block of raming is slided, ram and clash into wire rod and the moulding product.Because of board in continuous running, after product fell down, mould slide block was got back to low level again and is waited for line sending, and the thimble slide block and the slide block of raming are all got back to low level and waited for and action next time so just formed the action of a circulation, whenever turn around and will produce a product.
Claims (2)
1. forming machine for conducting wire of glass-sealed diode, comprise board, be located at tangent mechanism on the board, front mold, back mould, ram, and the pushing mechanism that drives above-mentioned each parts, described front mold, the back mould is involutory constitutes die cavity, it is characterized in that, described tangent mechanism comprises the threading piece with through wires hole, the port of export of this threading piece is adjacent with the arrival end of die cavity, adjacent is provided with cutting knife, and described make-up machine also comprises top line mechanism, and this top line mechanism is located at the front side of threading piece, it comprises the thimble anchor clamps, and is fixed in the thimble on the thimble anchor clamps; The line base is sent between the forward and backward mould through the threading piece, described pushing mechanism promotes the back mould line base is sandwiched die cavity, pushing mechanism continues to promote the back mould, cutting knife cuts off the line base, die cavity is pushed into the thimble place, pushing mechanism promotes top line mechanism, and thimble ejects to the port of export from the end of mold cavity inlet end with the line base, and the pushing mechanism promotion is ramed and hit the line blank molding.
2. forming machine for conducting wire of glass-sealed diode according to claim 1, it is characterized in that, described pushing mechanism comprises the main shaft by driven by motor, by travelling gear several power transmission shafts with the main shaft rotation, be located at the mould translating cam on main shaft and the power transmission shaft respectively, the thimble cam, the cam of raming, and the mould slide block that is used for transmission, the thimble slide block, the slide block of raming, described mould slide block is located between back mould and the mould translating cam, described thimble slide block is located between thimble anchor clamps and the thimble cam, and the described slide block of raming is located at and is ramed and ram between the cam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810041953 CN101656390B (en) | 2008-08-21 | 2008-08-21 | Forming machine for conducting wire of glass-sealed diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810041953 CN101656390B (en) | 2008-08-21 | 2008-08-21 | Forming machine for conducting wire of glass-sealed diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101656390A CN101656390A (en) | 2010-02-24 |
| CN101656390B true CN101656390B (en) | 2011-01-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810041953 Active CN101656390B (en) | 2008-08-21 | 2008-08-21 | Forming machine for conducting wire of glass-sealed diode |
Country Status (1)
| Country | Link |
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| CN (1) | CN101656390B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544975A (en) * | 2010-12-30 | 2012-07-04 | 上海慧高精密电子工业有限公司 | Production device for high-quality guide pin |
| CN102568697A (en) * | 2010-12-31 | 2012-07-11 | 上海慧高精密电子工业有限公司 | Bridge rectifier wire molding device |
| CN102543300B (en) * | 2010-12-31 | 2014-07-09 | 上海慧高精密电子工业有限公司 | Z-shaped lead molding device |
| CN102142305A (en) * | 2011-03-08 | 2011-08-03 | 上海慧高精密电子工业有限公司 | Eight-section lead moulding device and control method for same |
| CN109365693A (en) * | 2018-12-21 | 2019-02-22 | 东莞市混沌电子科技有限公司 | A kind of automatic unwrapping wire trimming equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5040940A (en) * | 1988-11-07 | 1991-08-20 | Helmut Kolodziej | Device for the alignment of the desheathed ends of round cables |
| CN1285595A (en) * | 1999-08-24 | 2001-02-28 | 住友电气工业株式会社 | Wire products making method, equipment for making same and wire products |
| CN1612432A (en) * | 2003-10-28 | 2005-05-04 | 科马斯控股股份公司 | Device for processing a wire |
| CN201048237Y (en) * | 2007-06-05 | 2008-04-16 | 吴志浩 | Automatized wire-stripping and tin-coating device |
| CN201263037Y (en) * | 2008-08-21 | 2009-06-24 | 上海慧高精密电子工业有限公司 | Device for forming glass-sealing diode conductor |
-
2008
- 2008-08-21 CN CN 200810041953 patent/CN101656390B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5040940A (en) * | 1988-11-07 | 1991-08-20 | Helmut Kolodziej | Device for the alignment of the desheathed ends of round cables |
| CN1285595A (en) * | 1999-08-24 | 2001-02-28 | 住友电气工业株式会社 | Wire products making method, equipment for making same and wire products |
| CN1612432A (en) * | 2003-10-28 | 2005-05-04 | 科马斯控股股份公司 | Device for processing a wire |
| CN201048237Y (en) * | 2007-06-05 | 2008-04-16 | 吴志浩 | Automatized wire-stripping and tin-coating device |
| CN201263037Y (en) * | 2008-08-21 | 2009-06-24 | 上海慧高精密电子工业有限公司 | Device for forming glass-sealing diode conductor |
Non-Patent Citations (2)
| Title |
|---|
| JP昭62-128436A 1987.06.10 |
| JP昭64-12481A 1989.01.17 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101656390A (en) | 2010-02-24 |
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Effective date of registration: 20170921 Address after: 201108, room 101, A District, 688 West Spring Road, Shanghai, Minhang District Patentee after: Light path new energy material (Shanghai) Co., Ltd. Address before: 201108 No. 688 West Spring Road, Xhenzhuang Industrial Zone, Shanghai, Minhang District Patentee before: Huigao Precise Electronic Industry Co., Ltd. |