CN201267022Y - Heating coil for purifying polycrystalline silicon empty space melt - Google Patents
Heating coil for purifying polycrystalline silicon empty space melt Download PDFInfo
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- CN201267022Y CN201267022Y CNU2008201365205U CN200820136520U CN201267022Y CN 201267022 Y CN201267022 Y CN 201267022Y CN U2008201365205 U CNU2008201365205 U CN U2008201365205U CN 200820136520 U CN200820136520 U CN 200820136520U CN 201267022 Y CN201267022 Y CN 201267022Y
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 37
- 238000010438 heat treatment Methods 0.000 title abstract description 24
- 229920005591 polysilicon Polymers 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000000498 cooling water Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims 2
- 235000012771 pancakes Nutrition 0.000 claims 1
- 238000007670 refining Methods 0.000 claims 1
- 230000007306 turnover Effects 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 abstract description 42
- 230000008018 melting Effects 0.000 abstract description 42
- 229910052710 silicon Inorganic materials 0.000 abstract description 7
- 239000010703 silicon Substances 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 3
- 238000000746 purification Methods 0.000 description 17
- 238000004857 zone melting Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 241000405070 Percophidae Species 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000005672 electromagnetic field Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 206010017076 Fracture Diseases 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000013014 purified material Substances 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P20/00—Technologies relating to chemical industry
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Abstract
本实用新型公开了一种用于多晶硅真空区熔提纯的加热线圈,包括线圈骨架、线圈水冷管、其特征在于,在线圈骨架内圆周围的上表面设有两级台阶,第二级台阶的底部一端和线圈骨架内圆边沿连接成的斜面与水平面呈第二倾斜角度,所述线圈骨架内圆为偏心式结构,线圈下表面上设有一个偏心刻槽。本实用新型所述加热线圈克服了真空区熔提纯过程中直径较大多晶硅边缘易出现毛刺的缺陷。内径偏心式结构,大大降低熔区出现腰带的可能性,线圈上表面倾斜设计,增强了多晶熔化界面熔硅流动性。在线圈骨架上靠近电极上法兰和电极下法兰的一侧设置一个切面互相平行的倾斜切口,减少了电磁泄漏。
The utility model discloses a heating coil for melting and purifying polysilicon in a vacuum zone, which comprises a coil frame and a coil water-cooled tube. The slope formed by connecting one end of the bottom with the inner circle edge of the coil frame forms a second inclination angle with the horizontal plane. The inner circle of the coil frame is an eccentric structure, and an eccentric groove is provided on the lower surface of the coil. The heating coil described in the utility model overcomes the defect that burrs are easy to appear on the edge of polysilicon with larger diameter during the process of melting and purifying in the vacuum zone. The eccentric structure of the inner diameter greatly reduces the possibility of a belt in the melting zone, and the inclined design of the upper surface of the coil enhances the fluidity of the molten silicon at the polycrystalline melting interface. On the side of the coil frame close to the upper flange of the electrode and the lower flange of the electrode, an oblique cut with cut planes parallel to each other is provided to reduce electromagnetic leakage.
Description
技术领域 technical field
本实用新型涉及多晶硅真空提纯领域,尤其涉及一种用于多晶硅真空区熔提纯的加热线圈。The utility model relates to the field of vacuum purification of polysilicon, in particular to a heating coil for melting and purifying polysilicon in a vacuum zone.
背景技术 Background technique
区域熔炼,简称区熔,指根据液体混合物在冷凝结晶过程中组分重新分布(称为偏析)的原理,通过多次熔融和凝固,制备纯度可达99.999%的高纯度的金属、半导体材料和有机化合物的一种提纯方法。区熔的典型方法是将被提纯的材料制成长度为0.5~3m或更长些的细棒,通过高频感应加热,使一小段固体熔融成液态,熔融区液相温度仅比固体材料的熔点高几度,稍加冷却就会析出固相。熔融区沿轴向缓慢移动,每小时几至十几厘米。随着熔融区向前移动,杂质也随着移动,最后富集于棒的一端,予以切除。一次区域熔炼往往不能满足所要求的纯度,通常须经多次重复操作,或在一次操作中沿细棒的长度依次形成几个熔融区。Zone melting, referred to as zone melting, refers to the preparation of high-purity metals, semiconductor materials and A method of purification of organic compounds. The typical method of zone melting is to make the purified material into a thin rod with a length of 0.5 ~ 3m or longer, and through high-frequency induction heating, a small section of solid is melted into a liquid state, and the liquid phase temperature in the melting zone is only higher than that of the solid material. The melting point is a few degrees higher, and a solid phase will precipitate out after a little cooling. The melting zone moves slowly along the axial direction, a few to ten centimeters per hour. As the melting zone moves forward, the impurities also move along, and are finally enriched at one end of the rod and removed. One-time zone smelting often cannot meet the required purity, and usually has to be repeated many times, or several melting zones are formed sequentially along the length of the thin rod in one operation.
利用杂质的蒸发及分凝效应,对多晶硅进行多次真空区熔提纯是制备低补偿、高纯度高阻区熔硅材料的必要步骤。由于多晶硅在提纯过程中,多晶各向结晶速率不一致,结晶潜热的释放极易使大直径多晶硅内部产生裂痕,导致无法使用,所以目前真空区熔提纯的多晶硅直径一般控制在50±2mm以下。由于制备高阻硅材料需要对多晶硅进行多次提纯,提纯的稳定性显得尤为重要,即制备期间如出现多晶边缘长刺、熔区凝固、熔区出现腰带、塌炉等情况都将中断整个制备过程,腰带生成一般在多晶提纯的放肩阶段,由于加热功率、热场形状、多晶形状三者不匹配,导致在熔区中心部分形成一圈带状的不熔化固体,俗称“腰带”,因此,一个稳定的用于真空区熔提纯的热场就显得尤为重要,热场的核心部分是加热线圈。Utilizing the evaporation and segregation effects of impurities, multiple times of vacuum melting and purification of polysilicon is a necessary step for preparing low compensation, high purity and high resistance melting silicon materials. During the purification process of polysilicon, the crystallization rate of polysilicon is inconsistent in all directions, and the release of latent heat of crystallization can easily cause cracks in the large-diameter polysilicon, which makes it unusable. Therefore, the diameter of polysilicon purified by vacuum zone melting is generally controlled below 50±2mm. Since the preparation of high-resistance silicon materials requires multiple purifications of polysilicon, the stability of the purification is particularly important, that is, during the preparation, if there are thorns on the edge of the polysilicon, solidification in the melting zone, belts in the melting zone, and furnace collapse, the entire process will be interrupted. In the preparation process, the belt is generally formed in the shoulder stage of polycrystalline purification. Due to the mismatch between the heating power, the shape of the thermal field, and the shape of the polycrystal, a belt-shaped non-melting solid is formed in the center of the melting zone, commonly known as "belt". ", therefore, a stable thermal field for melting and purification in the vacuum zone is particularly important, and the core part of the thermal field is the heating coil.
传统的用于52mm以下硅单晶生长的加热线圈一般为平板“鸭嘴线圈”,如图1和图2所示,线圈水冷管位于线圈骨架外围,线圈骨架内圆为一正圆,线圈下表面为一倾斜表面,在线圈有切口的一端采用法兰将线圈水冷管固定,目前,通常直接将这种“鸭嘴线圈”用于多晶硅真空提纯,但由于多晶硅真空提纯与单晶硅生长工艺特点并不相同,当多晶直径逐渐加大,多晶熔化界面熔硅流动性变差,多晶熔化边缘因过冷易产生毛刺,当多晶直径大于45mm时,这种现象尤为明显,很难应用于需要进行多次真空区熔提纯的工艺中,实验证明此种加热线圈并不适合真空区熔提纯。The traditional heating coil used for the growth of silicon single crystals below 52mm is generally a flat "duckbill coil". The surface is an inclined surface, and a flange is used to fix the coil water-cooling tube at the end of the coil. At present, this "duckbill coil" is usually directly used for polysilicon vacuum purification, but due to polysilicon vacuum purification and single crystal silicon growth process The characteristics are not the same. When the polycrystalline diameter gradually increases, the fluidity of the molten silicon at the polycrystalline melting interface becomes poor, and the polycrystalline melting edge is prone to burrs due to overcooling. When the polycrystalline diameter is greater than 45mm, this phenomenon is particularly obvious. It is difficult to apply to the process that requires multiple vacuum zone melting and purification. Experiments have proved that this kind of heating coil is not suitable for vacuum zone melting and purification.
可用于多晶硅真空区熔提纯的还有一种丹麦线圈,如图3和图4所示,线圈上表面刻有一个台阶,线圈下表面有倾斜设计,线圈骨架内圆采用偏心设计,即靠近法兰一侧为一矩形加一正半圆,另一侧为正半圆,实验证明这种线圈效果并不好,单台阶设计虽然在一定程度上降低了多晶熔化边缘长刺的几率,但由于台阶能量辐射范围有限,易造成局部能量分布不均,局部过冷产生毛刺,同时采用此种线圈提纯过程中,多晶熔化界面熔硅流动性仍然较差,存在塌炉隐患。此外,线圈采用的偏心设计,虽然在理论上可以降低腰带产生的几率,但由于线圈中心不对称程度较大,造成能量分布不均匀性较大,局部能量过低,对去除腰带的效果并不明显。There is also a Danish coil that can be used for melting and purifying polysilicon in a vacuum zone. As shown in Figure 3 and Figure 4, a step is engraved on the upper surface of the coil, the lower surface of the coil has an inclined design, and the inner circle of the coil skeleton adopts an eccentric design, that is, it is close to the flange. One side is a rectangle plus a positive semicircle, and the other side is a positive semicircle. The experiment proves that the effect of this coil is not good. Although the single-step design reduces the probability of thorns on the edge of polycrystalline melting to a certain extent, due to the step energy The radiation range is limited, which can easily cause uneven local energy distribution and local overcooling to produce burrs. At the same time, during the purification process using this coil, the fluidity of molten silicon at the polycrystalline melting interface is still poor, and there is a hidden danger of furnace collapse. In addition, the eccentric design of the coil can reduce the probability of belt generation in theory, but due to the large degree of asymmetry in the center of the coil, the energy distribution is relatively uneven, and the local energy is too low, which is not effective in removing the belt. obvious.
实用新型内容 Utility model content
本实用新型解决的技术问题是,提供一种用于多晶硅真空区熔提纯的加热线圈,为真空区熔提纯提供热场的同时,可以克服真空区熔提纯过程中直径较大的多晶硅边缘易出现毛刺的缺陷。The technical problem solved by the utility model is to provide a heating coil for melting and purifying polysilicon in a vacuum zone, which can provide a thermal field for melting and purifying in a vacuum zone, and can overcome the tendency of the polysilicon edge with a larger diameter to appear during the process of melting and purifying in a vacuum zone Glitch defect.
本实用新型采用的技术方案是,所述用于多晶硅真空区熔提纯的加热线圈,包括线圈骨架和线圈水冷管,线圈水冷管焊接嵌入线圈骨架内,线圈骨架内圆下边沿一端和线圈下表面连接成的斜面与水平面呈第一倾斜角度,该线圈采用平板单匝结构,在线圈骨架内圆周围的上表面设有第一级台阶和第二级台阶,第一级台阶所在圆的直径大于第二级台阶所在圆的直径,第二级台阶的底部一端和线圈骨架内圆边沿连接成的斜面与水平面呈第二倾斜角度。The technical solution adopted by the utility model is that the heating coil used for melting and purifying polysilicon in a vacuum zone includes a coil frame and a coil water-cooled tube, the coil water-cooled tube is welded and embedded in the coil frame, and one end of the lower edge of the inner circle of the coil frame and the lower surface of the coil The connected inclined plane and the horizontal plane form a first inclined angle. The coil adopts a flat single-turn structure, and the upper surface around the inner circle of the coil bobbin is provided with a first step and a second step. The diameter of the circle where the first step is located is greater than The diameter of the circle where the second step is located, and the slope formed by connecting the bottom end of the second step with the edge of the inner circle of the coil bobbin form a second inclination angle with the horizontal plane.
该线圈进一步包括电极上法兰和电极下法兰,电极上法兰和电极下法兰上有电极连接孔和水冷管孔,线圈水冷管穿过水冷管孔并分别与电极上法兰和电极下法兰相焊接,循环冷却水由线圈水冷管进出线圈骨架,在所述线圈骨架上靠近电极上法兰和电极下法兰的一侧设置一个切口。The coil further includes an electrode upper flange and an electrode lower flange. The electrode upper flange and the electrode lower flange have electrode connection holes and water cooling tube holes. The coil water cooling tube passes through the water cooling tube hole and connects with the electrode upper flange and the electrode respectively. The lower flanges are welded together, and the circulating cooling water enters and exits the coil frame through the coil water cooling tube, and a cutout is set on the side of the coil frame close to the electrode upper flange and the electrode lower flange.
作为一种优选的技术方案,所述线圈骨架内圆为偏心式结构,可以由一个半圆和半个椭圆组成,线圈下表面上设有一个偏心刻槽。As a preferred technical solution, the inner circle of the coil frame is an eccentric structure, which may be composed of a semicircle and a half ellipse, and an eccentric groove is provided on the lower surface of the coil.
作为另一种优选的技术方案,所述切口为一个切面互相平行的倾斜切口。As another preferred technical solution, the cut is an oblique cut with cut planes parallel to each other.
采用上述技术方案,本实用新型至少具有下列优点:By adopting the above-mentioned technical scheme, the utility model has at least the following advantages:
本实用新型所述用于多晶硅真空区熔提纯的加热线圈适合多次真空区熔提纯,线圈上表面有两级台阶,克服了真空区熔提纯过程中直径较大多晶硅边缘易出现毛刺的缺陷。内径偏心式设计,大大降低熔区出现腰带的可能性,线圈上表面倾斜设计,增强了多晶熔化界面熔硅流动性。线圈下表面倾斜设计,有利于多晶结晶潜热的释放。在线圈骨架上靠近电极上法兰和电极下法兰的一侧设置一个切面互相平行的倾斜切口,减少了电磁泄漏。The heating coil used for melting and purifying polysilicon in a vacuum zone described in the utility model is suitable for multiple vacuum zone melting and purification. There are two steps on the upper surface of the coil, which overcomes the defect that burrs are easy to appear on the edge of polysilicon with a large diameter during the process of melting and purifying in a vacuum zone. The eccentric design of the inner diameter greatly reduces the possibility of a belt in the melting zone, and the inclined design of the upper surface of the coil enhances the fluidity of the molten silicon at the polycrystalline melting interface. The inclined design of the lower surface of the coil is conducive to the release of latent heat of polycrystalline crystallization. On the side of the coil frame close to the upper flange of the electrode and the lower flange of the electrode, an oblique cut with cut planes parallel to each other is arranged to reduce electromagnetic leakage.
附图说明 Description of drawings
图1为鸭嘴线圈结构示意图;Fig. 1 is a schematic diagram of the duckbill coil structure;
图2为图1的A-A面剖视图;Fig. 2 is the A-A plane sectional view of Fig. 1;
图3为丹麦线圈结构示意图;Fig. 3 is a schematic diagram of the Danish coil structure;
图4为图3的A-A面剖视图;Fig. 4 is a sectional view of plane A-A of Fig. 3;
图5为本实用新型第一实施例加热线圈结构示意图;Fig. 5 is a schematic structural diagram of the heating coil of the first embodiment of the utility model;
图6为图5的A-A面剖视图;Fig. 6 is a sectional view of plane A-A of Fig. 5;
图7为图5的B向视图;Fig. 7 is the B direction view of Fig. 5;
图8为本实用新型第三实施例所述用于多晶硅真空区熔提纯的加热线圈结构示意图;Fig. 8 is a schematic structural diagram of the heating coil used for melting and purifying polysilicon in a vacuum zone according to the third embodiment of the present invention;
图9为图7的A-A面剖视图;Fig. 9 is a sectional view of plane A-A of Fig. 7;
图10为图7的B向视图;Fig. 10 is the B direction view of Fig. 7;
图11本实用新型第四实施例中加热线圈的切口示意图。Fig. 11 is a schematic diagram of the cutout of the heating coil in the fourth embodiment of the utility model.
具体实施方式 Detailed ways
为更进一步阐述本实用新型为达成预定目的所采取的技术手段及功效,以下结合附图及较佳实施例,对本实用新型提出的所述用于多晶硅真空区熔提纯的加热线圈详细说明如后。In order to further explain the technical means and effects adopted by the utility model to achieve the intended purpose, the heating coil for polysilicon vacuum zone melting and purification proposed by the utility model will be described in detail as follows in conjunction with the accompanying drawings and preferred embodiments. .
本实用新型第一实施例,所述用于多晶硅真空区熔提纯的加热线圈结构如图5所示,采用薄饼式平板单匝线圈的基本结构,所述薄饼式单匝结构的厚度为7~9mm。所述加热线圈包括线圈骨架501、线圈水冷管502、电极上法兰503和电极下法兰504,线圈水冷管502焊接嵌入线圈骨架501内,这种结构可以提高水冷的效果,同时易于线圈表面的加工,线圈骨架501和线圈水冷管502均采用紫铜T2级。如图7所示,电极上法兰503和电极下法兰504上有电极连接孔701和供线圈水冷管502穿过的水冷管孔702,线圈水冷管502穿过水冷管孔702并分别与电极上法兰503和电极下法兰504相焊接。循环冷却水由水冷管孔702进出线圈并对其进行冷却。In the first embodiment of the present utility model, the structure of the heating coil used for melting and purifying polysilicon in a vacuum zone is shown in Figure 5. The basic structure of the pancake-type flat single-turn coil is adopted, and the thickness of the pancake-type single-turn structure is 7-7. 9mm. The heating coil includes a coil frame 501, a coil water cooling tube 502, an electrode upper flange 503, and an electrode lower flange 504. The coil water cooling tube 502 is welded and embedded in the coil frame 501. This structure can improve the effect of water cooling, and at the same time, it is easy to For processing, the coil bobbin 501 and the coil water-cooled tube 502 are all made of red copper T2 grade. As shown in Figure 7, the electrode upper flange 503 and the electrode lower flange 504 have an
如图6所示,线圈骨架内圆周围的上表面采用两级台阶结构,包括第一级台阶601和第二级台阶602,两级台阶的直径均略大于多晶硅的直径,比如,如果多晶硅的直径是2英寸,即50.8mm,那么第一级台阶601所在圆的直径为52~54mm,第二级台阶602所在圆的直径为48~50mm,第一级台阶601和第二级台阶602的高度均为1~1.5mm。两级台阶的结构将所述用于多晶硅真空区熔提纯的加热线圈局部产生的电磁场增强,同时改善多晶外沿内外两侧的熔化界面,消除在真空提纯过程中较大直径尺寸多晶硅外沿易出现的毛刺,直径在45mm~52mm的多晶硅属于较大直径尺寸的多晶硅。线圈上表面为一向下倾斜面603,即第二级台阶的底部一端和线圈骨架内圆边沿连接成的斜面与水平面呈第二倾斜角度,第二倾斜角度可以是6~9度,可以使电磁场的能量由内向外不至逐渐降低,使多晶熔化界面平坦且由外向内倾斜,熔化界面熔硅趋于流向熔区中心,增加了熔硅的流动性。线圈下表面为一向上倾斜面604,即线圈骨架内圆下边沿一端和线圈下表面连接成的斜面与水平面呈第一倾斜角度,第一倾斜角度可以是7~10度,可以加大能量辐射面积,降低多晶凝固界面温度梯度,有利于多晶结晶过程中应力的释放,减少多晶硅内部出现断裂的危险。在线圈骨架501上靠近电极上法兰和电极下法兰的一侧开设有一个切面互相平行且垂直于水平面的切口703,该切口703位于线圈骨架内圆直径的延长线上。As shown in Figure 6, the upper surface around the inner circle of the coil bobbin adopts a two-level stepped structure, including a
本实用新型第二实施例,所述用于多晶硅真空区熔提纯的加热线圈的结构与第一实施例大体相同,只是本实施例中采用的第一级台阶所在圆的直径为53mm,第二级台阶所在圆的直径为49mm,第一级台阶和第二级台阶的高度均为1mm。In the second embodiment of the present utility model, the structure of the heating coil used for melting and purifying polysilicon in a vacuum zone is substantially the same as that of the first embodiment, except that the diameter of the circle where the first step used in this embodiment is 53 mm, and the second The diameter of the circle where the first step is located is 49 mm, and the height of the first step and the second step are both 1 mm.
本实用新型第三实施例,所述用于多晶硅真空区熔提纯的加热线圈结构如图8所示,所述用于多晶硅真空区熔提纯的加热线圈包括电极上法兰803、电极下法兰804、线圈骨架801、线圈水冷管802,线圈的结构与第一实施例大体相同,线圈具有上表面倾斜面903、下表面倾斜面904以及位于上表面的两级台阶:第一级台阶901和第二级台阶902,区别在于,所述线圈骨架内圆采用偏心式结构,在靠近法兰一侧扩大内圆圆弧,形成偏心805。实际应用中,采用偏心式结构的线圈骨架内圆可以由一半正圆与靠近法兰一侧的一半椭圆组成,椭圆的短半轴与正圆的半径相等,椭圆的长半轴的长度与正圆的半径之比可以为1.15:1。如图9所示,线圈下表面倾斜面904上设有偏心刻槽905,所述偏心刻槽905是从线圈骨架内圆下边沿水平向法兰方向刻出4~6mm。偏心式结构可使加热功率、热场形状、多晶形状三者更加匹配,减少出现腰带的可能性,而且由于采用了椭圆偏心,又不至于使电磁场分布过于不对称造成局部能量过低的情况,同时增加熔区搅拌,改善多晶硅径向电阻率不均匀性。偏心刻槽905可以使熔区下界面保持平坦稳定。如图10所示,在所述线圈骨架上靠近电极上法兰和电极下法兰的一侧开设有一个切面互相平行且垂直于水平面的切口1003,切口1003位于椭圆长半轴的延长线上靠近法兰一侧。In the third embodiment of the present utility model, the structure of the heating coil used for melting and purifying polysilicon in a vacuum zone is shown in Figure 8. The heating coil used for melting and purifying polysilicon in a vacuum zone includes an electrode
本实用新型第四实施例,所述用于多晶硅真空区熔提纯的加热线圈的结构与第三实施例中的基本一致,只是本实施例如图11所示,在所述线圈骨架上靠近电极上法兰和电极下法兰的一侧开设有一个切面互相平行的倾斜切口1103,倾斜切口1103位于椭圆长半轴的延长线上靠近法兰一侧,用于减少电磁泄漏。In the fourth embodiment of the present utility model, the structure of the heating coil used for melting and purifying polysilicon in a vacuum zone is basically the same as that in the third embodiment, except that this embodiment, as shown in Figure 11, is on the coil skeleton close to the electrode One side of the flange and the lower flange of the electrode is provided with an
通过具体实施方式的说明,可对本实用新型为达成预定目的所采取的技术手段及功效得以更加深入且具体的了解,然而所附图示仅是提供参考与说明之用,并非用来对本实用新型加以限制。Through the description of specific implementation methods, the technical means and effects of the utility model to achieve the intended purpose can be more deeply and specifically understood. However, the attached drawings are only for reference and description, and are not used to explain the utility model. be restricted.
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CN102358951A (en) * | 2011-10-11 | 2012-02-22 | 天津市环欧半导体材料技术有限公司 | Thermal system and technology for producing float zone doped single crystal silicon having size phi of 6 inches |
CN101787559B (en) * | 2010-01-12 | 2012-07-04 | 峨嵋半导体材料研究所 | Heater coil device for preparing high resistance zone-melting monocrystalline silicon in vacuum condition |
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CN101787559B (en) * | 2010-01-12 | 2012-07-04 | 峨嵋半导体材料研究所 | Heater coil device for preparing high resistance zone-melting monocrystalline silicon in vacuum condition |
CN102358951A (en) * | 2011-10-11 | 2012-02-22 | 天津市环欧半导体材料技术有限公司 | Thermal system and technology for producing float zone doped single crystal silicon having size phi of 6 inches |
CN102358951B (en) * | 2011-10-11 | 2014-04-16 | 天津市环欧半导体材料技术有限公司 | Thermal system and technology for producing float zone doped single crystal silicon having size phi of 6 inches |
CN102808216A (en) * | 2012-08-22 | 2012-12-05 | 北京京运通科技股份有限公司 | Float-zone monocrystalline silicon production process and float-zone thermal field |
CN102995106A (en) * | 2012-09-25 | 2013-03-27 | 北京京运通科技股份有限公司 | Electrode of heating device for zone melting furnace |
CN102995106B (en) * | 2012-09-25 | 2015-06-24 | 北京京运通科技股份有限公司 | Electrode of heating device for zone melting furnace |
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