CN201265982Y - Heat transfer device of electronic refrigerator - Google Patents
Heat transfer device of electronic refrigerator Download PDFInfo
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- CN201265982Y CN201265982Y CNU2008201886363U CN200820188636U CN201265982Y CN 201265982 Y CN201265982 Y CN 201265982Y CN U2008201886363 U CNU2008201886363 U CN U2008201886363U CN 200820188636 U CN200820188636 U CN 200820188636U CN 201265982 Y CN201265982 Y CN 201265982Y
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- heat
- pipe
- heat pipe
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- reserve tank
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Abstract
The utility model discloses a heat conducting device of an electric refrigerator, which comprises a refrigeration semiconductor, a liquid storage box arranged on the hot end of the refrigeration semiconductor and a heat pipe radiator, wherein the liquid storage box is provided with an exhaust opening and a backflow opening, the heat pipe radiator mainly comprises a coiling-shaped heat pipe and a steel wire arranged on the coiling-shaped heat pipe and is provided with an air inlet and a liquid outflow opening, and the exhaust opening and the backflow opening of the liquid storage box are respectively communicated with the air inlet and the liquid outflow opening of the heat pipe radiator. Furthermore, the heat conducting device of an electric refrigerator also comprises a bent cold conducting plate arranged in a box body, and the cold end of the refrigeration semiconductor is tightly attached to the bent cold conducting plate together. With the structure, the heat conducting device of an electric refrigerator only turns an original straight cold conducting plate into the bent cold conducting plate and takes the double surfaces of the bent section of the bent cold conducting plate as the heat conducting position of an cavity of the box body to increase the heat conducting area of the heat conducting device and enhance the heat conducting efficiency, and has simple and reasonable structure.
Description
Technical field
The utility model relates to the technical field of electronic refrigerator, specifically is a kind of heat transfer unit (HTU) of electronic refrigerator.
Background technology
The heat transfer unit (HTU) of existing electronic refrigerator, its structure is seen illustrated in figures 1 and 2, comprise refrigeration semiconductor 1, be arranged on the liquid reserve tank 2 in refrigeration semiconductor 1 hot junction, and heat-pipe radiator 3, liquid reserve tank 2 is provided with two and takes over 201 and 202, heat-pipe radiator 3 mainly is made of tortuous shape heat pipe 3001 and the steel wire 3002 that is arranged on the tortuous shape heat pipe 3001, heat-pipe radiator 3 has air intake 3001a and liquid outlet 3001b, take over 201 and 202 and be connected with heat-pipe radiator air intake 3001a and liquid outlet 3001b respectively for two of liquid reserve tank 2, wherein, also include the vertical configuration conduction cooling plate 4 that is installed in the electronic refrigerator casing, refrigeration semiconductor 1 cold junction and vertical configuration conduction cooling plate 4 are close together, and vertical configuration conduction cooling plate 4 is located at the rear wall of cabinets cavity.During work, refrigerant in the liquid reserve tank 2 absorbs heat to semiconductor 1 hot junction, refrigerant evaporation becoming gas, gas is taken over 201 by liquid reserve tank and is discharged and enter in the heat-pipe radiator 3 by heat-pipe radiator air intake 3001a, gas looses heat walk in heat-pipe radiator 3 and becomes liquid, tortuous shape heat pipe 3001 directions of liquid runs down are toward current downflow, at last, flow out through heat-pipe radiator liquid outlet 3001b, taking over 202 by liquid reserve tank again passes back in the liquid reserve tank 2, so periodic duty looses with the heat of realization with semiconductor 1 hot junction, makes the vertical configuration conduction cooling plate 4 of being close to refrigeration semiconductor 1 cold junction reach the effect of cooling; That is: by vertical configuration conduction cooling plate 4 heat of cabinets cavity is in time taken away, so that cabinets cavity reaches the effect of refrigeration.
But, the heat transfer unit (HTU) of said structure electronic refrigerator, still have the following disadvantages: the conduction cooling plate 4 in the electronic refrigerator casing is vertical configuration, and conduction cooling plate 4 is located at the cabinets cavity rear wall, therefore, vertical configuration conduction cooling plate 4 has only single vertical plane as heat transfer, limited by box height, its heat transfer area is less relatively, and heat transfer efficiency is relatively poor.
The utility model content
The purpose of this utility model is to overcome the deficiency that above-mentioned prior art exists, and provide a kind of simple and reasonable for structure, by the conduction cooling plate is arranged to bending, so that the conduction cooling plate extends into cabinets cavity, under the constant situation of box height, can increase its heat transfer area, improve the heat transfer unit (HTU) of the electronic refrigerator of heat transfer efficiency.
Order of the present utility model is achieved in that
A kind of heat transfer unit (HTU) of electronic refrigerator, comprise refrigeration semiconductor, be arranged on the liquid reserve tank in refrigeration semiconductor hot junction, and heat-pipe radiator, have exhaust outlet and refluxing opening on the liquid reserve tank, heat-pipe radiator mainly is made of tortuous shape heat pipe and the steel wire that is arranged on the tortuous shape heat pipe, heat-pipe radiator has air intake and liquid outlet, liquid reserve tank exhaust outlet and refluxing opening are connected with heat-pipe radiator air intake and liquid outlet respectively, also include the bending conduction cooling plate that is installed in the casing, refrigeration semiconductor cold junction and bending conduction cooling plate are close together.The electronic refrigerator heat transfer unit (HTU) of this structure, only by original vertical configuration conduction cooling plate is changed to bending conduction cooling plate, utilize its bending section to extend into cabinets cavity and conduct heat, under the constant situation of box height, can increase its heat transfer area, improve heat transfer efficiency, it is simple and reasonable for structure.
The purpose of this utility model can also adopt following technical measures to solve:
As improved plan further, bending conduction cooling plate is the plate of being made by the aluminum material of good heat conductive, and bending conduction cooling plate is made up of lower vertical plate piece section and last crooked plate section.
As more perfect scheme, described crooked plate is towards the bending of cabinets cavity direction.
As scheme more specifically, the level height of described liquid reserve tank exhaust outlet is higher than the level height of refluxing opening, and the refluxing opening place is connected with the liquid storage bend pipe of approximate U type, and the lowermost end level height of liquid storage bend pipe is lower than the level height of refluxing opening.The level height of liquid reserve tank exhaust outlet is arranged to be higher than the level height of refluxing opening, so that being height, the adapter at liquid reserve tank exhaust outlet and refluxing opening place arranges, gas is discharged from the exhaust outlet of eminence, liquid refluxes from the refluxing opening of lower, form an annularly flow, flow rate of fluid increases, and heat transfer efficiency increases; Moreover, also by be connected with the liquid storage bend pipe of approximate U type at the refluxing opening place, and the lowermost end level height of liquid storage bend pipe is lower than the level height of refluxing opening, the main effect of liquid storage bend pipe is a storaging liquid and to the liquid reserve tank liquid make-up, can guarantee the whole kind of refrigeration cycle process of refrigerant well, and rational in infrastructure.
Described heat-pipe radiator is made up of multilayer heat pipe heat radiation stratum reticulare, every layer of heat pipe heat radiation stratum reticulare is made up of tortuous shape heat pipe independently and the steel wire that is arranged on the tortuous shape heat pipe, the tortuous shape heat pipe two ends of every layer of heat pipe heat radiation stratum reticulare are respectively air intake and liquid outlet, each layer heat pipe heat radiation stratum reticulare with the front and back order side by side mode arrange, its air intake and liquid outlet are connected with the exhaust outlet and the refluxing opening of liquid reserve tank by being connected corresponding multiple-way valve body respectively.The heat pipe heat radiation stratum reticulare of multiple field, by improving its area of dissipation, it is little to overcome in the prior art two-layer heat pipe heat radiation stratum reticulare area of dissipation, the deficiency of radiating effect difference.
The beneficial effects of the utility model are:
(1), electronic refrigerator heat transfer unit (HTU) of the present utility model, only by original vertical configuration conduction cooling plate is changed to bending conduction cooling plate, utilizing its bending section to extend into cabinets cavity conducts heat, under the constant situation of box height, can increase its heat transfer area, improve heat transfer efficiency, it is simple and reasonable for structure;
(2), above-mentioned bending conduction cooling hardens and closes the improvement of heat pipe structure, utilize gas to rise and the dirty principle of liquid, the level height of liquid reserve tank exhaust outlet is arranged to be higher than the level height of refluxing opening, arrange that so that the adapter at liquid reserve tank exhaust outlet and refluxing opening place is height gas is discharged from the exhaust outlet of eminence, liquid refluxes from the refluxing opening of lower, form an annularly flow, flow rate of fluid increases, and heat transfer efficiency increases, and can effectively improve its radiating efficiency; Moreover, also by be connected with the liquid storage bend pipe of approximate U type at the refluxing opening place, and the lowermost end level height of liquid storage bend pipe is lower than the level height of refluxing opening, the main effect of liquid storage bend pipe is a storaging liquid and to the liquid reserve tank liquid make-up, can guarantee the whole kind of refrigeration cycle process of refrigerant well, and rational in infrastructure.
(3), the heat transfer unit (HTU) of this electronic refrigerator, adopted the heat pipe heat radiation stratum reticulare of multiple field, by improving its area of dissipation, it is little to overcome in the prior art two-layer heat pipe heat radiation stratum reticulare area of dissipation, the deficiency of radiating effect difference.
Description of drawings
Fig. 1 is the structural representation of prior art electronic refrigerator heat transfer unit (HTU);
Fig. 2 is the front view after Fig. 1 electronic refrigerator heat transfer unit (HTU) removes vertical configuration conduction cooling plate and refrigeration semiconductor;
Fig. 3 is the structural representation of electronic refrigerator heat transfer unit (HTU) of the present utility model;
Fig. 4 is the front view after Fig. 3 electronic refrigerator heat transfer unit (HTU) removes bending conduction cooling plate and refrigeration semiconductor.
The specific embodiment
The utility model is described in further detail below in conjunction with drawings and Examples.
As shown in Figure 3 and Figure 4, a kind of heat transfer unit (HTU) of electronic refrigerator, comprise refrigeration semiconductor 5, be arranged on the liquid reserve tank 6 in refrigeration semiconductor 5 hot junctions, and heat-pipe radiator 7, have exhaust outlet 601 and refluxing opening 602 on the liquid reserve tank 6, heat-pipe radiator 7 mainly is made of tortuous shape heat pipe 7001 and the steel wire 7002 that is arranged on the tortuous shape heat pipe 7001, heat-pipe radiator 7 has air intake 7001a and liquid outlet 7001b, liquid reserve tank exhaust outlet 601 and refluxing opening 602 are connected with heat-pipe radiator air intake 7001a and liquid outlet 7001b respectively, also include the bending conduction cooling plate 8 that is installed in the casing, refrigeration semiconductor 1 cold junction and bending conduction cooling plate 8 are close together.Wherein, described bending conduction cooling plate 8 is plates made from the aluminum material with thermal conductive resin energy, and bending conduction cooling plate 8 can be made up of lower vertical plate piece section 801 and last crooked plate section 802, goes up crooked plate section 802 towards the bending of cabinets cavity direction.Certainly, bending conduction cooling plate 8 can also be other shape.
Operation principle: during work, refrigerant in the liquid reserve tank 6 absorbs heat to refrigeration semiconductor 5 hot junctions, refrigerant evaporation becoming gas, gas is discharged and is entered in the heat-pipe radiator 7 by heat-pipe radiator air intake 7001a by liquid reserve tank exhaust outlet 601, gas looses heat walk in heat-pipe radiator 7 and becomes liquid, tortuous shape heat pipe 7001 directions of liquid runs down are toward current downflow, at last, flow out through heat-pipe radiator liquid outlet 7001b, pass back in the liquid reserve tank 6 by liquid reserve tank refluxing opening 602 again, so periodic duty is loose with the heat of realization with semiconductor 5 hot junctions, makes the curved allusion quotation shape conduction cooling plate 8 of being close to refrigeration semiconductor 5 cold junctions reach the effect of cooling; That is: the last crooked plate section 802 by bending conduction cooling plate 8 tops extends into cabinets cavity, under the constant situation of box height, has increased its heat transfer area, improves its heat transfer efficiency, so that cabinets cavity reaches better refrigeration.
See shown in Figure 4ly, the level height of described liquid reserve tank exhaust outlet 601 is higher than the level height of refluxing opening 602, and refluxing opening 602 places are connected with the liquid storage bend pipe 9 of approximate U type, and the lowermost end level height of liquid storage bend pipe 9 is lower than the level height of refluxing opening 602.Described heat-pipe radiator 7 is made up of multilayer heat pipe heat radiation stratum reticulare 70, every layer of heat pipe heat radiation stratum reticulare 70 is made up of tortuous shape heat pipe 7001 independently and the fin 7002 that is arranged on the tortuous shape heat pipe 7001, tortuous shape heat pipe 7001 two ends of every layer of heat pipe heat radiation stratum reticulare 70 are respectively air intake 7001a and liquid outlet 7001b, each layer heat pipe heat radiation stratum reticulare 70 with the front and back order side by side mode arrange, its air intake 7001a and liquid outlet 7001b are connected with liquid reserve tank exhaust outlet 601 and refluxing opening 602 by being connected corresponding multiple- way valve body 10,11 respectively.
Claims (5)
1. the heat transfer unit (HTU) of an electronic refrigerator, comprise refrigeration semiconductor (5), be arranged on the liquid reserve tank (6) in refrigeration semiconductor (5) hot junction, and heat-pipe radiator (7), it is characterized in that, have exhaust outlet (601) and refluxing opening (602) on the described liquid reserve tank (6), heat-pipe radiator (7) mainly is made of tortuous shape heat pipe (7001) and the steel wire (7002) that is arranged on the tortuous shape heat pipe (7001), heat-pipe radiator (7) has air intake (7001a) and liquid outlet (7001b), liquid reserve tank exhaust outlet (601) and refluxing opening (602) are connected with heat-pipe radiator air intake (7001a) and liquid outlet (7001b) respectively, also include the bending conduction cooling plate (8) that is installed in the casing, refrigeration semiconductor (1) cold junction and bending conduction cooling plate (8) are close together.
2. according to the heat transfer unit (HTU) of the described electronic refrigerator of claim 1, it is characterized in that described bending conduction cooling plate (8) is the plate that aluminum material is made, bending conduction cooling plate (8) is made up of lower vertical plate piece section (801) and last crooked plate section (802).
3. according to the heat transfer unit (HTU) of the described electronic refrigerator of claim 2, it is characterized in that the described crooked plate section (802) that is towards the bending of cabinets cavity direction.
4. according to the heat transfer unit (HTU) of the described electronic refrigerator of claim 1, it is characterized in that, the level height of described liquid reserve tank exhaust outlet (601) is higher than the level height of refluxing opening (602), and refluxing opening (602) locates to be connected with the liquid storage bend pipe (9) of approximate U type, and the lowermost end level height of liquid storage bend pipe (9) is lower than the level height of refluxing opening (602).
5. the heat pipe according to the described semiconductor electronic refrigerator of claim 4 improves structure, it is characterized in that, described heat-pipe radiator (7) is made up of multilayer heat pipe heat radiation stratum reticulare (70), every layer of heat pipe heat radiation stratum reticulare (70) is made up of tortuous shape heat pipe (7001) independently and the steel wire (7002) that is arranged on the tortuous shape heat pipe (7001), tortuous shape heat pipe (7001) two ends of every layer of heat pipe heat radiation stratum reticulare (70) are respectively air intake (7001a) and liquid outlet (7001b), each layer heat pipe heat radiation stratum reticulare (70) with the front and back order side by side mode arrange, its air intake (7001a) and liquid outlet (7001b) are respectively by being connected corresponding multiple-way valve body (10,11) be connected with liquid reserve tank exhaust outlet (601) and refluxing opening (602).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201886363U CN201265982Y (en) | 2008-08-15 | 2008-08-15 | Heat transfer device of electronic refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201886363U CN201265982Y (en) | 2008-08-15 | 2008-08-15 | Heat transfer device of electronic refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201265982Y true CN201265982Y (en) | 2009-07-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201886363U Expired - Lifetime CN201265982Y (en) | 2008-08-15 | 2008-08-15 | Heat transfer device of electronic refrigerator |
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| Country | Link |
|---|---|
| CN (1) | CN201265982Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103591730A (en) * | 2013-12-02 | 2014-02-19 | 广东富信科技股份有限公司 | Integrated semiconductor refrigeration system |
| CN107246755A (en) * | 2017-06-23 | 2017-10-13 | 珠海格力电器股份有限公司 | Semiconductor refrigeration box |
| CN111623551A (en) * | 2020-06-12 | 2020-09-04 | 广东奥达信制冷科技有限公司 | Refrigerating system and refrigerating equipment |
-
2008
- 2008-08-15 CN CNU2008201886363U patent/CN201265982Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103591730A (en) * | 2013-12-02 | 2014-02-19 | 广东富信科技股份有限公司 | Integrated semiconductor refrigeration system |
| CN103591730B (en) * | 2013-12-02 | 2016-06-22 | 广东富信科技股份有限公司 | Semiconductor refrigerating integrated system |
| CN107246755A (en) * | 2017-06-23 | 2017-10-13 | 珠海格力电器股份有限公司 | Semiconductor refrigeration box |
| CN111623551A (en) * | 2020-06-12 | 2020-09-04 | 广东奥达信制冷科技有限公司 | Refrigerating system and refrigerating equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090701 |
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| CX01 | Expiry of patent term |