CN201255534Y - Heat pipe improving structure for semiconductor electronic refrigerator - Google Patents
Heat pipe improving structure for semiconductor electronic refrigerator Download PDFInfo
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- CN201255534Y CN201255534Y CNU200820051673XU CN200820051673U CN201255534Y CN 201255534 Y CN201255534 Y CN 201255534Y CN U200820051673X U CNU200820051673X U CN U200820051673XU CN 200820051673 U CN200820051673 U CN 200820051673U CN 201255534 Y CN201255534 Y CN 201255534Y
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Abstract
The utility model discloses an improved structure of a heat pipe of a semi-conductor electronic refrigerator, which comprises a liquid storage box that is arranged at the heat end of a refrigerating semi-conductor and a heat pipe heat radiator, wherein, the liquid storage box is provided with a back-flow port ad an exhausting port, and the heat pipe heat radiator mainly comprises a coiled heat pipe and a steel wire that is arranged on the coiled heat pipe, and the heat pipe heat radiator is provided with a gas inlet and a liquid outlet, and the exhausting port and the back-flow port of the liquid storage box are respectively communicated with the gas inlet and the liquid outlet of the heat pipe heat radiator, and the horizontal height of the exhausting port of the liquid storage box is higher than the horizontal height of the back-flow port, and the back-flow port is connected with a U-shaped liquid storage elbow pipe, and the horizontal height of the most bottom end of the liquid storage elbow pipe is lower than the horizontal height of the back-flow port. The improved structure of the heat pipe has reasonable structure; the horizontal height of the exhausting port of the liquid storage box is higher than that of the back-flow port, so that the gas is prevented from flowing in an opposite direction of the liquid inside the connection pipe to influence the back-flow sped of the liquid, thereby can effectively improve the heat radiation efficiency.
Description
Technical field
The utility model relates to the technical field of electronic refrigerator, specifically is that a kind of heat pipe of semiconductor electronic refrigerator improves structure.
Background technology
The conventional semiconductor electronic refrigerator, its heat pipe structure as shown in Figure 1, comprise the liquid reserve tank 1 (chamber) that is arranged on the refrigeration semiconductor hot junction, and heat-pipe radiator 2, liquid reserve tank 1 is provided with two and takes over 101 and 102, heat-pipe radiator 2 mainly is made of tortuous shape heat pipe 2001 and the steel wire 2002 that is arranged on the tortuous shape heat pipe 2001, and liquid reserve tank 1 is taken over 101,102 by two and is connected with tortuous shape heat pipe 2001 respectively; Take over 101 and 102 for two on the liquid reserve tank and have identical level height, level of approximation is arranged between the adapter 101,102.During work, refrigerant in the liquid reserve tank 1 absorbs heat to the semiconductor hot junction, refrigerant evaporation becoming gas, gas is taken over 101 discharges by liquid reserve tank and is entered in the heat-pipe radiator 2, gas looses heat walk in heat-pipe radiator 2 and becomes liquid, liquid is along tortuous shape heat pipe 2001 tube walls toward current downflow, and is last, passes back in the liquid reserve tank 1; That is: gas up flows in the middle of pipeline, and condensed liquid gravitate refluxes along tube wall, and gas-liquid constantly circulates like this, looses with the heat of realization with the semiconductor hot junction, reaches the effect of refrigeration in the casing.But, the electronic refrigerator heat-pipe apparatus of said structure still has the following disadvantages: (1), be subjected to two of liquid reserve tank take over 101,102 between level of approximation arrange and influence that gas and liquid flow in opposite directions taking in 101,102, influence the back-flow velocity of liquid, cause its radiating efficiency lower.
The utility model content
The purpose of this utility model is to overcome the deficiency that above-mentioned prior art exists, and provide a kind of rational in infrastructure, two adapters of liquid reserve tank are divided into exhaust outlet and refluxing opening, the level height of exhaust outlet is higher than refluxing opening, influence the back-flow velocity of liquid to avoid gas and liquid to flow in opposite directions in taking over, the heat pipe that can effectively improve the semiconductor electronic refrigerator of its radiating efficiency improves structure.
Order of the present utility model is achieved in that
A kind of heat pipe of semiconductor electronic refrigerator improves structure, comprise the liquid reserve tank that is arranged on the refrigeration semiconductor hot junction, and heat-pipe radiator, have refluxing opening and exhaust outlet on the described liquid reserve tank, heat-pipe radiator mainly is made of tortuous shape heat pipe and the steel wire that is arranged on the tortuous shape heat pipe, heat-pipe radiator has air intake and liquid outlet, liquid reserve tank exhaust outlet and refluxing opening are connected with the air intake and the liquid outlet of heat-pipe radiator respectively, the level height of described liquid reserve tank exhaust outlet is higher than the level height of refluxing opening, and the refluxing opening place is connected with the liquid storage bend pipe of approximate U type, and the lowermost end level height of liquid storage bend pipe is lower than the level height of refluxing opening.The heat pipe of this electronic refrigerator improves structure, utilizes gas to rise and the dirty principle of liquid, the level height of liquid reserve tank exhaust outlet is arranged to be higher than the level height of refluxing opening; That is: the adapter at liquid reserve tank exhaust outlet and refluxing opening place is the height layout, and gas is discharged from the exhaust outlet of eminence, and liquid refluxes from the refluxing opening of lower, forms an annularly flow, and flow rate of fluid increases, and heat transfer efficiency increases, and can effectively improve its radiating efficiency; Avoiding having the par height, and gas and liquid are flowed in taking in opposite directions and influence the back-flow velocity of liquid because of exhaust outlet and refluxing opening; Moreover, heat pipe of the present utility model improves structure, also be connected with the liquid storage bend pipe of approximate U type at the refluxing opening place, and the lowermost end level height of liquid storage bend pipe is lower than the level height of refluxing opening, the main effect of liquid storage bend pipe is a storaging liquid and to the liquid reserve tank liquid make-up, refrigerant in liquid reserve tank fails to absorb heat fully, influenced by the casing internal pressure, the liquid that refluxes can be stored in the liquid storage bend pipe, when the complete endothermic gasification of refrigerant, gas is discharged the rear box internal pressure through exhaust outlet and is reduced, and the liquid in the liquid storage bend pipe can pass back in the casing, therefore, the liquid storage bend pipe can guarantee the whole kind of refrigeration cycle process of refrigerant well.
The purpose of this utility model can also adopt following technical measures to solve:
As above-mentioned more specifically scheme, heat-pipe radiator is made up of multilayer heat pipe heat radiation stratum reticulare, every layer of heat pipe heat radiation stratum reticulare is made up of tortuous shape heat pipe independently and the steel wire that is arranged on the tortuous shape heat pipe, the tortuous shape heat pipe two ends of every layer of heat pipe heat radiation stratum reticulare are respectively air intake and liquid outlet, each layer heat pipe heat radiation stratum reticulare with the front and back order side by side mode arrange, its air intake and liquid outlet are connected with the exhaust outlet and the refluxing opening of liquid reserve tank by being connected corresponding multiple-way valve body respectively.The heat pipe heat radiation stratum reticulare of above-mentioned multiple field can overcome that (to see) in the prior art two-layer heat pipe heat radiation stratum reticulare area of dissipation shown in Figure 1 little, the deficiency of radiating effect difference.The multiple-way valve body can adopt copper material to make.
The embodiment of above-mentioned multiple-way valve body, can be to be respectively four-way air valve and four-way liquid valve, heat-pipe radiator is made up of three layers of heat pipe heat radiation stratum reticulare, the air intake of three layers of heat pipe heat radiation stratum reticulare is connected with the liquid reserve tank exhaust outlet by connecting the four-way air valve, and the liquid outlet of three layers of heat pipe heat radiation stratum reticulare is connected with the liquid storage bend pipe at liquid reserve tank refluxing opening place by connecting four-way liquid valve.
Another embodiment of above-mentioned multiple-way valve body, also can be to be respectively five-way air valve and five-way liquid valve, heat-pipe radiator is made up of four layers of heat pipe heat radiation stratum reticulare, the air intake of four layers of heat pipe heat radiation stratum reticulare is connected with the liquid reserve tank exhaust outlet by connecting the five-way air valve, and the liquid outlet of four layers of heat pipe heat radiation stratum reticulare is connected with the liquid storage bend pipe at liquid reserve tank refluxing opening place by connecting five-way liquid valve.
For making above-mentioned design more reasonable, the level height of above-mentioned four-way air valve or five-way air valve is higher than the level height of four-way liquid valve or five-way liquid valve; The level height of four-way liquid valve or five-way liquid valve is lower than each layer heat pipe heat radiation stratum reticulare.
The level height of described liquid reserve tank is lower than the level height of heat-pipe radiator.
The refluxing opening of described liquid reserve tank is located at the bottom of liquid reserve tank.
The beneficial effects of the utility model are:
(1), the heat pipe of semiconductor electronic refrigerator of the present utility model improves structure, utilize gas to rise and the dirty principle of liquid, the level height of liquid reserve tank exhaust outlet is arranged to be higher than the level height of refluxing opening, arrange that so that the adapter at liquid reserve tank exhaust outlet and refluxing opening place is height gas is discharged from the exhaust outlet of eminence, liquid refluxes from the refluxing opening of lower, form an annularly flow, flow rate of fluid increases, and heat transfer efficiency increases, and can effectively improve its radiating efficiency; Moreover, also by be connected with the liquid storage bend pipe of approximate U type at the refluxing opening place, and the lowermost end level height of liquid storage bend pipe is lower than the level height of refluxing opening, the main effect of liquid storage bend pipe is a storaging liquid and to the liquid reserve tank liquid make-up, can guarantee the whole kind of refrigeration cycle process of refrigerant well, and rational in infrastructure.
(2), the heat pipe of this electronic refrigerator improves structure, the heat pipe heat radiation stratum reticulare of multiple field by improving its area of dissipation, can overcome in the prior art, two-layer heat pipe heat radiation stratum reticulare is little because of area of dissipation, the deficiency of radiating effect difference; Moreover, this heat pipe improve structure used the multiple-way valve body (as, the copper five-way valve), in order to be communicated with heat-pipe radiator and liquid reserve tank, solved the problem that original welding is difficult, weld seam easily leaks, thereby make the batch process of this multilayer heat-pipe radiator become possibility, the reliability of product quality is protected; More have plenty of, this heat pipe structure cooperates the environmental protection DuPontR134a of the Du Pont medium or the R410a of safety again, its better heat-radiation effect.
Description of drawings
Fig. 1 is the heat pipe structure schematic diagram of the semiconductor electronic refrigerator of prior art;
Fig. 2 is that the heat pipe of semiconductor electronic refrigerator of the present utility model improves structural representation;
Fig. 3 is the side view of Fig. 2.
The specific embodiment
The utility model is described in further detail below in conjunction with drawings and Examples.
Embodiment 1: as shown in Figures 2 and 3, a kind of heat pipe of semiconductor electronic refrigerator improves structure, comprise the liquid reserve tank 3 that is arranged on the refrigeration semiconductor hot junction, and heat-pipe radiator 4, have refluxing opening 301 and exhaust outlet 302 on the liquid reserve tank 3, refluxing opening 301 and exhaust outlet 302 places are connected with respectively and take over 8,9, two take over 8,9 are high and low position, heat-pipe radiator 4 mainly is made of tortuous shape heat pipe 4001 and the steel wire 4002 that is arranged on the tortuous shape heat pipe 4001, heat-pipe radiator 4 has air intake 4001a and liquid outlet 4001b, liquid reserve tank exhaust outlet 302 and refluxing opening 301 are respectively by corresponding adapter 9,8 are connected with heat-pipe radiator air intake 4001a and liquid outlet 4001b, the level height of described liquid reserve tank exhaust outlet 302 is higher than the level height of refluxing opening 301, and refluxing opening 301 places are connected with the liquid storage bend pipe 5 of approximate U type, and the lowermost end level height of liquid storage bend pipe 5 is lower than the level height of refluxing opening 301.Above-mentioned heat-pipe radiator 4 can be made up of multilayer heat pipe heat radiation stratum reticulare 40, every layer of heat pipe heat radiation stratum reticulare 40 is made up of tortuous shape heat pipe 4001 independently and the steel wire 4002 that is arranged on the tortuous shape heat pipe 4001, tortuous shape heat pipe 4001 two ends of every layer of heat pipe heat radiation stratum reticulare 40 are respectively air intake 4001a and liquid outlet 4001b, each layer heat pipe heat radiation stratum reticulare 40 with the front and back order side by side mode arrange, its air intake 4001a and liquid outlet 4001b are connected with the exhaust outlet 302 and the refluxing opening 301 of liquid reserve tank 3 by being connected corresponding multiple-way valve body 6,7 respectively.
See for details shown in Figure 2, described multiple-way valve body 6,7 is respectively five-way air valve 602 and five-way liquid valve 702, heat-pipe radiator 4 is made up of four layers of heat pipe heat radiation stratum reticulare 40, the air intake 4001a of four layers of heat pipe heat radiation stratum reticulare 40 is connected with liquid reserve tank exhaust outlet 302 by connecting five-way air valve 602, and the liquid outlet 4001b of four layers of heat pipe heat radiation stratum reticulare 40 is connected with the liquid storage bend pipe 5 at liquid reserve tank refluxing opening 301 places by connecting five-way liquid valve 702.
The level height of above-mentioned five-way air valve 602 is higher than the level height of five-way liquid valve 702; The level height of five-way liquid valve 702 is lower than each layer heat pipe heat radiation stratum reticulare 40.The level height of above-mentioned liquid reserve tank 3 is lower than the level height of heat-pipe radiator 4; And the refluxing opening 301 of liquid reserve tank 3 is located at the bottom of liquid reserve tank 3.
Operation principle: during work, refrigerant in the liquid reserve tank 3 absorbs heat to the semiconductor hot junction, refrigerant evaporation becoming gas, gas is according to rising principle, exhaust outlet 302 by liquid reserve tank 3 higher positions is discharged, and enter into respectively in each layer heat pipe heat radiation stratum reticulare 40 by five-way air valve 602, gas looses heat walk in heat pipe heat radiation stratum reticulare 40 and becomes liquid, tortuous shape heat pipe 4001 directions of liquid runs down are toward current downflow, at last, liquid outlet 4001b through each layer heat pipe heat radiation stratum reticulare 40 flows out respectively, flows into U-shaped liquid storage bend pipe 5 by five-way liquid valve 702 again, and is last, in liquid reserve tank refluxing opening 101 passes back into liquid reserve tank 1, so periodic duty looses with the heat of realization with the semiconductor hot junction, reaches the effect of refrigeration in the casing.
Embodiment 2: this embodiment (not shown) is similar to embodiment 1, its difference is, multiple-way valve body 6,7 can be to be respectively four-way air valve and four-way liquid valve, heat-pipe radiator 4 is made up of three layers of heat pipe heat radiation stratum reticulare 40, the air intake 4001a of three layers of heat pipe heat radiation stratum reticulare 40 is connected with liquid reserve tank exhaust outlet 302 by connecting the four-way air valve, and the liquid outlet 4001b of three layers of heat pipe heat radiation stratum reticulare 40 is connected with the liquid storage bend pipe 5 at liquid reserve tank refluxing opening 301 places by connecting four-way liquid valve.The level height of described four-way air valve is higher than the level height of four-way liquid valve; The level height of four-way liquid valve is lower than each layer heat pipe heat radiation stratum reticulare 40.
Claims (8)
1. the heat pipe of semiconductor electronic refrigerator improves structure, comprise the liquid reserve tank (3) that is arranged on the refrigeration semiconductor hot junction, and heat-pipe radiator (4), it is characterized in that, have refluxing opening (301) and exhaust outlet (302) on the described liquid reserve tank (3), heat-pipe radiator (4) mainly is made of tortuous shape heat pipe (4001) and the steel wire (4002) that is arranged on the tortuous shape heat pipe (4001), heat-pipe radiator (4) has air intake (4001a) and liquid outlet (4001b), liquid reserve tank exhaust outlet (302) and refluxing opening (301) are connected with heat-pipe radiator air intake (4001a) and liquid outlet (4001b) respectively, the level height of described liquid reserve tank exhaust outlet (302) is higher than the level height of refluxing opening (301), and refluxing opening (301) locates to be connected with the liquid storage bend pipe (5) of approximate U type, and the lowermost end level height of liquid storage bend pipe (5) is lower than the level height of refluxing opening (301).
2. the heat pipe according to the described semiconductor electronic refrigerator of claim 1 improves structure, it is characterized in that, described heat-pipe radiator (4) is made up of multilayer heat pipe heat radiation stratum reticulare (40), every layer of heat pipe heat radiation stratum reticulare (40) is made up of tortuous shape heat pipe (4001) independently and the steel wire (4002) that is arranged on the tortuous shape heat pipe (4001), tortuous shape heat pipe (4001) two ends of every layer of heat pipe heat radiation stratum reticulare (40) are respectively air intake (4001a) and liquid outlet (4001b), each layer heat pipe heat radiation stratum reticulare (40) with the front and back order side by side mode arrange, its air intake (4001a) and liquid outlet (4001b) are respectively by being connected corresponding multiple-way valve body (6,7) be connected with the exhaust outlet (302) and the refluxing opening (301) of liquid reserve tank (3).
3. the heat pipe according to the described semiconductor electronic refrigerator of claim 2 improves structure, it is characterized in that, described multiple-way valve body (6,7) is respectively four-way air valve and four-way liquid valve, heat-pipe radiator (4) is made up of three layers of heat pipe heat radiation stratum reticulare (40), the air intake (4001a) of three layers of heat pipe heat radiation stratum reticulare (40) is connected with liquid reserve tank exhaust outlet (302) by connecting the four-way air valve, and the liquid outlet (4001b) of three layers of heat pipe heat radiation stratum reticulare (40) is connected with the liquid storage bend pipe (5) that liquid reserve tank refluxing opening (301) is located by connecting four-way liquid valve.
4. the heat pipe according to the described semiconductor electronic refrigerator of claim 2 improves structure, it is characterized in that, described multiple-way valve body (6,7) is respectively five-way air valve (602) and five-way liquid valve (702), heat-pipe radiator (4) is made up of four layers of heat pipe heat radiation stratum reticulare (40), the air intake (4001a) of four layers of heat pipe heat radiation stratum reticulare (40) is connected with liquid reserve tank exhaust outlet (302) by connecting five-way air valve (602), and the liquid outlet (4001b) of four layers of heat pipe heat radiation stratum reticulare (40) is connected with the liquid storage bend pipe (5) that liquid reserve tank refluxing opening (301) is located by connecting five-way liquid valve (702).
5. the heat pipe according to claim 3 or 4 described semiconductor electronic refrigerators improves structure, it is characterized in that the level height of described four-way air valve or five-way air valve (602) is higher than the level height of four-way liquid valve or five-way liquid valve (702).
6. the heat pipe according to claim 3 or 4 described semiconductor electronic refrigerators improves structure, it is characterized in that the level height of described four-way liquid valve or five-way liquid valve (702) is lower than each layer heat pipe heat radiation stratum reticulare (40).
7. the heat pipe according to the described semiconductor electronic refrigerator of claim 1 improves structure, it is characterized in that the level height of described liquid reserve tank (3) is lower than the level height of heat-pipe radiator (4).
8. the heat pipe according to the described semiconductor electronic refrigerator of claim 1 improves structure, it is characterized in that the refluxing opening (301) of described liquid reserve tank (3) is located at the bottom of liquid reserve tank (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820051673XU CN201255534Y (en) | 2008-08-01 | 2008-08-01 | Heat pipe improving structure for semiconductor electronic refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820051673XU CN201255534Y (en) | 2008-08-01 | 2008-08-01 | Heat pipe improving structure for semiconductor electronic refrigerator |
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| Publication Number | Publication Date |
|---|---|
| CN201255534Y true CN201255534Y (en) | 2009-06-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200820051673XU Expired - Lifetime CN201255534Y (en) | 2008-08-01 | 2008-08-01 | Heat pipe improving structure for semiconductor electronic refrigerator |
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| CN (1) | CN201255534Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111623551A (en) * | 2020-06-12 | 2020-09-04 | 广东奥达信制冷科技有限公司 | Refrigerating system and refrigerating equipment |
-
2008
- 2008-08-01 CN CNU200820051673XU patent/CN201255534Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111623551A (en) * | 2020-06-12 | 2020-09-04 | 广东奥达信制冷科技有限公司 | Refrigerating system and refrigerating equipment |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090610 |