CN201256150Y - Non-adhesive encapsulation module for LED - Google Patents
Non-adhesive encapsulation module for LED Download PDFInfo
- Publication number
- CN201256150Y CN201256150Y CNU2008201539546U CN200820153954U CN201256150Y CN 201256150 Y CN201256150 Y CN 201256150Y CN U2008201539546 U CNU2008201539546 U CN U2008201539546U CN 200820153954 U CN200820153954 U CN 200820153954U CN 201256150 Y CN201256150 Y CN 201256150Y
- Authority
- CN
- China
- Prior art keywords
- led
- cover plate
- shell
- hole
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to the technique of LED package and products thereof, in particular to an LED gel-free package module. Aiming to solve the defects of complicate package process and unstable quality in the prior art, the utility model designs an LED gel-free package module without gel such as epoxy resin and the like. The technical scheme includes: the LED gel-free package module comprises an LED printed circuit board, wherein one surface of the LED printed circuit board is equipped with a plurality of pins and the other surface is equipped with an LED, and the LED gel-free package module is characterized in that the LED printed circuit board is arranged outside an outer casing, a cover plate is arranged on the outer casing, the LED printed circuit board is sealed in a space composed of the cover plate and the outer casing, the cover plate is provided with a plurality of through holes, and the pins penetrate through the through holes correspondingly. The package of the overall module utilizes mechanical structure connection without using gel to package or connect.
Description
Technical field
The utility model relates to LED encapsulation technology and products thereof, and relating in particular to a kind of LED does not have the glue package module.
Background technology
LED is the english abbreviation of light-emitting diode (Light Emitting Diode).LED is that a very little wafer is encapsulated in epoxy resin the inside basically, thus its very little, very light.The LED power consumption is very low, and in general the operating voltage of LED is 2-3.6V.Operating current is 0.02-0.03A.In other words: the electricity that it consumes is no more than 0.1W.The LED transistor is by nontoxic material, and containing mercury unlike fluorescent lamp can pollute, and LED also can recycling simultaneously.It also has advantages such as long service life, cost is low, brightness is high, fault is few.The internal characteristics of LED has determined that it is that optimal light source removes to replace traditional light source, and it has purposes widely.
At present, the encapsulating structure of LED is very many, but great majority have used the encapsulating structure of epoxy resin.As a kind of domestic publication number be CN101013689 LED encapsulating structure and method for packing.It comprises circuit board, several adhere to the LED luminescence unit in circuit board front.Back of circuit board is provided with the port that links to each other with external circuit, in each LED luminescence unit, offered the glue hole on the circuit board, each LED luminescence unit outside is encapsulated by packing colloid, the packing colloid of each LED luminescence unit is independently of one another, back of circuit board is equipped with a fixing colloid corresponding to each packing colloid, and fixedly colloid fuses by mistake glue hole with positive corresponding packing colloid.It also provides a kind of LED method for packing, comprising: make the dedicated templates step; Binding LED luminescence chip step; Dress mould step, the lower bolster of packing into to the circuit board face down, each LED luminescence unit are placed in respectively in each mould grain of lower bolster; The encapsulating step; Curing schedule.This is the encapsulating structure of typical epoxy resin type, and its defective is, epoxy resin easily when encapsulation attached to parts such as LED, circuit board, pins on, make product appearance become coarse, when serious even influence the product use.General treating method is after epoxy resin solidifies, with cutter unnecessary epoxy resin to be struck off.The method expends more manpower, and the production cycle prolongs, and product quality can not get guaranteeing.
Summary of the invention
The utility model mainly is at shortcomings such as prior art encapsulation process complexity, quality instabilities, has designed a kind of epoxy resin isocolloid encapsulated LED of not using and has not had the glue package module.
Above-mentioned technical problem of the present utility model is implemented by the following technical programs:
A kind of LED does not have the glue package module, comprise the LED printed circuit board (PCB), it simultaneously is provided with number of pins, its another side is provided with LED, it is characterized in that, the setting of LED printed circuit board (PCB) in the enclosure, shell is provided with cover plate, cover plate and shell are formed confined space the LED printed circuit board (PCB) are enclosed in the space, and cover plate is provided with some through holes, and pin and through hole pass through hole one to one.The encapsulation of whole module all adopts mechanical structure to connect, and does not adopt colloid as encapsulation or connection.
Above-mentioned LED does not have the glue package module, and as preferably, described through hole one end is a seal, and the through hole other end is a guiding port, and the guiding port diameter is greater than seal, and through hole is coniform.If there is not coniform guiding port, be unfavorable for that intensive a plurality of pins accurately insert through hole simultaneously.
Above-mentioned LED does not have the glue package module, and as preferably, the tapering of described through hole is 30～90 degree.Cover sheet thickness is less, and bigger tapering is easy to pin and inserts through hole, but excessive tapering can hinder the insertion of pin.
Above-mentioned LED does not have the glue package module, and is the most preferred, and the tapering of described through hole is 45 degree.This moment processing, installation effectiveness are the highest.
Above-mentioned LED does not have the glue package module, and as preferably, described seal diameter is identical with leg diameter.Pin is that metal material is made, and cover plate is that flexible plastic is made, and pin hardness is much larger than cover plate hardness, and pin can pass through hole excessively smoothly, pin pass through hole after, seal can closely coat pin, plays sealing function.
Above-mentioned LED does not have the glue package module, and as preferably, described cover plate simultaneously is provided with boss, and boss width and length are less than the cover plate width.Boss may be stuck in the shell, plays cover plate is fixed on effect on the shell.
Above-mentioned LED does not have the glue package module, and as preferably, shell and cover plate are cuboid, and described boss width is less than outer casing width, and greater than the width of shell internal cavity, and described land length is less than outer cover length, and greater than the length of shell internal cavity.Shell is a working of plastics, and shell wall is thinner, more easily produce deformation, so cover plate is stuck on the shell easily.The setting of above-mentioned width makes that shell generation deformation is easy, boss is stuck in the shell, but makes the cover plate beyond the boss be difficult for being absorbed in the shell.Cover plate promptly is stuck in the shell, the support of the shell of getting back.
Above-mentioned LED does not have the glue package module, and as preferably, described side edge thereof is provided with auxiliary mounting bar.When mounted, instrument will assist mounting bar to external pressure by the inboard outwards application of force of cover plate, because cover plate is the flexible plastic material, seal is unlimited slightly on the cover plate, and guiding port tightens up slightly, and this state is easy to pin and passes through through hole.
Above-mentioned LED does not have the glue package module, and as preferably, described side edge thereof is provided with the welding bar, and the welding bar is the sharp tooth setting, and the welding bar is parallel to side edge thereof and is arranged on around the cover plate and the housing contacts place.The welding bar is a working of plastics, and material and cover plate, shell are identical.The welding bar can melt under the laser of characteristic frequency, makes cover plate firmly be connected with shell.This laser welding technology is not repeated at this for the various laser welding technology of existing extensive use.
In sum, the utility model is compared with prior art and is had following advantage:
Do not adopt the colloid encapsulation, product is environmental protection more; Need once encapsulation promptly to reach the effect of moulding with the colloid encapsulation, if the fruit encapsulation process produces mistake, product is promptly scrapped, the utility model adopts the elasticity of working of plastics that associated components is connected, and can aim at encapsulation repeatedly, and encapsulation process is faster, encapsulation labour intensity reduces, and rate of finished products improves; Adopt the elasticity of working of plastics, associated components is firmly connected, and help dismounting.
Description of drawings
Fig. 1 is an overall schematic of the present utility model;
Fig. 2 is the profile of cover plate of the present utility model;
Fig. 3 is a scheme of installation of the present utility model;
Fig. 4 is the schematic rear view after the cover plate upset of the present utility model;
Fig. 5 is the profile after shell of the present utility model and cover plate are installed;
Fig. 6 is the profile of Fig. 1 of the present utility model;
Fig. 7 is the profile of the another kind of structure of cover plate of the present utility model;
Number in the figure is: 1, pin, 2, shell, 3, cover plate, 4, the LED printed circuit board (PCB), 5, through hole, 6, guiding port, 7, seal, 8, boss, 9, mounting bar, 10, the welding bar.
Embodiment
Below by embodiment, in conjunction with the accompanying drawings, the technical solution of the utility model is described in further detail:
Embodiment 1:
LED does not as shown in Figure 1 have the glue package module, LED printed circuit board (PCB) 4 wherein is installed, and printed circuit board (PCB) simultaneously is equipped with row's pin 1, and pin can be installed about 20 according to the needs of printed circuit board (PCB), the printed circuit board (PCB) another side is embedded with LED, and the LED printed circuit card is in shell 2.Shell is 6 * 12 * 120 millimeters a cube, and the recording quantity that shell is 12 * 120 millimeters constitutes a cavity.Shell one side is equipped with cover plate 3, and cover plate and shell are formed confined space the LED printed circuit board (PCB) is enclosed in the space.
As Fig. 2, Fig. 3, Fig. 4, Fig. 5, shown in Figure 6, cover plate is provided with the through hole 5 that equates with the pin number, through hole one end is a seal 7, the through hole other end is a guiding port 6, the guiding port diameter is greater than seal, and through hole is coniform, and the tapering of through hole is 45 degree, the seal diameter is identical with leg diameter, and pin and through hole pass through hole one to one.Itself has certain-length seal, and its side is substantially parallel to each other, because seal length much smaller than the length of through hole, is taught under the thin situation at cover plate, naked eyes are difficult to judge, therefore are referred to as seal.On the edge around the cover plate, the welding bar of sharp tooth is arranged all around along cover plate.The integrally manufactured moulding when cover plate is made of welding bar.
As Fig. 5, shown in Figure 6, cover plate simultaneously is provided with boss 8, boss width and length are less than the cover plate width, shell and cover plate are cuboid, described boss width is less than outer casing width, and greater than the width of shell internal cavity, described land length is less than outer cover length, and greater than the length of shell internal cavity, side edge thereof is provided with auxiliary mounting bar 9.
Cover plate, shell, welding bar are the working of plastics of same material, and pin is a stainless steel material.
During installation, as shown in Figure 3, cover plate has boss one side towards shell, pin and through hole pass through hole one to one, cover plate and shell close up then, can suitably apply the power to both sides on mounting bar, because cover plate is a working of plastics, cover plate after the application of force produces small radian, boss can enter in the shell smoothly, during installation, as shown in Figure 6, the boss of cover plate is stuck in the shell, side edge thereof is stuck on the shell, and seal and pin set are sealed shape, and boss edge and shell are the sealing dress, this moment, the LED printed circuit board (PCB) was enclosed in the space of shell and cover plate composition, and pin is fixing not removable by cover plate and printed circuit board (PCB).Adopt laser welding will weld the bar fusing then, cover plate closely is connected with shell.
Embodiment 2:
Itself has certain-length guiding port, and its side is substantially parallel to each other, because guiding port length much smaller than the length of through hole, is taught under the thin situation at cover plate, naked eyes are difficult to judge, therefore are referred to as guiding port.
All the other are identical with embodiment 1.
Specific embodiment described herein only is that the utility model spirit is illustrated.The utility model person of ordinary skill in the field can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present utility model or surmount the defined scope of appended claims.
Claims (9)
1. a LED does not have the glue package module, comprise LED printed circuit board (PCB) (4), it simultaneously is provided with number of pins (1), its another side is provided with LED, it is characterized in that, the LED printed circuit board (PCB) is arranged in the shell (2), shell is provided with cover plate (3), cover plate and shell are formed confined space the LED printed circuit board (PCB) are enclosed in the space, and cover plate is provided with some through holes (5), and pin and through hole pass through hole one to one.
2. the quick package module of LED according to claim 1 is characterized in that, described through hole one end is seal (7), and the through hole other end is guiding port (6), and the guiding port diameter is greater than seal, and through hole is coniform.
3. the quick package module of LED according to claim 2 is characterized in that, the tapering of described through hole is 30～90 degree.
4. the quick package module of LED according to claim 3 is characterized in that, the tapering of described through hole is 45 degree.
5. according to claim 1 or 2 or the 3 or 4 quick package modules of described LED, it is characterized in that described seal diameter is identical with leg diameter.
6. according to claim 1 or 2 or the 3 or 4 quick package modules of described LED, it is characterized in that described cover plate simultaneously is provided with boss (8), boss width and length are less than the cover plate width.
7. the quick package module of LED according to claim 6 is characterized in that shell and cover plate are cuboid, described boss width is less than outer casing width, and greater than the width of shell internal cavity, described land length is less than outer cover length, and greater than the length of shell internal cavity.
8. according to claim 1 or 2 or the 3 or 4 quick package modules of described LED, it is characterized in that described side edge thereof is provided with auxiliary mounting bar (9).
9. according to claim 1 or 2 or the 3 or 4 quick package modules of described LED, it is characterized in that described side edge thereof is provided with welding bar (10).
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201539546U CN201256150Y (en) | 2008-10-10 | 2008-10-10 | Non-adhesive encapsulation module for LED |
| US12/573,375 US20100094142A1 (en) | 2008-10-10 | 2009-10-05 | Display Module of LED Light Pillar of Hemomanometer and the Hemomanometer with LED Light Pillar |
| BRPI0903945 BRPI0903945A2 (en) | 2008-10-10 | 2009-10-09 | LED light pillar display module [LED] gauge and pressure gauge with led light pillar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201539546U CN201256150Y (en) | 2008-10-10 | 2008-10-10 | Non-adhesive encapsulation module for LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201256150Y true CN201256150Y (en) | 2009-06-10 |
Family
ID=40739478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201539546U Expired - Fee Related CN201256150Y (en) | 2008-10-10 | 2008-10-10 | Non-adhesive encapsulation module for LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201256150Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106910519A (en) * | 2015-12-31 | 2017-06-30 | 中山市江波龙电子有限公司 | A kind of solid state hard disc memory module and solid state hard disc |
| CN112798027A (en) * | 2019-11-13 | 2021-05-14 | 新奥科技发展有限公司 | Magnetic probe mounting and adjusting device |
-
2008
- 2008-10-10 CN CNU2008201539546U patent/CN201256150Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106910519A (en) * | 2015-12-31 | 2017-06-30 | 中山市江波龙电子有限公司 | A kind of solid state hard disc memory module and solid state hard disc |
| CN112798027A (en) * | 2019-11-13 | 2021-05-14 | 新奥科技发展有限公司 | Magnetic probe mounting and adjusting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100409418C (en) | QFN chip packaging technique | |
| EP1727410A3 (en) | Sealed electronic module with fasternerless circuit board support post | |
| CN201256150Y (en) | Non-adhesive encapsulation module for LED | |
| CN202308051U (en) | LED packaging support and LED device | |
| CN203339219U (en) | Novel light emitting diode (LED) packaging structure | |
| CN201898150U (en) | Light emitting diode support | |
| CN108400218B (en) | A kind of LED encapsulation method based on CSP pattern | |
| CN206876921U (en) | A kind of integrated guide optical mode group counterdie and guide-lighting module | |
| CN205767101U (en) | The encapsulating mould of power module | |
| CN202025753U (en) | LED (light-emitting diode) module | |
| CN201156543Y (en) | Encapsulation construction of LED display unit | |
| CN202274324U (en) | Led module | |
| CN206861350U (en) | A kind of light fixture for being easy to assemble cover | |
| CN212555356U (en) | Exempt from anti high temperature of silk screen printing and mould plastics textured shell | |
| CN207458474U (en) | Inexpensive LED display | |
| KR100742225B1 (en) | A high brightness light emitting diode and its method of making | |
| CN219285968U (en) | Package-free display for intelligent household appliance | |
| CN202032474U (en) | LED bulb lamp casing | |
| CN216643841U (en) | Light source of paster spotlight | |
| CN220065669U (en) | Highly integrated Bluetooth chip structure | |
| CN111092144A (en) | LED bracket with welding leg at cup opening and manufacturing method thereof | |
| CN209909808U (en) | LED lamp shell with optical lens and LED lamp shell group | |
| CN104393144A (en) | Novel manufacturing process of LED lamp | |
| CN212691558U (en) | Light-emitting structure | |
| CN202253432U (en) | LED (light-emitting diode) piranha iron case module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Yu Baoshan Document name: Notification to Pay the Fees |
|
| DD01 | Delivery of document by public notice |
Addressee: Yu Baoshan Document name: Notification of Termination of Patent Right |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090610 Termination date: 20141010 |
|
| EXPY | Termination of patent right or utility model |