CN106910519A - A kind of solid state hard disc memory module and solid state hard disc - Google Patents

A kind of solid state hard disc memory module and solid state hard disc Download PDF

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Publication number
CN106910519A
CN106910519A CN201511034559.7A CN201511034559A CN106910519A CN 106910519 A CN106910519 A CN 106910519A CN 201511034559 A CN201511034559 A CN 201511034559A CN 106910519 A CN106910519 A CN 106910519A
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CN
China
Prior art keywords
solid state
state hard
hard disc
circuit
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201511034559.7A
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Chinese (zh)
Other versions
CN106910519B (en
Inventor
李志雄
胡宏辉
覃金谋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongshan Jiangbolong Electronics Co Ltd
Original Assignee
Zhongshan Jiangbolong Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201511034559.7A priority Critical patent/CN106910519B/en
Application filed by Zhongshan Jiangbolong Electronics Co Ltd filed Critical Zhongshan Jiangbolong Electronics Co Ltd
Priority to KR1020167028416A priority patent/KR101827198B1/en
Priority to PCT/CN2016/090290 priority patent/WO2017113756A1/en
Priority to US15/120,707 priority patent/US10388329B2/en
Priority to JP2016555739A priority patent/JP6374977B2/en
Priority to TW105211444U priority patent/TWM533765U/en
Priority to TW105125797A priority patent/TWI595411B/en
Publication of CN106910519A publication Critical patent/CN106910519A/en
Priority to US16/513,370 priority patent/US10714148B2/en
Application granted granted Critical
Publication of CN106910519B publication Critical patent/CN106910519B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1446Reducing contamination, e.g. by dust, debris

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  • Semiconductor Memories (AREA)

Abstract

The present invention is applied to field of storage mediums, more particularly to a kind of solid state hard disc memory module and solid state hard disc.In an embodiment of the present invention, the solid state hard disc memory module includes printed circuit board (PCB), packing colloid and is welded in the inner surface of the printed circuit board (PCB) and possesses the electronic circuit of data storage function, the packing colloid is formed at the inner surface of the printed circuit board (PCB), and tight encapsulation is carried out to the electronic circuit, the outer surface of the printed circuit board (PCB) is provided with multiple metal contact pieces, the multiple metal contact piece is electrically connected with the electronic circuit, and the multiple metal contact piece includes multiple SATA interface contacts.In an embodiment of the present invention, the packing colloid carries out tight encapsulation to the electronic circuit, the electronic circuit is isolated with air, it is to avoid the electronic circuit is directly exposed in air the performance for influenceing component, causes the problem of the functional lability of solid state hard disc.

Description

A kind of solid state hard disc memory module and solid state hard disc
Technical field
The invention belongs to field of storage mediums, more particularly to a kind of solid state hard disc memory module and solid state hard disc.
Background technology
Hard disk is one of main storage medium of computer, and hard disk includes solid state hard disc (Solid State Drive), Solid state hard disc is the hard disk being made of solid-state electronic storage chip array, its internal structure very simple, main body One piece of circuit board, and accessory most basic on this block circuit board be exactly control chip, storage chip and its His auxiliary circuit.
The circuit module of existing solid state hard disc, is by control chip, storage chip and other circuit components It is directly welded on circuit board, then the shell of additional solid state hard disc is assembled into finished solid hard disk, using this Method is packaged, although circuit board is placed in the shell of solid state hard disc, but in the shell of solid state hard disc also Unnecessary space is left, so, circuit components can be directly exposed in air, so that circuit elements device Part moisture-sensitive and contamination dust, and then the performance of component is influenceed, cause the functional lability of solid state hard disc.
The content of the invention
The purpose of the embodiment of the present invention is to provide a kind of solid state hard disc memory module, it is intended to solve conventional solid-state Be directly exposed to circuit components in air by the packaged type of hard disk so that circuit components moisture-sensitive and is stained with Dye dust, influences the performance of component, causes the problem of the functional lability of solid state hard disc.
The embodiment of the present invention is achieved in that a kind of solid state hard disc memory module, the solid state hard disc storage Module includes printed circuit board (PCB), packing colloid and is welded in the inner surface of the printed circuit board (PCB) and possesses number According to the electronic circuit of store function;
The packing colloid is formed at the inner surface of the printed circuit board (PCB), and carries out nothing to the electronic circuit Space encapsulates;
The outer surface of the printed circuit board (PCB) is provided with multiple metal contact pieces, the multiple metal contact piece with it is described Electronic circuit is electrically connected, and the multiple metal contact piece includes multiple SATA interface contacts;
The electronic circuit includes control integrated circuit, storage integrated circuit and auxiliary circuit;The domination set It is electrically connected with the storage integrated circuit and the auxiliary circuit respectively into circuit.
Further, the multiple SATA interface contact is strip, and the multiple SATA interface is tactile The length of piece is not completely equivalent, and the multiple SATA interface contact is arranged in the appearance of the printed circuit board (PCB) The side in face.
Further, the side for the printed circuit board (PCB) being provided with the multiple SATA interface contact also sets There is a separate slot;The separate slot along perpendicular to the direction of the printed circuit board (PCB), from the outer of the printed circuit board (PCB) Surface is through to the inner surface and the packing colloid of the printed circuit board (PCB);The multiple SATA interface Contact is divided into the first contact area and the second wafer area by the separate slot, and the printed circuit board (PCB) is provided with the separate slot With the side of the multiple SATA interface contact as standard SATA interface plug-in unit part, and institute Stating standard SATA interface plug-in unit also includes a plastic parts.
Further, the first contact area is provided with 7 metal contact pieces, and the second wafer area is provided with 15 metal contact pieces.
Further, the printed circuit board (PCB) is provided with the edge of the side of separate slot and is additionally provided with chamfering.
Further, the multiple SATA interface contact is round point shape, and the multiple SATA interface is tactile Piece is arranged in the side of the outer surface of the printed circuit board (PCB).
Further, on the outer surface of the printed circuit board (PCB) with where the multiple SATA interface contact The opposite side of side Parallel Symmetric be provided with another group of SATA interface contact, another group of SATA connects Mouth contact is identical with the quantity of the multiple SATA interface contact.
Further, the control integrated circuit and the storage integrated circuit are un-encapsulated integrated electricity Road crystal grain.
Further, the storage integrated circuit includes 8 storage integrated-circuit dies, 8 storages Integrated-circuit die point both sides are stacked, and 4 are stacked per side.
Further, the auxiliary circuit includes power circuit, and the power circuit is un-encapsulated integrated Circuit die.
Further, the auxiliary circuit also includes protection circuit, and the protection circuit is resettable fuse, And the resettable fuse is serially connected in the input of the power circuit.
Further, the multiple metal contact piece also includes debugging interface contact and power interface contact.
The another object of the embodiment of the present invention is to provide a kind of solid state hard disc, and the solid state hard disc includes above-mentioned Described solid state hard disc memory module.
In an embodiment of the present invention, the solid state hard disc memory module includes printed circuit board (PCB), packing colloid And be welded in the inner surface of the printed circuit board (PCB) and possess the electronic circuit of data storage function;The envelope Dress colloid is formed at the inner surface of the printed circuit board (PCB), and carries out tight encapsulation to the electronic circuit; The outer surface of the printed circuit board (PCB) is provided with multiple metal contact pieces, the multiple metal contact piece and the electronics Circuit is electrically connected, and the multiple metal contact piece includes multiple SATA interface contacts.In reality of the invention Apply in example, the packing colloid is carried out without sky to the electronic circuit for being welded in the inner surface of the printed circuit board (PCB) Gap is encapsulated, the packing colloid isolated the electronic circuit with air, it is to avoid the electronic circuit The performance of influence component in air is directly exposed to, the problem of the functional lability of solid state hard disc is caused.
Brief description of the drawings
Fig. 1 is the cross-sectional view of solid state hard disc memory module provided in an embodiment of the present invention;
Fig. 2 is the schematic diagram of the solid state hard disc memory module that first embodiment of the invention is provided;
Fig. 3 is the schematic diagram of the solid state hard disc memory module that second embodiment of the invention is provided.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with accompanying drawing and reality Example is applied, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only Only it is used to explain the present invention, is not intended to limit the present invention.
First embodiment
Fig. 1 shows the cross-sectional view of solid state hard disc memory module provided in an embodiment of the present invention, for the ease of Illustrate, illustrate only the part related to the embodiment of the present invention.
A kind of solid state hard disc memory module, the solid state hard disc memory module includes printed circuit board (PCB) 1, encapsulation Colloid 2 and it is welded in the inner surface of printed circuit board (PCB) 1 and possesses the electronic circuit 3 of data storage function.
Packing colloid 2 is formed at the inner surface of printed circuit board (PCB) 1, and tight encapsulation is carried out to electronic circuit 3.
The outer surface of printed circuit board (PCB) 1 is provided with multiple metal contact pieces 11, multiple metal contact pieces 11 and electronics Circuit 3 is electrically connected, and multiple metal contact pieces 11 include multiple SATA interface contacts 110.
Electronic circuit 3 includes control integrated circuit 31, storage integrated circuit 32 and auxiliary circuit 33;Control Integrated circuit 31 is electrically connected with storage integrated circuit 32 and auxiliary circuit 33 respectively.
In the present embodiment, SATA (Serial ATA, serial ATA) interface is a kind of computer bus interface, For the data transfer between solid state hard disc and mainboard.
Used as one embodiment of the invention, control integrated circuit 31 and storage integrated circuit 32 are without envelope The integrated-circuit die of dress.In the present embodiment, control integrated circuit 31 and storage integrated circuit 32 are direct Using un-encapsulated integrated-circuit die, eliminate control integrated-circuit die and storage integrated circuit is brilliant The step of grain is packaged into chip, saves the time, shortens the production cycle, and reduce production cost.
Used as one embodiment of the invention, storage integrated circuit 31 includes 8 storage integrated-circuit dies, institute State 8 storage integrated-circuit die point both sides to stack, 4 are stacked per side.
Used as one embodiment of the invention, auxiliary circuit 33 includes power circuit, the power circuit be without The integrated-circuit die of encapsulation.
Used as one embodiment of the invention, auxiliary circuit also includes protection circuit, and the protection circuit is from extensive Double insurance silk, and the resettable fuse is serially connected in the input of the power circuit.In the present embodiment The protection circuit is protected to the power circuit, and the protection circuit makes institute using resettable fuse State solid state hard disc memory module more frivolous.
Used as one embodiment of the invention, multiple metal contact pieces 11 also include debugging interface contact and power interface Contact.Specifically, the sum of the debugging interface contact and power interface contact is 16.The debugging connects Mouth contact provides the outside debugging interface to the solid state hard disc memory module, and the power interface contact is used for Connection external power source.
Fig. 2 shows the schematic diagram of the solid state hard disc memory module that first embodiment of the invention is provided, in order to just In explanation, the part related to the embodiment of the present invention is illustrate only.
Multiple SATA interface contacts 110 are strip, and multiple SATA interface contact 110 length not Essentially equal, multiple SATA interface contacts 110 are arranged in the side of the outer surface of printed circuit board (PCB) 1.
In the present embodiment, the quantity of multiple metal contact pieces 11 is plural number.Specifically, multiple metal contact pieces 11 include 22 SATA interface contacts 110.
As one embodiment of the invention, printed circuit board (PCB) 1 is provided with multiple SATA interface contacts 11 Side be additionally provided with a separate slot 12;Separate slot 12 along perpendicular to the direction of printed circuit board (PCB) 1, from printed circuit The outer surface of plate 1 is through to the inner surface and packing colloid 2 of printed circuit board (PCB) 1;Multiple SATA interfaces 12 points by separate slot of contact 11 is the first contact area 111 and the second wafer area 112, and printed circuit board (PCB) 1 is provided with The side of separate slot 12 and multiple SATA interface contacts 11 as standard SATA interface plug-in unit part, And standard SATA interface plug-in unit also includes a plastic parts.
Used as one embodiment of the invention, the first contact area 111 is provided with 7 SATA interface contacts 11, The second wafer area 112 is provided with 15 SATA interface contacts 11.
Used as one embodiment of the invention, the edge that printed circuit board (PCB) 1 is provided with the side of separate slot 12 is additionally provided with Chamfering 13, the solid state hard disc memory module easily can be electrically connected by chamfering 13 with external plug-in Connect.
Second embodiment
Fig. 1 shows the cross-sectional view of solid state hard disc memory module provided in an embodiment of the present invention, for the ease of Illustrate, illustrate only the part related to the embodiment of the present invention.
A kind of solid state hard disc memory module, the solid state hard disc memory module includes printed circuit board (PCB) 1, encapsulation Colloid 2 and it is welded in the inner surface of printed circuit board (PCB) 1 and realizes the electronic circuit 3 of store function.
Packing colloid 2 is formed at the inner surface of printed circuit board (PCB) 1, and tight encapsulation is carried out to electronic circuit 3.
The outer surface of printed circuit board (PCB) 1 is provided with multiple metal contact pieces 11, multiple metal contact pieces 11 and electronics Circuit 3 is electrically connected, and multiple metal contact pieces 11 include multiple SATA interface contacts 110.
Electronic circuit 3 includes control integrated circuit 31, storage integrated circuit 32 and auxiliary circuit 33;Control Integrated circuit 31 is electrically connected with storage integrated circuit 32 and auxiliary circuit 33 respectively.
In the present embodiment, SATA (Serial ATA, serial ATA) interface is a kind of computer bus interface, For the data transfer between solid state hard disc and mainboard.
Used as one embodiment of the invention, control integrated circuit 31 and storage integrated circuit 32 are without envelope The integrated-circuit die of dress.In the present embodiment, control integrated circuit 31 and storage integrated circuit 32 are direct Using un-encapsulated integrated-circuit die, eliminate control integrated-circuit die and storage integrated circuit is brilliant The step of grain is packaged into chip, saves the time, shortens the production cycle, and reduce production cost.
Used as one embodiment of the invention, storage integrated circuit 31 includes 8 storage integrated-circuit dies, institute State 8 storage integrated-circuit die point both sides to stack, 4 are stacked per side.
Used as one embodiment of the invention, auxiliary circuit 33 includes power circuit, the power circuit be without The integrated-circuit die of encapsulation.
Used as one embodiment of the invention, auxiliary circuit also includes protection circuit, and the protection circuit is from extensive Double insurance silk, and the resettable fuse is serially connected in the input of the power circuit.In the present embodiment The protection circuit is protected to the power circuit, and the protection circuit makes institute using resettable fuse State solid state hard disc memory module more frivolous.
Used as one embodiment of the invention, multiple metal contact pieces 11 also include debugging interface contact and power interface Contact.Specifically, the sum of the debugging interface contact and power interface contact is 16.The debugging connects Mouth contact provides the outside debugging interface to the solid state hard disc memory module, and the power interface contact is used for Connection external power source.
Fig. 3 shows the schematic diagram of the solid state hard disc memory module that second embodiment of the invention is provided, in order to just In explanation, the part related to the embodiment of the present invention is illustrate only.
Used as one embodiment of the invention, multiple SATA interface contacts 110 are round point shape, and multiple SATA Interface contact 110 is arranged in the side of the outer surface of the printed circuit board (PCB).
As one embodiment of the invention, touched with multiple SATA interfaces on the outer surface of printed circuit board (PCB) 1 The opposite side of the side Parallel Symmetric where piece 110 is provided with another group of SATA interface contact, described another Group SATA interface contact is identical with the quantity of the multiple SATA interface contact.
3rd embodiment
Third embodiment of the invention provides a kind of solid state hard disc, and the solid state hard disc includes first embodiment or the Solid state hard disc memory module described in two embodiments.
In an embodiment of the present invention, the solid state hard disc memory module includes printed circuit board (PCB), packing colloid And be welded in the inner surface of the printed circuit board (PCB) and possess the electronic circuit of data storage function, the envelope Dress colloid is formed at the inner surface of the printed circuit board (PCB), and carries out tight encapsulation to the electronic circuit, The outer surface of the printed circuit board (PCB) is provided with multiple metal contact pieces, the multiple metal contact piece and the electronics Circuit is electrically connected, and the multiple metal contact piece includes multiple SATA interface contacts.In reality of the invention Apply in example, the packing colloid is carried out without sky to the electronic circuit for being welded in the inner surface of the printed circuit board (PCB) Gap is encapsulated, the packing colloid isolated the electronic circuit with air, it is to avoid the electronic circuit The performance of influence component in air is directly exposed to, the problem of the functional lability of solid state hard disc is caused.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in this hair Any modification, equivalent and improvement made within bright spirit and principle etc., should be included in the present invention Protection domain within.

Claims (13)

1. a kind of solid state hard disc memory module, it is characterised in that the solid state hard disc memory module includes printing Circuit board, packing colloid and it is welded in the inner surface of the printed circuit board (PCB) and possesses data storage function Electronic circuit;
The packing colloid is formed at the inner surface of the printed circuit board (PCB), and carries out nothing to the electronic circuit Space encapsulates;
The outer surface of the printed circuit board (PCB) is provided with multiple metal contact pieces, the multiple metal contact piece with it is described Electronic circuit is electrically connected, and the multiple metal contact piece includes multiple SATA interface contacts;
The electronic circuit includes control integrated circuit, storage integrated circuit and auxiliary circuit;The domination set It is electrically connected with the storage integrated circuit and the auxiliary circuit respectively into circuit.
2. solid state hard disc memory module as claimed in claim 1, it is characterised in that the multiple SATA Interface contact is strip, and the length of the multiple SATA interface contact is not completely equivalent, the multiple SATA interface contact is arranged in the side of the outer surface of the printed circuit board (PCB).
3. solid state hard disc memory module as claimed in claim 2, it is characterised in that in the printed circuit The side that plate is provided with the multiple SATA interface contact is additionally provided with a separate slot;The separate slot is along perpendicular to institute The direction of printed circuit board (PCB) is stated, is through in the printed circuit board (PCB) from the outer surface of the printed circuit board (PCB) Surface and the packing colloid;The multiple SATA interface contact is divided into the first contact area by the separate slot With the second wafer area, the printed circuit board (PCB) is provided with the one of the separate slot and the multiple SATA interface contact Side as standard SATA interface plug-in unit part, and the standard SATA interface plug-in unit also include one Plastic parts.
4. solid state hard disc memory module as claimed in claim 3, it is characterised in that the first contact area 7 metal contact pieces are provided with, the second wafer area is provided with 15 metal contact pieces.
5. solid state hard disc memory module as claimed in claim 4, it is characterised in that the printed circuit board (PCB) The edge for being provided with the side of separate slot is additionally provided with chamfering.
6. solid state hard disc memory module as claimed in claim 1, it is characterised in that the multiple SATA Interface contact is round point shape, and the multiple SATA interface contact is arranged in the appearance of the printed circuit board (PCB) The side in face.
7. solid state hard disc memory module as claimed in claim 6, it is characterised in that in the printed circuit Opposite side on the outer surface of plate with the side Parallel Symmetric where the multiple SATA interface contact is provided with Another group of SATA interface contact, another group of SATA interface contact is touched with the multiple SATA interface The quantity of piece is identical.
8. solid state hard disc memory module as claimed in claim 1, it is characterised in that the integrated electricity of control Road and the storage integrated circuit are un-encapsulated integrated-circuit die.
9. solid state hard disc memory module as claimed in claim 8, it is characterised in that the integrated electricity of storage Road includes 8 storage integrated-circuit dies, and 8 storage integrated-circuit dies point both sides stack, per side Respectively stack 4.
10. solid state hard disc memory module as claimed in claim 1, it is characterised in that the auxiliary circuit Including power circuit, the power circuit is un-encapsulated integrated-circuit die.
11. solid state hard disc memory modules as claimed in claim 10, it is characterised in that the auxiliary circuit Also include protection circuit, the protection circuit is resettable fuse, and the resettable fuse is serially connected in The input of the power circuit.
12. solid state hard disc memory modules as claimed in claim 1, it is characterised in that the multiple metal Contact also includes debugging interface contact and power interface contact.
13. a kind of solid state hard discs, it is characterised in that the solid state hard disc is included as claim 1-12 is any Solid state hard disc memory module described in.
CN201511034559.7A 2015-12-30 2015-12-31 Solid state disk storage module and solid state disk Active CN106910519B (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
CN201511034559.7A CN106910519B (en) 2015-12-31 2015-12-31 Solid state disk storage module and solid state disk
PCT/CN2016/090290 WO2017113756A1 (en) 2015-12-30 2016-07-18 Solid-state disk storage module, solid-state disk assembly, and solid-state disk
US15/120,707 US10388329B2 (en) 2015-12-30 2016-07-18 SSD storage module, SSD component, and SSD
JP2016555739A JP6374977B2 (en) 2015-12-30 2016-07-18 SSD parts and SSD
KR1020167028416A KR101827198B1 (en) 2015-12-30 2016-07-18 Ssd storage module, ssd component, and ssd
TW105211444U TWM533765U (en) 2015-12-31 2016-07-28 Solid state disk storage module, solid state disk component and solid state disk
TW105125797A TWI595411B (en) 2015-12-30 2016-08-12 Ssd storage module, ssd component and ssd
US16/513,370 US10714148B2 (en) 2015-12-30 2019-07-16 SSD storage module, SSD component, and SSD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201511034559.7A CN106910519B (en) 2015-12-31 2015-12-31 Solid state disk storage module and solid state disk

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CN106910519A true CN106910519A (en) 2017-06-30
CN106910519B CN106910519B (en) 2022-12-16

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