CN201188417Y - 芯片承片台 - Google Patents
芯片承片台 Download PDFInfo
- Publication number
- CN201188417Y CN201188417Y CNU2008200924993U CN200820092499U CN201188417Y CN 201188417 Y CN201188417 Y CN 201188417Y CN U2008200924993 U CNU2008200924993 U CN U2008200924993U CN 200820092499 U CN200820092499 U CN 200820092499U CN 201188417 Y CN201188417 Y CN 201188417Y
- Authority
- CN
- China
- Prior art keywords
- chip
- supporting platform
- annular groove
- cannelure
- bearer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008200924993U CN201188417Y (zh) | 2008-03-04 | 2008-03-04 | 芯片承片台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008200924993U CN201188417Y (zh) | 2008-03-04 | 2008-03-04 | 芯片承片台 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201188417Y true CN201188417Y (zh) | 2009-01-28 |
Family
ID=40311439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008200924993U Expired - Fee Related CN201188417Y (zh) | 2008-03-04 | 2008-03-04 | 芯片承片台 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201188417Y (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105835116A (zh) * | 2016-03-28 | 2016-08-10 | 苏州美图航空密封件有限公司 | 一种新型聚氨酯加工工具 |
CN107942621A (zh) * | 2017-12-12 | 2018-04-20 | 中国科学院光电技术研究所 | 一种适用于柔性衬底的纳米孔阵列承片台 |
CN116810972A (zh) * | 2023-08-28 | 2023-09-29 | 江苏晋誉达半导体股份有限公司 | 一种碳化硅承片台的成型工艺 |
-
2008
- 2008-03-04 CN CNU2008200924993U patent/CN201188417Y/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105835116A (zh) * | 2016-03-28 | 2016-08-10 | 苏州美图航空密封件有限公司 | 一种新型聚氨酯加工工具 |
CN107942621A (zh) * | 2017-12-12 | 2018-04-20 | 中国科学院光电技术研究所 | 一种适用于柔性衬底的纳米孔阵列承片台 |
CN116810972A (zh) * | 2023-08-28 | 2023-09-29 | 江苏晋誉达半导体股份有限公司 | 一种碳化硅承片台的成型工艺 |
CN116810972B (zh) * | 2023-08-28 | 2023-11-28 | 江苏晋誉达半导体股份有限公司 | 一种碳化硅承片台的成型工艺 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201188417Y (zh) | 芯片承片台 | |
CN105260060B (zh) | 一种蓝宝石盖板批量加工方法 | |
CN211251682U (zh) | 分组式同步丝网印刷装置 | |
CN201116947Y (zh) | 镜头清洁装置 | |
CN111083870A (zh) | 一种线路板印刷专用pin钉 | |
CN109822928A (zh) | 一种圆筒状硅胶套自动组装装置 | |
CN102689534A (zh) | 太阳能电池正面电极的丝网印刷方法 | |
JP4166770B2 (ja) | 板ガラス移送装置 | |
CN104588457B (zh) | 一种便于拆卸的折弯机上模组件 | |
CN107363448A (zh) | 一种大型机械部件切割及焊接加工平台 | |
CN213179919U (zh) | 一种异型笔类定位组装设备 | |
TW201313642A (zh) | 輪單元 | |
CN212169363U (zh) | 一种偏光片的激光裁切平台治具 | |
CN204870015U (zh) | 一种防漏墨定位平台 | |
CN211047417U (zh) | 一种可自动换面的电路板加工设备 | |
CN202200644U (zh) | 一种丝网印刷机的印刷台 | |
CN210080966U (zh) | 一种激光切割治具 | |
CN210305225U (zh) | 饰品高精度自动卷圆定型机 | |
CN105711236A (zh) | 一种玻璃屏丝印夹具、丝印设备及丝印方法 | |
CN102357477B (zh) | 防污染装置 | |
CN207479856U (zh) | 一种板材激光切割机 | |
CN202132331U (zh) | 导光板组装夹具 | |
CN220427198U (zh) | 一种玻璃激光板下片机 | |
CN210855817U (zh) | 一种低辐射镀膜玻璃切割机 | |
CN110861423A (zh) | 一种用于印刷线路板的转印法油墨加工工艺 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN SI SEMICONDUCTORS CO., LTD. Free format text: FORMER NAME: SHENZHEN SI SEMICONDUCTORS CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Baolong Baolong Industrial City seven road in Longgang District of Shenzhen City, Guangdong Province, No. 3 518118 Patentee after: Shenzhen Si Semiconductors Co., Ltd. Address before: 518029, 3 floor, building 2, three optical fiber street, Bagua Road, Shenzhen, Guangdong, Futian District Patentee before: Shenzhen SI Semiconductor Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090128 Termination date: 20160304 |