CN201181590Y - Test module and test system - Google Patents
Test module and test system Download PDFInfo
- Publication number
- CN201181590Y CN201181590Y CNU2008201107909U CN200820110790U CN201181590Y CN 201181590 Y CN201181590 Y CN 201181590Y CN U2008201107909 U CNU2008201107909 U CN U2008201107909U CN 200820110790 U CN200820110790 U CN 200820110790U CN 201181590 Y CN201181590 Y CN 201181590Y
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- test module
- power supply
- memory modules
- test
- electronic load
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model provides a test module and test system for simulating a memory module. The test module has the same size with the memory module. The test module includes a resistance group, a switch, a welding hole and a standby circuit. The switch is coupled with the resistance group; and a power supply is connected with the resistance group by the switch. The welding hole is used to weld an electronic load. The electronic load is set and different electronic loads are switched to simulate the operation status of the memory module chip. The standby circuit is charged by the power supply and supplies electricity to the electronic load.
Description
Technical field
The utility model relates to a kind of test module and test macro, and is particularly related to a kind of test module and test macro in order to the emulated physics memory modules.
Background technology
Internal memory can be kept in the central processing unit desired data, plays the part of considerable role in the running of computing machine.Memory modules just develops towards the direction of high power capacity and high transmission speed at present, when the memory modules of a new generation is released, how according to the heat radiation situation of memory modules suitable heat radiator and rotation speed of the fan to be set, and is considerable problem.
When the memory modules of a new generation is released, extravagent price is to be difficult to adopt the memory modules of physics one of the reason of test of dispelling the heat, therefore, heat radiator and rotation speed of the fan for this memory modules of design collocation, the heat that produces when usually operate with computing chip according to the specifications of this memory modules, and employing software is with the emulation situation of dispelling the heat.Yet this kind test mode will cause error.
On the other hand, how according to the operating characteristic of memory modules suitable power supply unit to be set also is considerable problem, if adopt the change situation of the charge capacity of the mode chip estimate of estimating, will cause error equally.
Therefore, for solving the problem that known method of testing causes, need a kind of test module of design, but the various modes of operation of its emulated physics memory modules, with as selecting for example reference of heat radiator and power supply unit, save testing cost simultaneously and improve efficiency of research and development.
The utility model content
The one side of technical problem to be solved in the utility model is to provide a kind of test module, in order to the thermal value of emulated physics memory modules, so that the heat radiation situation of assessment physical memory module.In addition, but this test module emulated physics memory modules power consumption under various modes of operation, with the power supply capacity of check power supply unit.
Technical problem to be solved in the utility model be to provide a kind of test macro on the other hand, in order to the various modes of operation of emulated physics memory modules, so that the heat radiation situation of assessment physical memory module and the power supply capacity of power supply unit.
In order to achieve the above object, according to above-mentioned explanation of the present utility model, propose a kind of test module in the utility model one preferred embodiment, this test module and physics DDR3 memory modules have same size with the emulated physics memory modules, for example a physics DDR3 memory modules.Test module comprises: resistance group, switch, welding hole and stand-by circuit (redundant circuit).Switch optionally connects a power supply unit and resistance group, and welding hole welding electronic load is set electronic load and switched between the different loads amount mode of operation with the chip of emulated physics DDR3 memory modules.Stand-by circuit charges by power supply unit, and the supply electric energy is to electronic load.In this preferred embodiment, a dissipating cover is set, it covers the resistance group, and stand-by circuit optionally comprises electric capacity group or inductance group.
In order to achieve the above object, according on the other hand of the present utility model, propose a kind of test macro in the utility model one preferred embodiment, it has the memory modules of chip in order to emulation, and test macro comprises at least: electronic load, power supply unit and above-mentioned test module.The utility model one preferred embodiment is to set electronic load to switch between the different loads amount mode of operation with emulation chip.
In addition, above-mentioned resistance group, switch, welding hole and stand-by circuit are arranged on the double-sided printed-circuit board, in the arrangements of chips mode of emulated physics DDR3 memory modules.
In the utility model preferred embodiment, but the thermal value of the chip of resistance group emulated physics DIMM according to the heat radiation situation of this test module, and is adjusted rotation speed of the fan for example and is selected the material of heat radiator.
In addition, in the utility model preferred embodiment, can be according to the power consumption between the different operating state of physics DDR3 memory modules, and adjust the switching state of switch.So, but the power consumption of this test module emulated physics DDR3 memory modules under various modes of operation, with the power supply capacity of check power supply unit.
In addition, according to the utility model one preferred embodiment, the welding hole of this test module is arranged on the position of corresponding each chip, and electronic load is welded in welding hole, electronic load is in order to the load situation of chipset under the emulation different operating state, with the power supply capacity of check power supply unit.Power supply unit supplies power to electronic load and stand-by circuit, when electronic load carries out the switching of different operating state, electronic load can be from the stand-by circuit received energy avoiding when the switching operation state, and the energy of power supply unit can't provide to electronic load in real time.
As shown in the above description, application the utlity model has following advantage:
1. test module of the present utility model and system adopt the thermal value of the chip of resistance group emulated physics memory modules, assess and adjust for example size and the material of rotation speed of the fan and heat radiator according to the heat radiation situation of this test module, therefore can improve the heat dissipation environment of physical memory module effectively.
2. test module of the present utility model and system adopt switch and resistance group with the power consumption of emulated physics memory modules under various modes of operation, therefore can check the power supply capacity of power supply unit effectively.
3. because test module of the present utility model and the system various test jobs of emulated physics DDR3 memory modules are practically adopted in holding at high price of physics DDR3 memory modules, therefore can save testing cost significantly.
Description of drawings
For above-mentioned and other purpose of the present utility model, feature, advantage and embodiment can be become apparent, being described in detail as follows of appended accompanying drawing:
Fig. 1 illustrates the circuit block diagram according to the test macro of the utility model one preferred embodiment;
Fig. 2 illustrates the circuit block diagram according to a kind of test module of the utility model one preferred embodiment;
Fig. 3 illustrates the circuit diagram according to a kind of stand-by circuit of the utility model one preferred embodiment;
Fig. 4 illustrates the circuit diagram according to the another kind of stand-by circuit of the utility model one preferred embodiment.
[main devices symbol description]
10,20: test module 91: power supply unit
11,21: resistance group 92: electronic load
12,22: switch 100: test macro
13,23: welding hole C1～Cn: electric capacity
14,24,24A, 24B: stand-by circuit L1～Ln: inductance
15,25: double-sided printed-circuit board
Embodiment
But test module of the present utility model and the various types of memory modules of system's emulation are to promote efficiency of research and development and to save cost.To be example below, preferred embodiment of the present utility model will be described with the DDR3 memory modules.
Fig. 1 illustrates the circuit block diagram according to the test macro of the utility model preferred embodiment.The test macro of various modes of operation that but test macro 100 is emulation has the physical memory module of chip, test macro comprises at least: electronic load 92, power supply unit 91 and test module 10.Test module 10 comprises: resistance group 11, switch 12, welding hole 13 and stand-by circuit (redundant circuit) 14, power supply unit 91 connects resistance group 11 by switch 12.
But the thermal value of a chip of resistance group 11 emulated physics DDR3 memory modules according to the heat radiation situation of this test module 10, and is adjusted rotation speed of the fan and heat radiator.
In addition, because the chip of actual DDR3 memory modules is two-sided arrangement, the resistance group 11 of preferred embodiment of the present utility model, switch 12, welding hole 13 preferably also can be arranged on the double-sided printed-circuit board 15 with stand-by circuit 14, with the mode of operation of emulated physics DDR3 memory modules exactly.
Fig. 2 illustrates the circuit block diagram according to a kind of test module of the utility model preferred embodiment.Please also refer to Fig. 1 and Fig. 2, test module 20 has same size and transmission pin position with physics DDR3 memory modules, and test module 20 comprises a plurality of blocks, and it is a plurality of chips of corresponding physics DDR3 memory modules respectively.Each block comprises resistance group 21, switch 22, welding hole 23 and stand-by circuit 24.
Resistance group 21 resistance value can be extrapolated according to the specifications of physics DDR3 memory modules.For instance, if the peak power of physics DDR3 memory modules is X watt, and have 9 chip blocks on the physics DDR3 memory modules, then test module 20 also has 9 groups of corresponding respectively resistance groups 21, and each resistance group's 21 maximum power dissipation is X/9.In addition, cooperate rated voltage or electric current and resistance number again, then can calculate the resistance value of each resistance of resistance group 21.
In the utility model preferred embodiment, when dispelling the heat test jobs, test module 20 can be plugged in the memory bank of motherboard.At this moment, power supply unit 91 is supplied electric energy to a plurality of resistance groups 21 according to the specifications of physics DDR3 memory modules, makes a plurality of resistance groups 21 produce heat energy.For more pressing close to the heat radiation situation of physics DDR3 memory modules, optionally adopt dissipating cover 26, it is covered on the resistance group 21, and the material of dissipating cover 26 can be silicon, silicon dioxide and alloy etc., so that the heat that the resistance group is produced evenly distributes, and by the operation of dispelling the heat of fan and heat radiator.
In the utility model preferred embodiment, test module 20 has same size and transmission pin position with physics DDR3 memory modules, so the radiating state of emulated physics DDR3 memory modules exactly.Can't adopt physics DDR3 memory modules dispel the heat the test situation under, test module 20 can replace the physics DDR3 memory modules test jobs that dispels the heat, and the test result of heat radiation test jobs can be used as selects for example foundation of rotation speed of the fan and fin material, with the raising efficiency of research and development.
The test module of the utility model preferred embodiment is by switch 22 and resistance group | 11|[w1] and, by switching a plurality of switches 22, can simulate the pairing power consumption of chip of physics DDR3 memory modules under the different operating state, with the power supply capacity of check power supply unit.
In preferred embodiment of the present utility model, can be according to the power consumption between the different operating state of physics DDR3 memory modules, and adjust the switching state of switch 22.Just, by Closing Switch 22, power supply unit 91 can provide electric energy to resistance group 21, and carries out the test jobs of the power supply capacity of power supply unit 91.So, but the just power consumption of chip under various modes of operation of emulated physics DDR3 memory modules of this test module 20, to carry out test jobs.
The tester can be according to the pairing power consumption of chip of physics DDR3 memory modules under the different operating state, and control the switching state of each switch 22, to change the delivery of power supply unit, and the overall performance of testing power supply supply simultaneously.
Just, can't adopt physics DDR3 memory modules to dispel the heat under the situation of test, test module 20 can replace physics DDR3 memory modules and check the power supply capacity of power supply unit effectively.
In addition, according to the utility model preferred embodiment, the welding hole 23 of test module 20 is arranged on the position of corresponding each chip, and electronic load 92 is welded in welding hole 13, electronic load 92 is in order to the load situation of chip under the emulation different operating state, with the power supply capacity of check power supply unit 91.
Can't adopt physics DDR3 memory modules to dispel the heat under the situation of test, test module 20 can replace physics DDR3 memory modules and carry out the check operation of the power supply capacity of power supply unit, reduces simultaneously testing cost significantly.
Fig. 3 illustrates the circuit diagram according to a kind of stand-by circuit of the utility model preferred embodiment.Please also refer to Fig. 2 and Fig. 3, stand-by circuit 24A comprises capacitor C 1～Cn, and stand-by circuit 24A is arranged on 92 of power supply unit 91 and electronic loads.The electric energy of supplying when power supply unit 91 takes above electronic load 92, and capacitor C 1～Cn can store unnecessary electric energy.When the electric energy of power supply unit 91 supply was not enough to the required electric energy of supplies electrons load 92, capacitor C 1～Cn can provide electric energy to electronic load 92 in real time.
Also promptly, by capacitor C 1～Cn, can eliminate difference between the energy supply and demand of 92 of power supply unit 91 and electronic loads to the impact of system.
Fig. 4 illustrates the circuit diagram according to the another kind of stand-by circuit of the utility model preferred embodiment.Please also refer to Fig. 2 and Fig. 4, stand-by circuit 24B comprises inductance L 1～Ln, in order to supply electric energy in real time to electronic load.Similarly, the energy supply and demand state of 92 of also visual power supply unit 91 of inductance L 1～Ln and electronic loads and store or provide electric energy.
Just, by inductance L 1～Ln, can eliminate difference between the energy supply and demand of 92 of power supply unit 91 and electronic loads to the impact of system.
By above-mentioned the utility model preferred embodiment as can be known, application the utlity model has following advantage:
1. test module of the present utility model and system adopt the thermal value of the chip of resistance group emulated physics memory modules, assess and adjust for example size and the material of rotation speed of the fan and heat radiator according to the heat radiation situation of this test module, therefore can improve the radiating state of physical memory module effectively.
2. test module of the present utility model and system adopt switch, resistance group and electronic load with the power consumption of emulated physics memory modules under various modes of operation, therefore can check the power supply capacity of power supply unit effectively.
3. because test module of the present utility model and the system various test jobs of emulated physics DDR3 memory modules are practically adopted in holding at high price of physics DDR3 memory modules, therefore can save testing cost significantly.
Though the utility model discloses as above with preferred embodiment; right its is not in order to limit the utility model; any those skilled in the art; in not breaking away from spirit and scope of the present utility model; when can doing various changes and distortion, therefore protection domain of the present utility model is when looking being as the criterion that the accompanying Claim book defined.
Claims (9)
1, a kind of test module has a memory modules of a chip in order to emulation, it is characterized in that this test module comprises at least:
One resistance group;
One switch couples this resistance group, and a power supply unit connects this resistance group by this switch;
One welding hole in order to weld an electronic load, is set this electronic load and is switched between the different loads amount mode of operation with this chip of emulation;
One stand-by circuit, by this power supply unit charging, and the supply electric energy is to this electronic load; And
One printed circuit board (PCB), this resistance group, this switch, this welding hole and this stand-by circuit are arranged on this printed circuit board (PCB),
Wherein, this test module and this memory modules is measure-alike.
2, test module according to claim 1 is characterized in that, this P.e.c. is a pair of face printed circuit board (PCB) very.
3, test module according to claim 1 is characterized in that, this stand-by circuit comprises an electric capacity group.
4, test module according to claim 1 is characterized in that, this stand-by circuit comprises an inductance group.
5, test module according to claim 1 is characterized in that, this memory modules is a DDR3 memory modules.
6, a kind of test macro has a memory modules of a chip in order to emulation, it is characterized in that this test macro comprises at least:
One electronic load is set this electronic load and is switched between the different loads amount mode of operation with this chip of emulation;
One power supply unit; And
One test module comprises at least:
One resistance group;
One switch couples this resistance group, and this power supply unit connects this resistance group by this switch;
One welding hole is in order to weld this electronic load;
One stand-by circuit, by this power supply unit charging, and the supply electric energy is to this electronic load; And
One printed circuit board (PCB), this resistance group, this switch, this welding hole and this stand-by circuit are arranged on this printed circuit board (PCB),
Wherein, this test module and this memory modules is measure-alike.
7, test macro according to claim 6 is characterized in that, this printed circuit board (PCB) is a two-sided printed circuit board (PCB).
8, test macro according to claim 6 is characterized in that, this stand-by circuit comprises an electric capacity group.
9, test macro according to claim 6 is characterized in that, this stand-by circuit comprises an inductance group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201107909U CN201181590Y (en) | 2008-04-25 | 2008-04-25 | Test module and test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201107909U CN201181590Y (en) | 2008-04-25 | 2008-04-25 | Test module and test system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201181590Y true CN201181590Y (en) | 2009-01-14 |
Family
ID=40251086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201107909U Expired - Fee Related CN201181590Y (en) | 2008-04-25 | 2008-04-25 | Test module and test system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201181590Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297760A (en) * | 2010-06-25 | 2011-12-28 | 康佳集团股份有限公司 | Test method and design method of cooling fin of power device, and analog resistor |
| CN102455966A (en) * | 2010-10-29 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Internal memory loading keyset |
| CN103698562A (en) * | 2013-12-26 | 2014-04-02 | 艾德克斯电子（南京）有限公司 | Electronic load device and simulation method thereof |
-
2008
- 2008-04-25 CN CNU2008201107909U patent/CN201181590Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297760A (en) * | 2010-06-25 | 2011-12-28 | 康佳集团股份有限公司 | Test method and design method of cooling fin of power device, and analog resistor |
| CN102455966A (en) * | 2010-10-29 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Internal memory loading keyset |
| CN103698562A (en) * | 2013-12-26 | 2014-04-02 | 艾德克斯电子（南京）有限公司 | Electronic load device and simulation method thereof |
| CN103698562B (en) * | 2013-12-26 | 2016-03-16 | 艾德克斯电子（南京）有限公司 | A kind of electronic load device and emulation mode thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090114 Termination date: 20130425 |