CN201176685Y - Composite thermal insulation and decoration laminated board - Google Patents
Composite thermal insulation and decoration laminated board Download PDFInfo
- Publication number
- CN201176685Y CN201176685Y CNU2008200625686U CN200820062568U CN201176685Y CN 201176685 Y CN201176685 Y CN 201176685Y CN U2008200625686 U CNU2008200625686 U CN U2008200625686U CN 200820062568 U CN200820062568 U CN 200820062568U CN 201176685 Y CN201176685 Y CN 201176685Y
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- circuit board
- insulating decorative
- compound thermal
- insulation layer
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Abstract
The utility model relates to a composite thermal-insulation decoration integrating board. The composite thermal-insulation decoration integrating board comprises a thermal insulation layer (1) and a surface protection layer (2) glued to the thermal insulation layer (1), and the surface of the surface protection layer (2) is coated with a nanometer modification coating (3). The board adopts nanometer modification paint as the coating, raises the adhesive force, water resistance, moisture resistance, fouling resistance, mildew resistance, bacterial inhibition, ultraviolet resistance, aging resistance and other capability of a facing layer, and can purify air enduringly and improve living environment.
Description
Technical field
The utility model relates to a kind of compound thermal-insulating decorative circuit board.
Background technology
Raising along with social progress and people's living standard, people are also more and more higher to the requirement of dwelling environment, traditional decorative material for wall surface can't satisfy people's requirement, as being used for decorative material for wall surface of building at present interior exterior wall Aluminiumplastic composite panel, exterior wall aluminum veneer and heat-insulating composite plate etc. is arranged.But the coating of these composite surface all adopts general coating as coating at present, and the adhesive power of general coating and finish coat, waterproof, protection against the tide, antifouling, mildew-resistant, antibacterial, uvioresistant and ageing-resistant ability are relatively poor, and are unfavorable for improving dwelling environment.
The utility model content
Technical problem to be solved in the utility model provides a kind of compound thermal-insulating decorative circuit board that helps improving dwelling environment.
The utility model solves the problems of the technologies described above the technical scheme that is adopted: the compound thermal-insulating decorative circuit board, comprise insulation layer and the surface protecting layer that glues together with insulation layer, and the surface protection laminar surface scribbles the nano modification coating.
Nano material has very strong multi-function action, and it can absorb ultraviolet ray, discharges anion, and mildew-resistant is antibacterial; Produce unique quantum tunneling effect, seizure automatically, absorption and hazardous substancess such as degrading benzene thing, formaldehyde purify air lastingly; It can also be penetrated in the base material, and super compact nanometer molecular structure makes paint film more tough and tensile, wear-resisting, and unique super thin property nanometer paint film makes water and dust granule be difficult to adhere to metope, self-cleaning anti-soil.Adopt the nanometer technology modified coating as coating, improved the adhesive power, waterproof, protection against the tide of finish coat, antifouling, mildew-resistant, antibacterial, uvioresistant and ageing-resistant ability etc.
Be provided with stress-buffer layer between described surface protecting layer and insulation layer.Adopt high molecular polymer materials such as epoxy resin, polyurethane resin or acrylic resin as stress-buffer layer, provide the material excellent bond performance, its flexible macromolecular chain provides extraordinary plasticity, the mechanics that has improved layer structure distributes, and has played the effect of buffering and balance inter-laminar stress.
Be provided with at least one aspect layer enhancement layer between described stress-buffer layer and insulation layer.The surface layer enhancement layer can be engineering plastics, inorganic material etc., is used to strengthen the anti-type change ability of surface material.
Be provided with stress-buffer layer between surface layer enhancement layer and insulation layer.
Described insulation layer bottom surface gummed has anti-around song distortion enhancement layer.Anti-adopt the comparatively compositions such as high molecular plastic alloy, metal and macromolecule copolymer resin of rigidity around song distortion enhancement layer, it can the plane or facade be placed in the insulation layer, improved the axial stiffness of layer structure, prevent its buckling deformation.
Described insulation layer is extruded polystyrene plate, hard polyurethane foam board or phenolic resin foamed board; Described surface protecting layer is metal sheet, engineering plastics plate or inorganic material plate; The fluorine carbon lacquer that described nano modification coating is a nano modification, silicon third lacquer, acrylic paint, polyurethane paint, polyester lacquer and emulsion paint.
Described stress-buffer layer is modified chloroprene rubber, epoxy resin, polyurethane resin or acrylic resin fluoropolymer resin.
Described surface layer enhancement layer is metal sheet, engineering plastics plate or inorganic material plate.
Described anti-be metal sheet, engineering plastics plate or macromolecule copolymer resin plate around song distortion enhancement layer.
To sum up, the beneficial effects of the utility model are:
1, adopts the nanometer technology modified coating as coating, improved the adhesive power, waterproof, protection against the tide of finish coat, antifouling, mildew-resistant, antibacterial, uvioresistant and ageing-resistant ability etc., and can purify air lastingly, improve dwelling environment.
2, the stress-buffer layer that is provided with between surface protecting layer and insulation layer can play the effect of buffering and balance inter-laminar stress.
3, insulation layer bottom surface gummed have anti-around song distortion enhancement layer, it can the plane or facade be placed in the insulation layer, improved the axial stiffness of layer structure, prevent its buckling deformation.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment 1;
Fig. 2 is the structural representation of the utility model embodiment 2.
The specific embodiment
Embodiment 1:
As shown in Figure 1, compound thermal-insulating decorative circuit board of the present utility model is a layered composite structure, insulation layer 1 and surface protecting layer 2 gummeds, surface protecting layer 2 surfaces scribble nano modification coating 3,1 of surface protecting layer 2 and insulation layer are provided with stress- buffer layer 4, and 1 of stress-buffer layer 4 and insulation layer are provided with one deck surface layer enhancement layer 5, and 1 of surface layer enhancement layer 5 and insulation layer are provided with stress-buffer layer 4, insulation layer 1 bottom surface gummed has anti-around song distortion enhancement layer 6, resists around song distortion enhancement layer 6 to be provided with for the plane.
Present embodiment also can glue together one deck insulation layer around song distortion enhancement layer 6 bottom surfaces again anti-.
The insulation layer of present embodiment can be extruded polystyrene plate, hard polyurethane foam board or phenolic resin foamed board; Surface protecting layer can be metal sheet, engineering plastics plate or inorganic material plate; The nano modification coating is fluorine carbon lacquer, silicon third lacquer, acrylic paint, polyurethane paint, polyester lacquer and the emulsion paint of nano modification; Stress-buffer layer is modified chloroprene rubber, epoxy resin, polyurethane resin or acrylic resin fluoropolymer resin; The surface layer enhancement layer is metal sheet, engineering plastics plate or inorganic material plate; Described anti-be metal sheet, engineering plastics plate or macromolecule copolymer resin plate around song distortion enhancement layer.
Embodiment 2:
As shown in Figure 2, the difference of present embodiment and embodiment 1 is that the anti-of embodiment 1 is that the plane is provided with around song distortion enhancement layer, and the plane is provided with promptly anti-composite bed around song distortion enhancement layer and its gummed and be arranged in parallel; The anti-of present embodiment is the facade setting around song distortion enhancement layer, and the facade setting is promptly anti-around composite bed vertical be provided with of song distortion enhancement layer with its gummed.
The utility model is not limited only to the foregoing description, also can comprise the increase or the minimizing of above-mentioned each composite bed.
Claims (10)
1, compound thermal-insulating decorative circuit board comprises insulation layer (1) and the surface protecting layer (2) that glues together with insulation layer (1), it is characterized in that described surface protecting layer (2) surface scribbles nano modification coating (3).
2, compound thermal-insulating decorative circuit board according to claim 1 is characterized in that, is provided with stress-buffer layer (4) between described surface protecting layer (2) and insulation layer (1).
3, compound thermal-insulating decorative circuit board according to claim 2 is characterized in that, is provided with at least one aspect layer enhancement layer (5) between described stress-buffer layer (4) and insulation layer (1).
4, compound thermal-insulating decorative circuit board according to claim 3 is characterized in that, is provided with stress-buffer layer (4) between described surface layer enhancement layer (5) and insulation layer (1).
According to any described compound thermal-insulating decorative circuit board of claim 1 to 4, it is characterized in that 5, described insulation layer (1) bottom surface gummed has anti-around song distortion enhancement layer (6).
6, compound thermal-insulating decorative circuit board according to claim 5 is characterized in that, described resisting around song distortion enhancement layer (6) is that the plane is provided with or the facade setting.
7, compound thermal-insulating decorative circuit board according to claim 1 is characterized in that, described insulation layer (1) is extruded polystyrene plate, hard polyurethane foam board or phenolic resin foamed board; Described surface protecting layer (2) is metal sheet, engineering plastics plate or inorganic material plate; The fluorine carbon lacquer that described nano modification coating is a nano modification, silicon third lacquer, acrylic paint, polyurethane paint, polyester lacquer and emulsion paint.
8, compound thermal-insulating decorative circuit board according to claim 2 is characterized in that, described stress-buffer layer (4) is modified chloroprene rubber, epoxy resin, polyurethane resin or acrylic resin fluoropolymer resin.
9, compound thermal-insulating decorative circuit board according to claim 3 is characterized in that, described surface layer enhancement layer (5) is metal sheet, engineering plastics plate or inorganic material plate.
10, compound thermal-insulating decorative circuit board according to claim 5 is characterized in that, described anti-be metal sheet, engineering plastics plate or macromolecule copolymer resin plate around song distortion enhancement layer (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200625686U CN201176685Y (en) | 2008-03-18 | 2008-03-18 | Composite thermal insulation and decoration laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200625686U CN201176685Y (en) | 2008-03-18 | 2008-03-18 | Composite thermal insulation and decoration laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201176685Y true CN201176685Y (en) | 2009-01-07 |
Family
ID=40216703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200625686U Expired - Fee Related CN201176685Y (en) | 2008-03-18 | 2008-03-18 | Composite thermal insulation and decoration laminated board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201176685Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106284898A (en) * | 2016-08-28 | 2017-01-04 | 山东地平线建筑节能科技有限公司 | A kind of heat insulation decoration integrated plate and manufacture method thereof |
| CN112265348A (en) * | 2020-10-28 | 2021-01-26 | 合肥华聚微科新材料有限责任公司 | Novel multilayer composite microporous material for white household appliances |
| CN111173216B (en) * | 2020-01-03 | 2021-08-17 | 苏州兴禾源复合材料有限公司 | High-strength impact-resistant VCM film-coated plate |
-
2008
- 2008-03-18 CN CNU2008200625686U patent/CN201176685Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106284898A (en) * | 2016-08-28 | 2017-01-04 | 山东地平线建筑节能科技有限公司 | A kind of heat insulation decoration integrated plate and manufacture method thereof |
| CN106284898B (en) * | 2016-08-28 | 2018-12-21 | 山东地平线建筑节能科技有限公司 | A kind of heat insulation decoration integrated plate and its manufacturing method |
| CN111173216B (en) * | 2020-01-03 | 2021-08-17 | 苏州兴禾源复合材料有限公司 | High-strength impact-resistant VCM film-coated plate |
| CN112265348A (en) * | 2020-10-28 | 2021-01-26 | 合肥华聚微科新材料有限责任公司 | Novel multilayer composite microporous material for white household appliances |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090107 |