CN201416251Y - Thermoplastic resin compound wood floor - Google Patents

Thermoplastic resin compound wood floor Download PDF

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Publication number
CN201416251Y
CN201416251Y CN2009201155358U CN200920115535U CN201416251Y CN 201416251 Y CN201416251 Y CN 201416251Y CN 2009201155358 U CN2009201155358 U CN 2009201155358U CN 200920115535 U CN200920115535 U CN 200920115535U CN 201416251 Y CN201416251 Y CN 201416251Y
Authority
CN
China
Prior art keywords
thermoplastic resin
wood floor
adhesive layer
resin adhesive
medium density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009201155358U
Other languages
Chinese (zh)
Inventor
陆铜华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANGZHOU HUAHAI WOOD CO Ltd
Original Assignee
HANGZHOU HUAHAI WOOD CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANGZHOU HUAHAI WOOD CO Ltd filed Critical HANGZHOU HUAHAI WOOD CO Ltd
Priority to CN2009201155358U priority Critical patent/CN201416251Y/en
Application granted granted Critical
Publication of CN201416251Y publication Critical patent/CN201416251Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a thermoplastic resin compound wood floor formed by a thermoplastic resin layer, a flooring slab, a medium density fiber board and a baseplate, and comprises the flooringslab; a thermoplastic resin adhesive layer is placed between the flooring slab and the medium density fiber board; and a thermoplastic resin adhesive layer is placed between the medium density fiber board and the baseplate. The compound wood floor has the advantages that since the thermoplastic resin adhesive layer is placed between the flooring slab and the medium density fiber board, and the thermoplastic resin adhesive layer is placed between the medium density fiber board and the baseplate, non-pollution adhesion can be achieved, the damp proof insulation function is provided, and meanwhile, the efficacy of a compound elastic wood floor is realized.

Description

The thermoplastic resin compoiste wood floor
Technical field
The utility model relates to a kind of by thermoplastic resin and the thermoplastic resin compoiste wood floor that ground slab, density board and substrate constitute, and belongs to wood flooring and makes the field.
Background technology
CN2460280Y, title " plastic cement compoiste wood floor ", the wooden boards of this wood flooring car is fixed on the surface of plastic cement base plate.Its weak point: the one, not only the plastic cement base plate easily deforms and directly causes its lip-deep wooden boards to deform; The 2nd, be positioned at wooden boards on the plastic cement backplate surface because poor with plastic cement base plate affinity, easily produce peel off, phenomenon such as distortion.
Summary of the invention
Purpose of design: avoid the weak point in the background technology, design and a kind ofly can either prevent floor deformation, have the damp proof insulation function again, have the thermoplastic resin compoiste wood floor of spring function simultaneously again.
Design scheme: in order to realize above-mentioned purpose of design.Between ground slab and density board, be equipped with the design of thermoplastic resin adhesive layer between sealing plate and substrate respectively, be the principal character of the utility model design.The purpose of doing like this is: because the thermoplastic resin adhesive layer had both had the function that heat is melted bonding Wooden veneer, the function that has damp proof insulation again, has simultaneously the function of elastic buffer again, therefore between ground slab and density board, one deck thermoplastic resin adhesive layer is set respectively between sealing plate and substrate both to have been solved between ground slab and the density board, adhesion problem between density board and the substrate, formed again by the ground slab, density board, the thermoplastic resin compoiste wood floor that substrate and thermoplastic resin adhesive layer constitute, both reached damp proof insulation, the purpose of elastic buffer has the texture of wooden floor again.Its technical scheme: the thermoplastic resin compoiste wood floor, it comprises the ground slab, is equipped with the thermoplastic resin adhesive layer between described ground slab and density board, is equipped with the thermoplastic resin adhesive layer between sealing plate and substrate.
The utility model is compared with background technology, the one, between ground slab and density board, be equipped with the design of thermoplastic resin adhesive layer between sealing plate and substrate respectively, both realized pollution-free bondingly, had the damp proof insulation function again, formed the effect of composite elastic wood flooring simultaneously again; The 2nd, reduced the consumption of timber resources, have energy-conservation and good environmental protection effect.
Description of drawings
Fig. 1 is the structural representation of thermoplastic resin compoiste wood floor.
The specific embodiment
Embodiment 1: with reference to accompanying drawing 1.The thermoplastic resin compoiste wood floor, it comprises the ground slab, and 3 of described ground slab 1 and density board are equipped with thermoplastic resin adhesive layer 2, and 5 of sealing plate 3 and substrates are equipped with thermoplastic resin adhesive layer 4.Described ground slab 1 both can be natural bark, plank skin, also can be artificial bark or paper.Described substrate 5 is plank or thermalplastic resin multi-layer plate, and its manufacture craft is a prior art, is not described herein at this.Described thermoplastic resin adhesive layer 2 and 4 is meant any in polyethylene, polypropylene, the polyvinyl chloride, with thermoplastic resins such as polyethylene, polypropylene, polyvinyl chloride is adhesive layer between Wooden veneer and the Wooden veneer, not only adhesive power is strong, is difficult for out layer, and environment friendly and pollution-free.
What need understand is: though the foregoing description is to the utility model detailed text description of contrasting; but these text descriptions; just the simple text of the utility model mentality of designing is described; rather than to the restriction of utility model mentality of designing; any combination, increase or modification that does not exceed the utility model mentality of designing all falls in the protection domain of the present utility model.

Claims (4)

1, a kind of thermoplastic resin compoiste wood floor, it comprises the ground slab, it is characterized in that: be equipped with the thermoplastic resin adhesive layer between described ground slab and density board, be equipped with the thermoplastic resin adhesive layer between sealing plate and substrate.
2, thermoplastic resin compoiste wood floor according to claim 1 is characterized in that: described ground slab is natural wood skin or paper.
3, thermoplastic resin compoiste wood floor according to claim 1 is characterized in that: described substrate is plank or thermalplastic resin multi-layer plate.
4, thermoplastic resin compoiste wood floor according to claim 1 is characterized in that: described thermoplastic resin adhesive layer is meant polyethylene, polypropylene, polyvinyl chloride.
CN2009201155358U 2009-03-11 2009-03-11 Thermoplastic resin compound wood floor Expired - Fee Related CN201416251Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201155358U CN201416251Y (en) 2009-03-11 2009-03-11 Thermoplastic resin compound wood floor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009201155358U CN201416251Y (en) 2009-03-11 2009-03-11 Thermoplastic resin compound wood floor

Publications (1)

Publication Number Publication Date
CN201416251Y true CN201416251Y (en) 2010-03-03

Family

ID=41792667

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009201155358U Expired - Fee Related CN201416251Y (en) 2009-03-11 2009-03-11 Thermoplastic resin compound wood floor

Country Status (1)

Country Link
CN (1) CN201416251Y (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105926881A (en) * 2016-04-29 2016-09-07 太仓龙益塑业有限公司 Polypropylene composite antibacterial board
CN108222413A (en) * 2012-06-01 2018-06-29 尤尼林有限公司 It is used to form the panel of floor covering
WO2021031146A1 (en) * 2019-08-21 2021-02-25 长兴经纬竹制品有限公司 Co-extrusion spc floor and production equipment therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108222413A (en) * 2012-06-01 2018-06-29 尤尼林有限公司 It is used to form the panel of floor covering
US11840850B2 (en) 2012-06-01 2023-12-12 Unilin, Bv Panel for forming a floor covering
CN105926881A (en) * 2016-04-29 2016-09-07 太仓龙益塑业有限公司 Polypropylene composite antibacterial board
WO2021031146A1 (en) * 2019-08-21 2021-02-25 长兴经纬竹制品有限公司 Co-extrusion spc floor and production equipment therefor

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100303

Termination date: 20170311

CF01 Termination of patent right due to non-payment of annual fee