CN201170806Y - Pick-up head chip dimension die set with novel structure - Google Patents
Pick-up head chip dimension die set with novel structure Download PDFInfo
- Publication number
- CN201170806Y CN201170806Y CNU2008200098724U CN200820009872U CN201170806Y CN 201170806 Y CN201170806 Y CN 201170806Y CN U2008200098724 U CNU2008200098724 U CN U2008200098724U CN 200820009872 U CN200820009872 U CN 200820009872U CN 201170806 Y CN201170806 Y CN 201170806Y
- Authority
- CN
- China
- Prior art keywords
- pick
- circuit board
- head
- components
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The utility model relates to a pick-up head chip size module with a novel structure. In the prior video transmission technology, the pick-up head module is adopted; however, as the prior pick-up head is separate from the circuit board and the pick-up head is required to be arranged on the surface of the circuit board, the volume is large; the pick-up head module is operated inconveniently; and the pick-up head and the circuit board are polluted by dust particle easily. In addition, as the printed circuit board can not be uniform in size, wastage of materials and inventory accumulations are caused. The pick-up head chip size module consists of a lens, a sensor, components, a circuit board and a vent hole. The middle of the surface of the circuit board is provided with the sensor; the edges of the surface of the circuit board are provided with the components. The pedestal of the lens is provided with the vent hole. The circuit board is equal to a packaged chip in size. The circuit board, the sensor and the components are assembled in the pedestal in ultra-precision. The pick-up head chip size module is compact and simple in structure without dust particle; the focal length is precise; the vent hole is designed to be processed at high temperature easily; the circuit board, the sensor and the components are assembled conveniently and flexibly; the application scope of the pick-up head chip size module is wide; and the pick-up head chip size module can be promoted conveniently.
Description
Technical field
The utility model relates to the electron optics field, is specifically related to a kind of camera chip size module of new structure.
Background technology
Along with increasing rapidly of video transmission technologies, requirement to the image input end also enlarges thereupon, all adopt the camera module to achieve the goal at present, and prior camera and wiring board are separated components, camera need be arranged on PCB surface during assembling, and be bulky, be awkward, easily cause the pollution problem of micronic dust, the PCB printed circuit board sizes also can't be unified simultaneously, causes problems such as data waste and stock's accumulation.
The utility model content
The purpose of this utility model is to provide a kind of and utilizes the wafer-level package technology, with module minimization and standardization, make the camera chip size module of the new structure that module can process in the electronic devices and components mode.
The utility model is made of camera lens, sensor, components and parts, wiring board and vent port, wiring board and components and parts design for microminiature, the PCB surface middle part is provided with sensor, limit portion is provided with components and parts, the camera lens base is provided with vent port, the wiring board size equals the Chip Packaging size, and wiring board and sensor, components and parts are assembled in camera lens base inside by ultraprecise.
Advantage of the present utility model be little, simple in structure, the no micronic dust of volume, focal length accurately, vent design is convenient to high temperature process, assembly operation is convenient, flexible, uses in extensive rangely, is beneficial to popularization.
Description of drawings
Fig. 1 is an one-piece construction synoptic diagram of the present utility model.
1 is camera lens among the figure, the 2nd, and sensor, the 3rd, components and parts, the 4th, wiring board, the 5th, vent port, the 6th, camera lens base.
Embodiment
The utility model is described in further details with most preferred embodiment below in conjunction with accompanying drawing:
The utility model is made of camera lens (1), sensor (2), components and parts (3), wiring board (4) and vent port (5), wiring board (4) designs for microminiature with components and parts (3), middle part, wiring board (4) surface is provided with sensor (2), limit portion is provided with components and parts (3), camera lens base (6) is provided with vent port (5), wiring board (4) size equals the Chip Packaging size, and wiring board (4) is assembled in camera lens base (6) inside with sensor (2), components and parts (3) by ultraprecise.
Claims (1)
1, a kind of camera chip size module of new structure, it is characterized in that it is made of camera lens (1), sensor (2), components and parts (3), wiring board (4) and vent port (5), wiring board (4) designs for microminiature with components and parts (3), middle part, wiring board (4) surface is provided with sensor (2), limit portion is provided with components and parts (3), camera lens base (6) is provided with vent port (5), wiring board (4) size equals the Chip Packaging size, and wiring board (4) is assembled in camera lens base (6) inside with sensor (2), components and parts (3) by ultraprecise.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200098724U CN201170806Y (en) | 2008-03-22 | 2008-03-22 | Pick-up head chip dimension die set with novel structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200098724U CN201170806Y (en) | 2008-03-22 | 2008-03-22 | Pick-up head chip dimension die set with novel structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201170806Y true CN201170806Y (en) | 2008-12-24 |
Family
ID=40209859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200098724U Expired - Fee Related CN201170806Y (en) | 2008-03-22 | 2008-03-22 | Pick-up head chip dimension die set with novel structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201170806Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102687497B (en) * | 2009-11-10 | 2014-12-24 | 韩国以事美德有限公司 | Camera module test and focus controlling apparatus |
| CN111123457A (en) * | 2018-10-31 | 2020-05-08 | 三赢科技（深圳）有限公司 | Base and camera module |
-
2008
- 2008-03-22 CN CNU2008200098724U patent/CN201170806Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102687497B (en) * | 2009-11-10 | 2014-12-24 | 韩国以事美德有限公司 | Camera module test and focus controlling apparatus |
| CN111123457A (en) * | 2018-10-31 | 2020-05-08 | 三赢科技（深圳）有限公司 | Base and camera module |
| CN111123457B (en) * | 2018-10-31 | 2022-06-24 | 三赢科技（深圳）有限公司 | Base and camera module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081224 Termination date: 20100322 |