CN201146046Y - Storing card - Google Patents
Storing card Download PDFInfo
- Publication number
- CN201146046Y CN201146046Y CNU2007201714381U CN200720171438U CN201146046Y CN 201146046 Y CN201146046 Y CN 201146046Y CN U2007201714381 U CNU2007201714381 U CN U2007201714381U CN 200720171438 U CN200720171438 U CN 200720171438U CN 201146046 Y CN201146046 Y CN 201146046Y
- Authority
- CN
- China
- Prior art keywords
- chip
- storage
- storage card
- model
- main control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The utility model relates to a memory card, comprising an external interface, a shell and a card body; the card body comprises a printing circuit board, and a main control chip and a memory chip which are welded on the printing circuit board; the external interface is connected with the main control chip which is connected with the memory chip; the main control chip and the memory chip are naked chips; the naked chips and the printing circuit board are integrally sealed in the shell. The memory card of the utility model can be manufactured by simple manufacture process, and has high yield and smaller volume of the finished memory card product.
Description
Technical field
The utility model relates to data storage technology, more particularly, relates to a kind of storage card.
Background technology
The application market of mini memory card is main from early stage digital camera, expands gradually in recent years to portable type electronic products such as mobile phone, PDA, gps satellite navigation.Especially along with multimedia handset is more and more universal, video/audio function under huge data storing demand, has more quickened the quick growth of the storage card market demand from strength to strength.On the other hand, the development of the specification of storage card is except cooperating the compact trend evolution of portable type electronic product, and multimedia application makes that also the capacity requirement of storage card is increasing.Therefore under more and more littler at the storage card volume, capacity was increasing, the assembling of storage card had produced structural change.
Storage card with SD series is an example, TSOP (English full name ThinSmall Outline Package is adopted in the assembling of early stage SD card, Chinese: thin-type small-size encapsulation) or the flash chip of WSOP encapsulated moulding, with SMT (English full name Surface mount technology, Chinese: mode surface mounting technique) places the circuit substrate of storage card, utilize again mode such as ultrasonic up and down two shells engage and form the card body.This kind assembling mode general memory module factory all can produce voluntarily, perhaps is contracted out to professional SMT foundries.
Yet evolution is during to the microSD card, because the storage card volume significantly dwindles, add the demand of high power capacity, make the microSD card must adopt the naked crystalline substance of flash memory, and with COB (English full name Chip on Board, Chinese: the IC nude film is fixed on the printed-wiring board (PWB) surely by nation) mode directly bind to substrate, even because of capacity requirement must wear down and pile up flash chip, and insert spare parts such as control IC, passive component, and then, impose roller, laser or water cutter cutting mode at last and finish the card body with the sealing of pressing mold (Molding) processing procedure of semiconductor packages.
World nand flash memory manufacturer directly supplies storage card and becomes the action of card frequent, even is once taking out the strategy that storage card one-tenth card price is lower than flash memory wafer (wafer).Following influence will be squeezed the wafer supply of flash memory in one's power if flash memory manufacturer directly is supplied in card and gradually becomes trend, make the wafer source of goods of producing the microSD card reduce.And piling up technical elements, along with memory card capacity is high more, the number of plies that flash chip piles up is also many more, but yields can be more and more lower along with piling up the number of plies.
The utility model content
The technical problems to be solved in the utility model is, in prior art, adopt the storage card volume of simple fabrication process bigger, and the little storage card manufacturing process more complicated of volume, the defective that yields is lower provides a kind of volume the little integrated storage card that is easy to make.
The technical scheme that its technical matters that solves the utility model adopts is: construct a kind of storage card, comprise external interface, housing and card body, described card body comprises printed circuit board (PCB) and the main control chip, storage chip and the resistor-capacitor unit that are welded on the printed circuit board (PCB), described external interface is connected to main control chip, main control chip is connected to storage chip, described main control chip and storage chip are nude film, and described nude film and printed circuit board (PCB) one are encapsulated in the described housing.
In storage card described in the utility model, described main control chip nude film model is CBM3080 or SM290.
In storage card described in the utility model, the model of described storage chip nude film can be among 32M, 64M, 128M, 256M, 512M, 1G, 2G and the 4G any one.
In storage card described in the utility model, described resistor-capacitor unit is a surface mounting component.
In storage card described in the utility model, described housing is the semiconductor-sealing-purpose epoxy resin moulding material.
In storage card described in the utility model, described external interface is Micro SD/TF interface, RS-MMC interface or Mini SD interface, USB interface.
In storage card described in the utility model, described storage chip nude film can be for one or more.
In storage card described in the utility model, described storage chip is a flash chip.
Implement storage card of the present utility model, have following beneficial effect: can realize the storage card that volume is littler by simple manufacturing process.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the structural drawing of a kind of storage card of the utility model;
Fig. 2 is the structural drawing of card body in the utility model;
Fig. 3 is the flow sheet of a kind of storage card of the utility model.
Embodiment
As shown in Figure 1, in a kind of storage card of the utility model, comprise card body 1, housing 2 and external interface 3.Card body 1 comprises: pcb board 11, main control chip nude film (Host controller die) 12, storage chip nude film (Flash die) 13, resistor-capacitor unit 14.
As shown in Figure 2, in card body 1, Host controller die 12 and Flash die 13 are connected on the pcb board 11 by bonding, and Resistor-Capacitor Unit 14 passes through the SMT paster on pcb board 11.
Host controller die 12 is master control schemes such as Chipsbank, SMI, and model is CBM3080, SMI290 etc.
It is among 32M, 64M, 128M, 256M, 512M, 1G, 2G and the 4G any one that Flash die 13 can select Samsung or modern model.According to the demand of memory capacity, one or more storage chip nude films can be arranged.Flash die 13 is connected to Host controller die 12.
Resistor-capacitor unit 14 is a surface mounting component, and precision is+/-5 ‰, guarantees the stability of product.
Housing 2 is the semiconductor-sealing-purpose epoxy resin moulding material, can adopt the BE08/09 of Chow Electronic, guarantees the waterproof and the antistatic characteristic of product.
Can make ultra-thin, different one-body molded storage card with Flash die and Host controller die.Corresponding processing need done during fabrication aspect thickness and the width.Aspect thickness: the thickness of the radian of Bonding and sealing controlled well comes the thickness of effective control store card, to reach the standard of the one-body molded storing card thickness of standard.As shown in Figure 3, be the flow sheet of storage card described in the utility model, comprise the steps:
S21: Resistor-Capacitor Unit is passed through the SMT paster.
S22: Flash die is connected with pcb board by bonding with Host controller die, obtains semi-manufacture.
S23: semi-manufacture are passed through burning program.
S24: test the good semi-manufacture that obtain confirming.
S25: packing material is fed in the chip and the space between the substrate of card body, this packing material can be the BE08/09 semiconductor-sealing-purpose epoxy resin moulding material of Chow Electronic.
S26: it is external that the BE08/09 semiconductor-sealing-purpose epoxy resin moulding material of use Chow Electronic is wrapped in card, obtains preliminary finished product after hot-forming.
S27: above-mentioned finished product is tested under Windows, got good finished product to the end.
S28: above-mentioned good finished product being carried out outward appearance handle, is exactly the finished product of can shipment giving the client.
Produce in the process of the one-body molded storage card of the utility model, perfusion, the hot-forming amount that will control the semiconductor-sealing-purpose epoxy resin moulding material well, hot pressing time strengthens the appearance of product in order to avoid the bad problem of moulding occurs.
The above; it only is the preferable embodiment of the utility model; but protection domain of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement all should be encompassed within the protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with the protection domain of claim.
Claims (8)
1, a kind of storage card, comprise external interface, housing and card body, described card body comprises printed circuit board (PCB) and the main control chip, storage chip and the resistor-capacitor unit that are welded on the printed circuit board (PCB), described external interface is connected to main control chip, main control chip is connected to storage chip, it is characterized in that described main control chip and storage chip are nude film, described nude film and printed circuit board (PCB) one are encapsulated in the described housing.
2, storage card according to claim 1 is characterized in that, described main control chip nude film model is CBM3080 or SMI290.
3, storage card according to claim 1 is characterized in that, the model of described storage chip nude film can be among 32M, 64M, 128M, 256M, 512M, 1G, 2G and the 4G any one.
4, storage card according to claim 1 is characterized in that, described resistor-capacitor unit is a surface mounting component.
5, storage card according to claim 1 is characterized in that, described housing is the semiconductor-sealing-purpose epoxy resin moulding material.
6, storage card according to claim 1 is characterized in that, described external interface is MicroSD/TF interface, RS-MMC interface or Mini SD interface, USB interface.
7, storage card according to claim 3 is characterized in that, described storage chip nude film can be for one or more.
8, storage card according to claim 3 is characterized in that, described storage chip is a flash chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007201714381U CN201146046Y (en) | 2007-12-07 | 2007-12-07 | Storing card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007201714381U CN201146046Y (en) | 2007-12-07 | 2007-12-07 | Storing card |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201146046Y true CN201146046Y (en) | 2008-11-05 |
Family
ID=40082928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2007201714381U Expired - Fee Related CN201146046Y (en) | 2007-12-07 | 2007-12-07 | Storing card |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201146046Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109284808A (en) * | 2018-09-13 | 2019-01-29 | 深圳市江波龙电子股份有限公司 | A kind of multimedia storage card and mobile electronic device |
-
2007
- 2007-12-07 CN CNU2007201714381U patent/CN201146046Y/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109284808A (en) * | 2018-09-13 | 2019-01-29 | 深圳市江波龙电子股份有限公司 | A kind of multimedia storage card and mobile electronic device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2005325736B2 (en) | Method of making memory cards by injection molding | |
US9082777B2 (en) | Method for encapsulating semiconductor and structure thereof | |
US20100110647A1 (en) | Molded Memory Card With Write Protection Switch Assembly | |
US20070063329A1 (en) | Structure Of Memory Card Packaging And Method Of Forming The Same | |
JP2006252390A (en) | Ic card manufacturing method and ic card | |
CN102498562A (en) | Flexible circuit module | |
CN101238579A (en) | Method of assembling semiconductor devices with LEDs | |
CN100369224C (en) | Chip with built-in software and hardware system and making method thereof | |
CN201146046Y (en) | Storing card | |
US20080126658A1 (en) | Inlayed flash memory module | |
CN102263080A (en) | Packaging component for quad flat no-pin triple IC (Integrated Circuit) chip with double salient points and manufacturing method thereof | |
CN102254893A (en) | Quadrilateral flat leadless package with double convex points and production method thereof | |
CN101271725A (en) | Flash memory card | |
CN210628280U (en) | Integrated chip packaging structure | |
CN205507840U (en) | USB flash disk with type -c3. 0 interface | |
CN211604150U (en) | Packaging structure of fingerprint module under screen | |
CN202339910U (en) | Quad flat non-leaded three-IC (Integrated Circuit)-chip packaging piece with double salient points | |
CN202067792U (en) | Semiconductor chip and memory device | |
US8154122B2 (en) | Semiconductor package and methods of manufacturing the semiconductor package | |
KR20060117541A (en) | Multi functional memory card mass-produced by transfer mold | |
CN102263081A (en) | Pin-free dual-IC (integrated circuit)-chip package part with double salient-points and four flat sides and manufacturing method thereof | |
CN209281891U (en) | The non-hermetically sealed three-dimension packaging SDRAM memory that a kind of capacity is 32M × 32bit | |
US20060176673A1 (en) | Removable data storage device and related assembling method | |
KR200390645Y1 (en) | Multi functional memory card mass-produced by transfer mold | |
CN213692050U (en) | System-in-package structure of CF storage card |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081105 Termination date: 20161207 |