CN201132647Y - Hot melting lower adhesive tape for packaging clip-type electron component - Google Patents
Hot melting lower adhesive tape for packaging clip-type electron component Download PDFInfo
- Publication number
- CN201132647Y CN201132647Y CNU2007201127039U CN200720112703U CN201132647Y CN 201132647 Y CN201132647 Y CN 201132647Y CN U2007201127039 U CNU2007201127039 U CN U2007201127039U CN 200720112703 U CN200720112703 U CN 200720112703U CN 201132647 Y CN201132647 Y CN 201132647Y
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- layer
- heat
- hot melt
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002390 adhesive tape Substances 0.000 title claims description 12
- 238000004806 packaging method and process Methods 0.000 title abstract description 3
- 230000008018 melting Effects 0.000 title 1
- 238000002844 melting Methods 0.000 title 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 11
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 17
- 229920000742 Cotton Polymers 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000012943 hotmelt Substances 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 18
- 239000011347 resin Substances 0.000 abstract description 18
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 150000001412 amines Chemical class 0.000 abstract description 6
- 239000004831 Hot glue Substances 0.000 abstract description 4
- 239000003292 glue Substances 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 3
- 229920000092 linear low density polyethylene Polymers 0.000 abstract description 2
- 239000004707 linear low-density polyethylene Substances 0.000 abstract description 2
- 238000005728 strengthening Methods 0.000 abstract 2
- 235000013162 Cocos nucifera Nutrition 0.000 abstract 1
- 244000060011 Cocos nucifera Species 0.000 abstract 1
- 239000005022 packaging material Substances 0.000 abstract 1
- 229920013716 polyethylene resin Polymers 0.000 abstract 1
- 239000000123 paper Substances 0.000 description 10
- 238000012856 packing Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229920006027 ternary co-polymer Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Landscapes
- Adhesive Tapes (AREA)
Abstract
The utility model relates to the packaging material field of electronic products, in particular relates to a hot melt adhesive tape used for packaging a chip type electronic element, which consists of a tissue paper layer, a vinyl strengthening layer, a heat-sensitive glue film, and a pure water layer; the vinyl strengthening layer is linear low-density polyethylene resin, the heat-sensitive glue film is heat-sensitive resin formed by mixing EEA resin and ethoxylated coconut amine; the polyethylene resin adheres to the tissue paper and then is compounded with the heat-sensitive glue film, after the stationary placing, the pure water layer is formed naturally. The hot melt adhesive tape has the advantages that the design is reasonable, the structure is simple, the production is convenient, the hot melt adhesive tape is safe and reliable, and the cost is low.
Description
Technical field
The utility model relates to a kind of electronic product packing field, exactly is a kind of Hot melt adhesive tape that encapsulates electronic element.
Background technology
Miniaturization development along with electrical equipment, micro-miniaturisation to electronic devices and components requires more and more higher, electronic element is the main flow form of present discrete electronic devices and components, its size is more and more littler, develop into 1608 from 3216, its application mainstream size from 1608 to 1005 transition, at present minimum developed into 0603 even to 0402, on so little yardstick, the packing of components and parts, transportation and the aspect such as take corresponding carrier must be arranged, the packing of electronic element is with the paperboard punching at present, seal with adhesive tape under the thermosol, put into slice component then, with adhesive tape on the thermosol hole is sealed subsequently, belt performance is directly being rung the quality of packing and the quality of efficient in the use and element installation, the patent No. is 03235569.6 Chinese patent plate resistor, the following adhesive tape of capacitor packaging tape provides a kind of adhesive tape that is used to encapsulate electronic element, it is to form by coating antistatic additive after rice paper and the hot sticky resin compounded more in the above, will be when this technology is produced through overbaking, the process of cooling and coating antistatic additive, complex process, can't once finish, effect is too low, and the discharging of organic solvent is arranged in process of production, cause environmental pollution, can not adapt to extensive high-speed production requirement, can not carry out the high speed braid, can not be used for the encapsulation of little chip element, the product that research and development adapt to extensive high-speed production requirement is a key of applying the electronic element packing technique.
Summary of the invention
The purpose of this utility model provides adhesive tape under a kind of hot melt that encapsulates electronic element, requires to have the low advantage of cost reasonable in design, simple in structure, convenient for production, safe and reliable.
The utility model is realized by following technical scheme.
The utility model is a kind of to encapsulate adhesive tape under the hot melt of electronic element, form by cotton paper layer, vinyl enhancement Layer, heat sensitive adhesive layer and pure water layer, described vinyl enhancement Layer is that a kind of linear low density polyethylene resin, heat sensitive adhesive layer are the heat-sensitive resins that EEA resin and ethoxylated coco amine mix, compound with heat sensitive adhesive layer again after poly-vinyl resin and the cotton paper bonding, leave standstill the back and form the pure water layer naturally.
During production, with the web-like cotton paper load onto the duplex co-extrusion extrude walk on the complex line of compounding machine flat, by crowded the answering a pager's call of allying the communists in pairs, the EVA resin of the ldpe resin of No. 1 extruder and No. 2 extruders and heat-sensitive resin that ethoxylated coco amine mixes be expressed into form vinyl enhancement Layer and heat sensitive adhesive layer on the cotton paper, with two-layer glued membrane and cotton paper pressing, place adhesive tape under the hot melt that promptly becomes case chip formula electronic component after 24 hours by the roller of colding pressing after the side cut rolling.Under a kind of hot melt that encapsulates electronic element of the present utility model in the adhesive tape, the coating of vinyl enhancement Layer and heat sensitive adhesive layer, compound can on a conveyor line, the finishing fast of calendering, there is not the discharging of organic solvent in the production process, each interfacial bonding strength height of product, the temperature adaptation wide ranges, can improve the package quality of electronic element greatly, therefore, the utlity model has the low advantage of cost reasonable in design, simple in structure, convenient for production, safe and reliable.
Description of drawings
Fig. 1 is an adhesive tape structure scheme drawing under a kind of hot melt that encapsulates electronic element
The specific embodiment
The utility model will be further described below in conjunction with accompanying drawing.
On market, purchase 14-18g/m
2The high-strength special type cotton paper; With above-mentioned roll of tissue paper load onto squeeze to walk on the complex line answer a pager's call flat, when answering a pager's call through the duplex co-extrusion is crowded, the EVA resin of the ldpe resin of No. 1 extruder and No. 2 extrusions and heat-sensitive resin that ethoxylated coco amine mixes be expressed into form the heat sensitive adhesive layer 3 that the thick vinyl enhancement Layer 2 of 10 μ m and thickness are 25 μ m on the cotton paper 1, the ldpe resin of therein ethylene resin on market, purchasing, heat-sensitive glue is by poly-vinyl resin 75, the part by weight of acrylic ternary copolymer resin 20 and ethoxylated coco amine 5 mixes, by the roller of colding pressing with two-layer glued membrane and cotton paper pressing, the side cut rolling was placed after 24 hours, ethoxylated coco amine absorb airborne moisture and the layer thickness that forms to be the moisture film of tens nanometers be pure water layer 4.
Claims (1)
1. adhesive tape under the hot melt that encapsulates electronic element, it is characterized in that forming by cotton paper layer (1), vinyl enhancement Layer (2), heat sensitive adhesive layer (3) and pure water layer (4), described vinyl enhancement Layer (2) is compound with heat sensitive adhesive layer again after boning with cotton paper, leaves standstill the back and forms pure water layer (4) naturally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201127039U CN201132647Y (en) | 2007-07-27 | 2007-07-27 | Hot melting lower adhesive tape for packaging clip-type electron component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201127039U CN201132647Y (en) | 2007-07-27 | 2007-07-27 | Hot melting lower adhesive tape for packaging clip-type electron component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201132647Y true CN201132647Y (en) | 2008-10-15 |
Family
ID=40060922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201127039U Expired - Lifetime CN201132647Y (en) | 2007-07-27 | 2007-07-27 | Hot melting lower adhesive tape for packaging clip-type electron component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201132647Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102108265A (en) * | 2009-12-01 | 2011-06-29 | 日东电工株式会社 | Surface protective sheet |
-
2007
- 2007-07-27 CN CNU2007201127039U patent/CN201132647Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102108265A (en) * | 2009-12-01 | 2011-06-29 | 日东电工株式会社 | Surface protective sheet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhejiang Jiemei Electronic and Technology Co., Ltd. Assignor: Fang Juanyun Contract record no.: 2010330001450 Denomination of utility model: Hot melting lower adhesive tape for packaging clip-type electron component Granted publication date: 20081015 License type: Exclusive License Record date: 20100726 |
|
| ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG JIEMEI ELECTRONIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FANG JUANYUN Effective date: 20100925 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 313301 TO: 313300 |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20100925 Address after: 313300 No. 008 Sunshine Industrial Park, passing Town, Anji County, Zhejiang Province Patentee after: Zhejiang Jiemei Electronic and Technology Co., Ltd. Address before: 313301, Anji County, Zhejiang Province pass town Sunshine Industrial Zone 008 Patentee before: Fang Juanyun |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Hot melting lower adhesive tape for packaging clip-type electron component Effective date of registration: 20120416 Granted publication date: 20081015 Pledgee: Anji County Rural Credit Cooperative Association Pledgor: Zhejiang Jiemei Electronic and Technology Co., Ltd. Registration number: 2012990000155 |
|
| C56 | Change in the name or address of the patentee |
Owner name: ZHEJIANG JIEMEI ELECTRONIC + TECHNOLOGY CO., LTD. Free format text: FORMER NAME: ZHEJIANG JIEMEI ELECTRONIC AND TECHNOLOGY CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 313300 No. 008 Sunshine Industrial Park, passing Town, Anji County, Zhejiang Province Patentee after: Zhejiang Jiemei Electronic & Technology Co., Ltd. Address before: 313300 No. 008 Sunshine Industrial Park, passing Town, Anji County, Zhejiang Province Patentee before: Zhejiang Jiemei Electronic and Technology Co., Ltd. |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20141119 Granted publication date: 20081015 Pledgee: Anji County Rural Credit Cooperative Association Pledgor: Zhejiang Jiemei Electronic & Technology Co., Ltd. Registration number: 2012990000155 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PM01 | Change of the registration of the contract for pledge of patent right |
Change date: 20141119 Registration number: 2012990000155 Pledgor after: Zhejiang Jiemei Electronic & Technology Co., Ltd. Pledgor before: Zhejiang Jiemei Electronic and Technology Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20081015 |