CN201116820Y - Cold dispersion structure for semiconductor refrigerator - Google Patents
Cold dispersion structure for semiconductor refrigerator Download PDFInfo
- Publication number
- CN201116820Y CN201116820Y CNU2007200591609U CN200720059160U CN201116820Y CN 201116820 Y CN201116820 Y CN 201116820Y CN U2007200591609 U CNU2007200591609 U CN U2007200591609U CN 200720059160 U CN200720059160 U CN 200720059160U CN 201116820 Y CN201116820 Y CN 201116820Y
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- China
- Prior art keywords
- boss
- guiding block
- cold
- recess
- aluminum liner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a scatter-cold structure of a semiconductor refrigerator, which comprises an aluminum container (1), a cold-guiding block (2), a refrigeration chip (3) and a heat radiator (4), and is characterized in that a lug boss (11) is at least extended outwards from the aluminum container (1), the aluminum container (1) and the internal side opposite to the boss form a pit (12) with approximate shape relative to the lug boss (11),, the size and shape of the lug boss (11) is inosculated with the cold-guiding block (2), the projected area of the boss (11) is larger or equal to the projected area of the cold-guiding block (2), the lug boss (11) is tightly connected with the cold-guiding block (2), and is tightly connected with the refrigeration end of the refrigeration chip (3), and the heat-production end of the refrigeration chip (3) is connected with the heat radiator (4). The utility model is directly extended out a lug boss which is connected tightly with the cold-guiding block, and the both has large contact area. And a cool fan is arranged in the pit of the aluminum container, which greatly improves the scatter-cold effect, increases the reliability of the product, and overcomes the weakness existing in the prior art that ice plug is formed on a fin.
Description
Technical field
The utility model relates to refrigerator cold scattering structure, especially is applied in the semiconductor freezer cold scattering structure in the semiconductor freezer.Belong to semiconductor refrigerating and cold scattering technical field.
Background technology
At present, the cold scattering mode that market semiconductor-on-insulator refrigerator is adopted mainly contains two kinds, a kind of cold scattering structure that is to use aluminium stretching inner bag, set gradually cool guiding block, refrigerating chip and radiator in the back of inner bag, adopt the refrigerator shortcoming of this kind cold scattering structure: only the temperature at the cooling piece center is minimum, and the temperature difference in the case on temperature and the cold aluminium courage is big especially.Another kind is to use the cold scattering structure of cold scattering aluminum fin, sets gradually refrigerating chip, radiator in the back of cold scattering aluminum fin, in the front of cold scattering aluminum fin thermantidote is set, and by the continuous blast-cold aluminium of high speed cold fan fin cold is spread in case.Adopt the shortcoming of the refrigerator of this kind cold scattering structure: 1. fan constantly runs up, and it is low to produce noise and reliability.2. cold scattering aluminum fin cooling area is little, freezes easily to form to ice on fin to block up, and influences the cold scattering performance.
The utility model content
The utility model technical issues that need to address, it is the purpose of this utility model, be that the temperature difference on temperature and the cold aluminium courage is big in the case that exists for the cold scattering structure that overcomes the stretching inner bag, and the cold scattering structure of the cold scattering aluminum fin defective that icing formation ice blocks up on fin easily, provide a kind of cold scattering effective, the semiconductor freezer that reliability is high cold scattering structure.
The purpose of this utility model can reach by following measure:
A kind of semiconductor freezer cold scattering structure comprises aluminum liner, cool guiding block, refrigerating chip and radiator; Its design feature is: extend outward a boss in the aluminum liner at least, corresponding with boss, aluminum liner forms the similar recess of a shape to boss inboard dorsad; The size of described boss, shape and cool guiding block coincide, and the projected area of boss is more than or equal to the projected area of cool guiding block; Boss closely is connected with the refrigeration end of refrigerating chip with the cool guiding block close proximity and by cool guiding block, and the end that heats of refrigerating chip is connected with radiator.
The purpose of this utility model can also reach by following measure:
A kind of embodiment of the present utility model is: the shape of described boss can be square, rectangle, circle, ellipse or egg type.
A kind of embodiment of the present utility model is: described boss can be arranged on the bottom surface or the sidewall of aluminum liner, perhaps is arranged on the bottom surface and the sidewall of aluminum liner.
A kind of embodiment of the present utility model is: a thermantidote can be set in each recess.
A kind of embodiment of the present utility model is: described recess mouth place is provided with fan guard.
A kind of embodiment of the present utility model is: the shaft section of described aluminum liner is the U font, its side is provided with square boss or two sides are equipped with square boss, opposite face at each boss forms the similar recess of a shape, one thermantidote respectively is set in each recess, one fan guard respectively is set at each recess mouth place.
A kind of truth mode of the present utility model is: boss in the aluminum liner and recess stretch one-body molded by aluminum liner by mold pressing.
The beneficial effects of the utility model are:
The utility model is owing to be directly to extend a boss by aluminum liner closely to be connected with cool guiding block, and both contacts area are big, so conduction cooling is fast.Owing in the recess of aluminum liner, be provided with thermantidote, will quickly diffuse to whole aluminum liner again, cold can be spread in case fast, can effectively lower the temperature difference in the case on the one hand by the cold that cool guiding block imports into; The thermantidote of auxiliary simultaneously cold scattering slowly runs, and when case entered keeping warm mode, the rotating speed of fan was lower or stop operating, and not only improved the cold scattering effect greatly, and reliability of products improved greatly also.Can overcome the prior art icing stifled defective of ice that forms on fin easily on the other hand.
Description of drawings
Fig. 1 is the overall structure schematic diagram of the utility model specific embodiment 1.
Fig. 2 is the aluminum liner stereogram of the utility model specific embodiment 1.
Fig. 3 is the overall structure schematic diagram of the utility model specific embodiment 2.
Fig. 4 is the aluminum liner stereogram of the utility model specific embodiment 2.
The specific embodiment
Specific embodiment 1:
Referring to Fig. 1 and Fig. 2, present embodiment comprises aluminum liner 1, cool guiding block 2, refrigerating chip 3 and radiator 4; The shaft section of described aluminum liner 1 is the U font, and its side is provided with square boss 11, forms the similar recess of a shape 12 at the opposite face of a boss 11.Boss 11 in the aluminum liner and recess 12 stretch one-body molded by aluminum liner 1 by mold pressing.The size of described boss 11, shape and cool guiding block 2 coincide, and the projected area of boss 1 is more than or equal to the projected area of cool guiding block 2; The inwall of aluminum liner 1 and refrigerator body 7 coheres and is integral; Boss 11 closely is connected with cool guiding block 2 close proximity and by the refrigeration end of cool guiding block 2 with refrigerating chip 3, and the end that heats of refrigerating chip 3 is connected with radiator 4.Described cool guiding block 2 is an aluminium brick, and radiator 4 is a hot aluminium.One thermantidote 5 is set in recess 12, and described recess 12 opening parts are provided with fan guard 6.Thermantidote 5 slowly runs, and when case entered keeping warm mode, the rotating speed of fan was lower or stop operating.
Specific embodiment 2:
With reference to Fig. 3 and Fig. 4, the characteristics of present embodiment are: the two sides of aluminum liner 1 are equipped with square concave station 11, opposite face at each boss 11 forms the similar recess of a shape 12, and a thermantidote 5 respectively is set in each recess 12, at each recess 12 opening part one fan guard 6 is set respectively.When the casing of semiconductor freezer is bigger, can guarantee to reach the cold scattering effect that needs.Other are identical with specific embodiment 1.
Other embodiment:
Being shaped as of boss 11, rectangle, circle, ellipse or egg type.Boss 11 is arranged on the bottom surface of aluminum liner 1, perhaps is arranged on the bottom surface and the sidewall of aluminum liner 1.One thermantidote 5 is set in each recess 12.Approximate change that above-mentioned semiconductor freezer is made of the shape size of the aluminum liner of cold scattering structure or the inner bag that adopts other materials that have the conduction cooling attribute equally to make all belong to protection domain of the present utility model.
Claims (7)
1, a kind of semiconductor freezer cold scattering structure comprises aluminum liner (1), cool guiding block (2), refrigerating chip (3) and radiator (4); It is characterized in that: extend outward a boss (11) in the aluminum liner (1) at least, corresponding with boss (11), aluminum liner (1) forms the similar recess of a shape (12) to boss inboard dorsad; Size, shape and the cool guiding block (2) of described boss (11) coincide, and the projected area of boss (11) is more than or equal to the projected area of cool guiding block (2); Boss (11) also closely is connected by the refrigeration end of cool guiding block (2) with refrigerating chip (3) with cool guiding block (2) close proximity, and the end that heats of refrigerating chip (3) is connected with radiator (4).
2, a kind of semiconductor freezer cold scattering structure according to claim 1 is characterized in that: boss (11) be shaped as square, rectangle, circle, ellipse or egg type.
3, a kind of semiconductor freezer cold scattering structure according to claim 1 and 2, it is characterized in that: boss (11) is arranged on the bottom surface or the sidewall of aluminum liner (1), perhaps is arranged on the bottom surface and the sidewall of aluminum liner (1).
4, a kind of semiconductor freezer cold scattering structure according to claim 1 and 2 is characterized in that: boss in the aluminum liner (11) and recess (12) stretch one-body molded by aluminum liner (1) by mold pressing.
5, a kind of semiconductor freezer cold scattering structure according to claim 1 and 2 is characterized in that: a thermantidote (5) is set in each recess (12).
6, a kind of semiconductor freezer cold scattering structure according to claim 5 is characterized in that: described recess (12) opening part is provided with fan guard (6).
7, a kind of semiconductor freezer cold scattering structure according to claim 5, it is characterized in that: the shaft section of described aluminum liner (1) is the U font, its side is provided with square boss (11) or two sides are equipped with square boss (11), opposite face at each boss (11) forms the similar recess of a shape (12), one thermantidote (5) respectively is set in each recess (12), one fan guard (6) respectively is set at each recess (12) opening part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200591609U CN201116820Y (en) | 2007-11-05 | 2007-11-05 | Cold dispersion structure for semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200591609U CN201116820Y (en) | 2007-11-05 | 2007-11-05 | Cold dispersion structure for semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201116820Y true CN201116820Y (en) | 2008-09-17 |
Family
ID=39991394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200591609U Expired - Fee Related CN201116820Y (en) | 2007-11-05 | 2007-11-05 | Cold dispersion structure for semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201116820Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104654849A (en) * | 2015-02-03 | 2015-05-27 | 青岛海尔股份有限公司 | Heat exchange device and semiconductor cryogenic refrigerator with same |
-
2007
- 2007-11-05 CN CNU2007200591609U patent/CN201116820Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104654849A (en) * | 2015-02-03 | 2015-05-27 | 青岛海尔股份有限公司 | Heat exchange device and semiconductor cryogenic refrigerator with same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |