CN201111124Y - Memory card - Google Patents

Memory card Download PDF

Info

Publication number
CN201111124Y
CN201111124Y CNU2007201255588U CN200720125558U CN201111124Y CN 201111124 Y CN201111124 Y CN 201111124Y CN U2007201255588 U CNU2007201255588 U CN U2007201255588U CN 200720125558 U CN200720125558 U CN 200720125558U CN 201111124 Y CN201111124 Y CN 201111124Y
Authority
CN
China
Prior art keywords
storage card
chip substrate
function element
enclosing cover
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007201255588U
Other languages
Chinese (zh)
Inventor
卓恩民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CNU2007201255588U priority Critical patent/CN201111124Y/en
Application granted granted Critical
Publication of CN201111124Y publication Critical patent/CN201111124Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Credit Cards Or The Like (AREA)

Abstract

The utility model relates to a memory card comprising a first outer cover, a second outer cover, a group of pins and a memory function element. The first outer cover has a group of openings; and the second outer cover can be combined with the first outer cover to define an accepting space. The pins are disposed in the accepting space, and one end of each pin shows up corresponding to one opening to serve as an external terminal. The memory function element is also arranged in the accepting space, and comprises a chip substrate and at least one function element in electrical connection with the chip substrate, wherein the chip substrate is provided with a group of conducting contacts which are in electrical connection with the other end of each pin respectively. On the basis of the structure of the memory card, the memory card with rather small chip substrate can be worked out for reducing the production cost of the memory card.

Description

Storage card
Technical field
The utility model relates to a kind of storage card, particularly a kind of storage card with less relatively chip substrate.
Background technology
Portable electronic devices is not only compact, and function is more and more powerful.Relatively, in the internal memory that is built in the portable electronic devices inadequate, therefore, the many storage cards that can support outside plug type of existing portable electronic devices are to remedy the deficiency of built-in internal memory.
Please refer to Fig. 1 a, a kind of structure of existing storage card 1 mainly comprises first enclosing cover 11, second enclosing cover 12 and memory function element 13.First enclosing cover 11 has a perforate 111, and can combine to form the shell of a storage card external form with second enclosing cover 12.13 of memory function elements are arranged between first enclosing cover 11 and second enclosing cover 12, and in order to realize the storage card 1 required function that possesses.For example, memory function element 13 comprises a chip substrate 131, and function element such as memory chip 132, control module 133 are arranged on the chip substrate 131, and electrically connects with chip substrate 131.Chip substrate 131 is provided with a conductive junction point 134 in addition, and it manifests shell with as an outside terminal via perforate 111.Electronic installation can electrically connect via outside terminal and memory function element 13, and to carry out every function of memory function element 13, for example the access memory chip 132.
Please refer to Fig. 1 b, (Secure Digital Card, SD card) is example with the secure digital storage card, meets the standard specification of SD storage card in order to make conductive junction point 134 formed outside terminals 14, and 131 of chip substrates need corresponding size.Therefore, according to the structure of said memory card 1, the size of chip substrate 131 can't effectively be dwindled.
The target that reduces cost and pursue for industry always, therefore, it is the target that the present utmost point need be made great efforts that the structure that how to improve storage card makes it have lower production cost.
Summary of the invention
At the problems referred to above, the purpose of this utility model is to overcome the deficiencies in the prior art and defective, proposes a kind of storage card, and it has less relatively chip substrate, therefore can reduce the production cost of storage card.
In order to achieve the above object, the utility model one embodiment provide a kind of storage card, comprises: one first enclosing cover, and it has one group of perforate; One second enclosing cover, it can combine with this first enclosing cover to define a receiving space; One group of pin, it is arranged in this receiving space, and the one end reveals corresponding to this perforate, with as an outside terminal; An and memory function element, be arranged in this receiving space, this memory function element comprises a chip substrate and function element at least one and that this chip substrate electrically connects, and wherein this chip substrate has one group of conductive junction point, the other end electric connection of its and this pin.
Useful technique effect of the present utility model is: the storage card that the utility model provides, it has less relatively chip substrate, therefore can reduce the production cost of storage card.
Below cooperate appended graphic explanation in detail by specific embodiment, when the effect that is easier to understand the purpose of this utility model, technology contents, characteristics and is reached.
Description of drawings
Fig. 1 a is a synoptic diagram, shows the decomposition texture of an existing storage card;
Fig. 1 b is a upward view, shows an existing SD storage card;
Fig. 2 a is a synoptic diagram, shows the decomposition texture of the storage card of the utility model one preferred embodiment;
Fig. 2 b is a vertical view, shows the structural representation of the storage card of the utility model one preferred embodiment that removes second enclosing cover.
Symbol description among the figure
1 existing storage card
11 first enclosing covers
111 perforates
12 second enclosing covers
13 memory function elements
131 chip substrates
132 memory chips
133 control modules
134 conductive junction points
14 outside terminals
2 storage cards of the present utility model
21 first enclosing covers
211 perforates
22 second enclosing covers
23 pins
One end of 231 pins
24 memory function elements
241 chip substrates
242 memory chips
243 control modules
244 conductive junction points
245 passive devices
25 outside terminals
The width of W outside terminal
The width of w chip substrate
Embodiment
Please refer to Fig. 2 a and Fig. 2 b, the storage card 2 of a preferred embodiment of the present utility model comprises one first enclosing cover 21, one second enclosing cover 22, one group of pin 23 and memory function element 24.First enclosing cover 21 has one group of perforate 211.22 of second enclosing covers can combine with first enclosing cover 21 in a suitable manner defining a receiving space, and form a shell with storage card external form.Shown in Fig. 2 b, storage card can be secure digital storage card (Secure DigitalCard, SD card), but is not limited thereto, storage card also can be multimedia storage card (Multi MediaCard, MMC).22 of first enclosing cover 21 and second enclosing covers can bind by adhesive agent, or with the mode combination of high frequency fusion etc.
Pin 23 is arranged in first enclosing cover 21 and one second enclosing cover, the 22 formed receiving spaces, and an end 231 of pin 23 reveals corresponding to perforate 211, with as an outside terminal 25.Be noted that can form a metal level in the surface of outside terminal 25 to increase the electric conductivity of outside terminal 25, for example, metal level can be a gold medal (Au) layer.
The above-mentioned explanation that continues, memory function element 24 is arranged in the receiving space, and it mainly is in order to realize every function of storage card.For example, memory function element 24 comprises a chip substrate 241 and at least one function element.Function element and chip substrate 241 electrically connect, and it comprises at least one memory chip 242 and control module 243, and the preferably more comprises at least one passive device 245 (shown in Fig. 2 b).241 of chip substrates have one group of conductive junction point 244, and it electrically connects in order to the other end with pin 23, the preferably, and the surface of conductive junction point 244 can form a metal level, and for example golden layer is to increase its electric conductivity.According to said structure, electronic installation can electrically connect via outside terminal 25 and storage card 2, and because pin 23 and 24 electric connections of memory function element, so electronic installation can electrically connect with memory function element 24 and every function of execution storage card 2, for example the access memory chip 242.
Be noted that the structure of memory function element 24 can be realized by various prior aries.For example, various chip as memory chip 242, can be fixedly arranged on chip substrate 241 with its non-active surface, electrically connects with lead-in wire and chip substrate 241 again; Or, be fixedly arranged on chip substrate 241, and electrically connect with conductive projection and chip substrate 241 with its active surface to cover brilliant mode.Again, a plurality of chips 242 can be fixedly arranged on chip substrate 241 in mode side by side, also can be fixedly arranged on chip substrate 241 in the mode of storehouse.In addition, the various element of memory function element 24 can also the system in package body (System in Package, mode SIP) is packaged together.
According to the structure of said memory card, the size of its chip substrate can not be subjected to outside terminal must meet the restriction of memory card standards specification.Please refer to Fig. 2 b and since an end 231 of pin 23 be as an outside terminal 25 to electrically connect with electronic installation, therefore, the width W of outside terminal must meet the standard specification of storage card.The other end of pin 23 then can be arranged arbitrarily because of design requirement, so the width w of chip substrate 241 can be less than or equal to the width W of outside terminal 25.
Comprehensively above-mentioned, the size of the chip substrate of the utility model storage card can not be subjected to outside terminal must meet the restriction of memory card standards specification, therefore can design the storage card with less relatively chip substrate, to reduce the material cost of storage card.In addition, the conductive junction point on the existing chip substrate mostly is copper material, in order to adapt to the repeatedly wearing quality of plug, then need plate thicker gold layer.And storage card of the present utility model, because the material of pin has possessed preferable wearing quality, so its surface only need plate thin gold layer and get final product, and so can further reduce material cost.Again, the big I of the conductive junction point on the utility model storage card is designed to the conductive junction point size less than existing storage card, therefore can reduce the material cost of plated with gold layer again, and the production cost of global storage card is further reduced.
Above-described embodiment only is explanation technological thought of the present utility model and characteristics, its purpose makes those skilled in the art can understand content of the present utility model and is implementing according to this, when can not with qualification claim of the present utility model, promptly the equalization of doing according to the spirit that the utility model disclosed generally changes or modifies, and must be encompassed in the claim of the present utility model.

Claims (8)

1. a storage card is characterized in that, comprises:
One first enclosing cover, it has one group of perforate;
One second enclosing cover, it can combine with this first enclosing cover to define a receiving space;
One group of pin, it is arranged in this receiving space, and the one end reveals corresponding to this perforate, with as an outside terminal; And
One memory function element, be arranged in this receiving space, this memory function element comprises a chip substrate and function element at least one and that this chip substrate electrically connects, and wherein this chip substrate has one group of conductive junction point, the other end electric connection of its and this pin.
2. storage card as claimed in claim 1 is characterized in that, the width of this chip substrate is less than or equal to the width of this outside terminal.
3. storage card as claimed in claim 1 is characterized in that, this function element comprises a control module, at least one memory chip and at least one passive device.
4. storage card as claimed in claim 3 is characterized in that, this memory function element is a system in package body.
5. storage card as claimed in claim 1 is characterized in that, the surface of this conductive junction point forms a gold medal layer.
6. storage card as claimed in claim 1 is characterized in that, the surface of this outside terminal forms a gold medal layer.
7. storage card as claimed in claim 1 is characterized in that, this first enclosing cover and this second enclosing cover are to bind with adhesive agent, or merge with high frequency.
8. storage card as claimed in claim 1 is characterized in that, this storage card is a secure digital storage card or a multimedia storage card.
CNU2007201255588U 2007-09-24 2007-09-24 Memory card Expired - Fee Related CN201111124Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007201255588U CN201111124Y (en) 2007-09-24 2007-09-24 Memory card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007201255588U CN201111124Y (en) 2007-09-24 2007-09-24 Memory card

Publications (1)

Publication Number Publication Date
CN201111124Y true CN201111124Y (en) 2008-09-03

Family

ID=39895662

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007201255588U Expired - Fee Related CN201111124Y (en) 2007-09-24 2007-09-24 Memory card

Country Status (1)

Country Link
CN (1) CN201111124Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102280424A (en) * 2011-06-08 2011-12-14 无敌科技(西安)有限公司 Non-volatile memory device, integrated circuit device and integrated circuit manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102280424A (en) * 2011-06-08 2011-12-14 无敌科技(西安)有限公司 Non-volatile memory device, integrated circuit device and integrated circuit manufacturing method

Similar Documents

Publication Publication Date Title
US9941245B2 (en) Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate
CN101355067B (en) Improved electrical connections for multichip modules
US20150022985A1 (en) Device-embedded package substrate and semiconductor package including the same
US9391009B2 (en) Semiconductor packages including heat exhaust part
US7884473B2 (en) Method and structure for increased wire bond density in packages for semiconductor chips
US8084856B2 (en) Thermal spacer for stacked die package thermal management
US9331054B2 (en) Semiconductor package assembly with decoupling capacitor
US8184449B2 (en) Electronic device having stack-type semiconductor package and method of forming the same
US20060145323A1 (en) Multi-chip package mounted memory card
CN103229293A (en) Semiconductor chip package, semiconductor module, and method for manufacturing same
AU2017403198B2 (en) Mainboard for consumer electronic product, and terminal
US8169066B2 (en) Semiconductor package
KR102160786B1 (en) Semiconductor Packages
CN101188232A (en) Laminated encapsulation structure and its making method
CN201111124Y (en) Memory card
US9504152B2 (en) Printed circuit board for semiconductor package
US8692133B2 (en) Semiconductor package
US7893530B2 (en) Circuit substrate and the semiconductor package having the same
CN101398908A (en) Memory card
JP3138127U (en) Memory card
CN211529933U (en) SIP packaging assembly and chip thereof
CN211529945U (en) System-in-package integrating multiple chips and elements
CN205319148U (en) Semiconductor package
US20230061258A1 (en) Semiconductor devices including stacked dies with interleaved wire bonds and associated systems and methods
US20080079174A1 (en) Substrate slot design for die stack packaging

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080903

Termination date: 20100924