CN201078680Y - LED embedded type multi-core high power light source - Google Patents
LED embedded type multi-core high power light source Download PDFInfo
- Publication number
- CN201078680Y CN201078680Y CNU2007201214037U CN200720121403U CN201078680Y CN 201078680 Y CN201078680 Y CN 201078680Y CN U2007201214037 U CNU2007201214037 U CN U2007201214037U CN 200720121403 U CN200720121403 U CN 200720121403U CN 201078680 Y CN201078680 Y CN 201078680Y
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- radiating substrate
- heat
- led
- conductor
- heat dissipation
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Abstract
The utility model discloses a LED embedded multi-core high-power light source, which comprises a reflecting shade arranged on the facade of the heat dissipation base plate and a LED fixedly installed on the heat dissipation base plate inside the reflecting shade. The heat dissipation base plate is embedded with a conductor inside; one end of the conductor is educed from the upper head face of the heat dissipation base plate and is connected with the LED; the other end is educed from the side wall or upper head face of the heat dissipation base plate and then is connected with the external plugs via lead; the part of the conductor embedded into the heat dissipation base plate is separated from the heat dissipation base plate. The heat dissipation base plate is made of high-conductivity metal. The high-conductivity metal used as the materials to make the heat dissipation base plate and the abolishment of the bracket heat conducting pillar shortens the heat dissipation pathway, increases the sectional area and removes the middle steps with high thermal resistance. The heat dissipation base plate has no down-leads at the bottom, which not only facilitates the installation, but also makes the junction surface of the heat dissipation base plate and the terminal radiator reach 100 percent, thus avoiding the influence on overall the heat dissipation efficiency by using the metal biscuit transfer.
Description
Technical field
The utility model relates to a kind of lighting, relates in particular to a kind of high-power LED light source.
Background technology
LED worldwide little by little is subjected to the attention of various countries as a kind of new type light source, compares with conventional light source, and main advantage is: 1, security is good, and LED belongs to the cold light source device, drives to be low-voltage, and sound construction can be not broken.Long service life, under good radiating condition, the life-span can reach 5-10 ten thousand hours, and is more much longer than other light source life.2, rich color, it is convenient to drive regulation and control.3, light efficiency significantly improves year by year, and mill run has reached 60-80lm/w now, substantially exceeds the highest fluorescent lamp 80lm/w of incandescent lamp 30lm/w and light efficiency and maintains an equal level, and it is matter of time that light efficiency surpasses existing other light source.4, environmental protection, discarded object does not have heavy metal pollution, meets the ROHS of European Union standard.
LED is as semiconductor devices, and To Be Protected from Heat is its intrinsic shortcoming, and especially for high power device, if the heat that produces in the work can not be derived timely and effectively and distributes, the temperature rising of PN junction can cause the rapid decline of light efficiency; If the temperature of PN junction surpasses 120 ℃, the time one is long, and expendable light decay even dead lamp can take place, and the situation of brightness decays in 1000 hours more than 50% is found everywhere.Common led light source structure: see Fig. 1, comprise solid Jinping face 01, heating column 02, heat-radiating substrate 03, user's radiator 04.This structure major defect: heating column 02 sectional area is little, and thermally conductive pathways is long, and thermal resistance is big.The general silicone grease 05 that adopts is connected between heating column 02 and the heat-radiating substrate 03, even the employing plumber's solder also can form bigger thermal resistance district.Because thermal resistance is big, the heat that structure can derive is limited, generally only can make the 1-3W light source, and the above light source of 5W but can not cause dying young because heat radiation does not reach requirement.
Existing simultaneously high-power LED lamp generally directly utilizes metal shell to make radiator, if supply lines is drawn from the heat-radiating substrate reverse side, usually handle in order to following method: re-use the metal derby that a thickness surpasses wire length and come transition between heat-radiating substrate and radiator, this will cause the increase of thermal resistance and heat accumulation.At the heat-radiating substrate reverse side lead-in wire is set, both has been inconvenient to install, can not make the bonded area of heat-radiating substrate and user's radiator reach 100%, have influence on radiating effect.
The utility model content
The utility model is poor in order to solve existing LED lamp heat dispersion, can not satisfy the technical problem of great power LED cooling, provides a kind of thermal diffusivity good, the heat-radiating substrate reverse side can with the embedded multicore high power light source of the complete LED that combines of user's radiator.
For addressing the above problem, the technical solution of the utility model is the embedded multicore high power light source of a kind of LED of structure, comprise heat-radiating substrate, be located at the reflection shield of this heat-radiating substrate upper surface, be installed on the heat-radiating substrate and be located at LED in the reflection shield, heat-radiating substrate is embedded with conductor, conductor one end is drawn with LED from the heat-radiating substrate upper surface and is connected, the other end is drawn from the sidewall of heat-radiating substrate or upper surface again and is connected with external plug through lead, and conductor embeds heat-radiating substrate portion through insulator and heat-radiating substrate isolation.
Wherein, described heat-radiating substrate is made by high-thermal conductive metal.
Described insulator be glass sintering form be filled in glass insulator between conductor and heat-radiating substrate.
Described insulator be glass sintering form be filled between conductor and heat-radiating substrate glass insulator and with conductor and heat-radiating substrate ceramics composition at interval.
Among first embodiment, described heat-radiating substrate bottom is provided with from its sidewall opening and radially extends in two " L " type grooves that axially run through its upper surface, conductor matches with " L " type groove and is " L " type, all be embedded with one " L " type conductor in " L " type groove, should be exposed to the heat-radiating substrate upper surface by " L " type conductor one end, the other end is drawn from the heat-radiating substrate side wall surface.
Described heat-radiating substrate is provided with the LED of many circular array, and LED is divided into many groups, and the LED in every group connects mutually and connects " L " type conductor through lead.
Described reflection shield profile in the form of a ring, the internal face of reflection shield is the camber inclined-plane, is provided with an inside groove in its bottom, the heat-radiating substrate upper surface is provided with ring shaped slot, reflection shield bottom embeds in the ring shaped slot.
Among second embodiment, described heat-radiating substrate is provided with a plurality of " U " type groove, " U " type groove is by the vertical core that runs through two arranged radiallys of the upper and lower end face of heat-radiating substrate and be located at heat-radiating substrate bottom the translot that two vertical cores are communicated with is constituted, conductor matches with " U " type groove and is " U " type, all be embedded with one " U " type conductor in " U " type groove, should be exposed to the heat-radiating substrate upper surface in " U " type conductor two ends.
Described heat-radiating substrate is provided with many groups and every group to be made up of plurality of LEDs and to arrange the LED group that is " V " font, and each is organized LED and is arranged in order and is round, is connected with " U " type conductor after the LED in every group connects mutually.
Described reflection shield profile in the form of a ring, the internal face of reflection shield is the camber inclined-plane, is provided with an inside groove in its bottom, and the heat-radiating substrate upper surface is provided with ring shaped slot, the reflection shield bottom embeds in the ring shaped slot, and the vertical core that is positioned at the outside in two vertical cores of " U " type groove is located at the inside groove below.
Light source in the utility model adopts high-thermal conductive metal to do heat-radiating substrate and get rid of the support heating column, compared with prior art makes heat dissipation path shortening, sectional area increase and has eliminated the very big intermediate link of thermal resistance.Simultaneously, adopt the mode of embedded conductor in the heat-radiating substrate, numerous electrodes are caused the heat-radiating substrate outside by conductor or the outer ring, upper surface is connected again, realized that the heat-radiating substrate bottom surface do not have lead-in wire, both made things convenient for installation, make heat-radiating substrate and user's radiator faying face can reach 100% again, avoided influencing the integral heat sink effect with the metal derby transition.The utility model increases by LED lamp single source power, and light decay significantly reduces, and the life-span improves greatly, makes LED enter the high-power illumination field.
Description of drawings
Below in conjunction with drawings and Examples the utility model is described further, wherein:
Fig. 1 is existing LED modulated structure schematic views;
Fig. 2 is the utility model first embodiment front view;
Fig. 3 is the cutaway view along Fig. 2 A-A line;
Fig. 4 is a heat-radiating substrate perspective view among the utility model first embodiment;
Fig. 5 is the utility model first embodiment LED wiring schematic diagram;
Fig. 6 is the utility model second embodiment front view;
Fig. 7 is the cutaway view along Fig. 6 A-A line;
Fig. 8 is Fig. 6 rearview;
Fig. 9 is the utility model second embodiment LED wiring schematic diagram;
Figure 10 is the utility model second embodiment stereoscopic-state assembly drawing;
Figure 11 is the positive three-dimensional explosive view of the utility model second embodiment;
Figure 12 is the three-dimensional explosive view in the utility model second embodiment back side.
The specific embodiment
Shown in Fig. 2,3, figure is a basic structure of the present utility model, the embedded multicore high power light source of a kind of LED, comprise heat-radiating substrate 1, be located at the reflection shield 2 of this heat-radiating substrate 1 upper surface, be installed on the heat-radiating substrate 1 and be located at LED3 in the reflection shield 2, heat-radiating substrate 1 is embedded with conductor, conductor one end is drawn with LED3 from heat-radiating substrate 1 upper surface and is connected, the other end is drawn from the sidewall of heat-radiating substrate 1 or upper surface and is being connected with external plug through lead, and conductor embeds 1 one of heat-radiating substrate through insulator and heat-radiating substrate 1 isolation.Heat-radiating substrate 1 is made by high-thermal conductive metal, as: aluminium, copper material etc., high-thermal conductive metal guarantee that heat-radiating substrate 1 has good thermal conductivity, thermal diffusivity.
Among first embodiment, as shown in Figure 4, heat-radiating substrate 1 shape is rounded, and heat-radiating substrate 1 bottom is provided with from its sidewall opening and radially extends in two " L " type grooves 5 that axially run through its upper surface.Conductor shape, length should match with " L " type groove 5, its conductor is " L " type, in two " L " type grooves 6, all embed " L " type conductor 6 is arranged, make " L " type conductor 6 one ends be exposed to heat-radiating substrate 1 upper surface by " L " type groove 5 and be connected with the LED3 that is located at heat-radiating substrate 1 upper surface, the other end is drawn from heat-radiating substrate 1 side wall surface again and is connected with the external plug (not shown) through lead.
Among first embodiment, two " L " type grooves 5 are symmetrically distributed on the heat-radiating substrate 1, needs during because of assembling, can process (fluting punching) in heat-radiating substrate 1 bottom, thereby form two " L " type grooves 5: offer two translots that radially extend from its sidewall opening in heat-radiating substrate 1 bottom, be tunneled to its upper surface and translot from heat-radiating substrate 1 bottom and intersect through hole.Guarantee the complete of heat-radiating substrate 1 lower surface (that is: heat-radiating substrate bottom) as need, can make in heat-radiating substrate 1 upper surface for the groove that " L " type conductor 6 embeds: mill out two in heat-radiating substrate 1 upper surface and establish the short slot of opening in its sidewall, the length of short slot, the degree of depth should be corresponding with " L " type conductor 6.
Insulator is the glass insulator that is filled in 1 of " L " type conductor 6 and heat-radiating substrate that glass sintering forms.The glass insulation physical efficiency that the glass sintering mode forms is well filled the space, has higher mechanical strength when " L " type conductor 6 and heat-radiating substrate 1 are isolated the formation insulation mutually.
Simultaneously in the glass sintering process, solid glass is melted up to liquid state allows in its parcel " L " type conductor 6 processes, because of " L " type conductor 6 has certain weight, " L " type conductor 6 may occur and sink to contacting to cause insulating and fail with heat-radiating substrate 1.For avoiding this situation, insulator is glass insulator and conductor and heat-radiating substrate 1 ceramics is at interval formed.In " L " type groove 5 or short slot, place ceramics in " L " type conductor 6 belows, can prevent effectively that " L " type conductor 6 sinks to directly contacting with heat-radiating substrate 1 in the glass sintering process.
Shown in Fig. 2,3, reflection shield 2 profiles are provided with an inside groove 7 in its bottom in the form of a ring, and heat-radiating substrate 1 upper surface is provided with inside and outside two circle ring shaped slots 8, and the polycrystalline substance of reflection shield 2 shell walls matches with it with inside and outside two circle ring shaped slots 8.During assembling, the bottom of reflection shield 2 shell walls can embed and make reflection shield 2 fixing in the ring shaped slot 8.Reflection shield 2 internal faces are the reflective surface on camber inclined-plane; Among first embodiment, the ring groove 8 that is positioned at inner ring makes heat-radiating substrate 1 middle part form a round platform 11, after reflection shield 2 was fixed on the heat-radiating substrate 1, the mesopore on the reflection shield 2 was corresponding with round platform 11, and it is close with round platform 11 sizes that the pore size of the mesopore of reflection shield 2 needs.Round platform 11 surfaces are provided with plurality of LEDs 3, the LED3 on round platform 11 surfaces is inside and outside Crossed Circle and arranges, LED3 on the round platform 11 is divided into four groups, and the LED3 in every group connects mutually and is positioned at heat-radiating substrate 1 upper surface one end through lead and " L " type conductor 6 and is connected (as shown in Figure 5).
Shown in Fig. 6,7, figure is the utility model second embodiment basic structure, heat-radiating substrate 1 shape is rounded, heat-radiating substrate 1 is evenly equipped with a plurality of " U " type groove 9, and " U " type groove 9 is by the vertical core that runs through two arranged radiallys of heat-radiating substrate 1 upper and lower end face and be located at heat-radiating substrate 1 bottom the translot that two vertical cores are communicated with is constituted.Conductor shape, length should match with " U " type groove 9, and its conductor is " U " type (with reference to Figure 12), and all embedding in each " U " type groove 9 has " U " type conductor 10, makes " U " type conductor 10 two ends be exposed to heat-radiating substrate 1 upper surface by " U " type groove 9." U " type conductor 10 is connected with the LED3 that is located at heat-radiating substrate 1 upper surface from being positioned at inboard vertical core exit, is being connected with the external plug (not shown) through lead from the vertical core exit that is positioned at the outside.Among second embodiment, be evenly equipped with four " U " type grooves 9 on the heat-radiating substrate 1, the number of " U " type groove 9 can need be made suitable adjustment by wiring.
Identical with first embodiment, for assembling " convenient during U type conductor 10, can process (fluting punching) in heat-radiating substrate 1 bottom, thereby " U " type of formation groove 9 (with reference to Fig. 8).Same as needing to guarantee the complete of heat-radiating substrate 1 lower surface (that is: heat-radiating substrate bottom), can make in heat-radiating substrate 1 upper surface for the groove that " U " type conductor 10 embeds: mill out groove in heat-radiating substrate 1 upper surface, the length of groove, the degree of depth should be corresponding with " U " type conductor 10.
Identical with first embodiment, " U " type conductor 10 carries out the interval with the glass insulator that heat-radiating substrate 1 also adopts glass sintering to form.In the glass sintering process, solid glass is melted up to liquid state allows in its parcel " U " type conductor 10 processes, also occur " U " type conductor 10 easily and sink to contacting and cause the problem that insulate and fail with heat-radiating substrate 1.For avoiding this situation, can in " U " type groove 9 or groove, place ceramics in " U " type conductor 10 belows.
Light source in the utility model adopts high-thermal conductive metal to do heat-radiating substrate and get rid of the support heating column, with existing There is technology to compare and makes heat dissipation path shortening, sectional area increase and eliminated the very big intermediate link of thermal resistance. Simultaneously, Adopt the mode of embedded conductor in the heat-radiating substrate, numerous electrodes are caused the heat-radiating substrate outside or upper end by conductor The face outer ring is being connected, reality the heat-radiating substrate bottom surface do not have lead-in wire, both made things convenient for installation, make again heat radiation base Plate and user's radiator faying face can reach 100%, and having avoided affects the integral heat sink effect with the metal derby transition. (can be brought up to interior by 5W now by this structure by the single source the increase of output power for the utility model 30W-200W), light decay significantly reduces (light decay was less than 5% in 1000 hours), and the life-span improves greatly (greater than 20000 Hour), make LED enter the high-power illumination field.
Claims (10)
1. embedded multicore high power light source of LED, it is characterized in that: comprise heat-radiating substrate (1), be located at the reflection shield (2) of this heat-radiating substrate (1) upper surface, be installed in described heat-radiating substrate (1) and go up and be located at the interior LED (3) of described reflection shield (2), described heat-radiating substrate (1) is embedded with conductor, described conductor one end is drawn with described LED (3) from described heat-radiating substrate (1) upper surface and is connected, the other end is drawn from the sidewall of described heat-radiating substrate (1) or upper surface again and is connected with external plug through lead, and described conductor embeds described heat-radiating substrate (1) portion isolates through insulator and described heat-radiating substrate (1).
2. the embedded multicore high power light source of LED according to claim 1, it is characterized in that: described heat-radiating substrate (1) bottom is provided with from its sidewall opening and radially extends in two " L " type grooves (5) that axially run through its upper surface, described conductor matches with " L " type groove (5) and is " L " type, all be embedded with described " L " type conductor (6) in described " L " the type groove (5), should be exposed to described heat-radiating substrate (1) upper surface by " L " type conductor (6) one ends, the other end is drawn from described heat-radiating substrate (1) side wall surface.
3. the embedded multicore high power light source of LED according to claim 2, it is characterized in that: described heat-radiating substrate (1) is provided with the described LED (3) of many circular array, described LED (3) is divided into many groups, and the described LED (3) in every group connect and mutually through lead connection described " L " type conductor (6).
4. the embedded multicore high power light source of LED according to claim 3, it is characterized in that: described reflection shield (2) profile in the form of a ring, the internal face of described reflection shield (2) is the camber inclined-plane, be provided with an inside groove (7) in its bottom, described heat-radiating substrate (1) upper surface is provided with ring shaped slot (8), and described reflection shield (2) bottom embeds in the ring shaped slot (8).
5. the embedded multicore high power light source of LED according to claim 1, it is characterized in that: described heat-radiating substrate (1) is provided with a plurality of " U " type groove (9), described " U " type groove (9) is by running through on the described heat-radiating substrate (1), the vertical core of two arranged radiallys in lower surface and be located at described heat-radiating substrate (1) bottom the translot that two described vertical cores are communicated with is constituted, described conductor matches with " U " type groove (9) and is " U " type, all be embedded with described " U " type conductor (10) in described " U " the type groove (9), should be exposed to described heat-radiating substrate (1) upper surface in " U " type conductor (10) two ends.
6. the embedded multicore high power light source of LED according to claim 5, it is characterized in that: described heat-radiating substrate (1) is provided with many groups and every group and is made up of many described LED (3) and arranges the LED (3) that is " V " font and organize, each is organized described LED (3) and is arranged in order and is round, and the described LED (3) in every group is connected with described " U " type conductor (9) the series connection back mutually.
7. the embedded multicore high power light source of LED according to claim 6, it is characterized in that: described reflection shield (2) profile in the form of a ring, the internal face of described reflection shield (2) is the camber inclined-plane, be provided with an inside groove (7) in its bottom, described heat-radiating substrate (1) upper surface is provided with ring shaped slot (8), described reflection shield (2) bottom embeds in the described ring shaped slot (8), and the vertical core that is positioned at the outside in two vertical cores of described " U " type groove (9) is located at described inside groove (7) below.
8. according to claim 2 or the embedded multicore high power light source of 5 described LED, it is characterized in that: described heat-radiating substrate (1) is made by high-thermal conductive metal.
9. the embedded multicore high power light source of LED according to claim 8 is characterized in that: described insulator be glass sintering form be filled in glass insulator between described conductor and heat-radiating substrate (1).
10. the embedded multicore high power light source of LED according to claim 8 is characterized in that: described insulator be glass sintering form be filled between described conductor and heat-radiating substrate (1) glass insulator and with the ceramics composition of described conductor with heat-radiating substrate (1) interval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201214037U CN201078680Y (en) | 2007-07-06 | 2007-07-06 | LED embedded type multi-core high power light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201214037U CN201078680Y (en) | 2007-07-06 | 2007-07-06 | LED embedded type multi-core high power light source |
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| Publication Number | Publication Date |
|---|---|
| CN201078680Y true CN201078680Y (en) | 2008-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201214037U Expired - Lifetime CN201078680Y (en) | 2007-07-06 | 2007-07-06 | LED embedded type multi-core high power light source |
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| Country | Link |
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| CN (1) | CN201078680Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103016968A (en) * | 2011-09-26 | 2013-04-03 | 普罗斯电器（中国）有限公司 | Integrated light source LED floodlight |
| US8888328B2 (en) | 2012-12-12 | 2014-11-18 | Orbotech Ltd. | Light engine |
| CN105607341A (en) * | 2011-04-14 | 2016-05-25 | 乐金显示有限公司 | Backlight unit and liquid crystal display device including the same |
| CN109671835A (en) * | 2019-01-23 | 2019-04-23 | 佛山市国星光电股份有限公司 | Supporting structure, LED component and support array |
-
2007
- 2007-07-06 CN CNU2007201214037U patent/CN201078680Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105607341A (en) * | 2011-04-14 | 2016-05-25 | 乐金显示有限公司 | Backlight unit and liquid crystal display device including the same |
| CN103016968A (en) * | 2011-09-26 | 2013-04-03 | 普罗斯电器（中国）有限公司 | Integrated light source LED floodlight |
| US8888328B2 (en) | 2012-12-12 | 2014-11-18 | Orbotech Ltd. | Light engine |
| CN109671835A (en) * | 2019-01-23 | 2019-04-23 | 佛山市国星光电股份有限公司 | Supporting structure, LED component and support array |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Dongguan Yijia Photoelectricity Science & Technology Co., Ltd. Assignor: Hongya Photoelectronics Co., Ltd., Shenzhen City Contract fulfillment period: 2009.6.15 to 2016.6.15 Contract record no.: 2009440001266 Denomination of utility model: LED embedded type multi-core high power light source Granted publication date: 20080625 License type: Exclusive license Record date: 20090817 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.6.15 TO 2016.6.15; CHANGE OF CONTRACT Name of requester: DONGGUAN CITY YIJIA PHOTOELECTRICITY SCIENCE AND T Effective date: 20090817 |
|
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Dongguan Yijia Photoelectricity Science & Technology Co., Ltd. Assignor: Hongya Photoelectronics Co., Ltd., Shenzhen City Contract record no.: 2009440001266 Date of cancellation: 20150826 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Buji street, Longgang District of Shenzhen city cloth Lan Road 518000 Guangdong province No. 135 Gan Li six road No. 9 Patentee after: Shenzhen Hoyol Opto Electronic Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Guanlan Fumin Zhen Dan Keng Cun Yun Tang Industrial Zone 8 Patentee before: Hongya Photoelectronics Co., Ltd., Shenzhen City |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080625 |