CN201057536Y - X-ray testing apparatus used for electric assembly fault detection - Google Patents
X-ray testing apparatus used for electric assembly fault detection Download PDFInfo
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- CN201057536Y CN201057536Y CN 200720031567 CN200720031567U CN201057536Y CN 201057536 Y CN201057536 Y CN 201057536Y CN 200720031567 CN200720031567 CN 200720031567 CN 200720031567 U CN200720031567 U CN 200720031567U CN 201057536 Y CN201057536 Y CN 201057536Y
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Abstract
The utility model relates to an X ray detector for detecting electronics assembly, comprising a micro-focus X-ray generator, a two-dimension regulation and operation table, a high resolution X-ray image intensifier and a CCD camera. The high resolution X-ray image intensifier comprises an aluminum window, a Kovar valve, a X-ray sensitive and reflective photoelectric cathode, a micro channel board, an output window and a ceramic shell; the aluminum window and the Kovar valve around the aluminum window, the output window and the Kovar ring around the output window and the ceramic shell are sealed and connected into a vacuum chamber through an aluminum solder, the reflective photoelectric cathode and the micro channel board are arranged in the vacuum chamber, and the internal surface of the output window is coated with a fluorescent powder layer. The utility model solves shortcomings of low solution, large size and high cost of the images obtained by the detector in automatic X-ray detecting technique, and has the advantages of high resolution, small size, high performance cost ratio, clear image and convenient operation, etc.
Description
Technical field
The utility model relates to a kind of image-forming detecting system device, particularly relates to a kind of x-ray detection device that is used for electronics assembling fault detect.
Background technology
Along with the develop rapidly of electronic technology, continuing to bring out of the miniaturization of encapsulation and the densification of assembling and various novel encapsulated technology had higher requirement to fault detection method.At first the detection of hiding solder joint in element assembling, as what of: scolder, the displacement of solder joint etc.Particularly the density of PCB assembly increases day by day, and the solder joint of a large amount of components and parts that had is in a kind of hidden state, for example: the flip-chip of BGA (BGA Package).Employing X ray detection technique is easy to confirm the defective (as there not being pad) of solder ball, and the bridge joint phenomenon that is taken place in the device bottom.Manufacturer all wishes in time to find electronics assembling fault, further improves the production technology level and the quality of production, presses for high-resolution automatic X ray checkout equipment for this reason.Automatically X ray detection technique (AXI) not only can detect invisible solder joint, as BGA etc., can also carry out qualitative, quantitative test to testing result, can find fault early.But the pick-up unit of the automatic X ray detection technique of traditional employing (AXI) all adopts intensifying screen or medical X-ray image intensifier to obtain image, and image resolution ratio is lower, and volume is bigger, and cost is higher, can not satisfy the needs of manufacturer.
Summary of the invention
The purpose of this utility model provides a kind of x-ray detection device that is used for electronics assembling fault detect, and it is low that it has solved the image resolution ratio that the pick-up unit that adopts automatic X ray detection technique obtains, and volume is big, the shortcoming that cost is high.
Technical solution of the present utility model is:
A kind of x-ray detection device that is used for electronics assembling fault detect, comprise X-ray generator 21, x-ray imaging system 23, described x-ray imaging system 23 comprises high-resolution X-ray image enhancer, ccd video camera 27 and image software disposal system 24, its special character is that described high-resolution X-ray image enhancer comprises power supply 25, input window 1, the photocathode 3 to the X ray sensitivity, microchannel plate assembly, output window 9, booster inner casing 10 and booster shell 28; Described input window 1, output window 9 and 10 sealing-ins of booster inner casing become vacuum seal 12; Described booster inner casing 10 comprises sealing ring 16, ceramic package 14 and the output window metal shell 15 that axially connects successively; Described input window 1 is the metal window 20 of sealing and fixing in the middle of sealing ring 16 front ends; Described vacuum seal 12 is arranged in the booster shell 28; Described microchannel plate assembly is arranged between input window 1 and the output window 9; Described photocathode 3 evaporations are on the microchannel plate assembly; Described output window 9 sealing and fixing are on output window metal shell 15; Described output window 9 comprises video screen 11, is arranged on the phosphor powder layer 8 of video screen 11 inside surfaces, is arranged on the aluminium film 7 outside the phosphor powder layer 8.
Above-mentioned x-ray detection device also comprises the two-dimensional adjustment operator's console 22 that is arranged between X-ray generator 21 and the x-ray imaging system 23; Described two-dimensional adjustment operator's console 22 comprises X-axis high precision stepper motor and Y-axis high precision stepper motor, and the moving range of its X-axis and Y-axis is 180mm, its rotating range by level to miter angle.
Above-mentioned X-ray generator 21 is little focal spot X-ray generator, and its X ray energy range is 20～70kV, and the X ray anode current is 0.1～0.5mA, and the X ray focal spot size is a micron dimension.
Above-mentioned microchannel plate assembly comprises pressure ring 4, microchannel plate 5 and the pallet 19 that axially connects successively, and described pallet 19 is fixed in the middle of the ceramic package 14, and described pressure ring 4 is fixed on the inboard of sealing ring 16; Described microchannel plate 5 is fixed on the pallet 19 by pressure ring 4; Described photocathode 3 evaporations are at the input face of microchannel plate 5.
Above-mentioned pressure ring 4 is the self-expanding pressure ring on band gap 18 and inclined-plane 17.
Above-mentioned vacuum seal 12 is enclosed in the booster shell 28 admittedly by the encapsulating mode; Described x-ray imaging system 23 also comprises the aluminum camera housing 26 that is arranged on outside the ccd video camera 27, and described aluminum camera housing 26 is connected with booster shell 28.
Above-mentioned power supply 25 is the tile power supply module, and described tile power supply module is enclosed in the booster shell 28 admittedly by the encapsulating mode.
5 of above-mentioned input window 1 and microchannel plates form front end vacuum gap 2, form rear end vacuum gap 6 between described microchannel plate 5 and the output window 9; The axial length of described front end vacuum gap 2 is 5～6mm; The axial length of described rear end vacuum gap 6 is 0.5～1mm; The thickness of described metal window 20 is 0.3～2mm, and effective diameter is Φ 18～Φ 100mm.
The material of above-mentioned metal window 20 is aluminium or beryllium; The material of described video screen 11 is K4 glass or fibre faceplate; Described photocathode 3 is an alkali halogen compound reflective photocathode; The material of described phosphor powder layer 8 is a P20 fluorescent powder; The material of described sealing ring 16 is kovar alloy 4J33; Pass through aluminium solder soldering sealing-in between described input window 1 and the sealing ring 16.
Above-mentioned alkali halogen compound reflective photocathode is the CsI photocathode.
The utility model has the advantages that:
1, resolution height.Electronics industry detects the spatial resolution of usefulness all in μ m magnitude, the utility model adopts little focal spot (μ m magnitude) X ray bulb and high-resolution X-ray to detect as the optical coupled of detector and high resolution CCD video camera, spatial resolution reaches more than the 141p/mm, can detect the bad point of minimum on the soldered wires that diameter has only 25 microns and the conglutination reaction of the pore crystal when temperature reduces on the die bonding etc.In addition, aluminum window and beryllium window have higher X ray transmitance, and be also helpful to improving resolution.
2, volume is little.Tradition x-ray detection device automatically all adopts intensifying screen or medical X-ray image intensifier to obtain image, owing to adopt amplification principle how much, so volume is bigger.The utility model adopts the electronics amplification principle, so volume diminishes relatively.Power supply uses the tile power supply module also can reduce volume significantly.
3, cost performance height.The utility model can detect defectives such as layer in the IC encapsulation is peeled off, explosion, cavity, may produce the defectives such as bad or bridge joint of aliging in printed circuit board (PCB) (pcb board) manufacturing process, check defectives such as the issuable cavity of BGA plate solder joint, rosin joint, short circuit or undesired connection, also can check the integrality of routing.
4, imaging is clear.Tile power supply module of the present utility model can be the high-voltage power supply that the X ray bulb provides high stable, can reduce the virtualization and the flicker of image.In addition, can adopt image processing software to image carry out noise reduction, processing such as the contrast that highlights, sharpening image edge, measurement image size, failure judgement.
5, easy and simple to handle.Rotatable two-dimensional adjustment operator's console makes detection more fast, accurately, conveniently.
Description of drawings
Fig. 1 is a structural principle synoptic diagram of the present utility model;
Fig. 2 is the structural representation of the utility model x-ray imaging system;
Wherein: 1-input window, 2-front end vacuum gap, 3-photocathode, the 4-pressure ring, 5-microchannel plate, 6-rear end vacuum gap, 7-aluminium film, 8-phosphor powder layer, 9-output window, 10-booster inner casing, 11-video screen, 12-vacuum seal, the 14-ceramic package, 15-output window metal shell, 16-sealing ring, the 17-inclined-plane, 18-gap, 19-pallet, the 20-metal window, 21-X ray generating means, 22-two-dimensional adjustment operator's console, the 23-X radiation imaging system, 24-image software disposal system, 25-power supply, 26-aluminum camera housing, the 27-CCD video camera, 28-booster shell.
Embodiment
The utility model structure is seen Fig. 1 and Fig. 2, comprises X-ray generator 21, two-dimensional adjustment operator's console 22 and x-ray imaging system 23; X-ray generator 21 is little focal spot X-ray generator, and its X ray energy range is 20～70kV, and the X ray anode current is 0.1～0.5mA, and the X ray focal spot size is a micron dimension; Two-dimensional adjustment operator's console 22 is arranged between X-ray generator 21 and the x-ray imaging system 23, its X-axis and Y-axis motion realize by the high precision stepper motor, the moving range of X-axis and Y-axis is 180mm, and two-dimensional adjustment operator's console 22 is also rotatable, rotating range by level to miter angle; X-ray imaging system 23 comprises high-resolution X-ray image enhancer, ccd video camera 27, is arranged on aluminum camera housing 26 and image software disposal system 24 outside the ccd video camera 27; Ccd video camera 27 is for having the high resolution CCD video camera of mega pixel camera lens; Aluminum camera housing 26 is connected with booster shell 28; High-resolution X-ray image enhancer comprises power supply 25, input window 1, the reflective cesium iodide photocathode 3 to the X ray sensitivity, microchannel plate (MCP) 5, output window 9, booster inner casing 10, booster shell 12; Input window 1, output window 9 and the 10 usefulness aluminum solder sealing-ins of booster inner casing become vacuum seal 12; Power supply 25 is the tile power supply module, is used for providing the high stable power supply to high-resolution X-ray image enhancer; Tile power supply module and vacuum seal 12 are enclosed in the booster shell 28 admittedly by the encapsulating mode; The material of output window 9 is K4 glass or fibre faceplate; Input window 1 comprises the metal window 14 that is arranged on vacuum device 13 leading section centers and is arranged on metal window 14 and the kovar alloy ring 6 of 7 of ceramic inner casings, and the material of metal window 14 is aluminium or beryllium, and the material of kovar alloy ring 6 is 4J33; Vacuum seal 12 is arranged in the booster shell 28; Microchannel plate 5 is arranged between input window 1 and the output window 9; Reflective CsI (cesium iodide) photocathode 3 evaporations are on microchannel plate 5; Output window 9 comprises video screen 11, is coated in the P20 phosphor powder layer of video screen 11 inside surfaces and the aluminium film 7 of protection phosphor powder layer.5 of input window 1 and microchannel plates form front end vacuum gap 2, form rear end vacuum gap 6 between microchannel plate 5 and the output window 9.The negative voltage that adds 800～1000V during work on the input face of microchannel plate 5, output face ground connection.The axial length of the rear end vacuum gap 6 between microchannel plate 5 and the phosphor powder layer 8 is 0.5～1mm.The positive voltage that adds 4～5KV during work therebetween.The self-expanding pressure ring is the annulus that has gap 18, thereby has certain elasticity; Pressure ring 4 tops are provided with an inclined-plane 17, and pressure ring 4 can compress microchannel plate 5 firmly, assemble very convenient.
The utility model principle and the course of work:
Wiring board that detects when needs or semi-conductor chip enter in the utility model pick-up unit behind the rotatable two-dimensional adjustment operator's console, be positioned at wiring board or semi-conductor chip top a little focal spot X-ray generator is arranged, the X ray of its emission passes the high resolution X-ray imaging system that is placed in the below behind the wiring board and receives, owing to contain materials such as the lead that can absorb X ray in a large number, bismuth, tin in the solder joint, therefore compare with the X ray that passes other materials such as glass fibre, copper, silicon, be radiated at X ray on the solder joint and absorbed in a large number and present stain.Front end input window in the high resolution X-ray imaging system has higher X ray transmitance, and the sightless X ray that will carry detection information to the reflective photocathode of X ray sensitivity changes electronic image into, and microchannel plate MCP plays the electronics multiplication; After electronic image doubled through microchannel plate MCP, the impact fluorescence bisque changed electronic image into visible images under electric field action, is exported by output window again; The mega pixel camera lens will be imaged in by the clear picture of output window on the high resolution CCD video camera, and the image software disposal system is handled the back with image noise reduction and shown on monitor.The utility model pick-up unit makes the analysis of butt welding point become quite directly perceived, more just can be automatically through Computer Image Processing and check welding point defect reliably.
Claims (10)
1. one kind is used for the x-ray detection device that electronics is assembled fault detect, comprise X-ray generator (21), x-ray imaging system (23), described x-ray imaging system (23) comprises high-resolution X-ray image enhancer, ccd video camera (27) and image software disposal system (24), it is characterized in that: described high-resolution X-ray image enhancer comprises power supply (25), input window (1), the photocathode (3) to the X ray sensitivity, microchannel plate assembly, output window (9), booster inner casing (10) and booster shell (28); Described input window (1), output window (9) and booster inner casing (10) sealing-in become vacuum seal (12); Described booster inner casing (10) comprises sealing ring (16), ceramic package (14) and the output window metal shell (15) that axially connects successively; Described input window (1) is the metal window (20) of sealing and fixing in the middle of sealing ring (16) front end; Described vacuum seal (12) is arranged in the booster shell (28); Described microchannel plate assembly is arranged between input window (1) and the output window (9); Described photocathode (3) evaporation is on the microchannel plate assembly; Described output window (9) sealing and fixing is on output window metal shell (15); Described output window (9) comprises video screen (11), is arranged on the phosphor powder layer (8) of video screen (11) inside surface, is arranged on the outer aluminium film (7) of phosphor powder layer (8).
2. a kind of x-ray detection device that is used for electronics assembling fault detect according to claim 1, it is characterized in that: described x-ray detection device comprises the two-dimensional adjustment operator's console (22) that is arranged between X-ray generator (21) and the x-ray imaging system (23); Described two-dimensional adjustment operator's console (22) comprises X-axis high precision stepper motor and Y-axis high precision stepper motor, and the moving range of its X-axis and Y-axis is 180mm, its rotating range by level to miter angle.
3. a kind of x-ray detection device that is used for electronics assembling fault detect according to claim 2, it is characterized in that: described X-ray generator (21) is little focal spot X-ray generator, its X ray energy range is 20～70kV, the X ray anode current is 0.1～0.5mA, and the X ray focal spot size is a micron dimension.
4. according to claim 1 or 2 or 3 described a kind of x-ray detection devices that are used for electronics assembling fault detect, it is characterized in that: described microchannel plate assembly comprises pressure ring (4), microchannel plate (5) and the pallet (19) that axially connects successively, described pallet (19) is fixed in the middle of the ceramic package (14), and described pressure ring (4) is fixed on the inboard of sealing ring (16); Described microchannel plate (5) is fixed on the pallet (19) by pressure ring (4); Described photocathode (3) evaporation is at the input face of microchannel plate (5).
5. a kind of x-ray detection device that is used for electronics assembling fault detect according to claim 4, it is characterized in that: described pressure ring (4) is the self-expanding pressure ring of band gap (18) and inclined-plane (17).
6. a kind of x-ray detection device that is used for electronics assembling fault detect according to claim 4, it is characterized in that: described vacuum seal (12) is enclosed in the booster shell (28) admittedly by the encapsulating mode; Described x-ray imaging system (23) also comprises the aluminum camera housing (26) that is arranged on outside the ccd video camera (27), and described aluminum camera housing (26) is connected with booster shell (28).
7. a kind of x-ray detection device that is used for electronics assembling fault detect according to claim 6, it is characterized in that: described power supply (25) is the tile power supply module, and described tile power supply module is enclosed in the booster shell (28) admittedly by the encapsulating mode.
8. a kind of x-ray detection device that is used for electronics assembling fault detect according to claim 4, it is characterized in that: form front end vacuum gap (2) between described input window (1) and microchannel plate (5), form rear end vacuum gap (6) between described microchannel plate (5) and the output window (9); The axial length of described front end vacuum gap (2) is 5～6mm; The axial length of described rear end vacuum gap (6) is 0.5～1mm; The thickness of described metal window (20) is 0.3～2mm, and effective diameter is Ф 18～Ф 100mm.
9. according to claim 6 or 7 or 8 described a kind of x-ray detection devices that are used for electronics assembling fault detect, it is characterized in that: the material of described metal window (20) is aluminium or beryllium; The material of described video screen (11) is K4 glass or fibre faceplate; Described photocathode (3) is an alkali halogen compound reflective photocathode; The material of described phosphor powder layer (8) is a P20 fluorescent powder; The material of described sealing ring (16) is kovar alloy 4J33; Pass through aluminium solder soldering sealing-in between described input window (1) and the sealing ring (16).
10. a kind of x-ray detection device that is used for electronics assembling fault detect according to claim 9, it is characterized in that: described alkali halogen compound reflective photocathode is the CsI photocathode.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200720031567 CN201057536Y (en) | 2007-04-17 | 2007-04-17 | X-ray testing apparatus used for electric assembly fault detection |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200720031567 CN201057536Y (en) | 2007-04-17 | 2007-04-17 | X-ray testing apparatus used for electric assembly fault detection |
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| CN201057536Y true CN201057536Y (en) | 2008-05-07 |
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| CN 200720031567 Expired - Fee Related CN201057536Y (en) | 2007-04-17 | 2007-04-17 | X-ray testing apparatus used for electric assembly fault detection |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106170226A (en) * | 2014-04-04 | 2016-11-30 | 诺信公司 | For checking the X-ray examination equipment of semiconductor wafer |
| CN107765287A (en) * | 2017-11-20 | 2018-03-06 | 中国工程物理研究院激光聚变研究中心 | A kind of nuclear leakage survey meter and its method for detecting pollution sources |
| CN109061826A (en) * | 2018-08-24 | 2018-12-21 | 深圳市荣者光电科技发展有限公司 | The packaging method of low-light picture pipe |
| CN110881111A (en) * | 2019-11-21 | 2020-03-13 | 杭州电子科技大学 | Small object multi-angle X-ray digital image acquisition system and method |
| CN111896673A (en) * | 2020-07-07 | 2020-11-06 | 南京理工大学 | Variable ramjet heat-insulating material laser ablation experimental apparatus of oxygen enrichment degree |
| CN114171366A (en) * | 2021-12-09 | 2022-03-11 | 中国建筑材料科学研究总院有限公司 | Image intensifier with double-optical-fiber light cone structure and image intensified detection imaging system |
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2007
- 2007-04-17 CN CN 200720031567 patent/CN201057536Y/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106170226A (en) * | 2014-04-04 | 2016-11-30 | 诺信公司 | For checking the X-ray examination equipment of semiconductor wafer |
| US10948425B2 (en) | 2014-04-04 | 2021-03-16 | Nordson Corporation | X-ray inspection apparatus for inspecting semiconductor wafers |
| CN106170226B (en) * | 2014-04-04 | 2022-06-07 | 诺信公司 | X-ray inspection apparatus for inspecting semiconductor wafers |
| CN107765287A (en) * | 2017-11-20 | 2018-03-06 | 中国工程物理研究院激光聚变研究中心 | A kind of nuclear leakage survey meter and its method for detecting pollution sources |
| CN107765287B (en) * | 2017-11-20 | 2023-11-14 | 中国工程物理研究院激光聚变研究中心 | Nuclear leakage detector and method for detecting pollution source by using same |
| CN109061826A (en) * | 2018-08-24 | 2018-12-21 | 深圳市荣者光电科技发展有限公司 | The packaging method of low-light picture pipe |
| CN110881111A (en) * | 2019-11-21 | 2020-03-13 | 杭州电子科技大学 | Small object multi-angle X-ray digital image acquisition system and method |
| CN111896673A (en) * | 2020-07-07 | 2020-11-06 | 南京理工大学 | Variable ramjet heat-insulating material laser ablation experimental apparatus of oxygen enrichment degree |
| CN114171366A (en) * | 2021-12-09 | 2022-03-11 | 中国建筑材料科学研究总院有限公司 | Image intensifier with double-optical-fiber light cone structure and image intensified detection imaging system |
| CN114171366B (en) * | 2021-12-09 | 2024-05-14 | 中国科学院高能物理研究所 | Image intensifier with double-fiber light cone structure and image intensifier type detection imaging system |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080507 Termination date: 20110417 |